CN106817838A - A kind of Upper conductive layer of net substrate - Google Patents
A kind of Upper conductive layer of net substrate Download PDFInfo
- Publication number
- CN106817838A CN106817838A CN201710191326.0A CN201710191326A CN106817838A CN 106817838 A CN106817838 A CN 106817838A CN 201710191326 A CN201710191326 A CN 201710191326A CN 106817838 A CN106817838 A CN 106817838A
- Authority
- CN
- China
- Prior art keywords
- conducting strip
- conductive layer
- conductive sheet
- clad laminate
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims 5
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 4
- 238000006073 displacement reaction Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention is the Upper conductive layer on a kind of net substrate, it is characterised in that it includes：Conducting strip（Upper side frame conducting strip, lower frame conducting strip, left frame conducting strip, left frame conducting strip, horizontal conductive strips, vertical conduction piece are named as according to its position）, using copper-clad plate (CCL Copper Clad Laminate) or flexibility coat copper plate (FCCL Flexible Copper Clad Laminate）Made through manufacturing process for printed circuit board, it is also possible to which thin metallic film makes of cutting technique；Conducting strip is provided with stopper slot and/or spacing protrusion, for being cooperated between conducting strip, being positioned, be connected, so as to constitute complete Upper conductive layer.This Upper conductive layer has low cost, the advantage of material-saving.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB), more particularly to a kind of printed circuit board (PCB) with net as substrate.
Background technology
CN105263259A proposes the concept of net substrate and Upper conductive layer in the prior art, and its upper strata conductive layer is
With copper-clad plate (CCL Copper Clad Laminate) or flexibility coat copper plate (FCCL Flexible Copper Clad
Laminate）Made through manufacturing process for printed circuit board, excision at component is not connected up and do not put thereon, due to circuitous pattern portion
Divide the area very little for accounting for, cause the copper-clad plate of 60%-80% or flexibility coat copper plate to be all wasted.
In order to reduce the waste of material of copper-clad plate or flexibility coat copper plate, while using chemical attack high precision, position standard
Advantage.The design people creates really tool practical finally by constantly research, design, and after studying sample repeatedly and improving
The present invention of value.
The content of the invention
It is a primary object of the present invention to overcome CN105263259A is proposed in the prior art net substrate and Upper conductive
The big shortcoming of waste of material in layer manufacturing process, and a kind of Upper conductive layer printed circuit of the net substrate of new structure is provided
Plate.Technical problem to be solved is using copper-clad plate (CCL Copper Clad Laminate) or flexibility coat copper plate (FCCL
Flexible Copper Clad Laminate）Made through manufacturing process for printed circuit board, it is also possible to thin metallic film cutting
Technique makes, and is then provided with stopper slot and/or spacing protrusion using conducting strip, realizes being cooperated between conducting strip, determines
Position, linking, so as to constitute complete Upper conductive layer, it is to avoid in whole material（Copper-clad plate, flexibility coat copper plate, metallic film）
Hollow out goes out circuitous pattern, so that material-saving.
The object of the invention to solve the technical problems is realized using following technical scheme.
According to a kind of Upper conductive layer of net substrate proposed by the present invention, it is characterised in that it includes：
Conducting strip（Upper side frame conducting strip is named as according to its position, lower frame conducting strip, left frame conducting strip, left frame is conductive
Piece, horizontal conductive strips, vertical conduction piece）, using copper-clad plate (CCL Copper Clad Laminate) or flexibility coat copper plate
(FCCL Flexible Copper Clad Laminate）Made through manufacturing process for printed circuit board, it is also possible to thin metallic film
Made of cutting technique；Conducting strip is provided with stopper slot and/or spacing protrusion, for being cooperated between conducting strip, being positioned,
Linking.
Further, thickness 0.1-0.3 millimeters of the conducting strip.
Further, the circuitous pattern and the copper-clad plate that are made through manufacturing process for printed circuit board on the conducting strip are scratched
There is insulation gap at the edge of property copper-clad plate, general 0.2-0.5 millimeters.
Further, the copper-clad plate or flexibility coat copper plate are lamina or multi-layer sheet.
From above technical scheme, a kind of Upper conductive layer of the present invention-net substrate at least has following advantages：Keep away
Exempt from whole material（Copper-clad plate, flexibility coat copper plate, metallic film）Hollow out goes out circuitous pattern, can material-saving 60%-80%.With
Conducting strip hand assembled goes out complete Upper conductive layer, and excessive cost is not increased yet, and the technical requirements to operator are not high.
Described above is only the general introduction of technical solution of the present invention, in order to better understand technological means of the invention,
And can be practiced according to the content of specification, below with presently preferred embodiments of the present invention and coordinate accompanying drawing describe in detail as after.
