CN106817846A - Liquid metal three-dimensional circuit based on 3D printing process and manufacturing method thereof - Google Patents
Liquid metal three-dimensional circuit based on 3D printing process and manufacturing method thereof Download PDFInfo
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- CN106817846A CN106817846A CN201510857645.1A CN201510857645A CN106817846A CN 106817846 A CN106817846 A CN 106817846A CN 201510857645 A CN201510857645 A CN 201510857645A CN 106817846 A CN106817846 A CN 106817846A
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- stereo circuit
- dimensional
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- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 58
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 50
- 238000010146 3D printing Methods 0.000 title claims abstract description 38
- 230000008569 process Effects 0.000 title abstract description 13
- 238000003672 processing method Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 57
- 239000007787 solid Substances 0.000 claims abstract description 24
- 238000007639 printing Methods 0.000 claims description 33
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 13
- 229910052733 gallium Inorganic materials 0.000 claims description 13
- MPZNMEBSWMRGFG-UHFFFAOYSA-N bismuth indium Chemical compound [In].[Bi] MPZNMEBSWMRGFG-UHFFFAOYSA-N 0.000 claims description 9
- 229910052738 indium Inorganic materials 0.000 claims description 9
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 9
- 238000000520 microinjection Methods 0.000 claims description 9
- 229910001369 Brass Inorganic materials 0.000 claims description 6
- 229910000846 In alloy Inorganic materials 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 239000010951 brass Substances 0.000 claims description 6
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 13
- 238000013461 design Methods 0.000 abstract description 12
- 238000002360 preparation method Methods 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000011900 installation process Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 19
- 230000004913 activation Effects 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000011161 development Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 230000010412 perfusion Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000013049 sediment Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 229920006352 transparent thermoplastic Polymers 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000005429 filling process Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- IXSZQYVWNJNRAL-UHFFFAOYSA-N etoxazole Chemical compound CCOC1=CC(C(C)(C)C)=CC=C1C1N=C(C=2C(=CC=CC=2F)F)OC1 IXSZQYVWNJNRAL-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000010814 metallic waste Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1344—Spraying small metal particles or droplets of molten metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
Abstract
本发明涉及一种基于3D打印工艺的液态金属立体电路制造方法，包括以下步骤：S1：建立与待制造立体电路的三维结构相对应的三维模型，并根据所述立体电路的线路走向在所述三维模型内部建立中空流道；S2：通过3D打印工艺，将所述步骤S1得到的三维模型打印成三维实体；S3：在所述三维实体的中空流道内注满液态金属。通过本发明所提供的制造方法不仅能够大幅降低立体电路的制作成本，而且简化了安装、制作流程，在常温常压下就可以实现立体电路的自由、快速、经济的个性化设计、制造。在充分利用液态金属和3D打印制造工艺以及发展新型柔性立体电路制备技术上具有较大优势。
The invention relates to a method for manufacturing a liquid metal three-dimensional circuit based on a 3D printing process, comprising the following steps: S1: establishing a three-dimensional model corresponding to the three-dimensional structure of the three-dimensional circuit to be manufactured, and according to the line direction of the three-dimensional circuit in the A hollow flow channel is built inside the three-dimensional model; S2: Print the three-dimensional model obtained in step S1 into a three-dimensional solid through a 3D printing process; S3: Fill the hollow flow channel of the three-dimensional solid with liquid metal. The manufacturing method provided by the invention can not only greatly reduce the manufacturing cost of the three-dimensional circuit, but also simplify the installation and manufacturing process, and realize the free, fast and economical individualized design and manufacture of the three-dimensional circuit under normal temperature and pressure. It has great advantages in making full use of liquid metal and 3D printing manufacturing technology and developing new flexible three-dimensional circuit preparation technology.
Description
Technical field
The present invention relates to electronic circuit manufacture field, and in particular to one kind is based on 3D printing technique
Liquid metal stereo circuit and its manufacture method.
Background technology
With the fast development of electronics and information industry, as the electronics electricity on electronics and information industry basis
Road such as is just entering to bear to stretch, compress, bend at the flexible electronic (Flexible of large deformation
Electronics) and directly in the stereo circuit of three-dimensional plastic carrier surface mount electronic component
(Three-dimensional Moulded Interconnect Devices：Three dimensional mold interconnecting device)
It is the New Times of main body of development.It is such it is extending, bending flexible electronic device and design freely,
Baroque stereo circuit solar cell, dynamic pickup, health monitoring systems, can
The fields such as wearable device have widely with good application prospect.
