CN106783679B - Chip mounting equipment and method of mounting chips - Google Patents
Chip mounting equipment and method of mounting chips Download PDFInfo
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- CN106783679B CN106783679B CN201611141417.5A CN201611141417A CN106783679B CN 106783679 B CN106783679 B CN 106783679B CN 201611141417 A CN201611141417 A CN 201611141417A CN 106783679 B CN106783679 B CN 106783679B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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Abstract
本发明提供一种芯片贴装设备及贴装芯片的方法，所述芯片贴装设备包括芯片取放装置、第一点胶装置及第二点胶装置，所述芯片取放装置用于吸取芯片并将所述芯片放置在基板上，所述第一点胶装置及第二点胶装置用于向基板的贴片位置注入粘结剂，所述第一点胶装置及第二点胶装置分设在所述芯片取放装置的两侧。本发明的优点在于，在芯片取放装置两侧均设置点胶装置，贴片与点胶同时进行，极大地提高了生产效率。
The invention provides a chip mounting equipment and a chip mounting method. The chip mounting equipment includes a chip picking and placing device, a first glue dispensing device and a second glue dispensing device. The chip picking and placing device is used to pick up chips. and place the chip on the substrate. The first glue dispensing device and the second glue dispensing device are used to inject adhesive into the patch position of the substrate. The first glue dispensing device and the second glue dispensing device are installed separately. on both sides of the chip pick-and-place device. The advantage of the present invention is that dispensing devices are provided on both sides of the chip pick-and-place device, and patching and dispensing are performed simultaneously, which greatly improves production efficiency.
Description
技术领域Technical field
本发明涉及半导体封装领域，尤其涉及一种芯片贴装设备及贴装芯片的方法。The invention relates to the field of semiconductor packaging, and in particular to a chip mounting equipment and a chip mounting method.
背景技术Background technique
高科技电子产品正朝着小、轻、薄的趋势发展。与之相反，受到成本及其他方面的市场压力，引线框架或封装载板的面积反而向着大尺寸的方向发展。目前最流行的扇出型封装技术，特别是基于大面积封装载板的封装技术，其封装载体的面积已经达到到传统封装载体(如引线框架)的10倍到20倍左右。面对这种技术趋势，如何提高装片/贴片效率是各个全球各个顶尖的设备制造商都在考虑的问题。High-tech electronic products are developing towards the trend of being small, light and thin. On the contrary, due to cost and other market pressures, the area of the lead frame or packaging carrier board is developing in the direction of large size. Currently, the most popular fan-out packaging technology, especially the packaging technology based on large-area packaging carriers, has a packaging carrier area that is about 10 to 20 times that of traditional packaging carriers (such as lead frames). Faced with this technological trend, how to improve the efficiency of chip mounting/mounting is an issue that all the world's top equipment manufacturers are considering.
目前通用的贴片设备包括点胶机及芯片取放装置，通用的贴片方法包括如下步骤：Currently, common patch equipment includes dispensing machines and chip pick-and-place devices. Common patch methods include the following steps:
参见图1A所示，点胶头10在基板11的待贴片位置点胶；参见图1B所示，移动基板11，芯片取放装置12将吸取的芯片放置在已经点胶的位置，完成该位置的贴片；参见图1C所示，移动基板11，使所述点胶头10在下一待贴片位置点胶；参见图1D所示，移动基板11，芯片取放装置12将吸取的芯片放置在已经点胶的位置，完成该位置贴片。如此反复，点一次胶贴装一次芯片，直至整个基板全部贴装上芯片。该方法的缺点是：点胶头工作时，芯片取放装置空闲，芯片取放装置工作时，点胶头空闲，生产效率低，不能满足需求。As shown in Figure 1A, the dispensing head 10 dispenses glue at the position to be placed on the substrate 11; as shown in Figure 1B, the substrate 11 is moved, and the chip pick-and-place device 12 places the picked-up chip at the position where glue has been dispensed, completing the process. position; as shown in Figure 1C, move the substrate 11 so that the dispensing head 10 dispenses glue at the next position to be patched; as shown in Figure 1D, move the substrate 11, and the chip pick-and-place device 12 will pick up the chip Place it at the location where glue has been dispensed and complete the placement at that location. Repeat this process, dispensing glue once and mounting the chip once, until all chips are mounted on the entire substrate. The disadvantage of this method is that when the dispensing head is working, the chip picking and placing device is idle. When the chip picking and placing device is working, the dispensing head is idle. The production efficiency is low and cannot meet the demand.
