CN106876346A - One kind layering encapsulated circuit structure and a kind of layering encapsulation T/R module - Google Patents

Abstract

The invention relates to the field of circuit packaging structures, in particular to a layered packaging circuit structure and a layered packaging TR module. The layered packaging circuit structure provided by the present invention divides the circuit into a low-frequency module and a radio frequency module according to functions, wherein the low frequency module is packaged with the first material, the radio frequency module is packaged with the second material, and the low frequency module packaged with the first material is packaged with the first material. The RF module encapsulated by two materials is connected through the reserved interface. This structure is a new circuit layout structure scheme under the condition of small volume, which realizes the organic combination of low-frequency power supply, RF power supply and logic control function, that is, reduces the existing The module structure under the packaging system is easily broken by stress, which reduces the production cost; the structure provided by the invention is especially suitable for some circuit modules that do not necessarily use the co-fired ceramic system.

Description

A layered packaging circuit structure and a layered packaging TR module

technical field

The invention relates to the field of circuit packaging structures, in particular to a layered packaging circuit structure and a layered packaging TR module.

Background technique

The current existing module integration technology solutions are generally realized through a single low-temperature co-fired ceramic system. Low-temperature co-fired ceramics are multi-layer circuits made by laminating unsintered cast ceramic materials, with printed interconnect conductors, components and circuits inside, and firing the structure into an integrated ceramic multilayer circuit. Layer materials, and then mount IC, LSI bare chips, etc. on the surface to form high-density microelectronic component technology with certain components or system functions. Functions such as radio frequency feed, low frequency power supply and logic control are realized. The application of millimeter-wave transceiver components based on hybrid microwave integrated circuit (HMIC) technology in radar and communication systems is quite mature. In particular, the development and widespread use of Microwave Monolithic Integrated Circuit (MMIC) has greatly reduced the volume of system sub-circuits and improved performance. Using low-temperature co-fired ceramic technology and internationally accepted material systems, it is possible to design high-density packaging of multi-layer structures for millimeter-wave systems. It provides an effective way to realize the miniaturization, high integration and high reliability of millimeter wave components.

However, due to the characteristics of the materials used (mostly synthetic powders such as silicon dioxide) in the existing co-fired ceramic packaging system, it is easy to break after being subjected to internal and external stress; at the same time, due to the high cost of basic materials, As a result, the manufacturing cost of the co-fired ceramic packaging system is also relatively high.

Contents of the invention

The purpose of the present invention is to overcome the problem of high cost of the co-fired ceramic packaging system in the prior art, and provide a layered packaging circuit structure that can reduce part of the cost.

In order to realize the above-mentioned purpose of the invention, the present invention provides the following technical solutions:

A layered packaging circuit structure, which divides the circuit into a low frequency module and a radio frequency module according to the function, wherein the low frequency module is packaged with the first material, the radio frequency module is packaged with the second material, and the low frequency module packaged with the first material is packaged with the second material. The RF module encapsulated by the material is connected through the reserved interface.

Further, the low frequency module includes a logic control module and a low frequency power supply module.

Preferably, the first material is a low-frequency packaging material, and the cost of the low-frequency packaging material is generally low, so the overall packaging cost of the circuit module can be relatively reduced. Fiber cloth composite board materials are preferred for low frequency packaging materials, such as FR4 (epoxy glass cloth laminated board, S1141, MTC-97).

Preferably, the second material is a radio frequency packaging material, and the fiber cloth composite board material is preferably used in the radio frequency packaging material. Such as TSM-DS3, TLY-5, RF-35, FR-27(pp), etc., or other RF materials from Taikangli. Whether it is a low-frequency packaging material or a radio-frequency packaging material, the module structure using fiber cloth composite board as the packaging material has made great progress in terms of stress compared with the previous co-fired ceramic system, that is, it is relatively unacceptable to break.

In some embodiments, both the first material and the second material may be radio frequency packaging materials.

The present invention also provides a layered packaging TR module, including a TR low frequency module and a TR radio frequency module. The TR low frequency module is packaged with the first material, and the TR radio frequency module is packaged with the second material. The TR low frequency module packaged with the first material and The TR radio frequency module encapsulated by the second material is connected through the reserved interface.

Further, the TR low-frequency module includes a logic control module and a low-frequency power supply module.

Further, the TR radio frequency module includes a TR driver chip, a power divider, a TR final chip and an output transmission line connected in sequence.

The first material is a low-frequency packaging material, such as FR4 (epoxy glass cloth laminated board).

Preferably, the second material is a radio frequency packaging material, such as TSM-DS3 (radio frequency material of Taikangli Company).

Compared with prior art, the beneficial effect of the present invention:

The layered packaging circuit structure provided by the present invention provides a new circuit layout structure scheme in the millimeter wave field, which realizes the organic combination of low-frequency power supply, radio frequency power supply and logic control functions, that is, reduces the module structure under the existing packaging system It is easy to be broken due to stress, and the production cost is reduced; the structural framework provided by the present invention is especially suitable for some circuit modules that do not necessarily use co-fired ceramic systems.

In addition, the cost advantage of the new packaging material itself allows the product to maintain excellent performance while significantly reducing the price of the product, thereby bringing additional product benefits.

