CN106711074A - Substrate processing equipment and alignment control method of to-be-processed substrate - Google Patents

Abstract

Embodiments of the present invention provide a substrate processing device and an alignment control method of a substrate to be processed, which relate to the technical field of semiconductors. The invention can solve the problem that the alignment result is inaccurate due to the poor reflective performance of the alignment mark when the substrate processing equipment aligns the substrate to be processed. The substrate processing equipment includes: a stage for carrying the substrate to be processed, and an alignment mark is provided on the substrate to be processed, and the alignment mark is made of light-shielding material. The light source is arranged on one side of the stage. The image sensor is arranged on the other side of the stage. Wherein, the light source is used to emit light toward the substrate to be processed, and the light reaches the image sensor through the substrate to be processed, so that the image sensor collects an image containing the alignment mark; the irradiation area of the light source at least surrounds the outer edge of the alignment mark.

Description

Alignment control method of substrate processing equipment and substrate to be processed

technical field

The invention relates to the technical field of semiconductors, in particular to substrate processing equipment and a method for controlling alignment of substrates to be processed.

Background technique

TFT-LCD (Thin Film Transistor-Liquid Crystal Display, Thin Film Transistor-Liquid Crystal Display, Thin Film Transistor-Liquid Crystal Display) usually includes an array substrate and a color filter substrate that are boxed to each other, and a liquid crystal layer that is sealed between the array substrate and the color filter substrate that are boxed to each other. There are pixel electrodes and common electrodes for forming an electric field on the liquid crystal display panel, and an electric field is generated between the pixel electrodes and the common electrodes by applying a voltage to control the deflection direction of the liquid crystal molecules of the liquid crystal layer and control the polarization of incident light, thereby generating Image display.

In the process of manufacturing thin film transistor liquid crystal displays, it is necessary to perform multiple processes such as evaporation, exposure, and etching on the array substrate and color filter substrate that make up the thin film transistor liquid crystal display. When performing the processing and production of the above processes, the processing Before operation, it is first necessary to accurately align the position of the substrate to be processed. After confirming that the substrate to be processed is placed correctly, the corresponding processing operation can be performed, which can reduce the defective products caused by the offset of the processing position and improve the quality of the substrate to be processed. Improve the processing quality of the substrate and improve the manufacturing yield of the substrate to be processed.

When performing alignment in existing substrate processing equipment, an alignment mark made of an opaque and reflective material is usually processed at a specific position on the substrate to be processed. The processed substrate provides frontal light, which will produce reflections when the frontal light shines on the alignment mark. The frontal photo of the substrate to be processed is taken by the CCD Camera (Charge Coupled Device Camera), and the digital image signal of the substrate to be processed is taken from the front. The position of the bit mark is in a state of high brightness due to the ability to reflect the light of the light, and the other positions corresponding to the substrate to be processed are in a state of low brightness due to the direct transmission of light. The grayscale analysis of the image signal and comparison with the stored preset standard digital image signal can determine the alignment accuracy of the substrate to be processed.

This alignment method has high requirements for the processing of alignment marks. In the industry, alignment marks are usually made of metal materials. If the surface of the alignment marks made of metal materials is poorly manufactured, it may cause poor reflective performance, and then In the grayscale analysis of the image captured by the charge-coupled device camera, the part corresponding to the reflection of the registration mark is not displayed clearly.

Contents of the invention

Embodiments of the present invention provide a substrate processing equipment and a method for controlling the alignment of substrates to be processed, which can solve the problem of inaccurate alignment results due to poor reflective performance of alignment marks when substrate processing equipment aligns substrates to be processed question.

In order to achieve the above object, embodiments of the present invention adopt the following technical solutions:

According to an aspect of the embodiments of the present invention, there is provided a substrate processing equipment, including: a stage for carrying a substrate to be processed, an alignment mark is provided on the substrate to be processed, and the alignment mark is made of a light-shielding material. The light source is arranged on one side of the stage. The image sensor is arranged on the other side of the stage. Wherein, the light source is used to emit light toward the substrate to be processed, and the light reaches the image sensor through the substrate to be processed, so that the image sensor collects an image containing the alignment mark; the irradiation area of the light source at least surrounds the outer edge of the alignment mark.

