CN106937028A - Camera module assemble method and camera module - Google Patents

Abstract

A camera module assembly method, comprising: providing a circuit board and a lens module, one end of the circuit board is provided with a connector, the other end is a circuit board, the circuit board is provided with a photosensitive chip and a cover for the photosensitive chip a bracket, the bracket accommodates a filter, and the lens module is a voice coil motor combined with a lens; adjust the lens module so that the lens focuses on the photosensitive chip and the optical axis of the lens is in line with the photosensitive chip Aligning the center normal; providing a curable glue, and coating the curable glue on the upper surface of the bracket; pre-pressing the lens module and the curable glue; adjusting the lens module again to make the lens The optical axis is aligned with the central normal of the photosensitive chip; the lens module is attached to the bracket, and the curable glue is cured. The invention also provides a camera module. The method for assembling the camera module can improve assembly efficiency, ensure the imaging quality of the camera module, and increase the adhesive force between the lens module and the bracket.

Description

Camera module assembly method and camera module

technical field

The invention relates to the field of camera technology, in particular to a method for assembling a camera module and a camera module.

Background technique

At present, a camera module with focusing function mainly includes a lens, a voice coil motor (VCM), a filter holder, a circuit board, and an image sensor (Sensor). The lens accommodates the lens, and the lens is matched with the VCM thread, and the VCM is used to drive the lens to move to realize the focusing function. When assembling, first install the Sensor on the top surface of the circuit board through Chip On Board (COB), and then dispense glue around the Sensor on the circuit board, and pass the filter holder containing the filter through the glue Paste on the circuit board, then dispense glue on the upper surface of the filter holder, grab the VCM combined with the lens by the extraction device to the position corresponding to the glue on the filter holder, and then glue the bottom surface of the VCM to the filter Glue on the film bracket to complete the assembly of the camera module.

During the assembly process of the above-mentioned camera module, when grabbing the VCM, the VCM often tilts, causing the lens center of the lens in the VCM to deviate from the center of the Sensor on the circuit board, thereby affecting the imaging quality of the camera module, or causing defective products. Increase.

Contents of the invention

Based on this, the present invention provides a method for assembling a camera module that can improve assembly efficiency, ensure image quality, and increase thrust of the camera module, and a camera module obtained by using the method.

In order to solve the above-mentioned technical problems, a method for assembling a camera module provided by the present invention includes:

a. Provide a circuit board and a lens module. One end of the circuit board is provided with a connector, and the other end is a circuit board. The circuit board is provided with a photosensitive chip and a bracket covering the photosensitive chip. The bracket accommodates a filter A light sheet, the lens module is a voice coil motor combined with a lens;

b. adjusting the lens module so that the lens focuses on the photosensitive chip and the optical axis of the lens is aligned with the central normal of the photosensitive chip;

c. providing a curable glue, and coating the curable glue on the upper surface of the bracket;

d. pre-pressing the lens module and the curable glue;

e. Adjust the lens module again so that the optical axis of the lens is aligned with the center of the photosensitive chip;

f. Attaching the lens module and the bracket, and curing the curable adhesive.

The present invention also provides a camera module assembled by using the camera module assembly method described above. A camera module, including a circuit board, a lens module and a curable glue,

One end of the circuit board is provided with a connector, and the other end is a circuit board. The circuit board is provided with a photosensitive chip, a bracket covering the photosensitive chip and several mounting components. The photosensitive chip is electrically connected to the circuit board through several gold wires. Sexual connection, the bracket accommodates a filter;

The lens module is a voice coil motor combined with a lens, and the lens includes a lens barrel and a number of lenses accommodated in the lens barrel;

The curable glue is coated on the upper surface of the bracket, and is cured when the lens is focused on the photosensitive chip and the optical axis of the lens is aligned with the central normal of the photosensitive chip, so that the lens module and the bracket pass through the photosensitive chip. The curing glue is bonded.

In the camera module assembly method described above, when the lens module is adjusted to focus on the photosensitive chip, because the lens module can be quickly located at the position where the highest definition value of the captured image is located, the focusing time is shortened, and the camera module’s performance is improved. assembly efficiency; at the same time, the lens module can be adjusted so that the optical axis of the lens is aligned with the central normal of the photosensitive chip to ensure the imaging quality of the camera module; finally, due to the pre-pressing of the lens module and the The cured glue increases the adhesion of the curable glue, thereby increasing the adhesion between the lens module and the bracket.

