CN106919003A - Pattern formation method and device, pattern exposure method and manufacturing method - Google Patents
Pattern formation method and device, pattern exposure method and manufacturing method Download PDFInfo
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- CN106919003A CN106919003A CN201611176699.2A CN201611176699A CN106919003A CN 106919003 A CN106919003 A CN 106919003A CN 201611176699 A CN201611176699 A CN 201611176699A CN 106919003 A CN106919003 A CN 106919003A
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- substrate
- pattern
- plate shape
- shape substrates
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- 230000007261 regionalization Effects 0.000 title claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 370
- 230000007246 mechanism Effects 0.000 claims description 39
- 230000001914 calming effect Effects 0.000 claims description 33
- 239000000203 mixture Substances 0.000 claims description 32
- 230000008602 contraction Effects 0.000 claims description 27
- 230000008859 change Effects 0.000 claims description 19
- 238000007639 printing Methods 0.000 claims description 8
- 238000000059 patterning Methods 0.000 claims description 7
- 230000009471 action Effects 0.000 claims description 6
- 238000012545 processing Methods 0.000 description 67
- 230000002093 peripheral effect Effects 0.000 description 27
- 238000004088 simulation Methods 0.000 description 14
- 230000033001 locomotion Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 7
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
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- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
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- 230000018199 S phase Effects 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- 229910052757 nitrogen Inorganic materials 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
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- 238000007747 plating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
- B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
- B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
- B65H23/188—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in connection with running-web
- B65H23/1882—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in connection with running-web and controlling longitudinal register of web
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
- B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
- B65H23/24—Registering, tensioning, smoothing or guiding webs longitudinally by fluid action, e.g. to retard the running web
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2404/00—Parts for transporting or guiding the handled material
- B65H2404/10—Rollers
- B65H2404/13—Details of longitudinal profile
- B65H2404/131—Details of longitudinal profile shape
- B65H2404/1314—Details of longitudinal profile shape convex
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2406/00—Means using fluid
- B65H2406/10—Means using fluid made only for exhausting gaseous medium
- B65H2406/11—Means using fluid made only for exhausting gaseous medium producing fluidised bed
- B65H2406/111—Means using fluid made only for exhausting gaseous medium producing fluidised bed for handling material along a curved path, e.g. fluidised turning bar
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2511/00—Dimensions; Position; Numbers; Identification; Occurrences
- B65H2511/10—Size; Dimensions
- B65H2511/12—Width
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2511/00—Dimensions; Position; Numbers; Identification; Occurrences
- B65H2511/50—Occurence
- B65H2511/51—Presence
- B65H2511/512—Marks, e.g. invisible to the human eye; Patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2553/00—Sensing or detecting means
- B65H2553/40—Sensing or detecting means using optical, e.g. photographic, elements
- B65H2553/42—Cameras
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2601/00—Problem to be solved or advantage achieved
- B65H2601/20—Avoiding or preventing undesirable effects
- B65H2601/25—Damages to handled material
- B65H2601/254—Permanent deformation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2801/00—Application field
- B65H2801/03—Image reproduction devices
- B65H2801/15—Digital printing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2801/00—Application field
- B65H2801/61—Display device manufacture, e.g. liquid crystal displays
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Liquid Crystal (AREA)
- Advancing Webs (AREA)
- Controlling Rewinding, Feeding, Winding, Or Abnormalities Of Webs (AREA)
- Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
- Electroluminescent Light Sources (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
Abstract
The present invention provides a kind of pattern formation method and device, pattern exposure method and manufacturing method, and substrate is transported in long side direction, and the pattern of electronic component is formed in the processed surface of substrate, comprising：While being supported on the long side direction of substrate position at separate both set a distances 2 respectively using guiding elements, while between position at make substrate 2 in the short side direction orthogonal with long side direction in the way of given degree shrinks, the step of the part to both set a distances of substrate assigns long side direction tension force；Between position at 2, in the state of friction free state or contact area are small, using supporting member for substrate by the part in the face of the dorsal part of the processed surface of substrate, the step of supporting to plane or curved；The step of with the pattern for forming electronic component is set in the region of processed surface in a part of corresponding of the substrate supported using supporting member for substrate in the state of being shunk with given degree.
Description
The application is divisional application, and the Application No. 201280053802.8 of original bill, the applying date is on 09 27th, 2012,
Entitled " substrate board treatment and substrate processing method using same ".
Technical field
The present invention is on being used to impose the film machine plate such as film and sheet material the processing substrate of the high accuracy processing such as patterning
The carrying device of device and film substrate.Also, the purpose of the present invention is providing a kind of substrate for being used to implement high accuracy processing
Processing method.
Present application advocates the priority of Japan's Patent 2011-242788 filed in 4 days November in 2011, by it
Content is applied at this.
Background technology
As the display element for constituting the display device such as display equipment, such as having liquid crystal display cells, organic electric shock
Luminous (organic EL) element, the electrophoresis element etc. for Electronic Paper.As one of gimmick for manufacturing these elements, for example, there is one kind
It is referred to as the gimmick of volume to volume (roll to roll) mode (hereinafter referred to as (winding method)) (for example, referring to patent document
1)。
This kind of winding method, sends out a piece of sheet (sheet shapes) substrate (web) wound on supply substrate side wheel and incites somebody to action
The substrate of submitting reclaims side wheel and wind while transport substrate with substrate, during submitting substrate is extremely by winding,
The patterns such as display circuit and drive circuit are sequentially formed the gimmick on substrate.In recent years, it has been proposed that one kind forms high accuracy
The processing unit of pattern.
Look-ahead technique document Prior Art
[patent document 1] International Publication No. 2006/100868
The content of the invention
The invention problem to be solved
However, in response to higher precision situation when, if require nothing more than processing unit patterning precision (height parsing, transfer
Low distortion of pattern etc.) it is inadequate.
The purpose of aspect of the present invention, is providing a kind of substrate board treatment for carrying out high Precision Processing or accurate conveyance
The device of film substrate.Additionally, the purpose of another aspect of the invention, is providing a kind of processing substrate for carrying out high Precision Processing
Method.
To the means to solve the problem
A kind of 1st aspect of the invention, there is provided substrate board treatment, substrate is transported in the 1st direction and to the quilt of the substrate
Process face is processed, and is possessed：By substrate-guided the 1st guiding elements in the 1st direction；Separated with the 1st guiding elements
Configure, be used to guide the 2nd guiding elements of the substrate guided by the 1st guiding elements；In the 1st guiding elements and the 2nd
Tension force is assigned to the substrate between guiding elements, so that size reduction of the substrate in the 2nd direction that intersects with the 1st direction
Tension force imparting mechanism；And between the 1st guiding elements and the 2nd guiding elements, at the processed surface of the substrate
The processing unit of reason.
A kind of 2nd aspect of the invention, there is provided substrate processing method using same, the strip substrate of sheet is transported in length direction,
In predetermined pattern is sequentially formed on the substrate, possess；Acquirement make the subregion of the pattern to be formed of the substrate with the length
The step of information of shrinkage degree correlation when the orthogonal width in degree direction shrinks；And clip the base in the length direction
At specific the 2 of the subregion of plate between position, length direction is assigned to the substrate according to the information related to the shrinkage degree
Tension force the step of.
Invention effect
A kind of aspect of the invention, it is possible to provide substrate board treatment that can carry out high Precision Processing.Additionally, according to this
A kind of another aspect of invention, it is possible to provide substrate processing method using same that can carry out high Precision Processing.
Brief description of the drawings
Fig. 1：All schematic diagrames for constituting of the substrate board treatment of this embodiment.
Fig. 2：Show the front view of the 1st composition of the processing unit of this embodiment.
Fig. 3：Observe the top view of the 1st composition of Fig. 2 in top.
Fig. 4：Show the figure of the substrate retracted position of this embodiment.
Fig. 5：The chart of the change that the substrate that show is carried out with the 1st simulation shrinks.
Fig. 6：The chart of the change that the substrate that show is carried out with the 2nd simulation shrinks.
Fig. 7：The chart of the change that the substrate that show is carried out with the 3rd simulation shrinks.
Fig. 8：Show the chart of the condition that substrate contraction is obtained from analog result.
Fig. 9：Show the top view of the 2nd composition of the processing unit of this embodiment.
Figure 10：Show the front view of the 3rd composition of the processing unit of this embodiment.
Figure 11：The top view of the 3rd composition shown in Figure 10 viewed from above.
Figure 12：Show the figure of the 4th composition of the processing unit of this embodiment.
Figure 13：Display is with the figure of the 4th of Figure 12 the state for being constituted the substrate for being processed.
Figure 14：Show the top view of the 5th composition of the processing unit of this embodiment.
Figure 15：Show the top view of the 6th composition of the processing unit of this embodiment.
Figure 16：The front view of the 6th composition of Figure 15 is observed from transverse direction.