Further, the substrate processing equipment also includes a controller, which is used to compare the image containing the alignment mark with the standard image, and output the comparison result.

Optionally, the irradiation area of the light source covers the entire substrate to be processed, and the image sensor is used to collect images of the entire substrate to be processed.

Optionally, the irradiated area of the light source covers part of the substrate to be processed, part of the substrate to be processed is composed of an alignment mark and a peripheral portion surrounding the alignment mark, and the image sensor is used to collect images of the part of the substrate to be processed.

Preferably, there are at least two alignment marks on the substrate to be processed, and they are respectively arranged at the corners of the substrate to be processed, the number of light sources and image sensors is the same as that of the alignment marks, and the irradiation area of each light source corresponds to one For the corner of the substrate to be processed where the alignment mark is located, the image sensor correspondingly captures the image of the corner of the substrate to be processed where the alignment mark is located.

Preferably, the light source is an infrared light source.

Further, the size of the alignment mark is in the same order range as the wavelength of the light emitted by the light source.

Another aspect of the embodiments of the present invention provides a method for controlling the alignment of a substrate to be processed. An alignment mark is provided on the substrate to be processed, and the alignment mark is made of a light-shielding material. The above method includes emitting light from one side of the substrate to be processed toward the substrate to be processed, so that the light passes through the substrate to be processed; on the other side of the substrate to be processed, collecting an image containing an alignment mark on the substrate to be processed. Wherein, the coverage area of the light at least surrounds the outer edge of the alignment mark.

Further, after collecting the image containing the alignment mark on the substrate to be processed, the above method further includes comparing the image containing the alignment mark with the standard image, and outputting the comparison result.

Further, when the size of the alignment mark is in the same order of magnitude as the light wavelength, the image containing the alignment mark is compared with the standard image, and the comparison result is output, including processing the image containing the alignment mark to obtain The center point position of the alignment mark; compare whether the center point position of the alignment mark in the image containing the alignment mark coincides with the center point position of the alignment mark in the standard image, and output the comparison result.

An embodiment of the present invention provides a substrate processing device, including: a carrier for carrying a substrate to be processed, an alignment mark is provided on the substrate to be processed, and the alignment mark is made of a light-shielding material. The light source is arranged on one side of the stage. The image sensor is arranged on the other side of the stage. Wherein, the light source is used to emit light toward the substrate to be processed, and the light reaches the image sensor through the substrate to be processed, so that the image sensor collects an image containing the alignment mark; the irradiation area of the light source at least surrounds the outer edge of the alignment mark. The light source is arranged on one side of the stage, and the image sensor is arranged on the other side of the stage. The light emitted by the light source toward the substrate to be processed passes through the substrate to be processed. Light, the part other than the alignment mark can pass through the light, and the irradiated area of the light source surrounds the outer edge of the alignment mark, so the image collected on the image sensor can record the position of the alignment mark through the light and dark boundary . This alignment method reduces the processing technology requirements for the alignment mark on the substrate to be processed, and improves the alignment stability of the substrate processing equipment.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

FIG. 1 is a schematic structural diagram of a substrate processing equipment provided by an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a substrate processing device including a controller provided by an embodiment of the present invention;

Fig. 3 is a schematic structural diagram of a light source irradiation area including the entire substrate to be processed in a substrate processing device provided by an embodiment of the present invention;

Fig. 4 is a schematic structural diagram of a light source irradiation area including a part of the substrate to be processed in a substrate processing device provided by an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a substrate processing device provided by an embodiment of the present invention including two image sensors;

Fig. 6 is a schematic diagram of a diffraction pattern of an alignment mark provided by an embodiment of the present invention;

FIG. 7 is a flow chart of a method for controlling alignment of a substrate to be processed provided by an embodiment of the present invention;

FIG. 8 is a flow chart of another alignment control method for a substrate to be processed provided by an embodiment of the present invention;

FIG. 9 is a flow chart of another alignment control method for a substrate to be processed provided by an embodiment of the present invention.

Reference signs:

10-stage; 11-substrate to be processed; 20-light source; 30-image sensor; 40-controller; X, X', X"-irradiation area of light source; a-alignment mark.