因此，有必要提供一种新的芯片贴装设备及贴装芯片的方法解决上述问题。Therefore, it is necessary to provide a new chip mounting equipment and a chip mounting method to solve the above problems.
发明内容Contents of the invention
本发明所要解决的技术问题是，提供一种芯片贴装设备及贴装芯片的方法，其能够极大提高生产效率。The technical problem to be solved by the present invention is to provide a chip mounting equipment and a chip mounting method, which can greatly improve production efficiency.
为了解决上述问题，本发明提供了一种芯片贴装设备，包括芯片取放装置、第一点胶装置及第二点胶装置，所述芯片取放装置用于吸取芯片并将所述芯片放置在基板上，所述第一点胶装置及第二点胶装置用于向基板的贴片位置注入粘结剂，所述第一点胶装置及第二点胶装置分设在所述芯片取放装置的两侧。In order to solve the above problems, the present invention provides a chip mounting equipment, which includes a chip picking and placing device, a first glue dispensing device and a second glue dispensing device. The chip picking and placing device is used to pick up the chip and place the chip. On the substrate, the first glue dispensing device and the second glue dispensing device are used to inject adhesive into the patch position of the substrate, and the first glue dispensing device and the second glue dispensing device are respectively located at the chip pick-up and place both sides of the device.
进一步，所述芯片取放装置具有多个吸嘴，依次吸取及放置芯片。Furthermore, the chip pick-and-place device has multiple suction nozzles to pick up and place chips sequentially.
进一步，所述芯片取放装置具有一转轴，所述吸嘴沿所述转轴圆周设置。Further, the chip picking and placing device has a rotating shaft, and the suction nozzle is arranged along the circumference of the rotating shaft.
进一步，第一点胶装置及第二点胶装置对称设置在所述芯片取放装置两侧。Further, the first glue dispensing device and the second glue dispensing device are symmetrically arranged on both sides of the chip pick-and-place device.
本发明还提供一种采用上述的芯片贴装设备贴装芯片的方法，待贴片的基板上平行设置有多组贴片组，每一贴片组包括一第一贴片行、一第二贴片行及一第三贴片行，所述方法包括如下步骤：(a)所述第一点胶装置向基板的第一贴片行点胶，在所述基板上形成第一点胶行；(b)所述芯片取放装置从所述第一点胶行首端起始贴片，所述第一点胶装置从基板的第二贴片行的中部起始点胶，当所述芯片取放装置完成第一点胶行前部的贴片时，所述第一点胶装置在所述第二贴片行后部形成第二点胶行后部；(c)所述芯片取放装置继续沿所述第一点胶行贴片，所述第二点胶装置从所述第二贴片行首端起始点胶，当所述芯片取放装置完成第一点胶行后部的贴片时，所述第二点胶装置在所述第二贴片行前部形成第二点胶行前部，至此，形成完整的第二点胶行；(d)所述芯片取放装置从所述第二点胶行尾端起始贴片，所述第二点胶装置从基板的第三贴片行的中部起始点胶，当所述芯片取放装置完成第二点胶行后部的贴片时，所述第二点胶装置在所述第三贴片行前部形成第三点胶行前部；(e)所述芯片取放装置继续沿所述第二点胶行贴片，所述第一点胶装置从所述第三贴片行尾端起始点胶，当所述芯片取放装置完成第二点胶行前部的贴片时，所述第一点胶装置在所述第三贴片行后部形成第三点胶行后部，至此，形成完整的第三点胶行；(f)重复步骤(b)～(e)。The present invention also provides a method for mounting chips using the above-mentioned chip mounting equipment. A plurality of chip groups are arranged in parallel on the substrate to be mounted. Each chip group includes a first chip row, a second chip row, and a second chip group. patch row and a third patch row, the method includes the following steps: (a) the first dispensing device dispenses glue to the first patch row of the substrate, forming the first glue dispensing row on the substrate ; (b) The chip pick-and-place device starts dispensing from the first end of the first dispensing line, and the first dispensing device starts dispensing from the middle of the second patch row of the substrate. When the When the chip picking and placing device completes the patching of the front part of the first glue dispensing row, the first glue dispensing device forms the rear part of the second glue dispensing row at the rear of the second patching row; (c) the chip picking and placing device The placing device continues to place chips along the first dispensing row, and the second dispensing device starts dispensing glue from the beginning of the second dispensing row. When the chip pick-and-place device completes the first dispensing row, When placing the first patch, the second dispensing device forms the front of the second dispensing row in front of the second patch row. At this point, a complete second dispensing row is formed; (d) the chip is taken The placing device starts dispensing chips from the end of the second dispensing row, and the second dispensing device starts dispensing glue from the middle of the third patch row of the substrate. When the chip pick-and-place device completes the second point When gluing the patches at the rear of the row, the second dispensing device forms the front of the third dispensing row in front of the third patch row; (e) the chip pick-and-place device continues along the second patch row The first glue dispensing device starts dispensing glue from the end of the third chip placement row. When the chip pick-and-place device completes the chip placement at the front of the second glue dispensing row, the The first dispensing device forms the rear part of the third dispensing row at the rear of the third patch row. At this point, a complete third dispensing row is formed; (f) Repeat steps (b) to (e).