Main element label declaration：
5 alignment video cameras
10th, 10A, 10B processing unit
11 the 1st rollers
12 the 2nd rollers
11a, 12a hold-down roll
13 baskets
The bottom of 13B baskets
13m, 13n opening portion
13R reception rooms
13Wa baskets-X-axis side end face
13Wb baskets+X-axis side end face
14 baseplate carrier mechanisms
14a outer peripheral faces
15 drive divisions
16 guide rails
17 shifting rollers
18 alignment video cameras
113 base components
113g guide rails
115 fluid control units
116 gas blankets (air bearing)
120 planes keep tool
122 drive mechanisms
The foot of 126 processing heads
ALM alignment marks
Ae, As distance
ATB air turning-bars
CC axles
CONT control units
CR pads
The conveyance direction of Dx substrates
EA view fields
EX exposure devices
The edge of Ee1, Ee2 substrate
The edge of Es1, Es2 substrate
F tension force
HD processing heads
IFM surveys length and uses laser interferometer
IL Lighting Divisions
LMa stators
LMb can mover
M light shields
MD cylinder light shields
MH light shield maintaining parts
MST mask stages
Np gaps
P patterns
PA, PB area of the pattern
PD panel zones
PL projection optics system
S substrates
Sa processed surface
Part between Sr rollers
The Y direction size of TD substrates
Wx calming zone
Specific embodiment
《1st embodiment》
Hereinafter, this embodiment is illustrated with reference to schema.
Fig. 1 shows the schematic diagram of the composition of the substrate board treatment 100 of the present embodiment.
As shown in figure 1, substrate board treatment 100 has the substrate of supply belt base plate (for example, flat member of banding) S
Processing substrate portion (patterning device) 3, recovery substrate that supply department 2, surface (processed surface) Sa to substrate S are processed
The substrate recoverer 4 of S and control the control unit CONT in these each portions.Processing substrate portion 3, by substrate S from supply substrate portion
2 send out, to during reclaiming substrate S with substrate recoverer 4, various treatment are implemented on the surface to substrate S.
This substrate board treatment 100, can form such as display such as organic EL element, liquid crystal display cells unit on substrate S
The occasion of part (electronic installation) is used.
Also, in the present embodiment, as shown in figure 1, one XYZ coordinate systems of setting, below, appropriate this XYZ coordinate system of use comes
Illustrate.In XYZ coordinate systems, for example, X-axis and Y-axis are set along the horizontal plane, Z axis is set upward along vertical direction.Additionally, substrate
Processing unit 100, generally along X-axis, from-side (- X-axis side) past+side (+X-axis side) conveyance substrate S.Now, belt base plate
The width (short side direction) of S is set as Y direction.
In substrate board treatment 100, as the substrate S of process object, such as resin film and stainless steel etc. can be used
Paper tinsel (foil).For example resin film can be used polyvinyl resin, acrylic resin, polyester resin, ethylene vinyl alcohol copolymer tree
Fat, Corvic, celluosic resin, polyamide, polyimide resin, polycarbonate resin, polystyrene resin,
The materials such as polyvinyl alcohol resin.
Substrate S, it is preferable for example to bear the small person of hot coefficient of dilatation that the 200 DEG C of heat of degree its sizes will not also change.Such as
Can inorganic filler be mixed in into resin film to reduce hot coefficient of dilatation.As inorganic filler, for example, there are titanium oxide, zinc oxide, oxygen
Change aluminium, silica etc..Additionally, substrate S can be with the very thin glass monolith of 100 μm of degree of thickness of the manufactures such as float method or
In the very thin above-mentioned resin film of glass gluing and the laminate of aluminium foil.
The width (short side direction) of substrate S is dimensioned so as to such as 1m~2m degree, length direction (long side direction)
Size is then formed as such as more than 10m.Certainly, this size is only one, however it is not limited to this.For example, the Y direction chi of substrate S
Very little can be below 1m or below 50cm, can also be more than 2m.Furthermore, the X-direction size of substrate S can be below 10m.
Substrate S is formed in the way of with pliability.Herein, so-called pliability, refers to the power for applying deadweight degree to substrate
Also the property that will not be disconnected or rupture, aforesaid base plate can be bent.Additionally, the property bent by the power of degree of conducting oneself with dignity
It is contained in pliability.Also, the material of the above-mentioned visual aforesaid base plate of pliability, size, thickness or temperature etc. or environment etc. change.
Furthermore, substrate S can be that the substrate of multiple units is connected into shape using the composition, or use of a piece of belt base plate
Composition as banding.
Supply substrate portion 2, the substrate S that will be rolled into such as tubular is supplied toward the submitting of processing substrate portion 3.This occasion, in
Supply substrate portion 2 is provided with the axle portion of winding substrate S and makes rotating driving device of foregoing axle portion rotation etc..In addition, also may be used
Setting is for example used to cover cover (cover) portion for the substrate S for being rolled into tubular state etc..
Additionally, supply substrate portion 2 is not limited to be wound into the mechanism that the substrate S of tubular sends out, as long as comprising by band
Mechanism's (such as clipping driving rolls etc.) that shape substrate S sequentially sends out in its length direction.
Substrate recoverer 4, by by the substrate S of substrate board treatment 100, is such as reclaimed after being rolled into tubular.Yu Ji
Plate recoverer 4, with supply substrate portion 2 likewise, setting is used to wind the axle portion of substrate S and drives the rotation of foregoing axle portion rotation
Cover portion of substrate S that dynamic source and covering are reclaimed etc..If also, entering to be about to substrate S in processing substrate portion 3 is cut into flat board (panel)
For example substrate S is reclaimed during the situation of shape etc., or with overlap condition, the state different from tubular state is rolled into
Reclaim the composition of substrate S.
Processing substrate portion 3, the substrate S that will be supplied from supply substrate portion 2 relocates to substrate recoverer 4, and in conveyance process pair
The processed surface Sa treatment of substrate S.Processing substrate portion 3, with adding that the processed surface Sa to substrate S is processed
Work processing unit (pattern forming portion) 10 with comprising with driving rolls R of the condition of corresponding working process form conveyance substrate S etc.
Carrying device (substrate conveying unit) 20.
Processing device 10 has to the processed surface Sa of substrate S, is for example used to be formed the various dresses of organic EL element
Put.As this kind of device, for example, have to form the interval of the marking (imprint) mode of spaced walls etc. on processed surface Sa
Wall forming apparatus, the electrode forming apparatus for being used to be formed electrode and it is used to be formed luminescent layer forming apparatus of luminescent layer etc..
Specifically, have apparatus for coating liquid droplet (such as inkjet type apparatus for coating etc.), film formation device (such as plating apparatus,
Evaporation coating device, sputtering unit etc.), exposure device, developing apparatus, surfaction device, decontaminating apparatus etc..These each devices are along base
The transport path of plate S is appropriately arranged with, and can produce panel of flexible display etc. in so-called volume to volume mode.The present embodiment
In, as the setting exposure device of processing device 10, and optionally on line, responsible its front and rear step of (inline) setting is (photosensitive
Layer forming step, photosensitive layer development step etc.) device.
In processing substrate portion 3, the alignment video camera with action of pulling together as the processing device 10 of exposure device is provided with
5.The other detection of 5, video camera of alignment for example along substrate S-Y-axis side end edge and+Y-axis side end edge each formed to fiducial mark
Note ALM (reference picture 3).The testing result for being directed at video camera 5 is sent to control unit CONT.
Fig. 2 and Fig. 3 show the figure that the part in the processing substrate portion 3 of the 1st composition of the present embodiment is constituted.Fig. 2 is the 1st composition
Processing substrate portion 3 composition front view.Fig. 3 is the top view of the composition in the 1st processing substrate portion 3 for constituting.
As shown in Figures 2 and 3, processing substrate portion 3 has the 1st roller 11 (swing roller), hold-down roll 11a (rotation rollings
Wheel), the 2nd roller 12 (swing roller), hold-down roll 12a (swing roller), basket 13 and the exposure as processing device 10
Electro-optical device EX.
1st roller 11 is towards the side of basket 13 in the 1st guiding elements (substrate-guided component) of+X-direction guiding substrate S.1st
Roller 11, be set as in the conveyance direction upstream side (- X-axis side) of substrate S with respect to basket 13 it is parallel with Y-axis, be configured to with
Can be rotated by motor etc. centered on the parallel rotary shaft of Y-axis.Substrate S is clamped by the 1st roller 11 with hold-down roll 11a, and
It is supported to the court+X-direction conveyance as shown in arrow Dx.
2nd roller 12, by the substrate S from basket 13 it is past+X-axis side guiding the 2nd guiding elements (substrate-guided component).
