CN106563974A - Intelligent device for detecting cutting parameters under impact state - Google Patents

Abstract

The invention discloses an intelligent device for detecting cutting parameters in an impact state: it includes a flexible substrate, a microcontroller (MCU), a MEMS sensor, an interface circuit, a microprocessor (MPU), a wireless communication module, a power supply module, a flexible cover plate. The MEMS sensor collects the impact force, vibration, attitude, temperature and other parameters caused by the impact, and sends them to the microprocessor (MPU) through the interface circuit in time-sharing, and the collected signal is sent to the microcontroller (MCU) after preprocessing, and the microcontroller (MCU) transmits the collected data to the local computer through the wireless transmission module. The invention relates to intelligent manufacturing fields such as mechanical processing, material forming, and mechanical performance analysis. It adopts a planar structure layout, has compact structure, simple installation, and is applicable to measured objects of different shapes, realizing point-to-point connection between the measured object and the control object. things.

Description

Intelligent device for detecting cutting parameters under impact state

technical field

The invention relates to an intelligent device for detecting processing parameters, in particular to an intelligent device for detecting processing parameters under dynamic working conditions, which can be realized in dynamic working conditions by applying intelligent manufacturing fields such as mechanical processing, material forming, and mechanical performance analysis. Real-time collection and information communication of processing parameters under environmental conditions.

Background technique

In the era of Industry 4.0, the manufacturing industry is tending to be intelligent. Smart manufacturing can realize two-way data information transmission between users or operators, production equipment, and manufacturing objects. The hardware basis of two-way data information transmission is the combination of advanced sensing technology and communication technology. Sensors sense the state changes of manufacturing objects, and after collecting the obtained data, transmit them to superior equipment or users via wireless or wired communication. After the data information is analyzed and processed, the correction information of the manufacturing process is sent to the equipment through the communication channel to optimize the manufacturing process. Intelligent manufacturing will greatly improve the flexibility of the manufacturing process, thereby improving the quality and efficiency of the product production process.

In the manufacturing process, the physical quantities that need to be measured mainly include: displacement, deformation, force, acceleration, humidity, temperature, etc., and the sensors used mainly include: resistance strain type, piezoresistive type, thermal resistance, heat-sensitive, gas-sensitive, humidity-sensitive Wait. At present, the main problems of the above-mentioned sensors are: the sensors are large in size and measure static physical quantities; it is a huge challenge to measure the physical quantities of impact loads in the manufacturing process, which requires the introduction of MEMS sensor technology to achieve.

The mainstream communication technology of the Industrial Internet of Things is wireless communication technology, such as Zigbee, Wifi, Blutooth, RFID, etc. Among them, Zigbee technology is widely used in the Industrial Internet of Things. The characteristics of Zigbee technology: it can self-organize a network between multiple nodes to realize remote autonomous communication between nodes and terminals; it can self-sleep and wake up, so it consumes less power; the data transmission rate is faster than RFID technology, etc. features. From the perspective of the development direction of intelligent manufacturing, the physical quantities monitored by MEMS sensors in real time are all analog quantities, which have the characteristics of large data volumes. Zigbee technology still has high power consumption, which is not conducive to the real-time transmission of large data analog quantities. The transmission path is susceptible to interference, and the transmission rate is too small and the transmission power is too high.

Contents of the invention

In order to solve the problems of the prior art, the object of the present invention is to overcome the deficiencies of the prior art, and provide an intelligent device for detecting cutting parameters in an impact state, using a miniaturized MEMS sensor and a point-to-point wireless communication device with low power consumption, which can Accurately and efficiently complete the online detection and transmission of processing parameters under the impact state. The device has the advantages of flat structure, flexibility, small volume, compact structure and high integration, and can be applied to different shapes of measured objects under the impact state. Detection can realize real-time collection and wireless communication of processing parameters under impact state.

For achieving above-mentioned invention creation purpose, design of the present invention is as follows:

Multiple MEMS sensors are used to collect analog quantities in real time, and the data after signal processing are transmitted to the adjacent intermediate links, such as local computers or processing centers, through point-to-point low-power, high-speed wireless transmission methods, and then transmitted to the cloud through the Internet Or a server to realize the point-to-point connection between the measured object and the control object. The intelligent device for detecting processing parameters in the impact state of the present invention has a flexible substrate, which can be adapted to different shapes of measured objects, and makes the structure of the intelligent measuring device flat and miniaturized. The intelligent device for detecting processing parameters in the impact state of the present invention has multiple miniaturized MEMS sensors and can collect multiple analog quantities in real time. The intelligent device for detecting processing parameters in impact state of the present invention has a wireless communication module. The wireless communication module adopts point-to-point low-power wireless communication technology, which only realizes short-distance data transmission from the measured object to the local computer or processing center, which reduces the power consumption of the intelligent detection device, improves the transmission rate, and reduces the transmission time. Signal interference, helps prolong battery life and life.