进一步，在步骤(a)～(f)中，移动基板，以使所述芯片贴装设备对应需要工作的位置。Further, in steps (a) to (f), the substrate is moved so that the chip mounting equipment corresponds to the position where work is required.
进一步，所述第一点胶装置及第二点胶装置对称设置在所述芯片取放装置两侧。Further, the first glue dispensing device and the second glue dispensing device are symmetrically arranged on both sides of the chip pick-and-place device.
进一步，所述第一点胶装置的点胶位置至所述芯片取放装置贴片位置的距离与所述第二点胶装置的点胶位置至所述芯片取放装置贴片位置的距离相等。Further, the distance from the dispensing position of the first dispensing device to the chip placement position of the chip pick-and-place device is equal to the distance from the dispensing position of the second dispensing device to the chip placement position of the chip pick-and-place device. .
进一步，所述第二贴片行中部是第二贴片行二分之一处，所述第三贴片行中部是第三贴片行二分之一处。Further, the middle part of the second patch row is one-half of the second patch row, and the middle part of the third patch row is one-half of the third patch row.
进一步，所述芯片取放装置具有多个吸嘴，在所述芯片取放装置的一个吸嘴放置芯片的时，另一个吸嘴吸取芯片。Further, the chip picking and placing device has a plurality of suction nozzles. When one suction nozzle of the chip picking and placing device places a chip, the other suction nozzle sucks the chip.
本发明的优点在于，在芯片取放装置两侧均设置点胶装置，贴片工艺与点胶工艺同时进行，极大地提高了生产效率。The advantage of the present invention is that dispensing devices are provided on both sides of the chip pick-and-place device, and the patching process and the dispensing process are performed simultaneously, which greatly improves production efficiency.
附图说明Description of the drawings
图1A～图1D是现有的贴片方法的工艺流程图；Figures 1A to 1D are process flow diagrams of existing patch methods;
图2是本发明芯片贴装设备结构示意图；Figure 2 is a schematic structural diagram of the chip mounting equipment of the present invention;
图3A～图3I是本发明贴装芯片的方法的工艺流程图。3A to 3I are process flow diagrams of the chip mounting method of the present invention.
具体实施方式Detailed ways
下面结合附图对本发明提供的芯片贴装设备及贴装芯片的方法的具体实施方式做详细说明。The specific implementation of the chip mounting equipment and chip mounting method provided by the present invention will be described in detail below with reference to the accompanying drawings.
参见图2所示，本发明芯片贴装设备包括芯片取放装置20、第一点胶装置21及第二点胶装置22。As shown in FIG. 2 , the chip mounting equipment of the present invention includes a chip pick-and-place device 20 , a first glue dispensing device 21 and a second glue dispensing device 22 .
所述芯片取放装置20用于吸取芯片并将所述芯片放置在基板30(参见图3A)上。进一步，所述芯片取放装置20包括一转轴29及沿所述转轴29圆周设置的多个吸嘴28。所述吸嘴28用于吸取芯片，在本具体实施方式中，所述吸嘴28为真空吸附吸嘴。所述转轴29转动，使所述吸嘴28朝向待吸取的芯片，所述吸嘴28伸缩吸取芯片，所述转轴29转动，可使多个所述吸嘴28依次吸取芯片，提高工作效率。进一步，本领域技术人员还可从现有技术中获取所述芯片取放装置20的结构，在满足本发明目的的前提下，本发明对此不进行限定。The chip picking and placing device 20 is used to pick up chips and place the chips on the substrate 30 (see FIG. 3A). Further, the chip picking and placing device 20 includes a rotating shaft 29 and a plurality of suction nozzles 28 arranged along the circumference of the rotating shaft 29 . The suction nozzle 28 is used to suck the chip. In this specific embodiment, the suction nozzle 28 is a vacuum suction nozzle. The rotation of the rotating shaft 29 causes the suction nozzle 28 to face the chip to be sucked, and the suction nozzle 28 expands and contracts to suck the chip. The rotation of the rotating shaft 29 allows multiple suction nozzles 28 to suck the chip in sequence, thereby improving work efficiency. Furthermore, those skilled in the art can also obtain the structure of the chip pick-and-place device 20 from the prior art. As long as the purpose of the present invention is met, the present invention does not limit this.