2nd roller 12, be configured in the conveyance direction downstream side (+X-axis side) of substrate S with respect to basket 13 it is parallel with Y-axis, can
By the rotation such as motor centered on the rotary shaft parallel with Y-axis.Substrate S is clamped by the 2nd roller 12 with hold-down roll 12a, and
It is supported to the court+X-direction conveyance as shown in arrow Dx.
Basket 13 is configured between the 1st roller 11 and the 2nd roller 12.Basket 13 is for example formed as rectangular-shape.Basket 13
With bottom 13B, wall portion 13W.Bottom 13B composition baskets 13-Z axis side end face.Wall portion 13W by-X-axis side end face
The end face 13Wd of 13Wa, the end face 13Wb of+X-axis side, the end face 13Wc of+Y-axis side and-Y-axis side is constituted.
Additionally, in basket 13+Z axis side, if being configured with projection optics system PL during projection exposure mode, if proximity exposure side
Mask stage portion MST is then configured with during formula.
Inside the reception room 13R surrounded by wall portion 13Wa~13Wd and bottom 13B, it is provided with and substrate S is imposed at processing
The baseplate carrier mechanism (substrate supporting portion) 14 of reason (being herein exposure).Therefore, in basket 13-the end face 13Wa shapes of X-axis side
Into there is the opening portion 13m that passes through the substrate S moved into from the 1st roller 11.Additionally, in basket 13+the end face 13Wb of X-axis side,
It is formed with the opening portion 13n for taking out of substrate S toward the 2nd roller 12 from reception room 13R (baseplate carrier mechanism 14).
In bottom 13B-Z axis side, be formed with shifting roller 17.Shifting roller 17 is placed in guide rail 16.Guide rail 16 is supported
In the support (not shown) in processing substrate portion 3, ground of such as factory etc..Guide rail 16 is along X-direction (or Y direction) shape
Into.Basket 13 is arranged to can be mobile in X-direction (or Y direction) along guide rail 16 by drive mechanism (not shown).This basket
13 by the movement of shifting roller 17 and guide rail 16 not necessarily.
In in the 13R of resettlement section, be provided with baseplate carrier mechanism 14, alignment video camera 18 (equivalent to the alignment video camera in Fig. 1
5).Baseplate carrier mechanism 14, is (below, to claim between the 1st roller 11 and the 2nd roller 12 in a non contact fashion in supporting substrates S
" part Sr between roller ") a part, and there is the outer peripheral face 14a for example formed as cylinder planar, its outer peripheral face 14a with order to
The pad component (Porous mattress etc.) that FDB layer is formed between substrate S is constituted.
Baseplate carrier mechanism 14, is provided with while making pad component ejecting fluid (air, nitrogen), one of composition outer peripheral face 14a
While attracting the fluid control unit 115 of the fluid of the ejection.
Drive division 15 comprising driving sources such as multiple motors, is used to make the position of baseplate carrier mechanism 14 (outer peripheral face 14a)
And the component of the micro change of posture, it is substantially carried out toward Z axis, X-axis, the fine motion of all directions of Y-axis and past θ Z-directions (about the z axis)
With each rotation fine motion of θ X (around X-axis).Drive division 15 and uses the 1st roller the 11, the 2nd with the control of the control unit CONT in Fig. 1
The conveyance control of the substrate S of roller 12 is synchronous, adjustment drive volume and sequential etc..
2 alignment video cameras 18, as shown in figure 3, detection is formed in Y direction (width) two ends of substrate S respectively
The alignment mark ALM in portion.Alignment mark ALM along in substrate S+end edge of Y-axis side and the end edge of-Y-axis side form multiple.It is many
Individual alignment mark ALM is in X-direction equidistantly configuring.Alignment video camera 18 towards in substrate S by 14, baseplate carrier mechanism
The part held, in the other inspection in front (- X-direction) position of slit-shaped view field EA (reference picture 3) of exposure device EX
Survey alignment mark ALM.That is, video camera 18 is directed in the conveyance direction of substrate S, in the more upper position in position compared with view field EA
Put, indivedual detection alignment mark ALM.The testing result for being directed at video camera 18 is sent to control unit CONT.
Alignment video camera 18 is the picture of the alignment mark ALM that will be amplified with microscope, is photographed with solid bodies such as CCD and CMOS
Element is subject to the microscope shoot system of light.The microscope shoot system in the viewing area on substrate S, about tens of μm of length and width
The scope of~hundreds of μm of degree.Therefore, in order to be able to observe alignment mark ALM really in this kind of narrow and small viewing area, for example
The linear pattern of line width number μm~20 μm degree is formed on substrate S or by parallel arrangement several the lattice of the linear pattern such as this
Sub- shape pattern.
Additionally, as shown in Fig. 2 exposure device EX has Lighting Division IL and mask stage MST.Lighting Division IL is towards substrate S
In-Z-direction illumination slit shape illumination light.Mask stage MST keeps being formed with the light shield M of predetermined pattern P.In mask stage
MST is provided with the light shield maintaining part MH that can keep various sizes of light shield M.Mask stage MST is configured to by (not shown)
Drive device is displaced into X-direction, is moved with the speed of the X-direction conveyance speed sync with substrate S.
The movement of mask stage MST can be controlled by with control unit CONT.Above-mentioned exposure device EX, will shine from Lighting Division IL
Penetrate, via light shield M exposure light picture (occasion of projection exposure mode be projection optics system PL formed aerial image, proximity
The occasion of Exposure mode is then image) project to view field EA (reference picture 3).Additionally, in the present embodiment, view field EA's
The shape of slit that shape extends with the crest line parallel elongate of the cylindric outer peripheral face 14a of baseplate carrier mechanism 14.
As shown in Fig. 2 substrate S by the 1st roller 11 after being clamped, roll up in a non contact fashion in the outer of baseplate carrier mechanism 14
After the first retainer of side face 14a point, fed by the 2nd roller 12, transported such as arrow Dx.The present embodiment, as shown in figure 3,
Between 1st roller 11 and the 2nd roller 12, the conveyance of the tension force F to substrate S imparting conveyance direction is carried out.
Specifically, the rotation by control unit CONT with the rotary speed (peripheral speed) of the 2nd roller 12 with respect to the 1st roller 11
The slightly fast mode of rotary speed (peripheral speed) controls each motor.During this is constituted, the 1st roller 11 and the 2nd roller 12, to accurate control
Make the drive motor of the peripheral speed (or torsion) of the grade roller and the electrical control system (containing formula) of the motor, equivalent to
Power imparting mechanism.
As it was previously stated, when the tension force F of X-direction is assigned to substrate S, if as shown in figure 3, setting into before the 1st roller 11
Substrate S Y direction size (width) for if TD0, between the 1st roller 11 and the 2nd roller 12, the Y direction size
(width) is to shrink and turn into TD1.That is, rolled in the 1st roller the 11 and the 2nd of X-direction distance of separation L (true length of substrate S)
Between wheel 12, when drawing substrate S with tension force F, substrate S is have the tendency of to be shunk in X-direction stretching, extension, in Y direction.
In the occasion of the initial stage width TD0 that substrate S is sufficiently above apart from L, as shown in figure 3, by simulation, learn from the
1 roller 11 toward+X-direction to the scope apart from As and to before the 2nd roller 12 (- X-direction) apart from Ae
Scope, contraction change rate (X-direction per unit Y direction amount of contraction (shrinkage degree) long) though it is larger, from the 1st roller
11 scopes toward+X-direction to apart from As and from the 2nd roller 12 toward between-scope of the X-direction to apart from Ae
Scope, the almost unchanged and stable scope of a contraction change rate (shrinkage degree) can be obtained.Therefore, in the present embodiment, make
The calming zone of the contraction change rate of the Y direction of one substrate S substantially certain (substantially 0), and view field EA is set in
The calming zone is exposed.
Fig. 4 is the simulation, and illustrates the figure of the retracted position of substrate in an exaggerated manner, the 1st clamped roller 11 of display
With the substrate S between the 2nd roller 12 apart from L, the state during situation of the initial stage width TD0 more than substrate S.When with tension force F in X
When direction of principal axis draws substrate S, from the past+X-direction of the 1st roller 11 to the scope apart from As, edge Es1, Es2 of substrate S is produced
Initial stage width TD0 compared with substrate S toward inner side retraction deformation, from the 2nd roller 12 toward-model of the X-direction to apart from Ae
Enclose, then edge Ee1, Ee2 of generation substrate S returns to the deformation of the initial stage width TD0 of substrate S.
And from the past+X-direction of the 1st roller 11 to the scope apart from As and from the past-X-direction of the 2nd roller 12 to distance
The scope apart from Wx between the scope of Ae, obtains the calming zone that a substrate S is contracted to substantially one fixed width TD1.
Calming zone according to the pattern transfer printing precision in view field EA, (allow by relative magnification error and aliasing error
Scope) determined.It is the first of substrate S with the Y direction size of view field EA as one of simulation example in the present embodiment
Said premised on the accurate exposure of less than several μm fine patterns of size of 80~90% degree and transfer of phase width TD0
It is bright.
