CN106647166A - Crystal direction alignment device and alignment method of nanometer impressing template - Google Patents

Abstract

The invention relates to a device for aligning the crystal direction of a nano-imprint template. The top surface of the wafer table is provided with a wafer mounting groove with an upward opening, and the bottom surface of the template adsorption fixture is provided with an imprint template groove with an opening downward. The two-electrode pattern board is installed on the top surface of the wafer table, the first electrode pattern plate is installed on the bottom surface of the template adsorption fixture, the electrode patterns in the first electrode pattern plate and the second electrode pattern plate are complementary electrode patterns, and the first electrode pattern plate The positive and negative poles are connected to the corresponding positive and negative poles of the resistance meter. The template adsorption fixture is installed on the fine-tuning table, which is used to adjust the position of the template adsorption fixture. The adsorption control system is used to control the adsorption end of the template adsorption fixture to the imprint For the adsorption of the template, the crystal direction of the wafer is parallel to the second electrode pattern plate, and the direction of the template pattern in the embossed template is parallel to the first electrode pattern plate. The invention has simple structure and high precision.

Description

Nanoimprint template crystal orientation alignment device and alignment method

technical field

The invention relates to the technical fields of microfabrication and semiconductor process equipment, in particular to a nanoimprint template crystal orientation alignment device and alignment method.

Background technique

The process accuracy and process area of nanoimprint technology are only related to the graphic definition of the template, and have the advantages of low cost and high output. When making some semiconductor devices, such as gratings of semiconductor lasers, it is necessary to align the embossed pattern with the crystal direction of the semiconductor wafer. Traditional nanoimprint equipment either does not have this equipment, or requires very expensive fine-tuning equipment, which is not suitable for mass production. It is necessary to develop a low-cost nanoimprint template crystal orientation alignment method to increase the alignment speed.

Contents of the invention

The object of the present invention is to provide a nanoimprint template crystal orientation alignment device and alignment method with simple structure and high precision.

In order to solve the above-mentioned technical problems, the present invention discloses a nanoimprint template crystal orientation alignment device, which is characterized in that it includes a wafer table, a template adsorption fixture, a fine-tuning table, a resistance meter, an adsorption control system, and a first electrode graphic board , a wafer, a second electrode pattern plate corresponding to the first electrode pattern plate, and an embossing template matching the wafer, the top surface of the wafer table is provided with a wafer mounting groove with an opening upward, and the bottom surface of the template adsorption fixture is provided with There is an embossing template groove with an opening downward, the adsorption end of the template adsorption jig is located at the bottom of the embossing template groove, the embossing template groove is located above the wafer installation groove, and the second electrode graphic board is installed On the top surface of the wafer table, the first electrode pattern plate is installed on the bottom surface of the template adsorption fixture, the first electrode pattern plate is located above the second electrode pattern plate, and the first electrode pattern plate and the second electrode pattern plate The electrode pattern is a complementary electrode pattern, the positive and negative poles of the first electrode pattern plate are connected to the positive and negative poles corresponding to the resistance meter, the template adsorption fixture is installed on the fine-tuning table, and the fine-tuning table is used to adjust the position of the template adsorption fixture. Adjustment, the control end of the adsorption control system is connected to the adsorption control end of the template adsorption fixture, the adsorption control system is used to control the adsorption of the imprint template by the adsorption end of the template adsorption fixture, the crystal orientation of the wafer and the second electrode pattern The plates are parallel, and the direction of the template pattern in the embossed template is parallel to the first electrode pattern plate.

A method for aligning the crystal direction of a nanoimprint template using the above-mentioned device, comprising the steps of:

Step 1: Control the adsorption control system to make the adsorption end of the template adsorption fixture adsorb the imprint template;

Step 2: Use the fine-tuning table to adjust the position of the stencil adsorption fixture, and observe the positions of the first electrode graphic board and the second electrode graphic board at the same time, so that the left edge and right edge of the second electrode graphic board are respectively in line with the left edge of the first electrode graphic board. The left edge of the side square electrode pattern and the right edge of the right square electrode pattern are aligned and pasted;

Step 3: Continue to adjust the position of the stencil adsorption fixture through the fine-tuning table. When the resistance meter obtains the lowest measured resistance, turn off the adsorption control system, so that the imprint template is closely attached to the wafer, and the alignment work is completed.

The invention uses the electrode pattern as a reference for the relative angle between the wafer and the embossing template, and judges the alignment degree of the crystal direction by testing the resistance of the electrode contact, without the need for a visual recognition system, and has simple structure, convenient operation, and nano-imprinting template crystal orientation The effect of high precision alignment.