As traditional integrated circuit manufacturing technology, matrix material is that these are emerging with preparation technology
The main drive of electronic technology development.With materialogy, mechanics and manufacturing technology level
It is constantly progressive, it is desirable to the manufacturing process and method of traditional silicon electronic device to be broken through, using energy-saving ring
Protect and the new material of flexible intelligent manufactures deformable, easy processing, can customize with manufacturing process
Individual electronic product of new generation.
Traditional chemical subtractive process circuit production technique is mainly prepared by base material, circuit is etched,
The process such as element welding and insulation-encapsulated prepares circuit.This kind of processing technology is primarily adapted for use in
The shaping of planar circuit, can be used to prepare flexible electronic circuit, but cannot realize 3 D stereo electricity
The preparation on road, and operating process very complicated is, it is necessary to make special circuit mask, metal material
Material wastes serious, it is necessary to use various chemical medicaments and special raw material, the chemistry generated after etching
Sewage, heavy metal waste liquid environmental pollution are serious.
The current addition manufacturing process with spray printing, laser direct forming as representative is that a class is non-to be connect
Tactile, no pressure, the circuit reproduction technology without printing plate, are capable of achieving the fast of complex three-dimensional circuit structure
Speed design and processing.Its technological process is by injection or extrusion process forming three-dimensional structure first
Carrier, is processed by spray printing conductive ink or laser activation and forms conducting wire in carrier surface,
Then the metal layer thickness of conducting wire is increased by plating or chemical plating, finally in three-dimensional structure
Surface mounted electronic element, the stereoscopic electric that be combined together for three dimensions and electric function by formation
Road.Due to needing to use special material to prepare three-dimensional structure carrier, and needs are electroplated
Or chemical plating, manufacturing cost is high；The injection moulding of carrier and the generation of line pattern need special
Mould and equipment and strict environmental condition, high energy consumption and equipment manufacturing cost and maintenance cost
It is high；In addition laser activation and metal plating process can produce influence to circuit precision, so as to make
Qualification rate into product is low.
Either " subtractive process " or " addition process ", in equipment investment, material selection, energy-saving ring
Protect etc. aspect all there is certain defect, it is impossible to realized under normal temperature, the environmental condition of normal pressure it is low into
Originally, personalized circuit customization that is easy to operate, having flexible circuit and stereo circuit feature concurrently.
The content of the invention
The technical problems to be solved by the invention are how to realize stereo circuit at normal temperatures and pressures
Manufacture.
For this purpose, three-dimensional the invention provides a kind of liquid metal based on 3D printing technique
Circuit fabrication method, comprises the following steps：
S1：Set up the threedimensional model corresponding with the three-dimensional structure of stereo circuit to be manufactured, and root
According to the line alignment of the stereo circuit hollow duct is set up inside the threedimensional model；
S2：By 3D printing technique, the three dimensional model printing that the step S1 is obtained is into three
Dimension entity；
S3：Liquid metal is filled in the hollow duct of the 3D solid.
Preferably, also include after the step S3：
S4：Electronic component pin is inserted the corresponding position of the 3D solid that the step S3 is obtained
Put.
Preferably, the step S1 also includes：Line alignment according to the stereo circuit is in institute
State threedimensional model surface and electronic component pin jack is set.
Preferably, the step S1 also includes：Intersection point and/or turning in the hollow duct
The perfusing hole and/or exhaust outlet of the liquid metal are set.
Preferably, also include after the step S4：To the electronic component pin jack,
The perfusing hole and/or exhaust outlet of the liquid metal are blocked.
Preferably, the step S2 includes：
STL formatted files according to the threedimensional model are layered to the threedimensional model, are cut
Piece treatment；
Printing head and forming board are preheated；
The three dimensional model printing that control printing head successively obtains the step S1 is real into three-dimensional
Body.
Preferably, the step S3 includes：The liquid metal is noted using micro-injection system
The full hollow duct.
Preferably, the liquid metal includes：Gallium, gallium-indium alloy, gallium-indium-tin alloy, gallium indium
Red brass, bismuth indium alloy, bismuth indium stannum alloy, bismuth indium red brass.
Preferably, the liquid metal is gallium indium bianry alloy, and gallium indium mass ratio range is
75.5%: 24.5%~90%: 10%.
On the other hand, present invention also offers one kind using it is above-mentioned any one be based on 3D printing
The liquid metal stereo circuit that the manufacture method of the liquid metal stereo circuit of technique is made.