For example, width TD0 is 300mm in the early stage, Y direction size is the occasion of 260mm in the design of view field EA,
When wet process and dried process via preceding step make substrate S integrally stretch 50ppm degree, projected area on counterpart substrate S
The Y direction size of domain EA is to stretch 13.0 μm.This value, represents and is overlapped after by the pattern of several μ m in size with high accuracy positioning
During exposure, maximum 13.0 μm site error (aliasing error) can be caused, be intended to carry out the exposure-processed right and wrong of precision under this state
It is often difficult.
During the situation of the PET film of typical film substrate, stretched because of processing procedure sometimes up to 100ppm degree.When in order to
Manufacture giant display and increase the initial stage width TD0 and view field EA of substrate S, and set Y-axis in the design of view field EA
Direction size is 520mm (TD0=600mm), and substrate S is when integrally stretching 100ppm, and the maximum extension amount of Y direction will exceed
50μm。
Additionally, in general, the permissible range of the aliasing error of exposure device and site error, is pattern chi to be transferred
One degree of several points of very little (or line width).Thus, for example the minimum dimension (line width) of pattern to be transferred is for if 3 μm, it is overlapped
The permissible range of error and site error is 0.6 μm.That is, during the exposure of reality, the Y direction in view field EA is any
Point, must all make aliasing error and site error below 0.6 μm.
Therefore, in the present embodiment, change 2 rollers 11,12 between substrate S apart from L, the initial stage width of substrate S
Various simulations have been carried out in the case of TD0, substrate thickness t, tension force F, Poisson's ratio (Poisson's ratio), young's modulus, will
The scope for meeting following 2 conditions is set to calming zone.
(1) obtain and shunk towards substrate S centers, the Y direction in X-direction per 30mm pitches from 2 rollers (11,12)
Amount, the variable quantity is less than 0.3 μm (contraction change rate substantially 0).
(2) variable quantity be less than 0.3 μm scope entirety in, shrink substrate S width TD1 absolute value change it is wide
Degree is within 1.5 μm.
These value conditions are in simulation, the extension of the substrate S that actual numerical value is caused depending on processing procedure, pattern to be transferred
The permissible range of minimum dimension, aliasing error and site error etc. suitably determined.
Substrate S between 2 rollers 11,12 is set to 100cm, initial stage width TD0 and is set to 30cm, base by Fig. 5 simulations apart from L
The thickness t of plate S is that 100 μm of PET film (Poisson's ratio is set as that 0.35, young's modulus is set as 4GPa) is object, tension force F points
The chart of the contraction distortion state (amount of contraction, shrinkage degree) when not being changed to the situation of 20N, 50N, 100N, 150N.Transverse axis position
Set to 0 the clip position that cm and 100cm distinguishes the 1st roller 11 and the 2nd roller 12.
The change as shown in figure 5, maximum collapse amount and the size of tension force F are substantially directly proportional.Additionally, substantially certain in amount of contraction
Scope that is, the width of calming zone narrow as tension force F becomes big.When tension force F is 20N degree, from two ends to 10cm journeys
It is nonlinear shrinkage untill degree, the calming zone width of 80cm degree can be obtained.When tension force F is 150N, from two ends to 20cm journeys
It is nonlinear shrinkage untill degree, the width of calming zone is 60cm degree.
Fig. 6 shows and compared with the situation of Fig. 5, by the point that 40cm is contracted to apart from L of the substrate S between 2 rollers 11,12
Outward, the chart of analog result when other conditions are all identical.Situation with Fig. 5 is compared, and 40% will be contracted to apart from L, in each
Calming zone width obtained by tension force F also accordingly narrows.Additionally, in simulation, with the reduction apart from L, the nonlinear shrinkage of both sides
Scope has the tendency of to become big.
For example, when tension force F is 20N, from two ends to 10cm degree for non-linear under conditions of Fig. 5, but in the situation of Fig. 6
When, it is non-linear from two ends to 14~15cm degree.
Substrate S between 2 rollers 11,12 is set to 100cm by Fig. 7 simulations apart from L, the thickness t of substrate S is 100 μm
PET film (Poisson's ratio is set as that 0.35, young's modulus is set as 4GPa) is object, and tension force F is set as 100N, and the initial stage is wide
The chart of the contraction distortion state (amount of contraction, shrinkage degree) when degree TD0 is changed to the situation of 40cm, 60cm, 100cm respectively.
Initial stage width for 100cm situation (that is, L=TD0), the calming zone of eligible is not obtained, in apart from L's
It is overall that nonlinear contraction is presented.But it is 60cm, 40cm as initial stage width TD0 is gradually decreased, that is, occurs in that calming zone.
The width Wx1 of calming zone during TD0=60cm be slightly below 30cm, calming zone when TD0=40cm width Wx2 then
About 60cm.
Additionally, also change the Poisson's ratio of different substrate S, young's modulus, thickness t be simulated, but calming zone
There is tendency and have no too big difference, from the point of view of the analog result as shown in Fig. 5~7, it is known that the master helpful to the appearance of calming zone
It is apart from the ratio between L and initial stage width TD0 to want reason.
Fig. 8 as substrate S with PET film as object, with the ratio (TD0/L) between the relative clampings of initial stage width TD0 apart from L
For the width Wx of the longitudinal axis, calming zone is transverse axis apart from the ratio (Wx/L) of L with respect to this, analog result several times is shown
Chart.
The analog result of pictorialization is the situation that tension force F is all set to 100N, links 1.0 line with the 1.0 of transverse axis of the longitudinal axis
The occasion of the resinous thins such as the boundary on BS representation theories, PET film, the tendency occur in the lower-left of line BS, without
Come across upper right.
Line Sim1 thickness t in Fig. 8 is 200 μm, Poisson's ratio is gained analog result when 0.3, young's modulus is 6GPa
Averagely, line Sim2 then representative thickness t be 100 μm, Poisson's ratio be the average of gained analog result when 0.4, young's modulus is 4GPa.
The occasion of representational PET film, result is substantially distributed between line Sim1 and line Sim2 under simulation.
However, when the extreme thin or surface area layers of thickness t have the situation of certain film, though there have result to occur to be online
The situation of the lower left of Sim2, but never appear in the upper right of boundary line BS.
From the tendency of above-mentioned analog result, when each data that above-mentioned Fig. 2, Fig. 3 shown device is constituted can be learnt, for example,
The Y direction amount of contraction (shrinkage factor, shrinkage degree) of needed substrate S and therefore needed tension force F in view field EA
Size when, can in advance obtain the width of the calming zone of the bottom line that be can ensure that by tension force F, apart from L and initial stage
The relation of width TD0 three, therefore substrate carrying channel length (apart from L) of the roller 12 of the 1st roller 11 to the 2nd can be given most preferably
Change.
Secondly, illustrate to manufacture organic EL element, liquid crystal display unit using the substrate board treatment 100 for constituting in the above described manner
The step of display elements such as part (electronic component).Substrate board treatment 100 is according to formula (the processing bar for being set in control unit CONT
Part, sequential, drive parameter etc.) control, manufacture foregoing display element.
First, will roll up and be wound in supply substrate portion 2 in the substrate S of roller (not shown).Control unit CONT makes (not shown)
Roller rotation sends out aforesaid base plate S from supply substrate portion 2 with from this state.And by by the aforesaid base plate S in processing substrate portion 3
Wound with the roller (not shown) located at substrate recoverer 4.
Control unit CONT, during substrate S is sent to be wound with substrate recoverer 4 from supply substrate portion 2, with base
The appropriate conveyance substrate S in aforesaid base plate processing unit 3 of the carrying device 20 of plate processing unit 3.
When substrate S to the conveyance in processing substrate portion 3 is exposed treatment using exposure device EX, first, control unit
CONT, in the state of with the 1st roller 11 and hold-down roll 11a clamping substrates S, make in substrate S compared with the 1st roller 11 more-X-axis
The partial relaxation of side.Additionally, control unit CONT, in the state of substrate S is clamped with hold-down roll 12a with the 2nd roller 12, makes base
In plate S compared with the 2nd roller 12 more+partial relaxation of X-axis side.By this act, can opposing substrate S other parts independence tune
The tension force (tension force F) of part Sr between whole roller.
Afterwards, control unit CONT is by the 1st roller 11, hold-down roll 11a, the 2nd roller 12 and hold-down roll 12a, one side
Between pair roller part Sr add set tension force, while with set conveyance speed in+X-direction conveyance substrate S.
Control unit CONT is used up, and make mask stage MST in the state of conveyance substrate S from Lighting Division IL irradiation exposures
Past+X-direction movement.Now, control unit CONT makes the translational speed of mask stage MST and the conveyance speed sync of substrate S.