Description of drawings

Fig. 1 is a structural representation of the present invention;

FIG. 2 is a schematic diagram of a top view structure of placing a wafer in a wafer table;

Fig. 3 is a top view structural diagram of adsorbing the imprint template in the template adsorption fixture;

FIG. 4 is a schematic diagram of the positions of the first electrode pattern board and the second electrode pattern plate when they are aligned.

Among them, 1—wafer table, 1.1—wafer installation groove, 2—stencil adsorption fixture, 2.1—adsorption end, 2.2—imprint template groove, 3—fine-tuning table, 4—resistance meter, 5—adsorption control system, 6—observation system, 7—first electrode pattern plate, 8—second electrode pattern plate, 9—wafer, 10—imprint template, 11—crystal orientation, 12—template pattern.

detailed description

Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

The nanoimprint template crystal direction alignment device designed by the present invention, as shown in Figures 1 to 4, includes a wafer table 1, a template adsorption fixture 2, a fine-tuning table 3, a resistance meter 4, an adsorption control system 5, and a first electrode Graphics board 7, wafer 9, second electrode graphics board 8 corresponding to the first electrode graphics board 7, embossing template 10 matching the wafer 9, the top surface of the wafer table 1 is provided with an opening upward wafer installation Groove 1.1, the bottom surface of the template adsorption fixture 2 is provided with an embossed template groove 2.2 with an opening downward, the adsorption end 2.1 of the template adsorption fixture 2 is located at the bottom of the embossed template groove 2.2, and the imprinted template groove 2.2 is located Above the wafer installation groove 1.1, the second electrode pattern plate 8 is installed on the top surface of the wafer table 1, the first electrode pattern plate 7 is installed on the bottom surface of the template adsorption fixture 2, and the first electrode pattern plate 7 is located on the second Above the two electrode graphics boards 8, the electrode graphics in the first electrode graphics board 7 and the second electrode graphics board 8 are complementary electrode graphics, and the positive and negative poles of the first electrode graphics board 7 are corresponding to the resistance meter 4. The positive and negative poles are connected, the template adsorption fixture 2 is installed on the fine-tuning table 3, the fine-tuning table 3 is used to adjust the position of the template adsorption fixture 2, and the control end of the adsorption control system 5 is connected to the adsorption control of the template adsorption fixture 2 end, the adsorption control system 5 is used to control the adsorption of the adsorption end 2.1 of the template adsorption fixture 2 to the imprint template 10, the crystal direction 11 of the wafer 9 is parallel to the second electrode pattern plate 8, and the imprint template 10 The direction of the stencil pattern 12 is parallel to the first electrode pattern plate 7.

In the above technical solution, the fine-tuning table 3 is a four-dimensional adjustment table (the two directions of the template adsorption fixture and the parallel plane of the wafer can be adjusted, the rotation angle and the distance perpendicular to the wafer platform), and the adjustment fine-tuning table 3 controls the position of the template adsorption fixture 2 relative position and proximity.

In the above technical solution, the device for aligning the crystal orientation of the nanoimprint template further includes an observation system 6 (magnification device) for observing whether the imprint template 10 is aligned with the wafer 9 .

In the above technical solution, the first electrode pattern plate 7 is insulated from the stencil adsorption jig 2 , and the second electrode pattern plate 8 is insulated from the wafer stage 1 .

In the above technical solution, the electrode pattern of the second electrode pattern plate 8 is a rectangular electrode pattern parallel to the crystal direction 11, and the long side of the rectangular pattern is parallel to the crystal direction.

In the above technical solution, the length of the second electrode pattern plate 8 is greater than the radius of the wafer 9 and smaller than the diameter of the wafer 9, and the width of the second electrode pattern plate 8 ranges from 10 to 50 microns. The above range can ensure that when the resistance is minimum, the deviation of the template pattern and the orientation angle of the wafer is negligible.

In the above technical solution, the electrode pattern of the first electrode pattern plate 7 is two square electrode patterns, and the distance between the left edge of the left square electrode pattern and the right edge of the right square electrode pattern is equal to the first The length of the second electrode pattern plate 8 and the side length of each square electrode pattern are equal to the width of the second electrode pattern plate 8 . In this range, the minimum resistance can be guaranteed, and the deviation between the template pattern and the orientation angle of the wafer is the minimum.

In the above technical solution, the wafer mounting groove 1.1 and the embossing template groove 2.2 have the same depth, and both have a depth range of 1-1.5 mm. This range ensures that the grooves are larger than the height of the wafer and imprint stencil.