Compared with prior art, its main distinction and beneficial effect are the present invention：
The present invention can be with TPUE as processing object, using 3D printing work
Skill prepares flexible 3 D structural solid and the hollow duct being consistent with predetermined conducting wire, without
Using special equipments such as mould, injection machines, the three-dimensional knot of personalization can be freely designed, manufactured
Structure entity and move towards complicated conducting wire；In addition, the present invention is by three-dimensional structure carrier
The mode that liquid metal is irrigated in interior hollow duct constitutes three-dimensional conducting wire, it is not necessary to use
Containing the material modified of the special composition such as special catalyst or laser activation metal, and then eliminate
The technological processes such as surface is modified, laser activation and metal deposition；Because conducting wire is tied in three-dimensional
Structure carrier inside is constituted, and can remove insulation-encapsulated step from；Three by way of pin is inserted
Dimension structural solid surface placement electronic component simultaneously carries out encapsulating encapsulation to pin interface, without weldering
Connect or paste operation.
Compared with existing preparation technology, the cost of manufacture of stereo circuit can not only be greatly reduced,
And installation, Making programme are simplified, stereo circuit oneself can be just realized at normal temperatures and pressures
By, quick, economic personalized designs, manufacture.Beaten liquid metal and 3D is made full use of
There is greater advantage in print manufacturing process and Development of Novel flexible stereo circuit technology of preparing.
Brief description of the drawings
The features and advantages of the present invention can be more clearly understood from by reference to accompanying drawing, accompanying drawing is to show
Meaning property and should not be construed as carrying out the present invention any limitation, in the accompanying drawings：
Fig. 1 shows the manufacture of liquid metal stereo circuit of the present invention based on 3D printing technique
The schematic flow sheet of method；
Fig. 2 shows the multiaspect of the use manufacture method manufacture of the invention that embodiment 2 is provided
The structural representation of LED flexible stereo lamp sockets；
Fig. 3 show the use manufacture method of the invention manufacture that embodiment 3 is provided containing built-in
The structural representation of the flexible hand casing of antenna
Specific embodiment
Below in conjunction with accompanying drawing, embodiments of the present invention is described in detail.
Embodiment 1
As shown in figure 1, a kind of liquid metal stereo circuit manufacturer based on 3D printing technique
Method, comprises the following steps：
S1：Foundation threedimensional model corresponding with the three-dimensional structure of stereo circuit to be manufactured, and according to
The line alignment of the stereo circuit sets up hollow duct inside the threedimensional model；
S2：By 3D printing technique, the three dimensional model printing that the step S1 is obtained is into three
Dimension entity；
S3：Liquid metal is filled in the hollow duct of the 3D solid；
Specifically, step S1：According to the design requirement of stereo circuit, using UG NX,
The Computerized three-dimensional such as Solidworks, ProE Wildfire modeling software is set up and stereoscopic electric to be manufactured
The corresponding threedimensional model of three-dimensional structure on road, and according to the line alignment of the stereo circuit in institute
State and hollow duct is set up inside threedimensional model, one STL file of output is used to instruct 3D printing
The system print threedimensional model.Wherein, the cross sectional shape of hollow duct can be square or circle
Shape, the cross-sectional square shape length of side or round diameter scope are more excellent in 0.5~1.5mm.Wherein preferably,
If using rigid printed material, can be according to the line alignment of the stereo circuit in institute
State threedimensional model surface and electronic component pin jack is set, if using flexible print material
Material, then can directly insert and pass through without setting electronic component pin jack by electronic component
Cross on the 3D solid of 3D printing.Furthermore it is possible to the hollow duct intersection point and/or turn
Angle sets the perfusing hole and/or exhaust outlet of the liquid metal.The perfusing hole of the liquid metal
And/or the directly preferably 2mm of exhaust outlet and electronic component pin jack.Wherein, it is
Avoid runner spacing it is too small may cause perfusion liquid metal wire between occur infiltration, it is short
Road, so the distance between adjacent hollow duct should be greater than 2mm.
Specifically, step S2：The STL forms of the stereo circuit threedimensional model that step S1 is obtained
File is imported in 3D printing control system Repetier-Host, set floor height parameter area as
0.25~0.4mm, the STL formatted files according to the threedimensional model are carried out to the threedimensional model
Layering, slicing treatment, specifically, by Slice Software special in 3D printing control system
Slic3r is layered to threedimensional model, slicing treatment, and every layer of data conversion is turned into fortune
Dynamic rail mark code, so as to instruct the printing-forming of follow-up 3D solid.
