CN106813591A - For the sample preparation methods of buckling deformation test - Google Patents
For the sample preparation methods of buckling deformation test Download PDFInfo
- Publication number
- CN106813591A CN106813591A CN201611258886.5A CN201611258886A CN106813591A CN 106813591 A CN106813591 A CN 106813591A CN 201611258886 A CN201611258886 A CN 201611258886A CN 106813591 A CN106813591 A CN 106813591A
- Authority
- CN
- China
- Prior art keywords
- sample
- white
- glued membrane
- boss
- glue film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 41
- 238000005464 sample preparation method Methods 0.000 title claims abstract description 12
- 238000005096 rolling process Methods 0.000 claims abstract 2
- 239000003292 glue Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 16
- 239000004809 Teflon Substances 0.000 claims description 3
- 229920006362 Teflon® Polymers 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000012528 membrane Substances 0.000 abstract 8
- 239000002313 adhesive film Substances 0.000 description 21
- 238000001514 detection method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000003973 paint Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
- G01B11/161—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a kind of sample preparation methods for buckling deformation test, it is characterized in that, comprise the following steps：（1）Testing sample is placed on sample stage, to place the placement region of testing sample in the middle of sample stage, boss is set around placement region；（2）White glued membrane is placed in the top of testing sample, the edge of white glued membrane is propped up on boss；（3）Pressure roller above sample stage is pressed down against, and pressure roller makes white glued membrane closely be pasted with testing sample from a lateral opposite side rolling；（4）Testing sample is removed from sample stage, and the unnecessary white glued membrane in testing sample edge is cut into removal.The present invention coats one layer of white glued membrane in sample surfaces, and the thickness control of the white glued membrane is more uniform；Being completed rear glued membrane can be easy to removal, and sample surfaces will not be polluted；Glued membrane is not volatile in temperature-rise period, and grating and sample tests will not be impacted.
Description
Technical Field
The invention relates to a sample preparation method for a warpage test, and belongs to the technical field of semiconductor packaging.
Background
In semiconductor manufacturing technology and semiconductor packaging technology, surface topography and warpage control of components such as chips and substrates are very important. A non-contact device (such as shadow moire) and a detection method for warpage detection by utilizing a moire interference principle are widely applied in the field, and have the advantages that a reflow process curve can be simulated, and deformation conditions of a sample at each temperature point in the whole reflow process can be detected. The detection device is generally provided with a lens for capturing the surface topography information of the sample; the glass grating engraved with certain length and spacing fringes irradiates parallel light beams on the surface of a sample, and the reflection fringes and the grating fringes interfere with each other to form interference fringes containing the deformation condition of the surface of the sample. The detection method requires that the surface of the sample is white, so that the sample can be captured by a lens above the sample, and the deformation condition of the sample is recorded. Therefore, during the sample preparation process, a white film is usually applied to the surface. In the testing process, the deformation information of the surface of the film captured by the lens is required to be equal to the deformation information of the surface of the sample, the film is easy to remove, and the surface of the sample is free from pollution, so that high requirements are provided for the film.
The current sample preparation method is usually to spray a layer of white paint on the surface. Fine liquid drops uniformly fall on the surface of the sample in the spraying process to form a layer of white film. However, the sample preparation technology can cause serious pollution to the surface of a sample, and the sample can only be discarded and not used after the test is finished, so that the test cannot be used for the online detection of a semiconductor manufacturing process, which causes great limitation to the test sample; in addition, in the temperature rise process, the white paint is partially volatilized, and the volatilized substances cover the grating above the sample, so that the interference of grating fringes and the detection result of sample deformation are influenced.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a sample preparation method for a warp deformation test, wherein a layer of white adhesive film is coated on the surface of a sample, and the thickness of the white adhesive film is more uniformly controlled; after the test is finished, the adhesive film can be easily removed, and the surface of the sample cannot be polluted; the glue film is not easy to volatilize in the temperature rising process, and the grating and the sample test result are not affected.
According to the technical scheme provided by the invention, the sample preparation method for the warp deformation test is characterized by comprising the following steps of:
(1) placing a sample to be tested on a sample table, wherein the middle of the sample table is a placing area for placing the sample to be tested, and bosses are arranged around the placing area;
(2) placing a white adhesive film above a sample to be detected, and supporting the edge of the white adhesive film on a boss;
(3) a pressure roller above the sample table extrudes downwards, and the pressure roller rolls from one side to the other side to ensure that the white glue film is tightly attached to the sample to be detected;
(4) and taking the sample to be detected down from the sample table, and cutting and removing the redundant white adhesive film on the edge of the sample to be detected.