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

An embodiment of the present invention provides a substrate processing equipment, as shown in FIG. 1 , including: a stage 10 for carrying a substrate 11 to be processed, an alignment mark a is provided on the substrate 11 to be processed, and the alignment mark a is a light-shielding material . The light source 20 is disposed on one side of the stage 10 . The image sensor 30 is disposed on the other side of the stage 10 . Wherein, the light source 20 is used to emit light toward the substrate 11 to be processed, and the light reaches the image sensor 30 through the substrate 11 to be processed, so that the image sensor 30 collects an image containing the alignment mark a; the irradiation area X of the light source 20 at least converts the alignment mark The outer edge of a is enclosed within.

It should be noted that, firstly, the light source 20 and the image sensor 30 are respectively arranged on both sides of the stage 10, the light source 20 emits light toward the substrate 11 to be processed placed on the stage 10, and the image sensor 30 collects corresponding images, as shown in the figure 1, the irradiation area X of the light source 20 at least surrounds the entire alignment mark a, and the image captured by the image sensor 30 can include the opaque alignment mark a and a part of the transparent area surrounding the alignment mark a. The light area, that is, the boundary of the opaque alignment mark a can be clearly displayed in the image collected by the image sensor 30 . Wherein, the size of the light-transmitting area that the image sensor 30 can collect is not specifically limited in the present invention, as long as it can at least surround the entire outer edge of the alignment mark a, so that the boundary of the alignment mark a can be completely displayed.

Second, because the light emitted by the light source 20 toward the substrate to be processed 11 needs to pass through the substrate to be processed 11 and the stage 10 to reach the image sensor 30 and be received by the image sensor 30, wherein the substrate to be processed 11 is usually a transparent glass substrate, Therefore, the substrate 11 to be processed can transmit light, so the stage 10 also needs to be made of a light-transmitting material, so that only the part of the light emitted by the light source 20 toward the substrate 11 to be processed that is irradiated on the alignment mark a is blocked. , other parts can pass through, so that in the image received by the image sensor 30 containing the alignment mark a, only the position corresponding to the alignment mark a is displayed as a shadow, and other positions can be displayed through light, so that through The image containing the alignment mark a received by the image sensor 30 can determine the position of the alignment mark a. To achieve the above purpose, the stage 10 can also be made of an opaque material as a whole, and only set in a light-transmissive form at the position corresponding to the alignment mark a, for example, use a light-transmitting material at the position corresponding to the alignment mark a. Material production, or setting the position corresponding to the alignment mark a as a hollowed-out area can be used.

Thirdly, the specific setting material of the alignment mark a is not specifically limited in the present invention, as long as the material for making the alignment mark a can block the transmission of light.

An embodiment of the present invention provides a substrate processing device, including: a carrier for carrying a substrate to be processed, an alignment mark is provided on the substrate to be processed, and the alignment mark is made of a light-shielding material. The light source is arranged on one side of the stage. The image sensor is arranged on the other side of the stage. Wherein, the light source is used to emit light toward the substrate to be processed, and the light reaches the image sensor through the substrate to be processed, so that the image sensor collects an image containing the alignment mark; the irradiation area of the light source at least surrounds the outer edge of the alignment mark. The light source is arranged on one side of the stage, and the image sensor is arranged on the other side of the stage. The light emitted by the light source toward the substrate to be processed passes through the substrate to be processed. Light, the part other than the alignment mark can pass through the light, and the irradiated area of the light source surrounds the outer edge of the alignment mark, so the image collected on the image sensor can record the position of the alignment mark through the light and dark boundary . This alignment method reduces the processing technology requirements for the alignment mark on the substrate to be processed, and improves the alignment stability of the substrate processing equipment.

Further, in order to judge whether the placement position of the substrate 11 to be processed is correct before the substrate processing equipment processes the substrate 11 to be processed, as shown in FIG. Compare the image marked a with the standard image, and output the comparison result.

It should be noted that the comparison result output by the controller 40 can be directly a superimposed image of the collected image and the standard image, and the operator can directly judge whether the superimposed image overlaps and the offset direction and offset amount of the superimposed image, and the placement of the substrate 11 to be processed The position is adjusted and moved accordingly, and the standard image and the collected image can also be processed and calculated in the controller 40 to directly output the position coordinates of the opaque shadow at the position of the alignment mark a, and then calculate the two images The overlap and offset between the opaque shadows, or other comparison methods, are not specifically limited here, as long as the opacity at the position of the alignment mark a in the two images can be calculated and output The location information of the shadow can be compared and calculated.