Description of drawings

1 is a flowchart of a method for assembling a camera module according to an embodiment of the present invention;

2 is a schematic cross-sectional view of an assembled state of the camera module according to an embodiment of the present invention;

3 is a schematic cross-sectional view of another assembled state of the camera module of FIG. 2;

4 is a schematic cross-sectional view of another assembled state of the camera module of FIG. 2;

5 is a schematic cross-sectional view of the curable glue coated on the camera module of FIG. 2;

FIG. 6 is a schematic cross-sectional view of the assembled camera module in FIG. 2 .

detailed description

In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. A preferred embodiment of the invention is shown in the drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be thorough and complete.

It should be noted that when an element is referred to as being “fixed on” another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In order to realize the present invention, the assembly device provided by the embodiment of the present invention (please refer to FIG. 2 ) includes a lens module extracting device 110, a controller 120, a carrying platform 130 and a test box arranged on the carrying platform 130 140 . The controller 120 is electrically connected to the test box 140 and controls the test box 140 and the lens module extraction device 110 .

Please refer to Fig. 1 and Fig. 2, the camera module assembly method of an embodiment of the present invention includes:

Step a: provide a circuit board 102 and a lens module 101, one end of the circuit board 102 is provided with a connector 1021, the other end is a circuit board 1022, the circuit board 1022 is provided with a photosensitive chip 103 and a cover for the photosensitive chip 103 is a bracket 104, the bracket 104 accommodates a filter 105, and the lens module 101 is a voice coil motor 1012 combined with a lens 1011.

Step b: Adjust the lens module 101 so that the lens 1011 focuses on the photosensitive chip 103 and the optical axis LL′ of the lens 1011 is aligned with the central normal SS′ of the photosensitive chip 103 .

In this embodiment, step b specifically includes the following steps:

Step b1: place the circuit board 102 on the carrier 130, the connector 1021 of the circuit board 102 is electrically connected to the test box 140 on the carrier 130, and the test box 140 is electrically connected to the controller 120 Connecting; use the lens module extraction device 110 to extract the lens module 101 , and adjust the lens module 101 so that the optical axis LL′ of the lens 1011 is aligned with the central normal SS′ of the photosensitive chip 103 .

The controller 120 adjusts the lens module 101 by controlling the lens module extraction device 110 to extract the lens module 101 . In FIG. 2 , when the lens module extracting device 110 extracts the lens module 101, the lens module 101 is tilted, that is, the optical axis LL' of the lens 1011 in the lens module 101 and the optical axis LL' of the photosensitive chip 103 The central normal SS' is not parallel, but forms a relatively large angle.

During the assembly process of the camera module of the present invention, the controller 120 controls the lens module extracting device 110 to extract the lens module 101, and the lens is moved along the direction of the six degrees of freedom of the lens module 101 with a first range of motion. The module 101 is adjusted, specifically, the lens module 101 is adjusted to a large extent along the X, Y and Z axis directions and the inclination angle around the X, Y and Z axis directions is adjusted. Referring to Fig. 3, it only shows a section of an assembled state during the step b1 assembly process. In Fig. 3, after step b1 is adjusted, the optical axis LL' of the lens 1011 in the lens module 101 is aligned with the photosensitive chip The included angle of the center normal SS' of 103 becomes smaller, and through subsequent adjustments until the optical axis LL' of the lens 1011 is aligned with the center normal SS' of the photosensitive chip 103, at the same time, the controller 120 records the lens 1011 The position of the lens module 101 when the optical axis LL' of the photosensitive chip 103 is aligned with the central normal line SS' of the photosensitive chip 103 .

Step b2: the lens module extracting device 110 extracts the lens module 101 located above the photosensitive chip 103, and at the same time, the controller 120 controls the photosensitive chip 103 to take an image of a test picture through the lens 1011, and analyzes the image The current sharpness value further predicts the highest sharpness value of the image and the position of the lens module 101 under the highest sharpness value of the image.