According to above-mentioned inventive concept, the present invention adopts following technical scheme:

An intelligent device for detecting cutting parameters in an impact state, including a flexible substrate and a flexible cover. The flexible cover encapsulates the front of the flexible substrate to form a packaging structure. The installation parts of the measuring target are fixed and combined, and the cutting parameter intelligent detection device device unit is set in the sealed chamber of the packaging structure. The cutting parameter intelligent detection device device unit is mainly composed of a microcontroller, a MEMS sensor, an interface, Circuit, microprocessor, wireless communication module and power supply module, the microcontroller is connected to the microprocessor for two-way data and signal transmission, the microprocessor is connected to the MEMS sensor signal through the interface circuit, and the microcontroller is also connected to the wireless The communication module is connected to the signal, and the power module is connected to the microcontroller signal. The power module supplies power to the electronic components of the cutting parameter intelligent detection device unit. Then the cutting parameter intelligent detection device device unit performs data collection, processing and transmission, and sends it to the external signal device through the wireless communication module, and the cutting parameter intelligent detection device device unit also receives the signal from the external signal device through the wireless communication module information and data.

As a preferred technical solution of the present invention, at least three Mark positioning marks are arranged and distributed at three set positions on the front of the flexible substrate, for positioning when the back of the flexible substrate is installed on the installation site of the target to be measured, and the front of the flexible substrate Leads and pads connected to the pins of each electronic component are provided, and glue or mechanical structure connection parts are provided on the back of the flexible substrate to connect the flexible substrate to the installation part of the measured object.

As a further preferred technical solution of the above solution, each Mark positioning mark is distributed on each corresponding corner position on the front of the flexible substrate, and each Mark positioning mark is not collinearly arranged to realize the geometric positioning of the installation part of the flexible substrate and the measured object or benchmarking.

As a further preferred technical solution of the above solution, the glue on the back of the flexible substrate is made of acrylate or epoxy resin.

As a further preferred technical solution of the above solution, the wireless communication module is connected to i transmitting antennas 61 that form 360/i degrees each other, and i is at least 2, so that the wireless communication module can perform short-distance data and signal transmission with the local computer or processing center.

As a further preferred technical solution of the above solution, the microcontroller adopts the SPI protocol, which can realize command control and data transmission of the entire device.

As a further preferred technical solution of the above scheme, the MEMS sensor at least includes any sensor or combination of any of several sensors in MEMS gyroscopes, MEMS accelerometers, MEMS magnetometers, displacement sensors and temperature sensors, for measuring angular acceleration, Acceleration, angle, displacement, velocity, temperature and other physical quantities.

As a further preferred technical solution of the above solution, the interface circuit is connected downward to the MEMS sensor, expands the digital motion processing function of multiple external sensors, and is connected upward to the microprocessor to realize time-sharing transmission of data.

As a further preferred technical solution of the above solution, the power module includes a battery pack, a voltage stabilizing circuit and a battery management module.

As a further preferred technical solution of the above solution, the microprocessor has a built-in scalable digital motion processor, which can expand multiple micro sensors.

As a further preferred technical solution of the above solution, the flexible cover is made of polyimide, which can provide three-proof protection, conduct electromagnetic waves, and transmit real-time measurement data.

As a further preferred technical solution of the above solution, the microcontroller is used as the central control unit to control the microprocessor, wireless communication module, and power supply module in real time, and the interface circuit is connected downward to multiple MEMS sensors and upward to the microprocessor to realize data exchange. Processing and transmission, the power module can provide electric energy storage and usage management, and the flexible cover is packaged with a flexible organic film to provide waterproof, dustproof, and leakage protection.

The working principle of the intelligent device of the present invention is as follows:

The reverse side of the smart device for detecting processing parameters in the impact state of the present invention is pasted on the workpiece to be tested. During the workpiece processing, the parameters collected by the MEMS sensor can be sent to the microprocessor through the interface circuit in time-sharing for acceleration, vibration, attitude, speed, displacement, etc., and the collected signal is sent to the microcontroller after preprocessing. The collected data is transmitted to the local computer or processing center several meters away through the wireless transmission module, and the local computer or processing center is uploaded to the cloud or server for data analysis and processing by wired or wireless means.