Wherein, the controller 40 may be a computer as shown in FIG. 2 , or may be other devices capable of data processing, which is not specifically limited here. The controller 40 receives the image including the alignment mark a collected by the image sensor 30 and compares it with the preset or pre-stored standard image. The standard image shows that the substrate 11 to be processed is placed in the correct position When the position of the light source 20, the stage and the image sensor 30 are all fixed, the image sensor 30 superimposes the collected image and the standard image, and the position of the alignment mark a in the two images is different If the light-transmitting shadow areas can completely overlap, the result of comparison and coincidence will be output, indicating that the placement position of the substrate 11 to be processed is completely correct. Overlap, the output comparison result is incorrect, indicating that the placement position of the substrate 11 to be processed is deviated, and the position of the substrate 11 to be processed can be determined according to the superimposition offset of the opaque shadow area in the output comparison result. Adjust accordingly so that eventually the opaque shadow areas overlap.

In this way, by setting the controller 40 in the substrate processing equipment, the image collected by the image sensor 30 can be directly calculated and processed, and the result can be output, for example, the standard image and the collected image to be processed can be directly output on the display screen. The superimposed image of the substrate 11 image, the operator can adjust the placement position of the substrate 11 to be processed in real time according to the superimposed image, so as to improve the work efficiency of the alignment of the substrate 11 to be processed before the processing operation of the substrate processing equipment.

In the following, the substrate processing equipment includes the controller 40 as an example for detailed description.

Further, as shown in FIG. 3 , the irradiation area X′ of the light source 20 covers the entire substrate 11 to be processed, and the image sensor 30 is used to collect images of the entire substrate 11 to be processed.

As shown in FIG. 3 , only one light source 20 and an image receiver 30 corresponding to the light source 20 are needed to collect the image of the entire substrate 11 to be processed, and in the controller 40, the collected image of the entire substrate to be processed The image of the substrate 11 is compared with the standard image of the entire substrate 11 to be processed to obtain a comparison result, so as to determine whether the placement position of the substrate 11 to be processed is correct. In this way, when multiple sets of light sources 20 and image receivers 30 are set to compare images collected by the substrate 11 to be processed, the error between multiple sets of image comparisons can be reduced, and errors caused by inconsistent results of multiple sets of alignment comparisons can be reduced. The probability of error is reduced, and the stability of alignment judgment in substrate processing equipment is improved.

Preferably, as shown in FIG. 4, the irradiation area X" of the light source 20 covers part of the substrate 11 to be processed (as shown by the dotted line box in the figure), and part of the substrate 11 to be processed is formed by the alignment mark a and the periphery surrounding the alignment mark a Partially constituted, the image sensor 30 is used to collect images of a part of the substrate 11 to be processed.

As shown in FIG. 4 , the image sensor 30 only collects the image at the part of the substrate 11 to be processed which is composed of the alignment mark a and the peripheral part surrounding the alignment mark a, compares the collected image with the standard image, and outputs By comparing the results, it is judged whether the placement position of the substrate 11 to be processed is correct. Since the judgment of whether the placement position of the substrate 11 to be processed is correct is to compare the shadow position of the alignment mark a in the collected image with the shadow position of the corresponding alignment mark a in the standard image. The acquisition of images of other regions on the entire substrate 11 to be processed by the image receiver 30 is improved, the amount of data processing in the controller 40 is reduced, the collection of a large amount of invalid data by the image sensor 30 is reduced, and the computing power of the controller 40 is improved. speed.

Wherein, the light source 20 may be as shown in FIG. 4 , only irradiating a small part of the area including the alignment mark a and the outer edge surrounding the alignment mark a, corresponding to the receiving area of the image sensor 30, or as shown in FIG. 3 shows that the entire substrate to be processed 11 is irradiated, and the image sensor 30 only correspondingly collects the image of the part of the substrate to be processed 11 formed by the alignment mark a and the peripheral part surrounding the alignment mark a. Here, the setting of the light source 20 is not For specific limitations, it is sufficient to ensure that the installation position of the light source 20 is the same as the installation position of the light source 20 in the standard image.