Wherein preferably, it is possible to use fusion sediment 3D printing system and use thermoplastic poly
Urethane elastomer is material, and the three dimensional model printing that the step S1 is obtained is into 3D solid.
Specifically, it is possible to use printing meet and discuss a diameter of 0.5mm fusion sediment 3D printing system and
The transparent thermoplastic polyurethane elastomer for using diameter 1.75mm is material, sets print speed
It is 10~15mm/s.
Printing head and forming board are preheated, specifically, will be printed by temperature control system
Shower nozzle is preheating to 220~250 DEG C, and forming board is preheating to 60~80 DEG C, then according to the fortune of generation
The dynamic rail mark code control printing head three dimensional model printing that successively obtains the step S1 into
3D solid.Specifically, in the print procedure of ground floor, print speed is the 80% of setting value
To ensure that it is effectively Nian Jie that first floor printed material can be formed between forming board.Complete ground floor
After the printing of structure, shower nozzle rises 0.25~0.4mm according to floor height setting value, then carries out the
The printing of two-layer structure, successively duplicate printing is until complete whole stereo circuit three-dimensional structure carrier
Manufacture.
Specifically, step S3：Liquid metal is filled in the hollow duct of the 3D solid；
Wherein preferably, the liquid metal is filled into the hollow duct using micro-injection system.
Specifically, it is possible to use by micro-injection pump, 20ml disposable syringes, internal diameter 1.65mm
The PVC transparent of dispensing needle head (external diameter 2.1mm), 1.6mm female Luers and internal diameter 1.5mm
Liquid metal is injected three by the micro-injection system that the flow of flexible pipe composition is controllable by perfusing hole
Hollow duct in dimension structural solid.Wherein, the liquid metal of perfusion includes：Gallium, gallium
Indium alloy, gallium-indium-tin alloy, gallium indium red brass, bismuth indium alloy, bismuth indium stannum alloy, bismuth indium
Red brass.Wherein preferred, the liquid metal is gallium indium bianry alloy, gallium indium mass ratio
Example scope is 75.5%: 24.5%~90%: 10%.In filling process, can be according to flow passage structure
Complexity and reality perfusion effect, component pin jack, exhaust outlet are converted into row
Gas port or perfusing hole are used, it is ensured that liquid metal fills all flow channel spaces.Treat that liquid metal is noted
The liquid metal of spilling is cleared up after full whole flow passage system.The liquid metal of injection can be by fluid
Circuit state works.Optionally, reused after can also being solidified, now, only need to use cold
Air is cooled down to printing filling piece, you can the stereo circuit after being solidified.
Preferably, step S4 can also be included：Electronic component pin is inserted into the step S3
The correspondence position of the 3D solid for obtaining.Wherein preferably, according to circuit design requirements, will be each
The installation connecting hole specified in independent electronic component pin insertion three-dimensional structure entity, uses
705 silicon rubber are blocked and electronics unit device to all pin jacks, perfusing hole and/or exhaust outlet
The fixation of part.
Embodiment 2
On the other hand, the manufacture method present invention also offers a kind of use embodiment 1 makes
Stereo circuit, for example：Multiaspect LED flexible stereo lamp sockets as shown in Figure 2
Wherein, the step of multiaspect LED flexible stereo lamp sockets is made using the manufacture method of embodiment 1
It is rapid as follows：
Step 1：According to the design requirement of multiaspect LED flexible stereo lamp sockets, computer three is used
Dimension modeling software UG NX10.0 build and the multiaspect LED flexibility lamp sockets three-dimensional knots of 2A shown in Fig. 2
The corresponding three-dimensional model of structure, and according to lamp socket inner conductive circuit trends of design in model
It is circle that portion creates cross sectional shape, and diameter of section is the hollow duct of 1mm, while in runner
Two-end-point be respectively provided with the perfusing hole and LED lamp bead pin jack of a diameter of 2mm, obtain
The threedimensional model corresponding with predetermined three-dimensional circuit pattern and physical form simultaneously exports STL forms
File, for instructing 3D printing system to prepare flexible liquid cubic metal characters or patterns circuit.
Step 2：Stl file is imported in 3D printing control system Repetier-Host, layer is set
High parameter is 0.3mm, by Slice Software Slic3r special in control system to threedimensional model
Be layered, slicing treatment, and by every layer of data conversion turn into movement locus code so that
Instruct the printing-forming of follow-up 3D solid.