Specifically, after the lens module extracting device 110 extracts the lens module 101 above the photosensitive chip 103 in the step b2, the position of the lens module 101 remains unchanged, which is the position of the controller in the above step b1. 120 records the position of the lens module 101 when the optical axis LL′ of the lens 1011 is aligned with the center normal SS′ of the photosensitive chip 103 .

Step b3: the controller 120 controls the lens module extracting device 100 to adjust the lens module 101 according to the current sharpness value of the image obtained in step b2, so that the lens module 101 quickly locates in the highest sharpness of the image predicted in step b2 At the same time, the controller 120 controls the photosensitive chip 103 to take the image of the test picture through the lens 1011, and analyzes the image definition value to fine-tune the lens module 101 so that The lens 1011 focuses on the photosensitive chip 103 , and the controller 120 records the position of the lens module 101 when the lens 1011 focuses on the photosensitive chip 103 .

Please refer to FIG. 4 , which shows an assembled state of the camera module in an embodiment of the present invention after the above step b3, the above step b3 is because the lens module 101 can quickly be located at the highest resolution of the image predicted by step b2 The location of the lens module 101 can reduce assembly time and improve assembly efficiency. However, due to the accuracy requirements and adjustment errors of the assembly device, it is necessary to precisely adjust the lens module 101 at the position where the highest definition value of the image predicted in step b2 is located with the second movement range, that is, the controller 120 controls The lens module extracting device 110 extracts the lens module 101 to move around the center of the lens 1011 of the lens module 101 with a second movement range smaller than the first movement range in the above-mentioned step b1, so as to adjust the tilt of the lens module 101 to make the lens 1011 focus on the photosensitive chip 103 .

Step c: providing a curable glue 106 , and coating the curable glue 106 on the upper surface of the bracket 104 .

Specifically, please refer to FIG. 5 , the controller 120 controls the lens module extraction device 110 to extract the lens module 101 and move it away from the bracket 104 , and the curable glue 106 is applied to the surrounding edges of the bracket 104 , and ensure that the curable glue 106 does not overflow outward to the edge of the bracket 104 and inward to the filter 105 to form a closed pattern, the curable glue 106 is ultraviolet light curing glue (UV glue).

Step d: pre-pressing the lens module 101 and the curable glue 106 .

In the step d, the lens module extracting device 110 moves the lens module 101 to the position where the lens module 110 is located when the lens 1011 is focused on the photosensitive chip 103 recorded by the controller 120 in step b3 position, and then control the lens module extracting device 110 to extract the lens module 101 to move downward first, and then move upward, and the up and down movement range is 30um. In this embodiment, in order to improve the adhesion of the curable adhesive 106 and improve the assembly efficiency, the step d is only to move the lens module 101 downward once, and then move upward once to return to the initial position of step d. .

Of course, in other embodiments, in order to better enhance the adhesion of the curable glue 106, the lens module 101 and the curable glue 106 can also be pre-compressed multiple times, that is, the lens module 101 can be Down and up movements several times.

Step e: Adjust the lens module 101 again to align the optical axis LL′ of the lens 1011 with the central normal SS′ of the photosensitive chip 103 .

In the step e, the starting position of the adjustment is the position of the lens module 101 when the lens 1011 focuses on the photosensitive chip 103 in the above step b3, that is, the starting position of the above step d.

Step f: attach the lens module 101 and the bracket 104 , and cure the curable adhesive 106 to assemble a camera module 100 (please refer to FIG. 6 ).

In this step f, the lens module 101 and the bracket 104 are pasted together through the curable glue 106, and the curable glue 106 is cured by ultraviolet light irradiation, so as to prevent exposure to light from affecting the assembled camera module. Image quality of group 100.

In the above camera module assembly method of the present invention, in the process of adjusting the lens module 101 involved, the controller 120 controls the photosensitive chip 103 to perform real-time imaging, analyzes the sharpness value of the formed image and records the sharpness of each image value and the position of the lens module 101 under each image definition value. When the central sharpness value of the image is the highest and the sharpness values of the four corners (upper left, lower left, upper right, lower right) of the image are higher than the fractional value set by the controller 120 (such as 35, calculated as a maximum of 100 points) ), it can be determined that the lens 1011 is focused on the photosensitive chip 103 and the optical axis LL′ of the lens 1011 is aligned with the central normal SS′ of the photosensitive chip 103 .