However, as shown in FIG. 4 , there is only one alignment mark a on the substrate 11 to be processed, and the image sensor 30 only captures the portion of the substrate 11 to be processed that is composed of the alignment mark a and the peripheral portion surrounding the alignment mark a. When collecting the position information of the substrate 11 to be processed, if there is only a small angular deflection centered on the alignment mark a between the placement position of the substrate 11 to be processed and the correct placement position of the standard image, the entire The movement size of the substrate 11 to be processed at the alignment mark a (that is, the center position of the deflection) is very small, but a larger movement size is formed at a position away from the center position of the deflection. At this time, in the controller 40, comparing the image of the alignment mark a at the central position of the acquisition deflection with the standard image, it may not be recognized due to the small offset at the corresponding alignment mark a, so that The controller 40 misjudges the placement position of the substrate 11 to be processed as the correct position. When the processing operation is performed on the substrate 11 to be processed at the placement position, the processing position on the substrate 11 to be processed will be wrong, resulting in rework or rework of defective products. The substrate 11 to be processed is discarded directly.

Preferably, there are at least two alignment marks a on the substrate 11 to be processed. As shown in FIG. part, the light source 20 and the image sensor 30 have the same number as the alignment mark a, the irradiation area X" of each light source 20 corresponds to the corner of the substrate 11 to be processed where the alignment mark a is located, and the image sensor 30 captures correspondingly An image of the corner of the substrate 11 to be processed where the alignment mark a is located.

As shown in Figure 5, there are two alignment marks a on the substrate 11 to be processed, and they are respectively arranged at the corners of the substrate 11 to be processed, and a light source 20 is arranged corresponding to each alignment mark a. The alignment mark a is irradiated to form a light source irradiation area X", an image sensor 30 is arranged on the side of the alignment mark a away from the light source 20, and the image corresponding to the light source irradiation area X" is collected, and the collected light source irradiation area X" is respectively Compared with the standard image at the corresponding position, two comparison results are obtained, and the two comparison results are combined to determine whether the placement position of the substrate 11 to be processed is correct.

In this way, each light source 20 corresponds to irradiating only one alignment mark a, and each image receiver 30 correspondingly collects an image of an area X" irradiated by the light source. There is a large distance between the two, so no matter whether the substrate 11 to be processed is deflected at a small angle around any position, the position of at least one of the two alignment marks a must be far away from The deflection center, the offset of the image comparison at the alignment mark a away from the deflection center must be recognized and output by the controller 40 . The joint work of the two groups of light sources 20 and the image sensor 30 further improves the determination accuracy of the placement position of the substrate 11 to be processed in the substrate processing equipment, and improves the determination accuracy.

Wherein, a plurality of image sensors 30 may be all connected to the same controller 40 as shown in FIG. 5 to perform calculation and processing of data, or each image sensor 30 may be connected to the controller 40 respectively to perform calculation and processing of data respectively, This is not specifically limited in the present invention, and can be set according to specific usage requirements.

Preferably, the light source 20 is an infrared light source.

Since in the manufacturing process of the liquid crystal display, the substrate 11 to be processed, such as an array substrate or a color filter substrate, needs to be processed and manufactured in various processes such as evaporation, exposure, and etching. equipment, the exposure process is to irradiate the substrate 11 to be processed with a light source through a mask plate with a specific pattern, so that the photoresist coated on the substrate 11 to be processed will change in nature due to exposure to light (the photoresist includes a positive resist And reverse glue, here we take the positive glue as an example to illustrate, if it is reverse glue, the part that is not exposed to light will change in nature), so as to carry out subsequent processes such as development and removal. Alignment of the substrate 11 to be processed by irradiation of a visible light source in the exposure processing equipment may adversely affect the photoresist on the substrate 11 to be processed and affect the subsequent exposure effect. Therefore, preferably, the light source 20 is an infrared light source. To avoid the impact on the subsequent processing of the substrate 11 to be processed, and the infrared light source is low in cost and mature in technology, using the infrared light source as the light source 20 in the present invention has a stable working state and can save costs.

Further, the size of the alignment mark a is in the same order range as the wavelength of the light emitted by the light source 20 .