In some embodiments, bonding is used to control the connection and conduction of two independent boards. For the field of millimeter-wave T/R components, it is equivalent to adding a design scheme, which makes the application scenarios richer and more targeted. The advantage of bonding compared to welding is that bonding usually requires lower working temperature, Lower cost and lower flatness requirements of the interface to be bonded, so that the overall production cost of the device using bonding is reduced, and the requirements for the process environment are lower.

Description of drawings:

FIG. 1 is a schematic cross-sectional diagram of a layered packaging circuit structure provided by the present invention.

FIG. 2 is a diagram of a specific example of a layered packaging TR module provided by the present invention.

Marks in the figure: 100-low frequency module; 200-radio frequency module; 110-layer connection; 101-logic control chip; 201-TR driver chip; 202-power splitter; 203-TR final chip; 204-output microstrip Wire.

detailed description

The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. However, it should not be understood that the scope of the above subject matter of the present invention is limited to the following embodiments, and all technologies realized based on the content of the present invention belong to the scope of the present invention.

Embodiment 1: As shown in Figure 1, this embodiment provides a layered packaging circuit structure, which divides the circuit into a low-frequency module and a radio frequency module according to functions, wherein the low-frequency module is packaged with the first material, and the radio frequency module is packaged with the second material. Material packaging, the low frequency module packaged with the first material is connected to the radio frequency module packaged with the second material through a reserved interface.

Further, the low frequency module includes a logic control module and a low frequency power supply module.

Preferably, the first material is a low-frequency packaging material, and the cost of the low-frequency packaging material is generally low, so the overall packaging cost of the circuit module can be relatively reduced. Fiber cloth composite board materials are preferred for low frequency packaging materials, such as FR4 (epoxy glass cloth laminated board).

Preferably, the second material is a radio frequency packaging material, and the fiber cloth composite board material is preferably used in the radio frequency packaging material. Such as TSM-DS3 (Taikangli's radio frequency material). Whether it is a low-frequency packaging material or a radio-frequency packaging material, the module structure using fiber cloth composite board as the packaging material has made great progress in terms of stress compared with the previous co-fired ceramic system, that is, it is relatively unacceptable to break.

This technical solution adopts a new material system to carry out integrated design and process assembly, design the structure and function step by step, and then combine them through post-processing, so as to reduce the cost and still achieve the same technical indicators. Traditional integration solutions often only use one material system for one-time processing of drawings, which will bring a high cost burden. At the same time, some components can only choose high-cost designs due to lack of suitable implementation solutions. Bring the disadvantage of overkill.

At the same time, according to the classification of low frequency and radio frequency, this application also facilitates the modular mass production of different modules, and carries out relevant tests in their respective fields (low frequency field, radio frequency field), and can also greatly improve the production efficiency of the overall device.

Embodiment 2: As shown in FIG. 2, this embodiment provides a layered packaging TR module, including a TR low frequency module and a TR radio frequency module. The TR low frequency module is packaged with the first material, and the TR radio frequency module is packaged with the second material. The TR low frequency module encapsulated by the first material is connected with the TR radio frequency module encapsulated by the second material through a reserved interface. The TR low-frequency module includes a logic control module and a low-frequency power supply module. The TR radio frequency module includes a TR driver chip, a power divider, a TR final chip and an output transmission line connected in sequence. The output transmission line can be, for example, a microstrip line, which is connected to the antenna unit of the radar system.

In this embodiment, the first material is FR4, and the second material is TSM-DS3.

In this embodiment, the interior of the T/R module is decomposed according to the function, and the functions of the original T/R are integrated and packaged by using two new materials, and finally the interface is reserved in the pre-connected part of the two modules (for example, with the pre-connected The method of embedding the wires) and process bonding of the two modules (such as silver paste bonding); makes the assembled parts reach the same electrical level as the original single system, and at the same time, its production cost is greatly reduced, and its stress resistance ability is greatly enhanced.

Claims (10)

1. a kind of layering encapsulated circuit structure, it is characterised in that it is low frequency module and radio-frequency module to be divided by function circuit, Wherein low frequency module uses the first material package, and radio-frequency module uses the second material package, using low after the first material package Frequency module is connected with using the radio-frequency module after the second material package by spare interface.

2. it is as claimed in claim 1 to be layered encapsulated circuit structure, it is characterised in that the low frequency module includes logic control mould Block and low frequency power supply module.

3. it is as claimed in claim 1 to be layered encapsulated circuit structure, it is characterised in that first material is low frequency package material Material.

4. it is as claimed in claim 1 to be layered encapsulated circuit structure, it is characterised in that second material is radio frequency package material Material.

5. it is as claimed in claim 5 to be layered encapsulated circuit structure, it is characterised in that first material is similarly radio frequency package Material.

6. a kind of layering encapsulates T/R module, it is characterised in that including TR low frequencies module and TR radio-frequency modules, TR low frequencies module is used First material package, TR radio-frequency modules use the second material package, using the TR low frequencies module after the first material package and use TR radio-frequency modules after second material package are connected by spare interface.

7. layering as claimed in claim 5 encapsulates T/R module, it is characterised in that the TR low frequencies module includes logic control mould Block and low frequency power supply module.

8. layering as claimed in claim 5 encapsulates T/R module, it is characterised in that the TR radio-frequency modules include what is be sequentially connected TR driving chips, power splitter, TR final stages chip and output transmission line.

9. layering as claimed in claim 5 encapsulates T/R module, it is characterised in that first material is low frequency encapsulating material.

10. layering as claimed in claim 5 encapsulates T/R module, it is characterised in that second material is radio frequency package material.