It can be understood that Fig. 2 to Fig. 6 only show a section of the lens 1011, the actual lens 1011 is rotationally symmetric about the optical axis LL', and the lens module 101 is a rectangular or square lens symmetrical about the section mod.

Please refer to FIG. 6 , which is a camera module 100 assembled by using the camera module assembly method according to the embodiment of the present invention. The camera module 100 includes a circuit board 102 , a lens module 101 and a curable adhesive 106 .

One end of the circuit board 102 is provided with a connector 1021, and the other end is a circuit board 1022. The circuit board 1022 is provided with a photosensitive chip 103, a support 104 covering the photosensitive chip 103 and several mounting components 107. The photosensitive chip 103 It is electrically connected with the circuit board 1022 through wires 1031 for signal transmission, and the bracket 104 accommodates a filter 105 .

Specifically, in this embodiment, a part of the mounting components 107 is distributed on the circuit board 1022 outside the bracket 104 and close to the bracket 104, and the remaining part is distributed on the circuit board 1022 inside the bracket 104, And arranged around the photosensitive chip 103 , the mounting components 107 can be resistors, electrical appliances, inductors, etc., to enhance the function of the circuit board 1022 . The optical filter 105 is arranged on the bracket 104, and is held in the middle through hole 1041 of the bracket 104, the middle through hole 1041 is facing the photosensitive chip 103, so that the optical filter 105 covers the photosensitive chip 103, The photosensitive chip 103 is used to filter out the infrared light entering the photosensitive chip 103 from the lens 1011 to prevent the infrared light from affecting the imaging quality of the camera module 100 .

The lens module 100 is a voice coil motor 1012 combined with the lens 1011 . The lens 1011 includes a lens barrel 10111 and three lenses 10112 accommodated in the lens barrel 10111 . The outer wall 1011a of the lens barrel is provided with external threads, and the inner wall 1012a of the voice coil motor is provided with internal threads matching the external threads of the lens barrel 10111. In the embodiment of the present invention, the external threads of the lens barrel 10111 and the voice coil The internal thread of the motor 1012 is threaded, and the lens 1011 is installed in the voice coil motor 1012 .

It can be understood that, in other embodiments, when there is no external thread on the outer wall 1011a of the lens barrel and no internal thread on the inner wall 1012a of the voice coil motor, the lens 1011 and the voice coil motor 1012 can pass through the outer wall 1011a of the lens barrel Glue dispensing is performed at the gap between the inner wall 1012a of the voice coil motor. In other embodiments, according to the requirements of the designer, the lens 1011 can contain one lens, two lenses, or more than three lenses.

The curable glue 106 is coated on the upper surface of the bracket 104, and is cured when the lens 1011 focuses on the photosensitive chip 103 and the optical axis LL' of the lens 1011 is aligned with the central normal SS' of the photosensitive chip 103, so that The lens module 101 and the bracket 104 are attached by the curable glue 106 .

Specifically, the curable glue 106 is coated on the surrounding edges of the bracket 104, and it is ensured that the curable glue 106 does not overflow outwards from the edge of the bracket 104, and does not overflow inwards on the optical filter 105. The upper surface of the bracket 104 forms a closed pattern, and the curable glue 106 is an ultraviolet light curing glue (UV glue), which can be cured quickly under the irradiation of ultraviolet light.

In the above camera module assembly method of the present invention, when adjusting the focus of the lens module 101 on the photosensitive chip 103, since the controller 120 can control the lens module extraction device 110, the lens module 101 can be quickly located in the captured image The position of the lens module 101 under the highest definition value, thereby shortening the focusing time and improving the assembly efficiency of the camera module 101; at the same time, the lens module 101 can be adjusted so that the optical axis LL' of the lens 1011 is in line with the The center normal SS' of the photosensitive chip 103 is aligned to ensure the imaging quality of the camera module 100; the lens module 101 and the curable glue 106 are pre-pressed to increase the adhesion of the curable glue 106, and then The adhesive force between the lens module 101 and the bracket 104 is increased.