Acted by this, the processed surface Sa of the substrate S moved for past+X-direction, via the exposure light of light shield M
It is projected the pattern P that forms light shield M in scan exposure mode in foregoing processed surface Sa in view field EA (reference picture 3)
Picture.
When this kind of exposure actions are carried out, control unit CONT between the 1st roller 11 and the 2nd roller 12 by assigning slightly
Rotary speed it is poor, the tension force F of the X-direction needed for being assigned to substrate S is so that the initial stage width TD0 of substrate S shrinks and adjusts
Area of the pattern in the Y direction size and the processed surface Sa to substrate S to be transferred of the area of the pattern on light shield M be (substrate
Subregion) Y direction size relative error (with respect to magnification error).
Additionally, the present embodiment, due to using view field EA to be made the elongate slit shape for extending Y direction, in X-axis
Direction is scanned the mode of exposure, therefore view field EA is that essence on substrate S is exposed region.Therefore, substrate S
Y direction size adjusting (shrinking correction) only needs at least to be exposed region (subregion of substrate) implementation to this, not
The Y direction size adjusting (shrinking correction) that all to 1 on substrate S area of the pattern must implement substrate S.
The present embodiment, as shown in figure 3, the downside of part Sr is by the stream of the outer peripheral face 14a of baseplate carrier mechanism 14 between roller
Body bearing layer is supported, therefore substantive friction is there's almost no at this.Therefore, between the roller of substrate S part Sr in aggravate direction
X-direction can extend, and with aggravate the Y direction intersected of direction, the initial stage, width TD0 can be shrunk to TD1.
The Y direction of part Sr is shunk between the roller for showing substrate S slightly exaggerated in Fig. 3, and baseplate carrier mechanism 14
Outer peripheral face 14a be then set in the width of the calming zone that can equally obtain contracted width TD1.
Additionally, after by the 2nd roller 12, because the tension force F that script acts on substrate S can be eliminated, therefore substrate S can be because
Elasticity and recover tension force assign before shape.That is, substrate S can be received from the state of Fig. 3 toward Y direction elongation and toward X-direction
Contracting.Therefore, after the pattern P of light shield M is transferred in the substrate S of the state of Y direction to the contraction shown in Fig. 3, when tension force F is eliminated
When, it is transferred to the area of the pattern (subregion of substrate) of processed surface Sa and with the ratio same with substrate S-phase in Y direction
Extend and then shunk in X-direction.
The present embodiment, is made in the elongate slit shape of Y direction extension using by view field EA, is carried out in X-direction
The mode of scan exposure.Therefore, for the relative magnification error (calibration (sacling) error) of X-direction, can be by throwing
Original synchronized relation, the Sv=kMv of the translational speed Mv of the conveyance speed Sv and light shield M of the substrate S of shadow zone domain EA are (if near
Then k is 1, is the multiplying power of projection system if projection exposure mode to connect Exposure mode) the imparting speed difference (X of counterpart substrate S slightly
Direction of principal axis extension rate) adjusted.
If additionally, in substrate S processed surface Sa as the area of the pattern (subregion of substrate) of bottom with wet type system
Journey (coating step or etching step etc.) etc. is formed, and during at this by the situation of the area of the pattern overlapping exposures of light shield M, substrate
S is possible to produce larger extension in wet process.
During this kind of situation, in especially known proximity Exposure mode, by the area of the pattern on light shield M with have been formed on base
The area of the pattern (subregion of substrate) of plate S, adds to good less than Y direction (direction orthogonal with scan exposure direction)
Correction with overlap that is, the calibration error of Y direction is extremely difficult.
In the present embodiment, opened by assigning conveyance direction (X-direction) to substrate S with the 1st roller 11 and the 2nd roller 12
Power, and the Y direction size of part Sr between the roller of substrate S can be made to be shunk in the scope of elastic deformation, is constituted reality with simple
The correction of the calibration error of the Y direction being now not readily accomplished in the past.
From the above, control unit CONT, can assign opening for substrate S by while calming zone is ensured, while changing
The size of power F adjusts the Y direction amount of contraction of substrate S, is located with substrate S with the Y direction size for adjusting exposing patterns
The relative ratios of the Y direction size of reason face Sa.Therefore, the Y-axis of the mask pattern picture for being transferred to substrate S can substantially be adjusted
The relative multiplying power in direction.
Substrate S toward Y direction amount of contraction to the tension force F of the X-direction of reply substrate S.Therefore, in control base board S toward Y
The occasion of the amount of contraction of direction of principal axis, the in advance simulation and experiment etc. through above-mentioned Fig. 5~Fig. 8 is obtained to the X-direction of substrate S
, used as data, the 1st roller 11 of control, the action of the 2nd roller 12 are with right for relation between the amount of contraction of tension force F and Y direction
Substrate S apply correspondence institute palpus amount of contraction tension force F.
When above-mentioned action is carried out, control unit CONT obtains amount of contraction (or shrinkage factor, the contraction of substrate S in the following manner
Degree).First, control unit CONT, detected using alignment video camera 18 be formed in substrate S-alignment mark of Y-axis side end edge
ALM be formed in+alignment mark the ALM of Y-axis side end edge.It is right that control unit CONT is calculated according to the testing result of alignment video camera 18
Fiducial mark remembers the Y direction distance of ALM, and the Y direction size (width after contraction of part Sr between roller is calculated according to afore-mentioned distance
TD1).Afterwards, control unit CONT, using the Y direction size of space for calculating result and pre-recorded alignment mark ALM, calculates
Go out the amount of contraction (or shrinkage factor, shrinkage degree) of substrate S.
Additionally, in above-mentioned experiment and simulation etc., the Y direction for obtaining counterpart substrate S in advance as data information is shunk
The X-direction elongation of amount, the translational speed of mask stage MST and the conveyance speed of substrate S are adjusted according to X-direction elongation
Degree, can substantially adjust the relative multiplying power (calibration error) of the X-direction of mask pattern picture.
Control unit CONT, in the occasion of the conveyance speed of the translational speed and substrate S of adjustment mask stage MST, if foregoing
Mask stage MST is past+and the translational speed of X-direction is Mv, conveyance speed (the outer peripheral face 14a of baseplate carrier 14 of aforesaid base plate S
Circumferential direction speed) for Sv, X-direction calibration error (extension rate) for if A (ppm), following formula (1) must be met.
Sv=kMv (1+A) or Sv (1-A)=kMv ... (1)
Wherein, if if proximity Exposure mode then k be 1, projection exposure mode then k be projection system multiplying power.
If additionally, if proximity Exposure mode, control unit CONT is to be carried by the suitably adjustment substrate of the drive division 15 in Fig. 2
The posture of platform mechanism 14 (outer peripheral face 14a) and position, by the view field EA on substrate S and the gap between light shield M and parallel
Degree setting is within the specific limits.
As previously discussed, according to the present embodiment, in the processing substrate portion 3 that the processed surface Sa to substrate S is processed, in
Substrate S is transported between the 1st roller 11 of X-direction and the 2nd roller 12, in the receipts for making the Y direction size of substrate S stable
Treatment is exposed in the state of contracting, therefore can simply adjust relative multiplying power (calibration error), realize high-precision patterning.
Also, can also transport substrate S's using the occasion of other devices different from exposure device EX in processing unit 10
Relative size between the roller of conveyance side adjustment substrate S between part Sr and the scope processed by processing unit 10.
Using the processing unit 10 beyond the exposure device EX of light shield, such as ink-jet table printing machine, using DMD etc. without light shield
Exposure machine, scanning laser point also can all be applicable the present embodiment to carry out laser beam printer etc. of pattern plotter.
Technical scope of the invention is simultaneously defined in above-described embodiment, is not departing from the range of idea of the invention, certainly may be used
Appropriate is changed.
For example, in the composition of above-mentioned Fig. 2, Fig. 3, alignment video camera 18 only view field EA-X-direction position sets
Put one group.But as shown in figure 9, may also set up configuration view field EA-one group of alignment video camera of X-direction position
One group of alignment the video camera 18b, 18e and configuration of 18a, 18d, configuration in X-direction position roughly the same with view field EA
View field EA rear positions (position of+X-direction or in substrate S conveyance direction view field EA downstream bits
Put) one group of alignment video camera 18c, 18f total totally 6 alignment video cameras (microscope shoot system).
When configuration multiple as shown in Figure 9 is directed at video camera 18a~18f, the substrate S's comprising view field EA is local
Face shape distortion (micro-strain in XY faces), can be instant in each pitch of the X-direction of alignment mark ALM, lasting
Measured.Accordingly, it is capable to the distortion inaccuracy slightly and multiplying power of the high-precision specific substrate S in view field EA are missed
Difference, and instant to relax error adjustment assign substrate S the size of tension force F and the position of baseplate carrier mechanism 14 and
Posture.
As described above, in the occasions of the multiple alignment video camera 18a~18f of configuration, the mark test position of each video camera,
It is desirable to be included in the calming zone Wx of substrate S.