所述第一点胶装置21及第二点胶装置22用于向基板30的贴片位置注入粘结剂，所述第一点胶装置21及第二点胶装置22分设在所述芯片取放装置20的两侧。优选地，所述第一点胶装置21及第二点胶装置22对称设置在所述芯片取放装置20两侧，所述第一点胶装置21的点胶位置至所述芯片取放装置20贴片位置的距离与所述第二点胶装置22的点胶位置至所述芯片取放装置20贴片位置的距离相等，进而可实现高效贴片。进一步，本领域技术人员可从现有技术中获取所述第一点胶装置21及第二点胶装置22的结构，在满足本发明目的的前提下，本发明对此不进行限定。The first glue dispensing device 21 and the second glue dispensing device 22 are used to inject adhesive into the patch position of the substrate 30. The first glue dispensing device 21 and the second glue dispensing device 22 are respectively located at the chip pick-up position. Place the two sides of the device 20. Preferably, the first glue dispensing device 21 and the second glue dispensing device 22 are symmetrically arranged on both sides of the chip picking and placing device 20, and the glue dispensing position of the first glue dispensing device 21 is from the chip picking and placing device. The distance of the chip placement position 20 is equal to the distance from the glue dispensing position of the second glue dispensing device 22 to the chip placement position of the chip pick-and-place device 20 , thereby achieving efficient chip placement. Furthermore, those skilled in the art can obtain the structures of the first glue dispensing device 21 and the second glue dispensing device 22 from the prior art. As long as the purpose of the invention is met, the invention is not limited thereto.
本发明还提供一种采用芯片贴装设备贴装芯片的方法。为了清楚简明解释本发明贴装芯片的方法的步骤，假设在待贴片的基板30上平行设置有多组贴片组，每一贴片组包括第一贴片行31、第二贴片行32及第三贴片行33，所述第一贴片行31、第二贴片行32及第三贴片行33由多个待贴片位置形成，由于所述第一贴片行31、第二贴片行32及第三贴片行33并非真实存在，因此，以虚线标示出其位置。The invention also provides a method for mounting chips using chip mounting equipment. In order to clearly and concisely explain the steps of the chip mounting method of the present invention, it is assumed that multiple groups of chip groups are arranged in parallel on the substrate 30 to be mounted, and each group includes a first chip row 31 and a second chip row. 32 and the third patch row 33. The first patch row 31, the second patch row 32 and the third patch row 33 are formed by a plurality of locations to be patched. Since the first patch row 31, The second patch row 32 and the third patch row 33 do not actually exist, so their positions are marked with dotted lines.
所述贴装芯片的方法包括如下步骤：The method of mounting chips includes the following steps:
步骤(a)：参见图3A、图3B及图3C所示，所述第一点胶装置21向基板30的第一贴片行31点胶，在所述基板30上形成第一点胶行34。在本具体实施方式中，所述基板30移动，如图中箭头所示，以使所述第一点胶装置21在不同位置点胶，在本发明其他具体实施方式中，所述芯片贴装设备移动，以使所述第一点胶装置21在不同位置点胶。所述基板30可以为现有技术中任何需要贴片的结构，本发明对此不进行限定。Step (a): As shown in FIG. 3A, FIG. 3B and FIG. 3C, the first dispensing device 21 dispenses glue to the first patch row 31 of the substrate 30, forming a first dispensing row on the substrate 30. 34. In this specific embodiment, the substrate 30 moves, as shown by the arrows in the figure, so that the first dispensing device 21 dispenses glue at different positions. In other specific embodiments of the present invention, the chip mounting The equipment moves so that the first dispensing device 21 dispenses glue at different positions. The substrate 30 can be any structure in the prior art that requires patching, and the present invention is not limited thereto.