The above-mentioned embodiments only express several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but should not be construed as limiting the patent scope of the present invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (10)

1. A camera module assembly method, comprising the following steps: a. Provide a circuit board and a lens module. One end of the circuit board is provided with a connector, and the other end is a circuit board. The circuit board is provided with a photosensitive chip and a bracket covering the photosensitive chip. The bracket accommodates a filter A light sheet, the lens module is a voice coil motor combined with a lens; b. adjusting the lens module so that the lens focuses on the photosensitive chip and the optical axis of the lens is aligned with the central normal of the photosensitive chip; c. providing a curable glue, and coating the curable glue on the upper surface of the bracket; d. pre-pressing the lens module and the curable glue; e. Adjust the lens module again so that the optical axis of the lens is aligned with the central normal of the photosensitive chip; f. Attaching the lens module and the bracket, and curing the curable glue. 2. The camera module assembly method according to claim 1, characterized in that the step b specifically further comprises the following steps: b1. Place the circuit board on a carrier platform, the connector of the circuit board is electrically connected to the test box on the carrier platform, and the test box is electrically connected to a controller; extract the lens module extraction device a lens module, and adjust the lens module so that the optical axis of the lens is aligned with the central normal of the photosensitive chip; b2. The lens module extraction device extracts that the lens module is located above the photosensitive chip, and at the same time, the controller controls the photosensitive chip to take an image of a test picture through the lens, and analyzes the current definition value of the image to further predict The highest resolution value of the image and the position of the lens module under the highest resolution value of the image; b3. The controller controls the lens module extraction device to adjust the lens module according to the current sharpness value of the image obtained in step b2, so that the lens module quickly locates the lens under the highest sharpness value of the image predicted in step b2 The position of the module, at the same time, the controller controls the photosensitive chip to take the image of the test picture through the lens, and analyzes the image definition value, fine-tunes the lens module to make the lens focus on the photosensitive chip, and the The controller records the position of the lens module when the lens focuses on the photosensitive chip. 3. camera module assembly method according to claim 2, is characterized in that, the adjustment of this lens module all is the adjustment on the six degrees of freedom of this lens module: namely X, Y and Z axis direction The adjustment and the adjustment of the inclination around the X, Y and Z axis directions. 4. The camera module assembly method according to claim 2, characterized in that the step b1 adjusts the lens module with the first range of motion, and the step b3 is at the highest resolution of the image predicted in step b2 The position of the degree value is precisely adjusted by the second range of motion to the lens module. 5. The camera module assembly method according to claim 4, wherein the second movement range is smaller than the first movement range. 6. The camera module assembly method according to any one of claims 1 to 5, characterized in that, in the process of adjusting the lens module, the photosensitive chip performs real-time imaging, analyzes the sharpness value of the formed image and records The resolution value of each image and the position of the lens module under each image resolution value. 7. The camera module assembly method according to claim 2, wherein the lens module is adjusted again in the step e, and the starting point of the adjustment is the lens module when the lens focuses on the photosensitive chip in the step b3. The position of the group. 8. The camera module assembly method according to claim 2, characterized in that, in step d, the lens module extracting device extracts the lens module and moves downward first, and then moves upward, and the up and down motion range is 30um, The lens module and the curable adhesive are pre-compressed multiple times to improve the adhesion of the curable adhesive. 9. A camera module, comprising a circuit board, a lens module and a curable glue, One end of the circuit board is provided with a connector, and the other end is a circuit board. The circuit board is provided with a photosensitive chip, a bracket covering the photosensitive chip and a plurality of mounting components. The photosensitive chip is electrically connected to the circuit board through wires, The bracket accommodates a filter; The lens module is a voice coil motor combined with a lens, and the lens includes a lens barrel and a number of lenses accommodated in the lens barrel; The curable glue is coated on the upper surface of the bracket, and is cured when the lens is focused on the photosensitive chip and the optical axis of the lens is aligned with the central normal of the photosensitive chip, so that the lens module and the bracket pass through the photosensitive chip. The curing glue is bonded. 10 . The camera module according to claim 9 , wherein the curable glue is an ultraviolet light curing glue, and is cured by ultraviolet light irradiation. 11 .