Step 3：It is the fusion sediment 3D printing system of 0.4mm to start jet diameters, with diameter
The transparent thermoplastic polyurethane silk material of 1.75mm is printed material, sets print speed as 10
Mm/s, 250 DEG C are preheating to by temperature control system by printing head, and forming board is preheating to 60 DEG C,
Then the movement locus code according to generation carries out the printing of 3D solid.In the printing of ground floor
During, print speed can be with shaping base to ensure first floor printed material for the 80% of setting value
Effectively bonding is formed between plate.After completing the printing of the first Rotating fields, shower nozzle sets according to floor height
Value rises 0.3mm, then carries out the printing of the second Rotating fields, and successively duplicate printing is until complete
The manufacture of whole stereo circuit three-dimensional structure carrier.
Step 4：Using by micro-injection pump, 20ml disposable syringes, internal diameter 1.65mm
The PVC transparent of dispensing needle head (external diameter 2.1mm), 1.6mm female Luers and internal diameter 1.5mm
The micro-injection system that the flow of flexible pipe composition is controllable passes through perfusing hole 2E by liquid metal
GaIn10Injection hollow duct forms conducting wire 2D.In filling process, can be according to flow passage structure
Complexity and reality perfusion effect, component pin jack is converted into exhaust outlet or filling
Geat is used, it is ensured that liquid metal fills all flow channel spaces.Treat that liquid metal fills whole stream
The liquid metal of spilling is cleared up after road system.
Step 5：According to the design requirement of multiaspect LED flexible stereo lamp sockets, by LED lamp bead 2B
Pin inserts the pin jack 2C of holder surface, and all of perfusing hole is blocked using 705 silicon rubber
2E and pin jack 2C, completes all operations step.
Embodiment 3
Present invention also offers the stereo circuit that a kind of manufacture method of use embodiment 1 makes,
For example：As shown in figure 3, the flexible hand casing containing built-in aerial.
Wherein, the flexible hand casing containing built-in aerial is made using the manufacture method of embodiment 1
The step of it is as follows：
Step 1：According to the design requirement of the flexible hand casing containing built-in aerial, calculating is used
Outside flexible mobile phone containing built-in aerial shown in machine 3 d modeling software UG NX10.0 structures and Fig. 3
The corresponding stereoscopic three-dimensional model of shell 3A three-dimensional structures, and according to the circuit design of built-in aerial
It is square that trend creates cross sectional shape inside model, and sectional dimension is the hollow flow of 1mm
Road, while the two-end-point in runner is respectively provided with the perfusing hole and exhaust outlet of a diameter of 2mm,
Obtain the threedimensional model corresponding with predetermined three-dimensional circuit pattern and physical form and export STL
Formatted file, for instructing 3D printing system to prepare flexible liquid cubic metal characters or patterns circuit.
Step 2：Stl file is imported in 3D printing control system Repetier-Host, layer is set
High parameter is 0.25mm, by Slice Software Slic3r special in control system to threedimensional model
Be layered, slicing treatment, and by every layer of data conversion turn into movement locus code so that
Instruct the printing-forming of follow-up 3D solid.
Step 3：It is the fusion sediment 3D printing system of 0.5mm to start jet diameters, with diameter
The transparent thermoplastic polyurethane silk material of 1.75mm is printed material, sets print speed as 12
Mm/s, 250 DEG C are preheating to by temperature control system by printing head, and forming board is preheating to 60 DEG C,
Then the movement locus code according to generation carries out the printing of 3D solid.In the printing of ground floor
During, print speed can be with shaping base to ensure first floor printed material for the 80% of setting value
Effectively bonding is formed between plate.After completing the printing of the first Rotating fields, shower nozzle sets according to floor height
Value rises 0.25mm, then carries out the printing of the second Rotating fields, and successively duplicate printing is until complete
Into the manufacture of whole stereo circuit three-dimensional structure carrier.
Step 4：Using by micro-injection pump, 20ml disposable syringes, internal diameter 1.65mm
The PVC transparent of dispensing needle head (external diameter 2.1mm), 1.6mm female Luers and internal diameter 1.5mm
The micro-injection system that the flow of flexible pipe composition is controllable passes through perfusing hole 3C by liquid metal
GaIn24.5Injection hollow duct forms built-in aerial 3B.Treat that liquid metal fills whole runner system
The liquid metal of spilling is cleared up after system, all of perfusing hole 3C and row are blocked using 705 silicon rubber
Gas port 3D, completes all operations step.
