CN106803079B - Fingerprint module and mobile terminal - Google Patents

Abstract

The invention discloses a fingerprint module, which comprises: the circuit board comprises a conductive part and an isolating part arranged around the conductive part, wherein the isolating part is used for isolating static electricity; the fingerprint chip is arranged on the circuit board and electrically connected with the conductive part; and the metal ring is sleeved on the periphery side of the fingerprint chip. The fingerprint module can prevent static electricity. The invention also discloses a mobile terminal applying the fingerprint module.

Description

Fingerprint module and mobile terminal

technical field

The present invention relates to the technical field of communication equipment, and in particular, to a fingerprint module and a mobile terminal using the fingerprint module.

Background technique

Most of the decorative rings of the fingerprint modules of the existing mobile terminals are made of metal materials. When a person touches the decorative rings or the decorative rings, static electricity is easily generated during the friction process. The static electricity on the decorative rings will adversely affect the fingerprint module.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is to provide an anti-static fingerprint module and a mobile terminal using the fingerprint module.

In order to achieve the above purpose, the embodiments of the present invention adopt the following technical solutions:

In one aspect, a fingerprint module is provided, including:

a circuit board, comprising a conductive part and an isolation part surrounding the conductive part, the isolation part is used to isolate static electricity;

a fingerprint chip, disposed on the circuit board and electrically connected to the conductive portion; and

A metal ring is sleeved on the outer peripheral side of the fingerprint chip.

On the other hand, a mobile terminal is also provided, which includes the fingerprint module and a casing as described above, wherein the casing includes a through hole, and the metal ring is clamped in the through hole.

Compared with the prior art, the present invention has the following beneficial effects:

Since the isolation portion is provided on the circuit board, the isolation portion can isolate static electricity, and the isolation portion is arranged around the conductive portion. Therefore, the isolation portion can prevent external static electricity from entering the conductive portion, thereby preventing static electricity from entering the conductive portion. The external static electricity destroys the circuit board, so the fingerprint module can prevent static electricity, has high working reliability, and has a long service life, so that the working reliability of the mobile terminal is high.

Description of drawings

In order to illustrate the technical solutions of the present invention more clearly, the following will briefly introduce the accompanying drawings used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention, which are common in the art. As far as technical personnel are concerned, other drawings can also be obtained from these drawings without creative labor.

FIG. 1 is a schematic structural diagram of a mobile terminal according to an embodiment of the present invention.

FIG. 2 is a schematic structural diagram of a fingerprint module of the mobile terminal shown in FIG. 1 .

FIG. 3 is a schematic structural diagram of a circuit board of the fingerprint module shown in FIG. 2 .

FIG. 4 is a schematic structural diagram of a conductive layer of the circuit board shown in FIG. 3 .

FIG. 5 is a schematic structural diagram of another circuit board of the fingerprint module shown in FIG. 2 .

FIG. 6 is a schematic structural diagram of the first conductive layer and the second conductive layer of the circuit board shown in FIG. 5 .

Detailed ways

The embodiments of the present application will be described below with reference to the accompanying drawings.

Referring to FIG. 1 , an embodiment of the present invention provides a mobile terminal 200 including a fingerprint module 100 and a casing 300 . The casing 300 includes a through hole 301 , and the fingerprint module 100 is clamped in the through hole 301 to be fixed to the inside of the casing 300 . The mobile terminal 200 may be an electronic device such as a mobile phone, a notebook computer, and a tablet computer. The casing 300 may be an upper casing or a casing of the mobile terminal 200 .

Please refer to FIG. 1 to FIG. 6 together. The fingerprint module 100 includes a circuit board 1 , a fingerprint chip 2 and a metal ring 3 . The circuit board 1 includes a conductive portion 11 and an isolation portion 12 surrounding the conductive portion 11 , and the isolation portion 12 is used to isolate static electricity. The fingerprint chip 2 is disposed on the circuit board 1 and is electrically connected to the conductive portion 11 . The metal ring 3 is sleeved on the outer peripheral side of the fingerprint chip 2 . The metal ring 3 is clamped in the through hole 301 , so that the fingerprint module 100 is fixed to the casing 300 . In other words, the metal ring 3 defines an accommodation space, and the fingerprint chip 2 is accommodated in the accommodation space.

