CN106937032A - Imaging module and electronic device - Google Patents

Abstract

The invention discloses an imaging module and an electronic device. The imaging module comprises a flexible circuit board, at least two camera modules and two connectors. The flexible circuit board comprises at least two module installation parts arranged at intervals and a connector installation part connected with the at least two module installation parts. At least two modules of making a video recording set up respectively on two at least module installation departments, and two at least modules of making a video recording set up at the interval. The two connectors are arranged on the connector mounting part at intervals. In the imaging module of the embodiment of the invention, at least two camera modules are arranged at intervals, so that enough space is reserved between the at least two camera modules, and the optical axes of the at least two camera modules can be conveniently adjusted to be parallel to each other. In addition, the two connectors can conveniently install the imaging module on the electronic device.

Description

Imaging module and electronic device

priority information

This application claims the priority and benefit of patent application numbers 201511025532.1, 201521132821.7, 201511024922.7, and 201521131513.2 filed with the State Intellectual Property Office of China on December 30, 2015, and is hereby incorporated by reference in its entirety.

technical field

The invention relates to the field of imaging technology, in particular to an imaging module and an electronic device.

Background technique

With the improvement of people's requirements for the quality of captured images, dual-camera photography technology has emerged as the times require. In order to ensure the quality of photographing, the optical axes of the two camera modules of the dual camera module are parallel to each other. Therefore, in the production process of the dual-camera module, how to conveniently adjust the optical axes of the two camera modules to be parallel to each other, and how to conveniently install the dual-camera module on the electronic device has become an urgent problem to be solved.

Contents of the invention

The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides an imaging module and an electronic device.

The imaging module according to the embodiment of the present invention includes a flexible circuit board, at least two camera modules and two connectors. The flexible circuit board includes at least two module installation parts arranged at intervals and a connector installation part connecting the at least two module installation parts. At least two camera modules are respectively arranged on at least two module mounting parts, and at least two camera modules are arranged at intervals. The two connectors are arranged at intervals on the connector installation part.

In the imaging module according to the embodiment of the present invention, at least two camera modules are arranged at intervals so that there is enough space between the at least two camera modules, and the optical axes of the at least two camera modules can be adjusted to be parallel to each other conveniently. In addition, two connectors allow for easy mounting of the imaging module to electronic devices.

In some embodiments, the number of the module installation part and the number of the camera modules are both two.

In some embodiments, the flexible circuit board includes two connecting parts arranged at intervals, and the two connecting parts respectively connect the two module mounting parts and the connector mounting parts.

In some embodiments, each of the camera modules includes a printed circuit board and an image sensor disposed on the printed circuit board and electrically connected to the printed circuit board, and the printed circuit board is disposed on the on the module installation part and electrically connected with the module installation part.

In some embodiments, the module mounting part includes a first electrical connection pad, and the printed circuit board includes a second electrical connection pad correspondingly connected to the first electrical connection pad, and the printed circuit board The board is electrically connected to the module installation part through the second electrical connection pad and the first electrical connection pad.

In some embodiments, the printed circuit board corresponds to the shape and size of the corresponding module mounting portion.

In some embodiments, the camera module includes a lens module disposed on the printed circuit board and above the image sensor.

In some embodiments, each of the lens modules includes a lens and a voice coil motor, the lens is arranged in the voice coil motor, each of the voice coil motors includes a housing, and two of the housings interval setting.

In some embodiments, the imaging module includes a substrate, the substrate is arranged on the connector installation part and is electrically connected with the connector installation part, and the two connectors are arranged on the on the substrate.

In some embodiments, the imaging module includes colloid, and the colloid is arranged between the two camera modules and bonds the two camera modules.

In some embodiments, each of the camera modules includes a connection side opposite to the other camera module, and the two camera modules are fixedly connected by welding the connection sides.

In some embodiments, the dual camera module includes a cover, and the cover covers the two camera modules and is fixedly connected to the two camera modules.

In some embodiments, the cover includes a frame surrounding the two camera modules and a top cover connected to the top of the frame, and the frame and the top cover are connected to the two camera modules through glue. The above camera module is fixedly connected.

An electronic device according to an embodiment of the present invention includes the aforementioned imaging module.

In the electronic device according to the embodiment of the present invention, at least two camera modules are arranged at intervals so that there is enough space between the at least two camera modules, and the optical axes of the at least two camera modules can be adjusted to be parallel to each other conveniently. In addition, two connectors allow for easy mounting of the imaging module to electronic devices.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

FIG. 1 is a schematic structural diagram of an imaging module according to an embodiment of the present invention.

FIG. 2 is a schematic perspective view of an imaging module according to an embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view of the imaging module in FIG. 2 along the direction III-III.