Additionally, as the drive mechanism of the mask stage MST for driving exposure device EX, can be used shown in Figure 10, Figure 11
Linear motor mechanism LM.
Figure 10, Figure 11 show the composition of the scanning-exposure apparatus of proximity mode, and mask stage MST is with stator
LMa with can mover LMb linear motor mechanism LM be subject to precision driving.
Stator LMa extends X-direction.In stator LMa, being arranged along X-direction has multiple lines (not shown)
Circle.Stator LMa is provided with a pair in Y direction across mask stage MST.A pair of stator LMa have in mask stage MST sides
Groove portion.This groove portion is formed along X-direction.
Can mover LMb, be respectively provided at mask stage MST+side and the side of-Y-axis side of Y-axis side.Respectively can mover
LMb has magnetite respectively.Can mover LMb insert the groove portion of corresponding stator LMa respectively.Can mover LMb can be along foregoing groove portion
It is displaced into X-direction.A pair of guiding face 13g of supporting mask stage MST are provided with the top of basket 13, with by can mover LMb
Toward the movement of X-direction, mask stage MST is set to be moved toward X-direction.
In the composition of the present embodiment, it is set as from conveyance substrate S approximate horizontal between the roller 12 of the 1st roller 11 to the 2nd,
It is configured to the outer peripheral face 14a of the baseplate carrier mechanism 14 of rotation drum, is contacted in minimum region with the back side of substrate S.That is,
Make the X-direction width of view field EA small as far as possible, and outer peripheral face 14a is wide with the X-direction of the contact area of substrate S
Degree is made the X-direction width with slit-shaped view field EA with the small of degree.
Further, the present embodiment, baseplate carrier mechanism 14 (rotational circle cylinder) outer peripheral face is made with the control of drive division 15
Conveyance speed syncs of the substrate S of peripheral speed and the 1st roller 11 and the 2nd roller 12 toward X-direction.
This occasion, because the contact area of the outer peripheral face 14a and substrate S of baseplate carrier mechanism 14 prolongs in Y direction is elongated
The slit-shaped and X-direction width stretched are sufficiently narrow, while the conveyance of baseplate carrier mechanism 14 (rotational circle cylinder) and substrate S
Speed sync rotates, therefore when the tension force F of X-direction is assigned to substrate S between the 1st roller 11 and the 2nd roller 12, i.e., such as
Shown in above-mentioned Fig. 4, substrate S shrinks in Y direction.
Certainly, the slit-shaped region for being contacted with the outer peripheral face 14a of baseplate carrier mechanism 14 in substrate S can produce friction.So
And, if the region X-direction width fully it is small if, can hardly receive the frictional influence in the case of, substrate S is substantially
Such as the contraction of Fig. 4.
In the composition of this Figure 10, Figure 11, the tension force F (X-direction) when being transported by control base board S can make substrate S's
Width (Y direction) shrinks, and can adjust relative scale error (the particularly relative calibration of Y direction when patterning
Error).
Additionally, in this composition, due to making the X-direction width of view field EA sufficiently small, therefore can make Fig. 4, Fig. 5~
The narrow width of the calming zone Wx illustrated by Fig. 8, the 1st roller 11 is shorter with what the interval (apart from L) of the 2nd roller 12 can also be made,
Therefore all miniaturizations of device can be made.
Additionally, setting the composition of multiple processing units as shown in figure 12, or in X-direction.In Figure 12, in X-axis
Direction is configured with 2 exposure device EX (Fig. 2,3 device or Figure 10,11 device) identical compositions having with above-described embodiment
Processing unit 10A and 10B.Between processing unit 10A with light shield M1 and the processing unit 10B with light shield M2, it is provided with
It is used to the tension force blocking mechanism 60 of the tension force for interdicting substrate S.
The occasion for the treatment of is exposed to substrate S using 2 processing unit 10A and 10B, such as shown in Figure 13, can by with
Area of the pattern (subregion of the substrate) PA of the light shield M1 exposures of processing unit 10A exposes with the light shield M2 of processing unit 10B
The mode that area of the pattern (subregion of the substrate) PB of light is arranged in X-direction interaction, in each processing unit 10A and 10B phases
Treatment is exposed away from certain intervals.
This occasion, for example, can ensure that past+X-direction when the mask stage MST that X-direction moves back and forth is in exposure-processed
After movement, it is past-X-direction return time.
Furthermore, in this kind of composition, each pattern P of each light shield M1, M2 of processing unit 10A, 10B is installed on, differ
Surely must be identical.For example can be the exposure that 36 inch display panel patterns are carried out in processing unit 10A, and be filled in treatment
Putting 10B then carries out the exposure of 40 inch display panel patterns.
Also, in above-described embodiment, though it is to be described as a example by a situation for shape of slit to lift view field EA, do not limit
In this.For example can also be slit-shaped exposure area in Y direction arrange a plurality of formation, and the grade exposure area with it is interactive in
The composition of the so-called zigzag configuration of the state configuration that X-direction staggers.
This occasion, the entirety (relative when in the subregion of substrate) for configuring saw-toothed multiple exposure areas is set to
In the calming zone Wx determined according to the maximum tension F of scenario.
Additionally, such as previous explanation, above-mentioned each substrate for being used to make substrate S be shunk in Y direction implemented shown in aspect
The composition of conveyance, can as light exposure, ink jet printing, laser description, static printing etc. need precise pattern various treatment
The transport mechanism of device.But, from the viewpoint of with regard to production, can most be expected with being exposed using the light of cylinder light shield.
Figure 14, is that penetrating type cylinder light shield MD is combined with the substrate transport mechanism of the embodiment of above-mentioned Fig. 2, Fig. 3
One of proximity exposure device.
In Figure 14, cylinder light shield MD thickness is quartz hollow cylinders processed more than several millimeters, is formed in the drum surface and schemed
Case P.Pad CR that cylinder light shield MD is supported through air bearing etc. is held in device, is with the axle CC for extending Y direction
Center is in rotation in XZ faces.Its rotary speed is with the outer peripheral face (formation of pattern P of the conveyance speed of substrate S and cylinder light shield MD
Face) the synchronous mode of peripheral speed set.Is configured with inside cylinder light shield MD and pattern P is projeced into Y direction is elongated to prolong
The illumination of the slit-shaped illumination light stretched is IL.
Substrate S is passed through gas blanket (air bearing) 116 along bearing-surface 14a with Fig. 2 identical baseplate carriers mechanism 14
(convex barrel surface) is supported, and to make being located for the substrate S on the nethermost part of outer peripheral face of cylinder light shield MD and bearing-surface 14a
Reason face Sa can keep set proximity, gap (tens of μm~hundreds of μm), and carry out baseplate carrier mechanism (support pads portion) 14 or circle
The fine setting of the Z-direction position of cylinder light shield MD.
In the present embodiment, baseplate carrier mechanism 14 makees comprising gas supply device, gas supply road and multiple supply openings etc.
It is gas blanket forming portion.
The transport mechanism of substrate S is with contactless air turning-bar (turn bar) ATB, the 1st roller 11, hold-down roll
11a, the 2nd roller 12, hold-down roll 12a are constituted, and substrate S is assigned between the roller 12 of the 1st roller 11 to the 2nd also in the present embodiment
The tension force of X-direction is given, substrate S is shunk in Y direction according to this.Therefore, the drive motor of each roller is controlled, makes the 2nd roller
12 peripheral speed (torque) is compared with the big given amount of the peripheral speed (torque) of the 1st roller 11.
Additionally, such as in the composition of Figure 14, curvature (radius) and the baseplate carrier mechanism 14 of the outer peripheral face of cylinder light shield MD
The curvature of cylindric bearing-surface 14a might not be consistent, and the curvature of bearing-surface 14a is decided to be the stabilization branch that can reach substrate S
Hold and determined with conveyance, the diameter of cylinder light shield MD size then according to display panel to be exposed.
In each embodiment discussed above, as processing unit 10, with sweeping using planar light cover M or cylinder light shield MD
As a example by retouching type exposure device.However, the transport mechanism of the present embodiment is equally applicable on the substrate S for forming display panel
The region-wide plane that is temporarily adsorbed in keep device of the tool to be exposed.
Figure 15, Figure 16 show that substrate S is adsorbed in into plane keeps tool to be exposed one of the device for the treatment of, such as Figure 15
Top view shown in, be formed with multiple panel zones (subregion of substrate) PD at certain intervals in X-direction on substrate S.
The present embodiment, can be in the calming zone Wx that the Y direction of substrate S is shunk with an X-direction width of panel zone PD
Mode, the X-direction between the 1st roller 11 of setting and the 2nd roller 12 is spaced (apart from L).
Additionally, being apart from As from the 1st roller 11 of substrate S to rear (+X-direction) to avoid panel zone PD from configuring
Non-linear region only and the non-linear region from the 2nd roller 12 toward-X-direction untill the Ae, panel zone PD is in X
The mode with gap Np (Np ＞ As, Ae) of direction of principal axis is arranged.