步骤(b)：参见图3D所示，所述芯片取放装置20从所述第一点胶行34首端起始向尾端方向贴装芯片40，所述第一点胶装置21从基板30的第二贴片行32的中部起始向第二贴片行32的后部点胶。所述第二贴片行32的中部指的是第二贴片行32的中间部位，在本具体实施方式中，所述第二贴片行32的中部指的是第二贴片行32的二分之一处。参见图3E所示，当所述芯片取放装置20完成第一点胶行34前部的贴片时，所述第一点胶装置21在所述第二贴片行32后部形成第二点胶行35后部。在本具体实施方式中，所述基板30移动，如图中箭头所示，以使所述第一点胶装置21在不同位置点胶，所述芯片取放装置20在不同位置贴片，在本发明其他具体实施方式中，所述芯片贴装设备移动，以使所述第一点胶装置21在不同位置点胶，所述芯片取放装置20在不同位置贴片。Step (b): As shown in FIG. 3D , the chip pick-and-place device 20 mounts the chip 40 from the head end of the first dispensing line 34 toward the tail end. The first dispensing device 21 starts from the substrate. The glue is dispensed from the middle of the second patch row 32 of 30 to the rear of the second patch row 32 . The middle part of the second patch row 32 refers to the middle part of the second patch row 32 . In this specific embodiment, the middle part of the second patch row 32 refers to the middle part of the second patch row 32 . One-half point. Referring to FIG. 3E , when the chip pick-and-place device 20 completes the chip placement in the front of the first glue dispensing row 34 , the first glue dispensing device 21 forms a second chip in the rear of the second chip placement row 32 . Dispensing line 35 rear. In this specific embodiment, the substrate 30 moves, as shown by the arrows in the figure, so that the first dispensing device 21 dispenses glue at different positions, and the chip pick-and-place device 20 places chips at different positions. In other specific embodiments of the present invention, the chip mounting equipment moves so that the first dispensing device 21 dispenses glue at different positions, and the chip pick-and-place device 20 places chips at different positions.
步骤(c)：参见图3F所示，所述芯片取放装置20继续沿所述第一点胶行34贴装芯片40，所述第二点胶装置22从所述第二贴片行32首端起始向尾端方向点胶，此时，所述第一点胶装置21处于没有基板30的位置，不进行点胶。当所述芯片取放装置20完成第一点胶行34后部的贴片时，所述第二点胶装置22在所述第二贴片行32前部形成第二点胶行35前部，至此，形成完整的第二点胶行35。在本具体实施方式中，所述基板30移动，如图中箭头所示，以使所述第二点胶装置22在不同位置点胶，所述芯片取放装置20在不同位置贴片，在本发明其他具体实施方式中，所述芯片贴装设备移动，以使所述第二点胶装置22在不同位置点胶，所述芯片取放装置20在不同位置贴片。Step (c): As shown in FIG. 3F , the chip pick-and-place device 20 continues to place the chip 40 along the first dispensing row 34 , and the second dispensing device 22 starts from the second dispensing row 32 Glue is dispensed from the head end toward the tail end. At this time, the first glue dispensing device 21 is in a position without the substrate 30 and does not dispense glue. When the chip pick-and-place device 20 completes the chip placement at the rear of the first glue dispensing row 34 , the second glue dispensing device 22 forms the front of the second glue dispensing row 35 in front of the second chip placement row 32 , at this point, a complete second dispensing line 35 is formed. In this specific embodiment, the substrate 30 moves, as shown by the arrows in the figure, so that the second dispensing device 22 dispenses glue at different positions, and the chip pick-and-place device 20 places chips at different positions. In other specific embodiments of the present invention, the chip mounting equipment moves so that the second dispensing device 22 dispenses glue at different positions, and the chip pick-and-place device 20 places chips at different positions.
