CN106876810A - Heat management device and power supply equipment - Google Patents

Abstract

The present application relates to the technical field of heat management, in particular to a heat management device and power supply equipment. The heat management device is applied to a power supply structure. The gas-generating solid heat-conducting substance and the skeleton can be arranged between adjacent power supply structures to form a housing chamber in the skeleton, and the solid heat-conducting substance is arranged in the housing chamber. When the calorific value of the power supply structure is small, the solid heat-conducting material can conduct the generated heat out due to the high thermal conductivity of the solid heat-conducting material. The gas conducts heat poorly and thus prevents heat from being transferred to adjacent power supply structures, thereby protecting the power supply structures. Obviously, this heat management device can take into account the heat management requirements of the power supply structure at room temperature and high temperature, thereby improving the cycle performance of the power supply structure.

Description

Thermal management device and power supply equipment

technical field

The present application relates to the technical field of heat management, in particular to a heat management device and power supply equipment.

Background technique

With the worsening of energy problems, the battery-based power supply structure has become a relatively common power supply method at present. The power supply structure can be a battery cell, a single battery, or a battery pack formed by multiple batteries, or even a battery pack. A battery pack formed by combining multiple battery packs, or other similar structures. When the power supply structure is working, it usually generates a lot of heat. In order to ensure the normal operation of the power supply structure, it is necessary to manage the heat generated by the power supply structure to prevent damage to the power supply structure.

In traditional technology, thermal insulation structures such as heat insulation cotton and heat insulation pads can be installed in the power supply structure. This heat insulation structure can block the heat generated by the power supply structure and prevent this part of heat from being transferred to the adjacent power supply structure. However, this kind of heat insulation structure can control the transfer of heat when the heat generation of the power supply structure is large, so as to control the heat in a smaller range as much as possible. If the heat generation of the power supply structure is small, the heat generated by the power supply structure cannot Transferred out, resulting in a long-term local high-temperature state of the power supply structure, resulting in poor cycle performance of the power supply structure.

Contents of the invention

The present application provides a heat management device and power supply equipment to improve the cycle performance of the power supply structure.

The first aspect of the present application provides a heat management device, which is applied to a power supply structure, the power supply structure is a battery cell, a battery, a battery pack or a battery pack, and the heat management device includes a skeleton and a solid capable of producing gas after being heated The thermally conductive substance, the skeleton can be disposed between adjacent power supply structures to form an accommodating cavity in the skeleton, and the solid thermally conductive substance is disposed in the accommodating cavity.

Preferably, the skeleton includes an annular shell, and the annular shell can surround the accommodation cavity with the adjacent power supply structure.

Preferably, the framework further includes a support plate connected to the annular shell.

Preferably, said support plate comprises a longitudinal plate which can be parallel to the mutually facing faces of said adjacent power supply structures.

Preferably, the support plate further includes a plurality of transverse plates, and the transverse plates extend along the arrangement direction of the adjacent power supply structures.

Preferably, at least two of the transverse plates are intersected, and/or the longitudinal plates are intersected with at least one transverse plate.

Preferably, the transverse plate and the longitudinal plate divide the accommodating cavity into a plurality of sub-cavities, and the solid heat-conducting substance is arranged in each of the sub-cavities.

Preferably, the annular housing is a closed housing, and the closed housing itself has the accommodating cavity.

Preferably, the framework includes longitudinal plates and support columns connected to the longitudinal plates.

Preferably, a plurality of support columns are provided, and the plurality of support columns are distributed on opposite sides of the longitudinal plate.

Preferably:

The solid heat-conducting substance fills the containing cavity,

And/or, the material of the solid heat conducting substance is one of sodium carbonate, sodium bicarbonate, melamine, aluminum dihydrogen phosphate and ammonium dihydrogen carbonate;

The material of the skeleton is one of mica, quartz, ceramics, asbestos, polyimide, polytetrafluoroethylene and Kevlar.