FIG. 4 is an enlarged schematic view of part IV of the imaging module in FIG. 3 .

FIG. 5 is an exploded schematic diagram of an imaging module according to an embodiment of the present invention.

FIG. 6 is another exploded schematic view of the imaging module according to the embodiment of the present invention.

FIG. 7 is a schematic perspective view of the cover of the imaging module according to the embodiment of the present invention.

FIG. 8 is a partial structural schematic diagram of an imaging module according to an embodiment of the present invention.

detailed description

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction of two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "below" and "under" the first feature to the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is less horizontal than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the invention. Furthermore, the present disclosure may repeat reference numerals and/or reference letters in different instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

FIG. 1 is a schematic structural diagram of an imaging module according to an embodiment of the present invention. The cover of the imaging module is not shown in FIG. 1 .

Referring to FIG. 1 and FIG. 5 , an imaging module 100 according to an embodiment of the present invention includes a flexible circuit board 10 , two camera modules 20 and two connectors 32 . The flexible circuit board 10 includes two module mounting portions 11 and a connector mounting portion 12 . The two module mounting parts 11 are arranged at intervals. The connector installation part 12 connects the two module installation parts 11 . Two camera modules 20 are arranged on the module installation part 11 respectively, and the two camera modules 20 are arranged at intervals. Two connectors 32 are arranged on the connector installation part 12 at intervals.

In the imaging module 100 of the embodiment of the present invention, the two camera modules 20 are arranged at intervals so that there is enough space between the two camera modules 20, and the optical axes of the two camera modules 20 can be easily adjusted to be parallel to each other. . In addition, the two connectors 32 can conveniently install the imaging module 100 on the electronic device.

Specifically, in one example, when assembling the imaging module 100, first fix the two camera modules 20 to the module installation part 11 respectively, and then clamp and fix one of the camera modules 20 with a manipulator, and then use the manipulator Adjust the position of the other camera module 20 so that the optical axes of the two camera modules 20 are parallel, and the two camera modules 20 face the same side.

It can be understood that, in other embodiments, the number of the module installation part and the camera module can be more than three, and more than three camera modules are arranged at intervals. More than three module installation parts are arranged at intervals. More than three camera modules are respectively arranged on more than three module installation parts.

For the convenience of description, an embodiment in which both the number of module mounting parts and the number of camera modules are two will be further described below, but it should not be construed as a limitation of the present invention.

Please refer to FIG. 8 , in this embodiment, the flexible circuit board 10 includes two connecting portions 13 arranged at intervals, and the two connecting portions 13 respectively connect the two module mounting portions 11 and the connector mounting portion 12 .

The distance between the two connecting parts 13 can further facilitate the deformation of the flexible circuit board 10 , thereby facilitating the adjustment of the positions of the two camera modules 20 so that the optical axes of the two camera modules 20 are parallel.

Referring to FIGS. 2-4 , in this embodiment, each camera module 20 includes a printed circuit board 21 (Printed Circuit Board, PCB) and an image sensor 22 . The printed circuit board 21 is disposed on the module installation part 11 and is electrically connected to the module installation part 11 . The image sensor 22 is disposed on the printed circuit board 21 and is electrically connected to the printed circuit board 21 .

In this way, the image sensor 22 can acquire the image of the object, and transmit the image to the external device through the printed circuit board 21 and the flexible circuit board 10 . It should be noted that the sensing surfaces of the two image sensors 22 face the same side.

Specifically, the image sensor 22 may be a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS) image sensor or a charge-coupled device (Charge-coupled Device, CCD) image sensor.

In this embodiment, the module mounting part 11 includes a first electrical connection pad 111, the printed circuit board 21 includes a second electrical connection pad 211 corresponding to the first electrical connection pad 111, and the printed circuit board 21 passes through the second electrical connection pad 111. The electrical connection pad 211 and the first electrical connection pad 111 are electrically connected to the module installation portion 11 .

In this way, the first electrical connection pad 111 and the second electrical connection pad 211 realize the electrical connection and communication between the flexible circuit board 10 and the camera module 20 . For example, both the first electrical connection pad 111 and the second electrical connection pad 211 use conductive glue.

In this embodiment, the printed circuit board 21 corresponds to the shape and size of the corresponding module mounting portion 11 .

In this way, the structure of the imaging module 100 can be made more compact, which is beneficial to reduce the volume of the imaging module 100 . When the imaging module 100 is applied to an electronic device, the volume of the electronic device can be further reduced.

In this embodiment, as an example, each of the printed circuit boards 21 and the corresponding module mounting portion 11 are in the shape of a flat plate and have the same size. In other embodiments, the shape of each printed circuit board and the corresponding module mounting portion can be specifically set according to actual needs. The size between the printed circuit board and the corresponding module mounting part can be adjusted as required.