In this embodiment, since the circuit board 1 is provided with the isolation portion 12 , the isolation portion 12 can isolate static electricity, and the isolation portion 12 surrounds the conductive portion 11 , so the isolation portion 12 can The external static electricity is prevented from entering the conductive portion 11, so as to prevent the external static electricity from damaging the circuit board 1, so the fingerprint module 100 can prevent static electricity, has high working reliability, and has a long service life, so that the mobile terminal 100 can work High reliability.

Optionally, the isolation portion 12 is made of conductive material and is grounded, and the isolation portion 12 and the conductive portion 11 are insulated from each other. The isolation portion 12 is grounded to form an electrostatic discharge path. When the metal ring 3 introduces external static electricity, the static electricity is quickly introduced to the ground through the isolation portion 12 , thereby preventing external static electricity from entering the conductive portion 11 .

A gap is formed between the isolation portion 12 and the conductive portion 11 so as to be insulated from each other. Alternatively, an insulating material is sandwiched between the isolation portion 12 and the conductive portion 11 to achieve mutual insulation.

The conductive material includes, but is not limited to, metallic materials such as copper, silver, aluminum, and the like. Optionally, the conductive material is a flexible conductive material.

Please refer to FIG. 2 to FIG. 4 together. In one embodiment, the circuit board 1 includes a base material layer 13 and a conductive layer 14 formed on the base material layer 13 . The conductive portion 11 includes a plurality of first pads 111 located on the conductive layer 14 and a signal line 112 electrically connected to the plurality of first pads 111, and the plurality of first pads 111 are used for electrical connection The fingerprint chip 2.

The isolation portion 12 includes a ground electrode 121 located on the conductive layer 14 , and the ground electrode 121 surrounds the periphery of the plurality of first pads 111 and the periphery of the signal line 112 . In this way, the ground electrode 121 is grounded to form an electrostatic discharge path. When the metal ring 3 introduces external static electricity, the static electricity is quickly introduced to the ground through the ground electrode 121 , thereby preventing external static electricity from entering the plurality of first pads 111 . and the signal line 112 .

Optionally, the base material layer 13 is made of a flexible material, so that the circuit board 1 is a flexible circuit board. The flexible material includes, but is not limited to, polyimide (PI) or polyethylene terephthalate (PET), so that the conductive layer 14 can be disposed on the base material layer 13 and can An insulating environment is provided to facilitate the etching of the conductive layer 14 . The conductive layer 14 is a patterned copper foil layer.

The circuit board 1 further includes a first cover film 15 and a second cover film 16 . The first cover film 15 is located on the side of the conductive layer 14 away from the base material layer 13 , the first cover film 15 covers the signal line 112 and the ground electrode 121 and exposes the plurality of The first pad 111 . The second cover film 16 is located on the side of the base material layer 13 away from the conductive layer 14 . Specifically, the first cover film 15 may be thermoformed by using a polyester material. The first cover film 15 is pasted on the conductive layer 14 by adhesive, so as to protect the signal line 112 and the ground electrode 121 from being broken or damaged. At the same time, the adhesive bonding method can also make the connection between the first cover film 15 and the conductive layer 14 tighter, so as to prevent the first cover film 15 from being displaced or detached so that the first cover film 15 cannot be exposed. The signal line 112 and the ground electrode 121 of the cover film 15 are protected. Likewise, the second cover film 16 can be thermoformed by using polyester material. The second cover film 16 is adhered to the base material layer 13 by adhesive, so as to protect the base material layer 13 from being broken or damaged. At the same time, the adhesive bonding method can also make the connection between the second cover film 16 and the base material layer 13 tighter, and prevent the second cover film 16 from being displaced or detached.

Further, the thickness of the ground electrode 121 is greater than the thickness of the signal line 112 and the thickness of the plurality of first pads 111 . At this time, the distance between the ground pole 121 and the metal ring 3 is closer, static electricity is more likely to flow from the ground pole 121 to the ground, and the anti-static performance of the fingerprint module 100 is better. At the same time, the larger thickness of the ground electrode 121 can be used as a reinforcing plate of the circuit board 1 to increase the structural strength of the circuit board 1 .