The second aspect of the present application provides a power supply device, which includes a power supply structure and a heat management device arranged between adjacent power supply structures, the power supply structure is a battery cell, a battery, a battery pack or a battery pack, The thermal management device is any one of the thermal management devices described above.

The technical solution provided by the application can achieve the following beneficial effects:

The heat management device described above can be applied to a power supply structure, which includes a skeleton and a solid heat-conducting material. When the calorific value of the power supply structure is small, since the solid heat-conducting material has high thermal conductivity, the solid heat-conducting material can conduct the generated heat away. When the heat generation of the power supply structure is large, the solid heat-conducting material will generate gas, and the gas has poor thermal conductivity, so it can prevent heat from being transferred to the adjacent power supply structure, thereby protecting the power supply structure. Obviously, this heat management device can take into account the heat management requirements of the power supply structure at room temperature and high temperature, thereby improving the cycle performance of the power supply structure.

It is to be understood that both the foregoing general description and the following detailed description are exemplary only and are not restrictive of the application.

Description of drawings

FIG. 1 is a schematic structural diagram of a heat management device provided in an embodiment of the present application;

Fig. 2 is a sectional view of the structure shown in Fig. 1;

Fig. 3 is the schematic diagram after the solid heat-conducting substance in the device shown in Fig. 1 is converted into a gaseous state;

Fig. 4 is a sectional view of the structure shown in Fig. 3;

Fig. 5 is a schematic diagram of another heat management device provided by the embodiment of the present application after the solid heat-conducting substance is converted into a gaseous state;

Fig. 6 is a sectional view of the structure shown in Fig. 5;

Fig. 7 is a schematic diagram of another heat management device provided by the embodiment of the present application after the solid heat-conducting substance is transformed into a gaseous state;

Fig. 8 is a sectional view of the structure shown in Fig. 7;

Fig. 9 is a schematic diagram of another heat management device provided by the embodiment of the present application after the solid heat-conducting substance is transformed into a gaseous state;

FIG. 10 is a sectional view of the structure shown in FIG. 9 .

Reference signs:

10 - skeleton;

100 - longitudinal plate;

101 - support column;

102-annular shell;

103 - longitudinal plate;

104 - transverse plate;

11-Solid heat conducting substance.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description serve to explain the principles of the application.

detailed description

The present application will be described in further detail below through specific embodiments and in conjunction with the accompanying drawings.

As shown in Figure 1-10, the embodiment of the present application provides a heat management device, which is applied in a power supply structure, and the power supply structure can be a battery cell, a battery, a battery pack or a battery pack, specifically, it can The heat management device is provided between adjacent cells, between adjacent batteries, between adjacent battery packs, and between adjacent battery packs. When the power supply structure is a battery pack, it can simultaneously A heat management device is set between the cells and adjacent batteries. When the power supply structure is a battery pack, a heat management device can be set between adjacent cells, adjacent batteries, and adjacent battery packs at the same time. .

The above-mentioned heat management device may include a skeleton 10 and a solid heat-conducting substance 11 capable of generating gas after being heated. The skeleton 10 can be arranged between adjacent power supply structures, and it is used to provide support for the solid thermally conductive substance 11, so that the solid thermally conductive substance 11 can be kept between adjacent power supply structures. Therefore, an accommodating cavity can be formed in the framework 10, and the solid heat-conducting substance 11 is arranged in the accommodating cavity. Generally, the accommodating cavity is a closed cavity. On the one hand, it can prevent the solid heat-conducting substance 11 from falling partially or even completely. On the other hand, it can also keep the gas generated after the solid heat-conducting substance 11 is heated in the adjacent power supply structure. between.

Preferably, the material of the solid heat-conducting substance 11 can be one of sodium carbonate, sodium bicarbonate, melamine, aluminum dihydrogen phosphate and ammonium dihydrogen carbonate, or any combination of these materials, and can be other gas generating agents or phase change materials. In addition, the manufacturing material of the framework 10 may be one of mica, quartz, ceramics, asbestos, polyimide, polytetrafluoroethylene, Kevlar, or any combination of these materials.