Brief description of the drawings
Fig. 1 is a kind of Upper conductive layer top view schematic diagram of net substrate of one embodiment of the invention.
1st, the hole of Upper conductive layer 11, Upper conductive layer hollow out（There are 117 in Fig. 1）2nd, upper side frame conducting strip 3, the right side
Frame conducting strip 4, lower frame conducting strip 5, left frame conducting strip 6, horizontal conductive strips 7, vertical conduction piece 21, it is upper and lower,
The spacing protrusion of left and right frame conducting strip（Respectively there are 2）22nd, the stopper slot of upper and lower, left and right frame conducting strip（Respectively have 2
It is individual）23rd, the horizontal displacement stopper slot of upper and lower frame conducting strip（Respectively there are 3）24th, left and right frame conducting strip and vertical conduction
The vertical displacement stopper slot of piece（Respectively there are 12）.
Specific embodiment
Further to illustrate the present invention to reach technological means and effect that predetermined goal of the invention is taken, below in conjunction with
Accompanying drawing and preferred embodiment, to according to a kind of net substrate proposed by the present invention Upper conductive layer specific embodiment, structure,
Feature and its effect, describe in detail as after.
It is accurate if Fig. 1 is a kind of Upper conductive layer top view schematic diagram of net substrate that presently preferred embodiments of the present invention is proposed
Prepare the net substrate Upper conductive layer of work（1）It is long 30 centimetres, wide 21 centimetres, thick 0.2 millimeter, 117 1.7*1.7 lis of hollow out thereon
The hole of rice（11）.Upper side frame conducting strip (2), left frame conducting strip (3), lower frame conducting strip are produced using flexibility coat copper plate
(4), left frame conducting strip (5).By the spacing protrusion of upper side frame conducting strip (2)（21）Insertion left frame conducting strip (5) is spacing
Groove（22）, then by the spacing protrusion of left frame conducting strip (3)（21）Insertion upper side frame conducting strip (2) stopper slot（22）, then will
The spacing protrusion of lower frame conducting strip (4)（21）Insertion left frame conducting strip (3) stopper slot（22）, then left frame is conductive
The spacing protrusion of piece (5)（21）Insertion lower frame conducting strip (4) stopper slot（22）, form frame.
Successively 12 horizontal conductive strips（6）Through 3 vertical conduction pieces（7）Vertical displacement stopper slot（24）, then 3
Root vertical conduction piece（7）Through upper side frame conducting strip（2）, lower frame conducting strip（4）Horizontal displacement stopper slot（23）, then 12
Root horizontal conductive strips（6）Through left frame conducting strip（3）With left frame conducting strip（5）Vertical displacement stopper slot（24）, formed
Complete Upper conductive layer（1）.
The above, is only one embodiment of the present of invention, and any formal limitation is not made to the present invention, is appointed
What those skilled in the art, without departing from the scope of the present invention, when in the technology using the disclosure above
Appearance makes a little change or is modified to the Equivalent embodiments of equivalent variations, as long as being the content without departing from technical solution of the present invention,
Any simple modification, equivalent variations and the modification made to above example according to technical spirit of the invention, still fall within this
In the range of inventive technique scheme.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710191326.0A CN106817838A (en) | 2017-03-28 | 2017-03-28 | A kind of Upper conductive layer of net substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710191326.0A CN106817838A (en) | 2017-03-28 | 2017-03-28 | A kind of Upper conductive layer of net substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106817838A true CN106817838A (en) | 2017-06-09 |
Family
ID=59116620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710191326.0A Pending CN106817838A (en) | 2017-03-28 | 2017-03-28 | A kind of Upper conductive layer of net substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106817838A (en) |
Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB932210A (en) * | 1959-12-12 | 1963-07-24 | Dielektra Ag | Improvements in and relating to printed circuits |