The present invention can be with TPUE as processing object, using 3D printing work
Skill prepares flexible 3 D structural solid and the hollow duct being consistent with predetermined conducting wire, without
Using special equipments such as mould, injection machines, the three-dimensional knot of personalization can be freely designed, manufactured
Structure entity and move towards complicated conducting wire；In addition, the present invention is by three-dimensional structure carrier
The mode that liquid metal is irrigated in interior hollow duct constitutes three-dimensional conducting wire, it is not necessary to use
Containing the material modified of the special composition such as special catalyst or laser activation metal, and then eliminate
The technological processes such as surface is modified, laser activation and metal deposition；Because conducting wire is tied in three-dimensional
Structure carrier inside is constituted, and can remove insulation-encapsulated step from；Three by way of pin is inserted
Dimension structural solid surface placement electronic component simultaneously carries out encapsulating encapsulation to pin interface, without weldering
Connect or paste operation.
Compared with existing preparation technology, the cost of manufacture of stereo circuit can not only be greatly reduced,
And installation, Making programme are simplified, stereo circuit oneself can be just realized at normal temperatures and pressures
By, quick, economic personalized designs, manufacture.Beaten liquid metal and 3D is made full use of
There is greater advantage in print manufacturing process and Development of Novel flexible stereo circuit technology of preparing.
Although being described in conjunction with the accompanying embodiments of the present invention, those skilled in the art can
To make various modifications and variations without departing from the spirit and scope of the present invention, so
Modification and within the scope of modification each falls within and is defined by the appended claims.
Claims (10)
1. a kind of liquid metal stereo circuit manufacture method based on 3D printing technique, it is characterised in that comprise the following steps：
S1：The threedimensional model corresponding with the three-dimensional structure of stereo circuit to be manufactured is set up, and hollow duct is set up inside the threedimensional model according to the line alignment of the stereo circuit；
S2：By 3D printing technique, the three dimensional model printing that the step S1 is obtained is into 3D solid；
S3：Liquid metal is filled in the hollow duct of the 3D solid.
2. the liquid metal stereo circuit manufacture method based on 3D printing technique according to claim 1, it is characterised in that also include after the step S3：
S4：Electronic component pin is inserted the correspondence position of the 3D solid that the step S3 is obtained.
3. the liquid metal stereo circuit manufacture method based on 3D printing technique according to claim 2, it is characterised in that the step S1 also includes：Line alignment according to the stereo circuit sets electronic component pin jack on the threedimensional model surface.
4. the liquid metal stereo circuit manufacture method based on 3D printing technique according to claim 3, it is characterised in that the step S1 also includes：In the intersection point of the hollow duct and/or turning, the perfusing hole and/or exhaust outlet of the liquid metal are set.
5. the liquid metal stereo circuit manufacture method based on 3D printing technique according to claim 4, it is characterised in that also include after the step S4：The electronic component pin jack, the perfusing hole of the liquid metal and/or exhaust outlet are blocked.
6. the liquid metal stereo circuit manufacture method based on 3D printing technique according to claim 1-5 any one, it is characterised in that the step S2 includes：
STL formatted files according to the threedimensional model are layered to the threedimensional model, slicing treatment；
Printing head and forming board are preheated；
Control the three dimensional model printing that printing head successively obtains the step S1 into 3D solid.
7. the liquid metal stereo circuit manufacture method based on 3D printing technique according to claim 1-5, it is characterised in that the step S3 includes：The liquid metal is filled into the hollow duct using micro-injection system.
8. the liquid metal stereo circuit manufacture method based on 3D printing technique according to claim 1-5, it is characterised in that the liquid metal includes：Gallium, gallium-indium alloy, gallium-indium-tin alloy, gallium indium red brass, bismuth indium alloy, bismuth indium stannum alloy, bismuth indium red brass.
9. the liquid metal stereo circuit manufacture method based on 3D printing technique according to claim 8, it is characterised in that the liquid metal is gallium indium bianry alloy, gallium indium mass ratio range is 75.5%: 24.5%~90%: 10%.
10. a kind of liquid metal stereo circuit based on 3D printing technique, it is characterised in that be made up of the liquid metal stereo circuit manufacture method based on 3D printing technique described in any one in claim 1~9.
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Application publication date: 20170609 Assignee: BEIJING DREAM INK TECHNOLOGIES Co.,Ltd. Assignor: Technical Institute of Physics and Chemistry Chinese Academy of Sciences Contract record no.: X2021110000040 Denomination of invention: Liquid metal stereo circuit based on 3D printing process and its manufacturing method Granted publication date: 20190215 License type: Exclusive License Record date: 20210924 |
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