When the calorific value of the power supply structure is small, since the solid thermal conductive material 11 has high thermal conductivity, the solid thermal conductive material 11 can conduct the generated heat out; when the calorific value of the power supply structure is large, the solid thermal conductive material 11 can be Taking away part of the heat will also generate gas, and the gas has poor thermal conductivity, so it can prevent the heat from being transferred to the adjacent power supply structure, thereby protecting the power supply structure. Obviously, this heat management device can take into account the heat management requirements of the power supply structure at room temperature and high temperature, thereby improving the cycle performance of the power supply structure.

In one embodiment, as shown in FIGS. 9 and 10 , the framework 10 may include a longitudinal plate 100 and a support column 101 connected to the longitudinal plate 100 . The support column 101 can extend along the arrangement direction of the adjacent power supply structures, so that the support column 101 can be in contact with the solid heat-conducting substance 11, so as to provide a supporting force for the solid heat-conducting substance 11, so that the solid heat-conducting substance 11 can reliably Accommodated in the accommodating cavity in the frame 10. Specifically, the support column 101 may be provided only on one side of the longitudinal plate 100 , or the support column 101 may be provided on both opposite sides of the longitudinal plate 100 . In the present application, a plurality of support columns 101 are preferably set, and the shape can be a cylinder. Each support column 101 is distributed on the opposite sides of the longitudinal plate 100, that is, the support columns 101 are arranged on the opposite sides of the longitudinal plate 100, so that adjacent The power supply structures are all in contact with the solid heat-conducting material 11 to avoid severe heat accumulation in local areas and thereby optimize the cycle performance of the power supply structures.

In another embodiment, as shown in FIGS. 1-8 , the framework 10 may include an annular casing 102 , which can enclose the aforementioned accommodation cavity with adjacent power supply structures. That is to say, the adjacent power supply structure can clamp the annular casing 102 , and then form an accommodating cavity through the outer surface of the annular casing 102 and the power supply structure. Compared with the previous skeleton 10, this structure can better restrict the solid heat-conducting substance 11 and prevent the solid heat-conducting substance 11 from scattering.

Further, the skeleton 10 may also include a support plate, which is connected to the above-mentioned annular shell 102 . Similar to the structure of the support column 101 , the support plate can assist in confining the solid heat-conducting substance 11 . Optionally, the support plate may comprise a longitudinal plate 103 which can be parallel to the faces of adjacent power supply structures facing each other. For example, the annular housing 102 may be a rectangular annular housing 102 , and the outer edge of the longitudinal plate 103 may be fixedly connected to the annular housing 102 along the outer peripheral direction of the annular housing 102 . Such a structure can not only assist in confining the solid heat-conducting substance 11, but also simplify the processing procedure of the heat management device.

Further, the above-mentioned support plate may further include a plurality of transverse plates 104, and the transverse plates 104 extend along the arrangement direction of adjacent power supply structures. The transverse plate 104 can also play the role of assisting in restricting the solid heat-conducting substance 11 and simplifying the processing procedure of the heat management device. Optionally, at least two of the transverse plates 104 can be intersected to form a grid-like structure, such as a well-shaped structure, a Pozi-shaped structure, etc., so as to improve the structural strength of the support plate. When the support plate includes a longitudinal plate 103, the longitudinal plate 103 can be intersected with at least one transverse plate 104 to form a stronger support plate.

The above-mentioned transverse plate 104 and longitudinal plate 103 can further divide the aforesaid accommodating cavity into a plurality of sub-cavities, each sub-cavity is provided with a solid heat-conducting substance 11, thereby increasing the amount of solid heat-conducting substance 11 installed, and optimizing the thermal conductivity of the heat management device . At the same time, this way can also disperse the solid heat-conducting substance 11 in multiple sub-cavities, so that the restricting force on the solid heat-conducting substance 11 is more sufficient and uniform, and further improves the solidity of the solid heat-conducting substance 11 in the skeleton 10 .