Please refer to FIG. 2 , FIG. 5 and FIG. 6 together. In another embodiment, the circuit board 1 includes a substrate layer 13 , and a first substrate layer 13 is located on the side of the substrate layer 13 facing the fingerprint chip 2 . The conductive layer 17 and the second conductive layer 18 are located on the side of the base material layer 13 away from the fingerprint chip 2 . The conductive portion 11 includes a plurality of first pads 111 located on the first conductive layer 17 , a plurality of second pads 113 located on the second conductive layer 18 and electrically connected to the plurality of second pads 113 of the signal line 112, the plurality of first pads 111 are used to electrically connect the fingerprint chip 2, and the plurality of second pads 113 are electrically connected to the plurality of first pads 111 in a one-to-one correspondence.

The isolation portion 12 includes a first ground electrode 122 located on the first conductive layer 17 and a second ground electrode 123 located on the second conductive layer 18. The first ground electrode 122 is surrounded by the plurality of ground electrodes. Around the first pad 111 , the second ground electrode 123 is arranged around the plurality of second pads 113 and the signal line 112 . At this time, the first ground electrode 122 is grounded and the second ground electrode 123 is grounded to form an electrostatic discharge path, the first ground electrode 122 prevents static electricity from entering the plurality of first pads 111, the second ground electrode 122 The ground electrode 123 prevents static electricity from entering the plurality of second pads 113 and the signal lines 112 . When the external static electricity is introduced into the metal ring 3, the static electricity is quickly introduced into the ground through the first ground electrode 122 and the second ground electrode 123, so as to prevent external static electricity from entering the plurality of first pads 111 and the plurality of first pads 111. a second pad 113 and the signal line 112 .

It can be understood that because the first conductive layer 17 is closer to the metal ring 3 than the second conductive layer 18, the electrostatic discharge effect of the first ground electrode 122 is more obvious. In one embodiment , only the first ground electrode 122 may be provided and the second ground electrode 123 may be omitted. Of course, in another embodiment, only the second ground electrode 123 may be provided and the first ground electrode 122 may be omitted.

The base material layer 13 includes a plurality of via holes 131 for electrically connecting the plurality of second pads 113 and the plurality of first pads 111 in a one-to-one correspondence. Of course, the base material layer 13 may further include via holes for electrically connecting the first ground electrode 122 and the second ground electrode 123 .

Optionally, the base material layer 13 is made of a flexible material, so that the circuit board 1 is a flexible circuit board. The flexible material includes, but is not limited to, polyimide (PI) or polyethylene terephthalate (PET), so that the conductive layer 14 can be disposed on the base material layer 13 and can An insulating environment is provided to facilitate the etching of the conductive layer 14 . The first conductive layer 17 is a patterned copper foil layer. The second conductive layer 18 is a patterned copper foil layer.

The circuit board 1 further includes a first cover film 15 and a second cover film 16 . The first cover film 15 is located on the side of the first conductive layer 17 away from the base material layer 13 , the first cover film 15 covers the first ground electrode 122 and exposes the plurality of first electrodes Pad 111 . The second cover film 16 is located on the side of the second conductive layer 18 away from the base material layer 13 , and the second cover film 16 covers the plurality of second pads 113 and the signal lines 112 and the second ground pole 123 . Specifically, the first cover film 15 may be thermoformed by using a polyester material. The first cover film 15 is pasted on the first conductive layer 17 by adhesive, so as to protect the first ground electrode 122 from being broken or damaged. At the same time, the adhesive bonding method can also make the connection between the first cover film 15 and the first conductive layer 17 tighter, so as to prevent the first cover film 15 from being displaced or detached and unable to expose the The first ground electrode 122 of the first cover film 15 is protected. Likewise, the second cover film 16 can be thermoformed by using polyester material. The second cover film 16 is pasted on the second conductive layer 18 by adhesive, so as to protect the plurality of second pads 113 , the signal lines 112 and the second ground electrodes 123 from being damaged or damage. At the same time, the adhesive bonding method can also make the connection between the second cover film 16 and the second conductive layer 18 tighter, and prevent the second cover film 16 from being displaced or detached.

Further, the thickness of the first ground electrode 122 is greater than the thickness of the plurality of first pads 111 . At this time, the distance between the first ground pole 122 and the metal ring 3 is closer, static electricity is more likely to flow from the first ground pole 122 to the ground, and the anti-static performance of the fingerprint module 100 is better. At the same time, the larger thickness of the first ground electrode 122 can be used as a reinforcing plate of the circuit board 1 to increase the structural strength of the circuit board 1 .