In the present embodiment, by substrate S toward X-direction transport and reach state shown in Figure 15, that is, substrate S be located at wait to expose
When light or a panel zone PD of drawing processing are in calming zone Wx, that is, stop the drive of the 1st roller 11 and the 2nd roller 12
It is dynamic, temporarily cease the conveyance of substrate S.
As shown in figure 16, between the 1st roller 11 and the 2nd roller 12, substrate S keeps flat above tool 120 with plane
Smooth adsorption plane is almost parallel to be transported in X-direction.
In under the state, as shown in figure 16, plane keep the X-direction width of 120 (adsorption planes) of tool be set as by comprising
In calming zone Wx, and adsorb the entirety of panel zone PD.
When panel zone PD is positioned at into plane holding 120 top of tool, supporting plane keeps the base component of tool 120
113 is mobile toward top (+Z-direction) i.e. by the drive mechanism 122 of Z-direction, is uniformly contacted with the back side of substrate S
When plane keeps the adsorption plane of tool 120, stop the driving of Z-direction.
Also, the back portion of the corresponding panel zone PD of substrate S, is protected by the way that vacuum suction or Electrostatic Absorption are temporary transient
It is held in plane and keeps tool 120.Untill the eve of so far absorption holding, the tension force F of X-direction is assigned to substrate S to maintain base
The calming zone Wx of plate S shrinks the state in Y direction with the amount for predetermining.
When the entirety of the panel zone PD of substrate S is uniformly adsorbed in plane keeps tool 120, it is supported in and is located at base
The guide rail 113g at the Y direction both ends of seat component 113, the processing head HD that can be moved toward X-direction (or Y direction), that is, exist
1 dimension or 2 dimension movements are carried out on panel zone PD, exposure-processed and description printing treatment needed for carrying out.
As processing head HD, using unglazed Lacquer finish pattern generator, ink-jet table printing machine head, the microlens array of DMD
Mask pattern projector, the scanning plotter of laser point etc..
Additionally, in the foot 126 from the supporting processing head of base component 113 HD, for the surface by head and substrate S are processed
It is set in most preferably in the interval of Z-direction and relative tilt, the actuator (pressure moved up and down in Z-direction with grade is installed
Electric notor and voice coil motor etc.), the X-axis of processing head HD, Y direction position are surveying length laser interferometer IFM or uniform enconding
Device is accurate to be measured.
Also can be in this processing head HD, setting detects alignment mark ALM and panel zone PD on substrate S optically
The alignment video camera 18 of interior specific pattern shape and other alignment sensors.
The occasion of the present embodiment, as shown in figure 15, the panel zone PD on substrate S is in X-direction with gap (remaining white)
Np and arrange, if distance between the clip position of the clip position of the 1st roller 11 and the 2nd roller 12 is L, the X of panel zone PD
When direction of principal axis width is Xpd, when being set in as the relation of following formula (2), temporarily ceasing substrate S's to be processed
During conveyance, due to the 1st roller 11, the 2nd roller 12 each on the PD of adjacent panels region without static, therefore be able to can reduce
Counter plate region PD cause need not scratch etc..
Xpd ＜ L ＜ (Xpd+2Np) ... (2)
Additionally, as shown in Figure 15, Figure 16, all absorption into good accuracy of the panel zone PD on substrate S can put down
During the situation in face, macrotype light shield that can be cover plate region PD all is ready for, carries out using the once static of proximity mode
Exposure.
In various embodiments above, though it is set to be exposed treatment in the calming zone Wx shown in Fig. 4 (or Fig. 9, Figure 15),
If but can make to extend the X-direction width of the slit-shaped exposure area (view field EA) of Y direction it is fully narrow if,
Can be in fig. 4 be exposed apart from As and apart from the non-linear region of Ae.
Additionally, in Fig. 2, Figure 10, Figure 12, Figure 14, Figure 15 each shown in processing unit (exposure device) in, to make
It is the 1st roller 11 (and hold-down roll 11a) of the 1st guiding elements (substrate-guided component) with used as the 2nd guiding elements, (substrate draws
Lead component) the 2nd roller 12 (and hold-down roll 12a) between each peripheral speed assign narrow difference method with constitute tension force tax
Give mechanism.However, the occasion of the silent oscillation substrate board treatment (exposure device) shown in Figure 15, also applicable not utilize the 1st rolling
Take turns the tension force imparting mechanism of the difference of the peripheral speed of the 11 and the 2nd roller 12.
Specifically, a drivetrain is set in Figure 15, Figure 16, when substrate S is transported, is controlled into by the 1st roller 11
Substrate S is transported with relatively loose tension force (such as 10~20N degree) with the 2nd roller 12, is positioned in the panel zone PD of substrate S
In plane keep the superjacent air space of tool 120 and it is static after, in the case of clamp position is kept, mobile 1st roller 11 and clamping
Any group in the group of the group of roller 11a or the 2nd roller 12 and hold-down roll 12a, so that two groups of intervals in X-direction
Expansion.
Or, in Figure 15, be made following composition, that is, in substrate S conveyance direction (+X-direction) and then the
Position before position after 1 roller 11 and and then the 2nd roller 12, the Y direction width entirety for being respectively arranged at substrate S is strong
Clamping substrate S bar-shaped clamping components, substrate S be positioned and it is static after, with the clamping components clamping substrate S's at two
Gap (remaining white) Np parts, afterwards, make any clamping components in X-direction fine motion, between the X-direction of two clamping components is made according to this
Every expansion.
This occasion, by clamping components at two and changes the drive mechanism that the X-direction between two clamping components is spaced and constitutes
Power imparting mechanism.
In the various embodiments described above, microscope shoot system (alignment video camera 5,18 etc.) is used as mark detecting system
Carry out the radiographic measurement of the alignment mark ALM (such as cross bar shapes) on substrate S.Therefore, base is being transported with certain speed
In the state of plate S, the occasion of the image of detection mark ALM, the picture of the mark ALM for being photographed will be as problem.Therefore, also can profit
With the mark detecting system for not using the photographic elements such as CCD and CMOS (video camera).
One example, the thunder laser beam of the wavelength band that the photoinduction layer without substrate S can be sensed, is shaped as elongate slit
It is projeced on substrate S after shape or interference fringe shape, and the alignment mark of the diffraction clathrate to being formed on substrate S crosses the slit
The diffraction light produced during the light beam of shape or interference fringe shape carries out the mode of Photoelectric Detection.The generation position of the diffraction light, can lead to
The rotary encoder for crossing the roller 14 being located in the roller 11,12 of conveyance substrate S or Figure 10 is obtained.The embodiment of Figure 16
Occasion, can carry out the mark detecting system of Photoelectric Detection to diffraction light to obtain by surveying length interferometer IFM in head HD assemblings
Produce the position of diffraction light.
Claims (22)
1. a kind of pattern formation method, the plate shape substrates of the strip with pliability are transported in long side direction, in the sheet
The processed surface of substrate forms the pattern of electronic component, comprising：
While position separate both set a distance 2 at is supported on the long side direction of the plate shape substrates respectively using guiding elements,
On one side so that at described the 2 of the plate shape substrates between position in the short side direction orthogonal with the long side direction with given degree
The mode of contraction, to the step of both the part of set a distance assigns the tension force of the long side direction described in the plate shape substrates；
Between position at described 2, in the state of friction free state or contact area are small, using supporting member for substrate by institute
The part in the face of the dorsal part of the processed surface of plate shape substrates is stated, the step of supporting to plane or curved；With
And
The step of the pattern for forming the electronic component is set in the region of the processed surface, the region with
A part for the plate shape substrates supported using the supporting member for substrate in the state of being shunk with the given degree
Correspond to and be set in the processed surface.
2. pattern formation method as claimed in claim 1, wherein, the guiding elements include with described in the plate shape substrates
The face contact of processed surface or dorsal part and the hold-down roll of revolvable roller or the clamping plate shape substrates.
3. pattern formation method as claimed in claim 2, wherein, it is using will be formed in light shield the step of form the pattern
The pattern exposed with projection pattern or proximity mode exposure device, using DMD without light shield exposure device, scanning laser
Point is implemented with carrying out the printer or any one of ink-jet table printing machine of pattern plotter.
4. pattern formation method as claimed in claim 2, wherein, be the step of form the pattern utilize by the pattern with
Exposure device that projection pattern or proximity mode expose, carry out pattern without light shield exposure device, scanning laser point using DMD
Any one of the printer of description is implemented,
The region is set to the exposure area of the narrow slit-shaped of the width of the long side direction of the plate shape substrates, described
At described the 2 of plate shape substrates between position, the exposure area of the slit-shaped is set in the short side direction of the plate shape substrates
Contraction the big part of rate of change.