In addition, the solid heat-conducting substance 11 may only occupy a part of the space of the containing cavity, or may fill the containing cavity. In order to optimize the heat conduction performance of the heat management device, in the embodiment of the present application, it is preferred that the solid heat conduction substance 11 fills the cavity.

The foregoing embodiments describe the manner in which the skeleton 10 and the adjacent power supply structure jointly form an accommodating cavity. In order to better limit the solid heat-conducting substance 11, the annular casing 102 of the skeleton 10 can also be set as a closed casing, and the closed casing It has an accommodating chamber itself, that is, the framework 10 alone can form an accommodating chamber, and does not need to jointly form an accommodating chamber with adjacent power supply structures. In contrast, this method enables the solid heat-conducting substance 11 to always be located in the frame 10 even when it is not assembled with the power supply structure, and is less likely to be scattered.

Based on the above structure, an embodiment of the present application also provides a power supply device, which may include a power supply structure and a heat management device arranged between adjacent power supply structures, the power supply structure is a cell, a battery, a battery pack or a battery pack, The heat management device is the heat management device described in any one of the above embodiments.

The above descriptions are only preferred embodiments of the present application, and are not intended to limit the present application. For those skilled in the art, there may be various modifications and changes in the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application shall be included within the protection scope of this application.

Claims (12)

1. A heat management device, applied to a power supply structure, the power supply structure is a battery cell, a battery, a battery pack or a battery pack, characterized in that the heat management device includes a skeleton and a solid heat-conducting substance that produces gas after being heated, The frame is arranged between adjacent power supply structures to form a receiving cavity in the frame, and the solid heat-conducting substance is arranged in the receiving cavity. 2 . The heat management device according to claim 1 , wherein the frame comprises an annular shell, and the annular shell and the adjacent power supply structure enclose the accommodation cavity. 3 . 3 . The heat management device according to claim 2 , wherein the skeleton further comprises a support plate, and the support plate is connected to the annular shell. 4 . 4 . The heat management device according to claim 3 , wherein the support plate comprises a longitudinal plate parallel to the faces of the adjacent power supply structures facing each other. 5 . 5 . The heat management device according to claim 4 , wherein the support plate further comprises a plurality of transverse plates, and the transverse plates extend along the arrangement direction of the adjacent power supply structures. 6 . The heat management device according to claim 5 , wherein at least two of the transverse plates are intersected, and/or the longitudinal plates are intersected with at least one of the transverse plates. 7. The heat management device according to claim 6, wherein the transverse plate and the longitudinal plate divide the accommodating cavity into a plurality of sub-cavities, and the solid heat-conducting substance is arranged in each of the sub-cavities . 8 . The heat management device according to claim 2 , wherein the annular shell is a closed shell, and the closed shell itself has the accommodating cavity. 9 . 9. The heat management device according to claim 1, wherein the frame comprises longitudinal plates and support columns connected to the longitudinal plates. 10 . The heat management device according to claim 8 , wherein there are a plurality of support columns, and the plurality of support columns are distributed on opposite sides of the longitudinal plate. 11 . 11. The thermal management device according to any one of claims 1-10, characterized in that: The solid heat-conducting substance fills the containing cavity, And/or, the material of the solid heat conducting substance is one of sodium carbonate, sodium bicarbonate, melamine, aluminum dihydrogen phosphate and ammonium dihydrogen carbonate; The material of the skeleton is one of mica, quartz, ceramics, asbestos, polyimide, polytetrafluoroethylene and Kevlar. 12. A power supply device, characterized in that it includes a power supply structure and a heat management device arranged between adjacent power supply structures, the power supply structure is a cell, a battery, a battery pack or a battery pack, and the heat The management device is the heat management device described in any one of claims 1-11.