Further, the white glue film comprises teflon.
Further, the thickness of the white glue film is not more than 5 microns.
Furthermore, the boss is arranged around the placing area of the sample table and is in a closed shape, or the boss is arranged around the placing area of the sample table and is in a plurality of boss arranged in a discontinuous shape.
Further, the height of the boss is higher than the thickness of the sample to be detected, so that a certain gap exists between the white glue film and the sample to be detected after the edge of the white glue film in the step (2) is supported on the boss.
Further, in the step (3), the pressure roller rolls one or more times from one side of the placing area to the other side.
The invention cancels a sample preparation method of spraying paint on the surface of a sample, and instead coats a layer of white glue film on the surface of the sample, and the thickness of the white glue film is more controllable and uniform compared with a film formed by spraying paint droplets; after the test is finished, the adhesive film can be easily removed, and the surface of the sample cannot be polluted; in the temperature rising process, the resin component in the adhesive film is more stable and is not easy to volatilize, and the grating and the sample test result can not be influenced. Because the surface pollution of the sample is avoided, the sample using the sample preparation method can be continuously used after the warping test is finished without wasting extra samples, and therefore, the method can be suitable for the online detection of the semiconductor manufacturing process.
Drawings
Fig. 1 to 4 are flow charts of the sample preparation method for warp deformation test according to the present invention. Wherein,
fig. 1 is a schematic diagram of a sample to be measured placed on a sample stage.
FIG. 2 is a schematic view of a white adhesive film placed on a sample to be tested.
Fig. 3 is a schematic diagram of the white adhesive film and the sample to be tested being tightly attached by the pressure roller.
Fig. 4 is a schematic diagram illustrating the cutting and removal of the excess white glue film on the edge of the sample to be tested.
Fig. 5 is a schematic diagram of a warpage test of a to-be-tested sample attached with a white adhesive film.
FIG. 6 is a schematic diagram of the sample after removing the adhesive film.
Detailed Description
The invention is further described below with reference to the specific drawings and the specific embodiments.
The invention relates to a sample preparation method for a warpage deformation test, which comprises the following steps:
(1) as shown in fig. 1, a sample 1 to be measured is placed on a sample table 2, a placement area for placing the sample 1 to be measured is arranged in the middle of the sample table 2, and bosses 3 are arranged around the placement area; the boss 3 is provided with a closed boss around the placing area of the sample table 2, or a plurality of bosses which are discontinuously arranged around the placing area of the sample table 2;
(2) as shown in fig. 2, a white glue film 4 is placed above a sample 1 to be tested, and the edge of the white glue film 4 is supported on a boss 3; the height of the boss 3 is higher than the thickness of the sample 1 to be detected, so that a certain gap is formed between the white glue film 4 and the sample 1 to be detected;
(3) as shown in fig. 3, the sample platform 2 is extruded downwards by a pressure roller 5, and the pressure roller 5 rolls one or more times from one side to the other side, so that the white glue film 4 is tightly attached to the sample 1 to be detected, and no bubble or layering is ensured between the white glue film and the sample to be detected;
(4) as shown in fig. 4, the sample 1 to be measured is taken down from the sample stage 2, and the redundant white glue film 4 on the edge of the sample 1 to be measured is cut and removed; after the test is finished, the white adhesive film on the surface of the sample is removed, and the viscosity of the sample can be invalidated through a film removing machine, chemical dissolution or illumination and other modes.
The white glue film adopted in the process is Teflon, and the thickness is generally not more than 5 microns.
Placing the sample to be tested after being attached with the white adhesive film in a warping test device for testing, as shown in fig. 5, placing a sample 1 to be tested on a sample table 7 of the test device, placing a glass grating 6 above the sample 1 to be tested, and allowing light to penetrate through the glass grating 6 to form interference fringes so as to obtain sample surface deformation information; during the test, the sample 1 to be tested can be heated by the heating module 8, and the maximum heating temperature is not more than 300 ℃. And after the test is finished, removing the white adhesive film from the surface of the sample, wherein the white adhesive film can be removed by a film removing device, or the sample can be immersed in chemical cleaning liquid to remove the film or removed by a light irradiation method. The sample after removing the adhesive film is shown in fig. 6.