Please refer to FIG. 5 and FIG. 6 , in this embodiment, the camera module 20 includes a lens module 23 disposed on the printed circuit board 21 and above the image sensor 22 .

In this way, the lens module 23 can enable the image sensor 22 to obtain better quality images, thereby improving the shooting quality of the imaging module 100 .

In this embodiment, each lens module 23 includes a lens 231 and a voice coil motor 232 , the lens 231 is disposed in the voice coil motor 232 , each voice coil motor 232 includes a casing 2321 , and the two casings 2321 are arranged at intervals.

The voice coil motor 232 can drive the lens 231 to move along the optical axis direction of the lens 231 to adjust the distance between the lens 231 and the image sensor 22, thereby realizing the autofocus of the imaging module 100, so that the imaging module 100 can obtain better quality images. image.

Further, a filter 24 is disposed between the lens 231 and the image sensor 22 . The filter 24 can filter light with a preset frequency, so that the image sensor 22 can form a better image according to the filtered light.

Preferably, the filter 24 is an infrared cut filter. In this way, the infrared cut-off filter 24 can filter infrared light to avoid image distortion of the image sensor 22 .

Specifically, the lens module 23 further includes a base 233 , the base 233 defines a groove 2331 , and the bottom surface of the groove 2331 defines a through hole 2332 . The optical filter 24 is disposed in the groove 2331 and supported on the bottom surface of the groove 2331 , and the light filtered by the optical filter 24 can reach the image sensor 22 through the through hole 2332 .

In order to take the filter 24 conveniently, a connection groove 2333 is defined on the base 233 , and the connection groove 2333 communicates with the groove 2331 .

Referring to FIG. 8 , in this embodiment, the imaging module 100 includes a substrate 31 disposed on the connector mounting portion 12 and electrically connected to the connector mounting portion 12 . Two connectors 32 are disposed on the substrate 31 .

In this way, the substrate 31 can increase the reliability of the connection between the connector 32 and the connector installation portion 12 , making it difficult for the connector 32 to fall off from the connector installation portion 12 .

It should be pointed out that, in this embodiment, the two connectors 32 are disposed on the same substrate 31 . It can be understood that in other implementation manners, the two connectors can be respectively disposed on the two substrates.

In this embodiment, the imaging module 100 includes a colloid 40 , and the colloid 40 is arranged between two camera modules 20 and bonded to the two camera modules 20 .

After the optical axes of the two camera modules 20 are adjusted to be parallel to each other, glue 40 is injected between the two camera modules 20 . The colloid 40 can ensure that the two camera modules 20 are relatively fixed. The colloid 40 can increase the connection strength of the two camera modules 20 and can reduce the probability of optical axis deviation of the two imaging modules 100 .

It should be noted that, in this embodiment, as shown by the orientation in FIG. 3 , the colloid 40 is located at the lower part of the gap between the two camera modules 20 . In other embodiments, the glue can fill the gap between the two camera modules.

The glue 40 can be, for example, UV glue (Ultraviolet Glue) and other viscous glue.

In some embodiments, each camera module includes a connecting side opposite to another camera module, and the two camera modules are fixedly connected by welding the connecting side.

In this way, the two camera modules can be firmly fixed together by welding. For example, the connection side of each camera module can be fixedly connected to another camera module by laser spot welding or solder paste or tin wire welding.

In this embodiment, the imaging module 100 includes a cover body 50 , and the cover body 50 covers two camera modules 20 and is fixedly connected with the two camera modules 20 .

For example, the cover body 50 and the two camera modules 20 can be fixedly connected by welding or glue.

In this way, the cover body 50 can further fix the positions of the two camera modules 20, reduce the impact force on the camera module 20 in the process of falling or shaking, increase the structural stability of the imaging module 100, and improve the imaging performance. Mod 100 quality.

Please refer to FIG. 7. In this embodiment, the cover body 50 includes a frame body 51 surrounding the two camera modules 20 and a top cover 52 connected to the top of the frame body 51. The frame body 51 and the top cover 52 are connected to the two camera modules through colloid. Module 20 is fixedly connected.

In this way, the frame body 51 and the top cover 52 of the cover body 50 are connected to the two camera modules 20 through colloid, which can increase the connection area between the cover body 50 and the two camera module groups 20, so that the cover body 50 is connected to the two camera modules 20. The camera module 20 is connected more firmly.

Specifically, the top cover 52 is provided with two light holes 251 , and the two camera modules 20 are respectively exposed through the two light holes 251 . The light passes through the aperture 251 , the lens 231 and the filter 24 in sequence and then reaches the image sensor 22 , so that the image sensor 22 can collect images of the outside world.