| US3465435A (en) * | 1967-05-08 | 1969-09-09 | Ibm | Method of forming an interconnecting multilayer circuitry |
| US4189533A (en) * | 1973-11-07 | 1980-02-19 | General Electric Company | Stippled substrate for pressed battery plates |
| JPH05275852A (en) * | 1992-03-24 | 1993-10-22 | Toppan Printing Co Ltd | Printed wiring board with metal core and manufacturing method thereof |
| JPH09214074A (en) * | 1996-02-06 | 1997-08-15 | Hitachi Cable Ltd | Composite molded article and manufacturing method thereof |
| JP2000133891A (en) * | 1998-08-19 | 2000-05-12 | Sony Chem Corp | Flexible printed wiring board and its manufacture |
| US20050092519A1 (en) * | 2003-11-05 | 2005-05-05 | Beauchamp John K. | Partially flexible circuit board |
| KR20080006069A (en) * | 2006-07-11 | 2008-01-16 | 이형곤 | Economy Conductive Materials |
| US20090236141A1 (en) * | 2008-03-19 | 2009-09-24 | Samsung Electro-Mechanics Co., Ltd. | Electromagnetic bandgap structure and printed circuit board |
| CN101778543A (en) * | 2010-02-04 | 2010-07-14 | 深南电路有限公司 | Multi-layer printed circuit board machining process |
| CN201936892U (en) * | 2010-11-24 | 2011-08-17 | 吉富新能源科技(上海)有限公司 | Combined type thin film solar energy cell composition structure |
| CN202507612U (en) * | 2012-02-24 | 2012-10-31 | 鹤山东力电子科技有限公司 | Metal copper-clad plate |
| US20160037623A1 (en) * | 2012-09-07 | 2016-02-04 | Joseph Fjelstad | Solder alloy free electronic (safe) rigid-flexible/stretchable circuit assemblies having integral, conductive and heat spreading sections and methods for their manufacture |
| CN106255317A (en) * | 2016-08-23 | 2016-12-21 | 凯普金业电子科技（昆山）有限公司 | A kind of convenient splicing durable type HDI flexible circuit board and processing technique thereof |
| US20170055346A1 (en) * | 2008-03-18 | 2017-02-23 | Metrospec Technology, L.L.C. | Interconnectable circuit boards |
| JP6093073B1 (en) * | 2016-06-17 | 2017-03-08 | 達也 宮崎 | Metal foil substrate for electronic circuits |
| CN206894989U (en) * | 2017-03-28 | 2018-01-16 | 西华大学 | A kind of Upper conductive layer of net substrate |
-
2017
- 2017-03-28 CN CN201710191326.0A patent/CN106817838A/en active Pending
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB932210A (en) * | 1959-12-12 | 1963-07-24 | Dielektra Ag | Improvements in and relating to printed circuits |
| US3465435A (en) * | 1967-05-08 | 1969-09-09 | Ibm | Method of forming an interconnecting multilayer circuitry |
| GB1221968A (en) * | 1967-05-08 | 1971-02-10 | Ibm | Printed circuit card |
| US4189533A (en) * | 1973-11-07 | 1980-02-19 | General Electric Company | Stippled substrate for pressed battery plates |
| JPH05275852A (en) * | 1992-03-24 | 1993-10-22 | Toppan Printing Co Ltd | Printed wiring board with metal core and manufacturing method thereof |
| JPH09214074A (en) * | 1996-02-06 | 1997-08-15 | Hitachi Cable Ltd | Composite molded article and manufacturing method thereof |
| JP2000133891A (en) * | 1998-08-19 | 2000-05-12 | Sony Chem Corp | Flexible printed wiring board and its manufacture |
| US20050092519A1 (en) * | 2003-11-05 | 2005-05-05 | Beauchamp John K. | Partially flexible circuit board |
| KR20080006069A (en) * | 2006-07-11 | 2008-01-16 | 이형곤 | Economy Conductive Materials |
| US20170055346A1 (en) * | 2008-03-18 | 2017-02-23 | Metrospec Technology, L.L.C. | Interconnectable circuit boards |
| US20090236141A1 (en) * | 2008-03-19 | 2009-09-24 | Samsung Electro-Mechanics Co., Ltd. | Electromagnetic bandgap structure and printed circuit board |
| CN101778543A (en) * | 2010-02-04 | 2010-07-14 | 深南电路有限公司 | Multi-layer printed circuit board machining process |
| CN201936892U (en) * | 2010-11-24 | 2011-08-17 | 吉富新能源科技(上海)有限公司 | Combined type thin film solar energy cell composition structure |
| CN202507612U (en) * | 2012-02-24 | 2012-10-31 | 鹤山东力电子科技有限公司 | Metal copper-clad plate |
| US20160037623A1 (en) * | 2012-09-07 | 2016-02-04 | Joseph Fjelstad | Solder alloy free electronic (safe) rigid-flexible/stretchable circuit assemblies having integral, conductive and heat spreading sections and methods for their manufacture |
| JP6093073B1 (en) * | 2016-06-17 | 2017-03-08 | 達也 宮崎 | Metal foil substrate for electronic circuits |
| CN106255317A (en) * | 2016-08-23 | 2016-12-21 | 凯普金业电子科技（昆山）有限公司 | A kind of convenient splicing durable type HDI flexible circuit board and processing technique thereof |
| CN206894989U (en) * | 2017-03-28 | 2018-01-16 | 西华大学 | A kind of Upper conductive layer of net substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170609 |