Compared with the prior art, the present invention has the following obvious outstanding substantive features and significant advantages:

1. The intelligent device for detecting processing parameters in the impact state of the present invention adopts a flexible substrate with a flat structure, which can be adapted to be installed on measured objects of different shapes;

2. The intelligent device for detecting processing parameters under the impact state of the present invention uses glue to connect the measured object, which can closely fit the measured object and is easy to disassemble;

3. The intelligent device for detecting processing parameters in the impact state of the present invention adopts MEMS sensors, which can accurately collect parameters such as acceleration, vibration, attitude, speed, and displacement caused by impact loads in the processing process, and transmit them to the local computer in real time;

4. The intelligent device for processing parameter detection under the impact state of the present invention adopts an expandable digital motion processor (DMP), which can expand multiple micro sensors;

5. The intelligent device for processing parameter detection under the impact state of the present invention adopts i-radiating antennas that form 360°/i mutually, so as to avoid the "shadow effect" caused by the constantly changing position of the transmitting antenna with the measured object, that is: the receiving point Fluctuations in the median value of the field strength lead to inaccurate and effective data transmission;

6. The intelligent device for detecting processing parameters in the impact state of the present invention adopts a flexible cover, which has the advantages of dustproof, waterproof, electromagnetic interference, corrosion resistance, high temperature resistance and impact resistance;

7. The intelligent device for detecting processing parameters in the impact state of the present invention adopts a battery module, which has the advantages of long service life and convenient battery disassembly;

8. The intelligent device for processing parameter detection under the impact state of the present invention adopts a point-to-point high-speed, low-power wireless communication mode to complete short-distance data transmission from the measured object to the local computer or processing center, etc., reducing the cost of the intelligent detection device. Power consumption improves the transmission rate, reduces signal interference during transmission, and helps to extend battery life and service life.

Description of drawings

FIG. 1 is a schematic structural diagram of an intelligent device for detecting processing parameters in an impact state according to Embodiment 1 of the present invention.

2 is a cross-sectional schematic diagram of an intelligent device for detecting processing parameters in an impact state according to Embodiment 1 of the present invention.

Fig. 3 is a working principle diagram of an intelligent device for detecting processing parameters in an impact state according to Embodiment 1 of the present invention.

Fig. 4 is a diagram of the installation and use state of the intelligent device for detecting processing parameters in the impact state according to Embodiment 1 of the present invention.

Fig. 5 is a diagram of the installation and use state of the intelligent device for detecting processing parameters in the second embodiment of the present invention under the impact state.

detailed description

Preferred embodiments of the present invention are described in detail as follows:

Embodiment one:

In this embodiment, referring to Figures 1-4, an intelligent device for detecting cutting parameters under impact conditions includes a flexible substrate 1 and a flexible cover 8, and the flexible cover 8 encapsulates the front side of the flexible substrate 1 to form a packaging structure , the flexible cover 8 is made of flexible polymer materials such as polyimide, dust-proof, waterproof, electromagnetic shielding, corrosion-resistant, high-temperature resistant and impact-resistant, and the back of the flexible substrate 1 forms an installation junction, which can It is fixedly combined with the installation part of the target part to be tested, and the cutting parameter intelligent detection device device unit is set in the sealing chamber of the packaging structure. The cutting parameter intelligent detection device device unit is composed of the microcontroller 2, MEMS, and The sensor 3, the interface circuit 4, the microprocessor 5, the wireless communication module 6 and the power supply module 7 are composed. The microcontroller 2 is connected with the microprocessor 5 for two-way data and signal transmission. It is connected with MEMS sensor 3 signal, microcontroller 2 is also connected with wireless communication module 6 signal, power supply module 7 is connected with microcontroller signal, and described power supply module 7 supplies power for the electronic components of cutting parameter intelligent detection device unit, MEMS The sensor 3 can carry out non-contact independent measurement of each cutting parameter of the object to be measured under the impact state, and then the cutting parameter intelligent detection device unit performs data collection, processing and transmission, and sends it to the external signal device through the wireless communication module 6 , the cutting parameter intelligent detection device device unit also receives information and data from external signal equipment through the wireless communication module 6 .

In this embodiment, referring to Fig. 1 and Fig. 4, three Mark positioning marks 11 are arranged and distributed at three set positions on the front of the flexible substrate 1, when the back of the flexible substrate 1 is installed on the installation site of the target to be measured. For positioning, the front of the flexible substrate 1 is provided with leads and pads connected to the pins of each electronic component to form a circuit structure, and glue is provided on the back of the flexible substrate 1 to make the installation of the flexible substrate 1 and the measured object parts are connected. The Mark positioning marks 11 are distributed on the corresponding corner positions on the front of the flexible substrate 1, and the Mark positioning marks 11 are not collinearly arranged to realize the geometric positioning or reference calibration of the flexible substrate 1 and the installation part of the measured object.

In this embodiment, referring to FIG. 1 , FIG. 2 and FIG. 4 , the adhesive on the back of the flexible substrate 1 is made of acrylate or epoxy resin, and the flexible substrate 1 is bonded to the measured object.