It should be noted that, in this embodiment, the two light holes 251 are both cylindrical. In other implementation manners, the shapes of the two light holes can be determined respectively. Therefore, the shape of the light hole in this embodiment cannot be construed as a limitation of the present invention.

In this embodiment, preferably, the optical hole 251 is coaxially arranged with the optical axis of the lens 231 .

Please refer to FIG. 5 and FIG. 6 , further, the imaging module 100 further includes a reinforcement board 60 , and the two module installation parts 11 are fixed on the reinforcement board 60 .

In this way, the reinforcing plate 60 can further fix the positions of the two camera modules 20, improve the anti-collision capability of the imaging module 100, and further improve the shooting quality. The reinforcing plate 60 can be made of high strength material, such as metal material.

In this embodiment, the imaging module 100 further includes a metal foil 70 , and the reinforcing plate 60 is disposed on the metal foil 70 . The metal foil 70 can prevent the imaging module 100 from being interfered by electromagnetic waves, so as to ensure that the imaging module 100 obtains images with better quality. The anti-electromagnetic wave interference member 70 can be made of metal material, for example.

The electronic device according to the embodiment of the present invention includes the above-mentioned imaging module 100 . Electronic devices are, for example, mobile phones, tablet computers, and the like.

In the electronic device according to the embodiment of the present invention, the two camera modules 20 are arranged at intervals so that there is enough space between the two camera modules 20, and the optical axes of the two camera modules 20 can be adjusted to be parallel to each other conveniently. In addition, the two connectors 32 can conveniently install the imaging module 100 on the electronic device.

In the description of this specification, reference to the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific examples", or "some examples" etc. A specific feature, structure, material, or characteristic described in an embodiment or an example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the invention is defined by the claims and their equivalents.

Claims (14)

1. a kind of imaging modules, it is characterised in that including：

Flexible PCB, the flexible PCB is included described in spaced at least two modules installation portion and connection at least Two connector installation portions of module installation portion；

At least two camera modules, at least two camera module is separately positioned at least two modules installation portion On, at least two camera modules interval setting；And

Two connectors, described two connectors are disposed on the connector installation portion.

2. imaging modules as claimed in claim 1, it is characterised in that the quantity of the module installation portion and the shooting The quantity of module is two.

3. imaging modules as claimed in claim 2, it is characterised in that the flexible PCB includes spaced two Individual connecting portion, described two connecting portions connect two module installation portions and the connector installation portion respectively.

4. imaging modules as claimed in claim 2, it is characterised in that each described camera module includes printed circuit board (PCB) And the imageing sensor being electrically connected with the printed circuit board and with the printed circuit board (PCB), the printed circuit are set Plate is arranged on the module installation portion and is electrically connected with the module installation portion.

5. imaging modules as claimed in claim 4, it is characterised in that the module installation portion includes that first is electrically connected with Pad, the printed circuit board (PCB) includes the second electric connection pad of connection corresponding with first electric connection pad, the printing Circuit board is electrically connected with the module installation portion by second electric connection pad with first electric connection pad.

6. imaging modules as claimed in claim 4, it is characterised in that the printed circuit board (PCB) and the corresponding module Installation portion shape and size are corresponding.

7. imaging modules as claimed in claim 4, it is characterised in that the camera module includes being arranged on the printing Camera lens module on circuit board and above described image sensor.

8. imaging modules as claimed in claim 7, it is characterised in that each described camera lens module includes camera lens and voice coil loudspeaker voice coil Motor, the camera lens is arranged in the voice coil motor, and each described voice coil motor is included between housing, two housings Every setting.

9. imaging modules as claimed in claim 2, it is characterised in that the imaging modules include substrate, the substrate It is arranged on the connector installation portion and is electrically connected with the connector installation portion, described two connectors is arranged on institute State on substrate.

10. imaging modules as claimed in claim 2, it is characterised in that the imaging modules include colloid, the glue Body is arranged between two camera modules and is bonded two camera modules.

11. imaging modules as claimed in claim 2, it is characterised in that each described camera module includes and another The relative connecting side of the camera module, two camera modules are fixedly connected by welding the connecting side.

12. imaging modules as claimed in claim 2, it is characterised in that described pair of camera module includes cover body, the cover Body cover sets two camera modules and is fixedly connected with two camera modules.

13. imaging modules as claimed in claim 12, it is characterised in that the cover body is included around two shootings The framework of module and the top cover being connected with framework top, the framework and the top cover are taken the photograph by colloid with described in two As module is fixedly connected.

14. a kind of electronic installations, it is characterised in that including the imaging modules as described in claim any one of 1-13.