When the size of the alignment mark a is the nanoscale size of the wavelength of the light wave, the light source 20 irradiates toward the alignment mark a, and when the light wave encounters the alignment mark a that can be regarded as an obstacle during the propagation process, a straight line deviation will occur Diffraction phenomenon of propagation, as shown in FIG. 6, for example, the alignment mark a is a circle as shown in FIG. When the image sensor 30 is on the image sensor 30, the diffraction pattern of the alignment mark a can be received on the image sensor 30. The diffraction pattern is a group of concentric ring stripes with alternating light and dark, and the size of the outer ring is larger than the size of the alignment mark a. That is, the concentric and equal-scale enlarged image of the alignment mark a.

In this way, when it is necessary to perform high-precision alignment on the substrate 11 to be processed, a nanoscale-sized alignment mark a can be set on the substrate 11 to be processed, and the alignment mark a received by the image sensor 30 can be detected by the controller 40 Calculate and process the enlarged image to obtain the center point position of the enlarged image, and then compare the center point position with the center point position of the alignment mark a in the standard image, so as to determine whether the placement position of the substrate 11 to be processed is correct judgment result.

It should be noted that, first, the shape of the alignment mark a is not limited to the circular shape shown in Figure 6. According to the diffraction theory of light, when the size of the obstacle is in the same order of magnitude as the wavelength of the light, the light irradiation The above-mentioned diffraction phenomenon will occur on the obstacle, the received image is the same as the central projection of the obstacle, and concentric and proportionally enlarged light and dark fringes appear along the edge of the obstacle. For example, if the alignment mark is a rectangle, the received diffraction pattern is a plurality of straight stripes with alternating light and dark that are concentric with the rectangle and increase away from the center along the four sides of the rectangle.

Second, when the alignment mark a is an irregular pattern, the size of the alignment mark a may be the maximum length along two pairs of sides perpendicular to each other of the substrate 11 to be processed.

Thirdly, the same order of magnitude range means that the wavelength of light is usually hundreds of nanometers, and when the size of the alignment mark a is in nanometers, it is in the same order of magnitude range as the light wavelength. For example, tens of nanometers, hundreds of nanometers, etc., all belong to the same order of magnitude range as the wavelength of light

Another aspect of the embodiments of the present invention provides a method for controlling alignment of a substrate to be processed. An alignment mark a is provided on the substrate 11 to be processed, and the alignment mark a is a light-shielding material. As shown in Figure 7, the above method includes,

S101 , emitting light from one side of the substrate to be processed 11 toward the substrate to be processed 11 , so that the light passes through the substrate to be processed 11 .

S102. On the other side of the substrate 11 to be processed, collect an image including the alignment mark a on the substrate 11 to be processed. Wherein, the coverage area X of the light at least surrounds the outer edge of the alignment mark a.

The light emitted toward the substrate 11 to be processed, because the alignment mark a is made of a light-shielding material, the light irradiated on the alignment mark a is blocked by the alignment mark a and cannot pass through, and the light irradiated at positions other than the alignment mark a The light can pass through the substrate 11 to be processed, and an image is collected on the other side of the substrate 11 to be processed, that is, an opaque shadow area with the same shape as the alignment mark a is collected at the position corresponding to the alignment mark a. Wherein, as long as the light coverage area X includes the entire alignment mark a and the outer edge of the alignment mark a, the shadow area of the entire alignment mark a and the boundary of the shadow area can be recorded, thereby determining the position of the alignment mark a , and then determine the placement position of the substrate 11 to be processed.

Further, after capturing the image containing the alignment mark a on the substrate 11 to be processed, as shown in FIG. 8 , the above method further includes:

S103. Compare the image containing the alignment mark a with the standard image, and output a comparison result.

The standard image refers to the image containing the alignment mark a on the substrate 11 to be processed when the substrate 11 to be processed is placed in the correct position. In the case where the position of each device of the collected image is fixed, by comparing the collected image with the standard image, the placement position of the substrate 11 to be processed can be obtained through the superimposition of the shadow of the alignment mark a in the two images information.

Since the standard image is a reference image for comparison, the standard image needs to be stored or set in the substrate processing equipment before the substrate processing equipment works, so as to compare with the collected results at the same position during the comparison.

Further, when the size of the alignment mark a is in the same order of magnitude as the light wavelength, as shown in FIG. 9 , compare the image containing the alignment mark a with the standard image, and output the comparison results including,

S1031. Process the image containing the alignment mark a to obtain the center point position of the alignment mark a.