Please refer to FIG. 2 to FIG. 6 together. As an optional embodiment, the fingerprint chip 2 includes a plurality of connection pads 21 , and the plurality of connection pads 21 are located on the fingerprint chip 2 and face the printed circuit. On one side of the board 1 , the plurality of first pads 111 are in a one-to-one correspondence with the plurality of connection pads 21 . At this time, the plurality of first pads 111 are located within the vertical projection range of the fingerprint chip 2 on the circuit board 1 .

In this embodiment, since the plurality of first pads 111 are in a one-to-one correspondence with the plurality of connection pads 21 , the fingerprint chip 2 is flip-chipped on the circuit board 1 and assembled by flip-chip In this way, the overall height of the fingerprint module 100 can be reduced. Since the plurality of first pads 111 are located within the vertical projection range of the fingerprint chip 2 on the circuit board 1 , the distances between the plurality of first pads 111 and the metal ring 3 are relatively far. It can further prevent static electricity on the metal ring 3 from entering the plurality of first pads 111 .

The plurality of first pads 111 and the plurality of connection pads 21 may be connected by soldering.

Optionally, the signal line 112 (and the plurality of second pads 113 ) are also located within the vertical projection range of the fingerprint chip 2 on the circuit board 1 , so that the signal line 112 (and the plurality of second pads 113 ) The distance between the plurality of second pads 113 ) and the metal ring 3 is far away, which can further prevent the static electricity on the metal ring 3 from entering the signal line 112 (and the plurality of second pads 113 ) .

Referring to FIG. 2 , as an optional embodiment, the fingerprint module 100 further includes a reinforcing plate 4 , and the reinforcing plate 4 is located on the side of the circuit board 1 away from the fingerprint chip 2 . The reinforcing plate 4 is attached to the circuit board 1 to increase the structural strength of the circuit board 1 and prevent the circuit board 1 from being damaged by bending. In particular, when the circuit board 1 is a flexible circuit board, the reinforcing effect of the reinforcing plate 4 is more important.

Optionally, the reinforcing plate 4 is made of metal and is grounded. For example, the reinforcing plate 4 is a reinforcing steel plate. At this time, the reinforcing plate 4 can also be used to absorb the static electricity introduced by the metal ring 3 and release it to the ground.

Please refer to FIG. 1 and FIG. 2 together. As an optional embodiment, the fingerprint module 100 further includes a first insulating portion 5 , and the first insulating portion 5 is filled in the metal ring 3 and the fingerprint. Gap between chips 2. The first insulating portion 5 is made of insulating material, such as insulating glue.

In this embodiment, the first insulating portion 5 can isolate static electricity, preventing the static electricity of the metal ring 3 from directly entering the fingerprint chip 2 and damaging the fingerprint chip 2 . Therefore, the first insulating portion 5 can further improve the The anti-static performance of the fingerprint module 100 is described.

It can be understood that the insulating part can also play a sealing role at the same time, sealing the gap between the metal ring 3 and the fingerprint chip 2, so as to prevent external liquids (such as sweat on the user's hands) or dust from entering the environment. The internal parts of the mobile terminal 200 are damaged, and the parts inside the mobile terminal 200 play a role of waterproof and dustproof, so as to ensure the reliability of the operation of the mobile terminal 200 .

Optionally, the metal ring 3 includes a main body 31 and a flange 32 extending from one end of the main body 31 , the main body 31 defines the receiving space, and the flange 32 abuts against the circuit board 1 . .

Further, please refer to FIG. 2 to FIG. 6 together, the fingerprint module 100 further includes a second insulating portion 6 , and the second insulating portion 6 is sandwiched between the flange 32 and the circuit board 1 . . At this time, the metal ring 3 , the second insulating portion 6 and the isolation portion 12 of the circuit board 1 (ie the ground electrode 121 , the first ground electrode 122 or the second ground electrode 123) A coupling capacitor is formed together, and the coupling capacitor can absorb static electricity and then discharge it to the ground, thus preventing static electricity from damaging the fingerprint module 100 .

One end of the body 31 connected to the flange 32 is provided with a chamfer 311 to increase the coupling capacitance. Meanwhile, the first insulating portion 5 and the second insulating portion 6 are integrally formed, and the chamfer 311 makes the structure of the connection between the first insulating portion 5 and the second insulating portion 6 firm and reliable.