In the preparation of the sample for the warpage test, the surface of the sample is coated with a layer of adhesive film, and the following requirements are met: the adhesive film has uniform thickness, is tightly attached to the surface of a sample after being attached, and ensures that the surface deformation information of the film is completely the same as that of the sample; the test device can bear the high temperature of 300 ℃, and has no volatilization, no delamination and peeling from a sample in the test process of heating and simulating a reflux curve; the dimension in the thickness direction is sufficiently small; after the test is finished, the adhesive film can be removed by film stripping equipment, chemical dissolution or illumination and the like; the adhesive film has no residue on the surface of the sample after removal, and the surface of the sample is not polluted.
Claims (6)
1. A sample preparation method for a warpage test is characterized by comprising the following steps:
(1) placing a sample (1) to be tested on a sample table (2), wherein the middle of the sample table (2) is a placing area for placing the sample (1) to be tested, and bosses (3) are arranged around the placing area;
(2) a white glue film (4) is placed above the sample (1) to be detected, and the edge of the white glue film (4) is supported on the boss (3);
(3) a pressure roller (5) above the sample table (2) extrudes downwards, and the pressure roller (5) rolls from one side to the other side to ensure that the white glue film (4) is tightly attached to the sample (1) to be detected;
(4) and taking the sample (1) to be detected down from the sample table (2), and cutting and removing the redundant white glue film (4) on the edge of the sample (1) to be detected.
2. The method of preparing a sample for warp deformation testing as claimed in claim 1, wherein: the white glue film comprises Teflon.
3. The method of preparing a sample for warp deformation testing as claimed in claim 1, wherein: the thickness of the white glue film is not more than 5 microns.
4. The method of preparing a sample for warp deformation testing as claimed in claim 1, wherein: the boss (3) is arranged around the placing area of the sample table (2) and is a closed boss, or is arranged around the placing area of the sample table (2) in a discontinuous mode.
5. The method of preparing a sample for warp deformation testing as claimed in claim 1, wherein: the height of the boss (3) is higher than the thickness of the sample (1) to be detected, so that a certain gap exists between the white glue film (4) and the sample (1) to be detected after the edge of the white glue film (4) in the step (2) is supported on the boss (3).
6. The method of preparing a sample for warp deformation testing as claimed in claim 1, wherein: and (4) rolling the pressure roller (5) from one side of the placing area to the other side for one time or multiple times in the step (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611258886.5A CN106813591A (en) | 2016-12-30 | 2016-12-30 | For the sample preparation methods of buckling deformation test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611258886.5A CN106813591A (en) | 2016-12-30 | 2016-12-30 | For the sample preparation methods of buckling deformation test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106813591A true CN106813591A (en) | 2017-06-09 |
Family
ID=59110544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611258886.5A Pending CN106813591A (en) | 2016-12-30 | 2016-12-30 | For the sample preparation methods of buckling deformation test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106813591A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101837335A (en) * | 2009-03-20 | 2010-09-22 | 昆山西钛微电子科技有限公司 | Platform for coating epoxy resin thin film for wafer-level chip package |
| CN201841094U (en) * | 2010-10-29 | 2011-05-25 | 刘希文 | Mesh belt conveying device for coating equipment |
| CN102173316A (en) * | 2010-12-21 | 2011-09-07 | 上海技美电子科技有限公司 | Film sticking method and equipment |
| CN102275650A (en) * | 2011-05-24 | 2011-12-14 | 冠捷显示科技（厦门）有限公司 | Device and method for automatically coating film on surface of electrical product |
| CN104230184A (en) * | 2014-09-07 | 2014-12-24 | 合肥嘉伟装饰工程有限责任公司 | Glass laminating device |
| US20160013221A1 (en) * | 2006-09-29 | 2016-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and manufacturing apparatus of semiconductor device |
-
2016
- 2016-12-30 CN CN201611258886.5A patent/CN106813591A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160013221A1 (en) * | 2006-09-29 | 2016-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and manufacturing apparatus of semiconductor device |
| CN101837335A (en) * | 2009-03-20 | 2010-09-22 | 昆山西钛微电子科技有限公司 | Platform for coating epoxy resin thin film for wafer-level chip package |
| CN201841094U (en) * | 2010-10-29 | 2011-05-25 | 刘希文 | Mesh belt conveying device for coating equipment |
| CN102173316A (en) * | 2010-12-21 | 2011-09-07 | 上海技美电子科技有限公司 | Film sticking method and equipment |
| CN102275650A (en) * | 2011-05-24 | 2011-12-14 | 冠捷显示科技（厦门）有限公司 | Device and method for automatically coating film on surface of electrical product |
| CN104230184A (en) * | 2014-09-07 | 2014-12-24 | 合肥嘉伟装饰工程有限责任公司 | Glass laminating device |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170609 |
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| RJ01 | Rejection of invention patent application after publication |