S1032. Compare whether the center point position of the alignment mark a in the image containing the alignment mark a coincides with the center point position of the alignment mark a in the standard image, and output the comparison result.

In this way, when the size of the alignment mark a is in the same order of magnitude as the light wavelength, by processing the collected diffraction pattern of the alignment mark a, the center point position of the alignment mark a is obtained, which is the same as that of the alignment mark in the standard image The position of the center point of a is compared to obtain the placement position information of the substrate 11 to be processed in the substrate processing equipment.

Wherein, the standard image can be the image information when the substrate 11 to be processed is in the correct position, and before comparing with the collected image, the center point position of the alignment mark a when the substrate 11 to be processed is in the correct position is obtained by processing , and process to obtain the center point position of the alignment mark a in the collected image, compare the two, and output the comparison result. The standard image can also directly be the position information of the center point of the alignment mark a when the substrate 11 to be processed is in the correct position. When the collected image is obtained, only the alignment mark a in the collected image is processed to obtain the collected The position of the center point of the alignment mark a in the image is compared directly, and the comparison result is output.

In the above detailed description of the alignment principle and working process of the substrate processing equipment, the alignment control method has been described in detail, and will not be repeated here.

The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.

Claims (10)

1. a kind of substrate processing equipment, it is characterised in that including：

Microscope carrier, for carrying substrate to be processed, the substrate to be processed is provided with alignment mark, and the alignment mark is lightproof material Matter；

Light source, is arranged at the side of the microscope carrier；

Imageing sensor, is arranged at the opposite side of the microscope carrier；

Wherein, the light source is used to be emitted beam towards the substrate to be processed, and the light is arrived through the substrate to be processed Up to described image sensor, so as to described image sensor image of the collection comprising the alignment mark；The irradiation of the light source At least be enclosed in for the outward flange of the alignment mark interior by region.

2. substrate processing equipment according to claim 1, it is characterised in that also including controller, for will be comprising described The image of alignment mark is compared with standard picture, and exports comparison result.

3. substrate processing equipment according to claim 1, it is characterised in that the irradiation area of the light source covers whole institute Substrate to be processed is stated, described image sensor is used to gather the image of the whole substrate to be processed.

4. substrate processing equipment according to claim 1, it is characterised in that the irradiation area covering part institute of the light source Substrate to be processed is stated, the part substrate to be processed is by the alignment mark and the peripheral part structure of the encirclement alignment mark Into described image sensor is used for the image of substrate to be processed described in collecting part.

5. substrate processing equipment according to claim 4, it is characterised in that the alignment mark on the substrate to be processed sets It is equipped with least two, and is respectively arranged at the corner of the substrate to be processed, the light source and described image sensor and institute The setting quantity for stating alignment mark is identical, and the irradiation area of each light source is corresponding to where an alignment mark The corner of substrate to be processed, described image sensor accordingly gather the alignment mark where substrate to be processed corner Image.

6. the substrate processing equipment according to claim any one of 1-5, it is characterised in that the light source is infrared light supply.

7. substrate processing equipment according to claim 6, it is characterised in that the size of the alignment mark and the light source Send optical wavelength and be in same order scope.

8. a kind of aligning control method of substrate to be processed, it is characterised in that be provided with alignment mark on the substrate to be processed, The alignment mark is shading material, and methods described includes,

Emitted beam towards the substrate to be processed from the side of the substrate to be processed so that the light is by described to be added Work substrate；

In the opposite side of the substrate to be processed, the image comprising the alignment mark on the substrate to be processed is gathered；

Wherein, at least be enclosed in for the outward flange of the alignment mark interior by the overlay area of the light.

9. aligning control method according to claim 8, it is characterised in that included on the collection substrate to be processed After the image of the alignment mark, methods described also includes,

Image comprising the alignment mark and standard picture are compared, and exports comparison result.

10. aligning control method according to claim 9, it is characterised in that when the alignment mark size with it is described It is described that the image comprising the alignment mark and standard picture are compared when optical wavelength is in same order scope, and Exporting comparison result includes,

The image comprising alignment mark is processed, the center position of the alignment mark is obtained；

Compare the center position and alignment mark in the standard picture of alignment mark in the image comprising alignment mark Center position whether overlap, and export comparison result.