Referring to FIG. 2 , as an optional embodiment, the fingerprint module 100 further includes a cover plate 7 , and the cover plate 7 is located on the side of the fingerprint chip 2 away from the circuit board 1 . The cover plate 7 covers the fingerprint chip 2 for protecting the fingerprint chip 2 . The cover plate 7 is accommodated in the accommodation space. The first insulating portion 5 is filled between the cover plate 7 and the metal ring 3 .

Optionally, the cover plate 7 is a glass cover plate or a ceramic cover plate.

The embodiments of the present invention have been introduced in detail above, and specific examples are used to illustrate the principles and implementations of the present invention. The descriptions of the above embodiments are only used to help understand the methods and core ideas of the present invention; at the same time, for Persons of ordinary skill in the art, according to the idea of the present invention, will have changes in the specific embodiments and application scope. To sum up, the contents of this specification should not be construed as limiting the present invention.

Claims (14)

1. a fingerprint module, is characterized in that, comprises: The circuit board includes a conductive part and an isolation part surrounding the conductive part, the isolation part and the conductive part are located in the same layer and spaced apart, the thickness of the isolation part is greater than the thickness of the conductive part, so The isolation part is used to isolate static electricity; a fingerprint chip, disposed on the circuit board and electrically connected to the conductive portion; and The metal ring is sleeved on the outer peripheral side of the fingerprint chip, and the metal ring and the isolation portion are insulated from each other. 2 . The fingerprint module of claim 1 , wherein the isolation portion is made of conductive material and is grounded, and the isolation portion and the conductive portion are insulated from each other. 3 . 3 . The fingerprint module according to claim 2 , wherein the circuit board comprises a base material layer and a conductive layer formed on the base material layer, and the conductive part comprises a plurality of a plurality of first pads and a signal line electrically connected to the plurality of first pads, and the plurality of first pads are used to electrically connect the fingerprint chip. 4 . The fingerprint module according to claim 3 , wherein the isolation portion comprises a ground electrode located on the conductive layer, and the ground electrode is arranged around the periphery of the plurality of first pads and the around the signal line. 5 . The fingerprint module of claim 2 , wherein the circuit board comprises a base material layer, a first conductive layer located on the side of the base material layer facing the fingerprint chip, and a first conductive layer located on the base material. 6 . A second conductive layer on the side away from the fingerprint chip, and the conductive portion includes a plurality of first pads on the first conductive layer, a plurality of second pads on the second conductive layer, and electrical Signal lines connecting the plurality of second pads, the plurality of first pads are used for electrically connecting the fingerprint chip, and the plurality of second pads are electrically connected to the plurality of first pads in a one-to-one correspondence pad. 6 . The fingerprint module of claim 5 , wherein the isolation portion comprises a first ground electrode located on the first conductive layer and a second ground electrode located on the second conductive layer, and the The first ground electrode is arranged around the periphery of the plurality of first pads, and the second ground electrode is arranged around the periphery of the plurality of second pads and the signal line. 7 . The fingerprint module of claim 5 , wherein the base material layer comprises a plurality of via holes, and the plurality of via holes are used to electrically connect the plurality of second pads in a one-to-one correspondence. 8 . and the plurality of first pads. 8 . The fingerprint module according to claim 3 , wherein the fingerprint chip comprises a plurality of connection pads, and the plurality of connection pads are located on the fingerprint chip facing the circuit board. 9 . On one side of the , the plurality of first pads are in a one-to-one correspondence with the plurality of connection pads. 9. The fingerprint module according to any one of claims 3 to 7, wherein the fingerprint module further comprises a reinforcing plate, and the reinforcing plate is located at a part of the circuit board away from the fingerprint chip. side. 10 . The fingerprint module of claim 9 , wherein the reinforcing plate is made of metal and is grounded. 11 . 11 . The fingerprint module of claim 1 , wherein the fingerprint module further comprises a first insulating portion, and the first insulating portion is filled in a gap between the metal ring and the fingerprint chip. 12 . . 12. The fingerprint module according to claim 1 or 11, wherein the metal ring comprises a main body and a flange extending from one end of the main body, the main body defines a receiving space, and the flange abutting the circuit board. 13 . The fingerprint module of claim 12 , wherein the fingerprint module further comprises a second insulating portion, and the second insulating portion is sandwiched between the flange and the circuit board. 14 . 14. A mobile terminal, comprising the fingerprint module according to any one of claims 1 to 13 and a casing, wherein the casing comprises a through hole, and the metal ring is clamped in the through hole .

Images