A method for aligning the crystal direction of a nanoimprint template using the above-mentioned device, comprising the steps of:

Step 1: Control the adsorption control system 5 to make the adsorption end 2.1 of the template adsorption fixture 2 adsorb the imprint template 10;

Step 2: Use the fine-tuning table 3 to adjust the position of the template adsorption fixture 2, and observe the positions of the first electrode pattern plate 7 and the second electrode pattern plate 8 at the same time, so that the left edge and the right edge of the second electrode pattern plate 8 are respectively in line with the first electrode pattern plate. The left edge of the left square electrode pattern of the electrode pattern plate 7 and the right edge of the right square electrode pattern are aligned and pasted;

Step 3: Continue to adjust the position of the stencil adsorption fixture 2 through the fine-tuning station 3, and when the resistance meter 4 obtains the lowest measured resistance (at this time, the first electrode pattern plate 7 and the second electrode pattern plate 8 are completely aligned), close the adsorption control system 5. Make the imprint template 10 close to the wafer 9 to complete the alignment work.

The content not described in detail in this specification belongs to the prior art known to those skilled in the art.

Claims (7)

1. A nanoimprint template crystal orientation alignment device is characterized in that: it includes a wafer table (1), a template adsorption fixture (2), a fine-tuning table (3), a resistance meter (4), an adsorption control system (5 ), a first electrode pattern plate (7), a wafer (9), a second electrode pattern plate (8) corresponding to the first electrode pattern plate (7), an embossing template (10) matched with the wafer (9) ), the top surface of the wafer table (1) is provided with a wafer mounting groove (1.1) with an upward opening, and the bottom surface of the template adsorption fixture (2) is provided with an embossing template groove (2.2) with an opening downward, and the template adsorption The suction end (2.1) of the clamp (2) is located at the bottom of the embossing template groove (2.2), the embossing template groove (2.2) is located above the wafer mounting groove (1.1), and the second electrode pattern The plate (8) is installed on the top surface of the wafer table (1), the first electrode pattern plate (7) is installed on the bottom surface of the template adsorption fixture (2), and the first electrode pattern plate (7) is located on the second electrode pattern plate ( 8), the electrode patterns in the first electrode pattern plate (7) and the second electrode pattern plate (8) are complementary electrode patterns, and the positive and negative poles of the first electrode pattern plate (7) and the resistance meter (4) The corresponding positive and negative poles are connected, and the template adsorption fixture (2) is installed on the fine-tuning platform (3), and the fine-tuning platform (3) is used to adjust the position of the template adsorption fixture (2), and the adsorption control system ( 5) Used to control the adsorption of the imprint template (10) by the adsorption end (2.1) of the template adsorption fixture (2), the crystal direction (11) of the wafer (9) is parallel to the second electrode pattern plate (8) , the direction of the template pattern (12) in the embossing template (10) is parallel to the first electrode pattern plate (7). 2. The nanoimprint template crystal orientation alignment device according to claim 1, characterized in that: the first electrode pattern plate (7) is insulated from the template adsorption fixture (2), and the second electrode pattern plate (8) Insulated from the wafer table (1). 3. The nanoimprint template crystal direction alignment device according to claim 1, characterized in that: the electrode pattern of the second electrode pattern plate (8) is a rectangular electrode pattern parallel to the crystal direction (11). 4. The nanoimprint template crystal orientation alignment device according to claim 3, characterized in that: the length of the second electrode pattern plate (8) is greater than the radius of the wafer (9) and less than the radius of the wafer (9). Diameter, the width of the second electrode pattern plate (8) ranges from 10 to 50 microns. 5. The nanoimprint template crystal orientation alignment device according to claim 1, characterized in that: the electrode pattern of the first electrode pattern plate (7) is two square electrode patterns, the square electrode pattern on the left side The distance between the left edge and the right edge of the square electrode pattern on the right equals the length of the second electrode pattern plate (8), and the side length of each square electrode pattern equals the width of the second electrode pattern plate (8) . 6. The nanoimprint template crystal orientation alignment device according to claim 1, characterized in that: the depth of the wafer mounting groove (1.1) and the imprint template groove (2.2) are equal, and the depth ranges are both 1 to 1.5mm. 7. A method utilizing the device according to claim 1 to carry out the crystal orientation alignment of the nanoimprint template, characterized in that it comprises the steps of: Step 1: Control the adsorption control system (5) to make the adsorption end (2.1) of the template adsorption fixture (2) adsorb the imprint template (10); Step 2: Use the fine-tuning table (3) to adjust the position of the stencil adsorption fixture (2), and observe the positions of the first electrode graphic board (7) and the second electrode graphic board (8) at the same time, so that the second electrode graphic board (8) The left edge and the right edge of the first electrode pattern plate (7) are respectively aligned with the left edge of the left square electrode pattern and the right edge of the right square electrode pattern; Step 3: Continue to adjust the position of the template adsorption fixture (2) through the fine-tuning table (3), when the resistance meter (4) obtains the lowest measured resistance, close the adsorption control system (5), so that the imprint template (10) is close to the On the wafer (9), the alignment work is done.