5. a kind of patterning device, the plate shape substrates of the strip with pliability are transported in long side direction, in the sheet
The processed surface of substrate forms the pattern of electronic component, possesses：
Tension force imparting mechanism, one lateral dominance guiding elements be supported on respectively on the long side direction of the plate shape substrates separate it is set
Position at the 2 of distance, on one side so that in the short side orthogonal with the long side direction between position at described the 2 of the plate shape substrates
Direction in the way of given degree shrinks, to both the part of set a distance assigns the long side direction described in the plate shape substrates
Tension force；
Supporting member for substrate, its between position at described 2, in the state of friction free state or contact area are small, by institute
The part in the face of the dorsal part of the processed surface of plate shape substrates is stated, plane or curved ground is supported；And
Pattern forming portion, its pattern that the electronic component is formed being set in the region of the processed surface is described
Region and the plate shape substrates supported using the supporting member for substrate in the state of being shunk with the given degree
A part correspondence and be set in the processed surface.
6. patterning device as claimed in claim 5, wherein, the pattern forming portion is as described in will be formed in light shield
Exposure device that pattern is exposed with projection pattern or proximity mode, entered without light shield exposure device, scanning laser point using DMD
The printer of row pattern plotter or any one composition of ink-jet table printing machine.
7. a kind of pattern exposure method, the plate shape substrates of the strip with pliability are transported in long side direction, in the sheet
The processed surface of substrate exposes the pattern of electronic component, comprising：
Position separate both set a distance 2 at is supported on the long side direction of the plate shape substrates respectively using guiding elements, so that
At described 2 between position the short side direction orthogonal with the long side direction by given degree shrink in the way of, to the sheet
The step of part of both set a distances of substrate assigns the tension force of the long side direction；
Between position at described 2, in the state of friction free state or contact area are small, by described in the plate shape substrates
The part in the face of the dorsal part of processed surface, the step of supporting to plane or curved；And
In the plate shape substrates supported using the supporting member for substrate in the state of being shunk with the given degree
The processed surface on the step of expose the pattern of the electronic component.
8. pattern exposure method as claimed in claim 7, wherein, the guiding elements include with described in the plate shape substrates
The face contact of processed surface or dorsal part and the hold-down roll of revolvable roller or the clamping plate shape substrates.
9. pattern exposure method as claimed in claim 8, wherein, it is using the institute that will be formed in light shield the step of the exposure
State exposure device that pattern exposes with projection pattern or proximity mode, using DMD without light shield exposure device or scanning laser
Point is implemented with carrying out any one of printer of pattern plotter.
10. the pattern exposure method as described in any one of claim 7 to 9, wherein, the step of the exposure in, will be described
The region of exposure is set to the exposure area of the narrow slit-shaped of the width of the long side direction of the plate shape substrates, in the sheet
At described the 2 of substrate between position, the exposure area of the slit-shaped is set in the receipts of the short side direction of the plate shape substrates
The big part of the rate of change of contracting.
11. pattern exposure method as described in any one of claim 7 to 9, wherein, the supporting member for substrate has supporting
The surface bearing of the dorsal part of the plate shape substrates is to possess curvature in the long side direction by face, the bearing-surface.
12. pattern exposure method as described in any one of claim 7 to 9, wherein, make institute comprising one side the step of the exposure
State plate shape substrates to be moved with set conveyance speed in long side direction, while the pattern described in scan exposure in the exposure area
Action.
A kind of 13. manufacturing methods, electronic component, bag are formed in the processed surface of the plate shape substrates of the strip with pliability
Contain：
The plate shape substrates after being processed with the device of responsible photosensitive layer forming step are transported the step of long side direction；
Position separate both set a distance 2 at is supported on the long side direction of the plate shape substrates respectively using guiding elements, so that
At described 2 between position the short side direction orthogonal with the long side direction by given degree shrink in the way of, to the sheet
The step of scope of both set a distances of substrate assigns the tension force of the long side direction；
Between position at described 2, in the state of friction free state or contact area are small, using supporting member for substrate by institute
The part in the face of the dorsal part of the processed surface of plate shape substrates is stated, the step of supporting to plane or curved；With
And
In the plate shape substrates supported using the supporting member for substrate in the state of being shunk with the given degree
The processed surface on given area the step of expose the pattern of the electronic component.
14. manufacturing methods as claimed in claim 13, wherein, the guiding elements includes the institute with the plate shape substrates
State face contact and the hold-down roll of revolvable roller or the clamping plate shape substrates of processed surface or dorsal part.
15. manufacturing methods as claimed in claim 14, wherein, the step of form the pattern utilized the pattern
The exposure device that is exposed with projection pattern or proximity mode, carry out figure without light shield exposure device, scanning laser point using DMD
Any one of printer that case is described or ink-jet table printing machine are implemented.
16. manufacturing methods as claimed in claim 14, wherein, the step of form the pattern utilized the pattern
The exposure device that is exposed with projection pattern or proximity mode, carry out figure without light shield exposure device, scanning laser point using DMD
Any one for the printer that case is described is implemented,
The given area is set to the exposure area of the narrow slit-shaped of the width of the long side direction of the plate shape substrates,
At described the 2 of the plate shape substrates between position, the exposure area of the slit-shaped is set in the short side of the plate shape substrates
The big part of the rate of change of the contraction in direction or described it is punctured into certain part.
A kind of 17. pattern formation methods, the plate shape substrates of the strip with pliability are transported in long side direction, in the sheet
The processed surface of substrate forms the pattern of electronic component, comprising：
While position separate both set a distance 2 at is supported on the long side direction of the plate shape substrates respectively using guiding elements,
While between position at described the 2 of the plate shape substrates, to be formed and the side long with given width in the long side direction
The size of the orthogonal short side direction in direction in the way of given degree is contracted to substantially certain calming zone, at described 2
The step of tension force of the long side direction being assigned between the guiding elements to the plate shape substrates；And
The electronics unit is formed in the flat of the processed surface corresponding with the calming zone of the plate shape substrates
The step of pattern of part.
18. pattern formation methods as claimed in claim 17, wherein, the guiding elements includes the institute with the plate shape substrates
State face contact and the hold-down roll of revolvable roller or the clamping plate shape substrates of processed surface or dorsal part.
19. pattern formation methods as claimed in claim 18, wherein, the step of form the pattern utilized the pattern
The exposure device that is exposed with projection pattern or proximity mode, carry out figure without light shield exposure device, scanning laser point using DMD
Any one of printer that case is described or ink-jet table printing machine are implemented.
20. pattern formation methods as claimed in claim 18, wherein, the step of form the pattern utilized the pattern
The exposure device that is exposed with projection pattern or proximity mode, carry out figure without light shield exposure device, scanning laser point using DMD
Any one for the printer that case is described is implemented,
When forming the pattern, flatly keep corresponding with the calming zone of the plate shape substrates using supporting member for substrate
Dorsal part face.
21. pattern formation methods as claimed in claim 20, wherein, the supporting member for substrate keeps tool comprising plane, uses
To adsorb the face of the dorsal part for keeping the plate shape substrates corresponding with the calming zone.
22. pattern formation method as described in any one of claim 17 to 21, wherein, so as to be formed with the described of the pattern
The width of the long side direction of the area of the pattern in the processed surface of plate shape substrates be housed in the calming zone it is described both
Mode in fixed width degree, the both set a distances between the guiding elements at setting described 2.
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| JPJP2011-242788 | 2011-11-04 | ||
| JP2011242788 | 2011-11-04 | ||
| CN201280053802.8A CN103958379B (en) | 2011-11-04 | 2012-09-27 | Substrate processing apparatus and substrate processing method |
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| CN201280053802.8A Active CN103958379B (en) | 2011-11-04 | 2012-09-27 | Substrate processing apparatus and substrate processing method |
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Also Published As
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| CN103958379B (en) | 2016-12-28 |
| JP6308247B2 (en) | 2018-04-11 |
| KR101623695B1 (en) | 2016-05-23 |
| KR20160006242A (en) | 2016-01-18 |
| JP2016029484A (en) | 2016-03-03 |
| JP5842925B2 (en) | 2016-01-13 |
| JP5962831B2 (en) | 2016-08-03 |
| WO2013065429A1 (en) | 2013-05-10 |
| TWI541932B (en) | 2016-07-11 |
| KR20140087024A (en) | 2014-07-08 |
| JP2015034989A (en) | 2015-02-19 |
| JP2018109786A (en) | 2018-07-12 |
| CN106919003B (en) | 2018-10-16 |
| TW201322361A (en) | 2013-06-01 |
| JP2016197241A (en) | 2016-11-24 |
| JP5822016B2 (en) | 2015-11-24 |
| CN103958379A (en) | 2014-07-30 |
| JPWO2013065429A1 (en) | 2015-04-02 |
| KR101623666B1 (en) | 2016-05-31 |
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