步骤(d)：参见图3G所示，所述芯片取放装置20从所述第二点胶行35尾端起始向首端方向贴装芯片40，所述第二点胶装置22从基板30的第三贴片行33的中部起始向第三贴片行33的首端方向点胶。所述第三贴片行33的中部指的是第三贴片行33的中间部位，在本具体实施方式中，所述第三贴片行33的中部指的是第三贴片行33的二分之一处。参见图3H所示，当所述芯片取放装置20完成第二点胶行35后部的贴片时，所述第二点胶装置22在所述第三贴片行33前部形成第三点胶行36前部。在本具体实施方式中，所述基板30移动，如图中箭头所示，以使所述第二点胶装置22在不同位置点胶，所述芯片取放装置20在不同位置贴片，在本发明其他具体实施方式中，所述芯片贴装设备移动，以使所述第二点胶装置22在不同位置点胶，所述芯片取放装置20在不同位置贴片。Step (d): As shown in FIG. 3G , the chip pick-and-place device 20 mounts the chip 40 starting from the rear end of the second dispensing line 35 toward the head end. The second dispensing device 22 starts from the substrate. Glue is dispensed starting from the middle of the third patch row 33 of 30 toward the head end direction of the third patch row 33. The middle part of the third patch row 33 refers to the middle part of the third patch row 33 . In this specific embodiment, the middle part of the third patch row 33 refers to the middle part of the third patch row 33 . One-half point. Referring to FIG. 3H , when the chip pick-and-place device 20 completes the patching at the rear of the second dispensing row 35 , the second dispensing device 22 forms a third patch in front of the third patching row 33 . Dispensing line 36 front. In this specific embodiment, the substrate 30 moves, as shown by the arrows in the figure, so that the second dispensing device 22 dispenses glue at different positions, and the chip pick-and-place device 20 places chips at different positions. In other specific embodiments of the present invention, the chip mounting equipment moves so that the second dispensing device 22 dispenses glue at different positions, and the chip pick-and-place device 20 places chips at different positions.
步骤(e)：参见图3I所示，所述芯片取放装置20继续沿所述第二点胶行35贴装芯片40，所述第一点胶装置21从所述第三贴片行33尾端起始点胶，当所述芯片取放装置20完成第二点胶行35前部的贴片时，所述第一点胶装置21在所述第三贴片行33后部形成第三点胶行36后部，至此，形成完整的第三点胶行36。Step (e): As shown in FIG. 3I , the chip pick-and-place device 20 continues to mount the chip 40 along the second dispensing row 35 , and the first dispensing device 21 starts from the third patch row 33 Dispensing starts from the tail end. When the chip pick-and-place device 20 completes the patching in the front of the second patching row 35 , the first dispensing device 21 forms the third patching row 33 in the back. The rear part of the three glue dispensing rows 36, thus forming a complete third glue dispensing row 36.
步骤(f)：重复步骤(b)～(e，直至基板30贴满芯片40。Step (f): Repeat steps (b) to (e) until the substrate 30 is completely attached to the chip 40 .
进一步，所述第一点胶装置21及第二点胶装置22对称设置在所述芯片取放装置20两侧，且所述第一点胶装置21的点胶位置至所述芯片取放装置20贴片位置的距离与所述第二点胶装置22的点胶位置至所述芯片取放装置20贴片位置的距离相等，所述第一点胶装置21或所述第二点胶装置22点胶时，所述芯片取放装置20恰好位于带贴片位置的上方，从而可实现点胶的同时贴片。Further, the first glue dispensing device 21 and the second glue dispensing device 22 are symmetrically arranged on both sides of the chip picking and placing device 20, and the dispensing position of the first glue dispensing device 21 reaches the chip picking and placing device. 20 The distance between the chip placement position and the distance from the glue dispensing position of the second glue dispensing device 22 to the chip pick and place device 20 is equal to the distance between the first glue dispensing device 21 or the second glue dispensing device. 22 When dispensing glue, the chip pick-and-place device 20 is located just above the position with patching, so that simultaneous dispensing of glue can be achieved.
本发明贴装芯片的方法在点胶的同时贴装芯片，极大地提供了生产效率，节约成本，节省时间。The chip mounting method of the present invention mounts the chip while dispensing glue, which greatly improves production efficiency, saves costs and saves time.
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。The above are only preferred embodiments of the present invention. It should be noted that those of ordinary skill in the art can also make several improvements and modifications without departing from the principles of the present invention. These improvements and modifications should also be regarded as It is the protection scope of the present invention.
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| CN107979970A (en) * | 2017-11-13 | 2018-05-01 | 北京七星华创微电子有限责任公司 | A kind of chip chip mounter and chip pasting method |
| CN109327267B (en) * | 2018-10-11 | 2021-09-17 | 深圳飞骧科技股份有限公司 | SMD debugger |
| CN109746599B (en) * | 2019-01-30 | 2023-11-17 | 无锡奥特维科技股份有限公司 | Battery piece processing equipment and method |
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Address after: No. 3699 Xiyou Road, Gaoxin District, Hefei City, Anhui Province, 230094 Patentee after: Hefei Silicon Microelectronics Technology Co.,Ltd. Country or region after: China Address before: Room 201, Building H2, No. 2800 Chuangxin Avenue, High tech Zone, Hefei City, Anhui Province, 230001 Patentee before: Hefei Silicon Microelectronics Technology Co.,Ltd. Country or region before: China |