In this embodiment, referring to Figs. 1-4, the wireless communication module 6 is connected with i transmitting antennas 61 which are mutually 360/i degrees, and i is at least 4, so that the wireless communication module 6 and the local computer carry out short-distance data and signal transmission , to reduce communication shadowing effects during rotational measurements.

In this embodiment, referring to FIGS. 1-4 , the microcontroller 2 adopts the SPI protocol, which can realize command control and data transmission of the entire device. This embodiment adopts a point-to-point wireless communication mode with high frequency and low power consumption to realize real-time and effective transmission of a large amount of data.

In this embodiment, referring to Fig. 1 and Fig. 3, the MEMS sensor 3 includes a MEMS gyroscope, a MEMS accelerometer, a MEMS magnetometer and a combination of a temperature sensor, which can detect parameters such as acceleration, vibration, displacement, attitude, and speed caused by impact .

In this embodiment, referring to FIGS. 1-4 , the interface circuit 4 is connected downward to the MEMS sensor 3 to expand the digital motion processing function of multiple external sensors, and connected upward to the microprocessor 5 to realize time-sharing transmission of data. The MEMS sensor 3 is connected to the microprocessor 5 through the interface circuit 4 module, so that the signals collected by each MEMS sensor 3 do not interfere with each other.

In this embodiment, referring to FIGS. 1-4 , the power supply module 7 includes a battery pack, a voltage stabilizing circuit and a battery management module. Provide continuous and stable power supply for the microprocessor 5, the MEMS sensor 3, and the wireless communication module 6.

In this embodiment, referring to FIGS. 1-4 , the microprocessor 5 has a built-in scalable digital motion processor (DMP), which can expand multiple micro sensors.

In this embodiment, referring to FIGS. 1 to 4 , there is a microcontroller 2 on the flexible substrate 1, the microprocessor 5 is connected to the microcontroller 2, and the microprocessor 5 is connected to each MEMS sensor 3 through an interface circuit 4 module, The microprocessor 5 is connected to the wireless communication module 6 , the wireless communication module 6 is connected to the transmitting antenna 61 , and the power supply module 7 is connected to the microcontroller 2 . The acceleration, vibration, attitude, temperature and other parameters collected by the MEMS sensor 3 are sent to the microprocessor 5 through the interface circuit 4 in time division or frequency division, and the data is sent to the microcontroller 2 after preprocessing. The communication module 6 transmits the collected data to the local computer in real time.

In this embodiment, referring to Figs. 1-4, the intelligent device for detecting processing parameters under the impact state adopts a circular ring structure, so as to be pasted and installed on the tool handle of machining, and implement dynamic data measurement of tool processing, refer to Fig. 4 . During installation, the position of the flexible substrate 1 is adjusted to establish a coordinate system between the reference of the positioning mark 11 of the flexible substrate 1 and the reference of the machine tool. Parameters such as acceleration, vibration, attitude and other parameters collected by the impact load collected by the MEMS sensor 3 are sent to the microprocessor 5 through the interface circuit 4, and the microprocessor 5 is connected to the microcontroller 2. Wireless communication to transmit data from the sensor system to the local computer.

In this embodiment, referring to Figs. 1-4, the microcontroller 2 acts as the central control unit to control the microprocessor 5, the wireless communication module 6, and the power module 7 in real time, and the interface circuit 4 is connected downward to a plurality of MEMS sensors 3, upward The microprocessor 5 is connected to realize data processing and transmission. The power module 7 can provide electric energy storage and usage management. The flexible cover 8 is packaged with a flexible organic film to provide waterproof, dustproof, and leakage protection.

During the tool cutting process, if: the rotating speed of the tool handle is 600r/min (10r/s), the data transmission time is 10ms, and the emission angle θ ₀ of a single directional antenna is 120°;

There is θ=n·360·T,

Among them: θ----rotation angle of the antenna (unit data transmission time), n----speed, T----data transmission time.

θ=n·360·T=10×360×0.01=36°<θ ₀ =120°

The above formula shows that if the rotation speed of the handle is low, the scanning angle of a single directional antenna within the data transmission time cannot cover its emission angle, so outside the area of the antenna emission angle, the antenna cannot effectively transmit data, resulting in shadow effects.

i=θ ₀ /θ=120/36≈4. Therefore, at least four antennas are used to cover the emission angle and realize data transmission without blind spots.

The MEMS sensor 3 of this embodiment collects parameters such as impact force, vibration amount, posture, temperature and the like caused by the impact, and sends them to the microprocessor 5 in time-sharing through the interface circuit 4, and the collected signals are sent to the microcontroller 2 through preprocessing, and the microcontroller The controller 2 transmits the collected data to the local computer through the wireless transmission module. This embodiment adopts a non-contact measurement method, which can be applied to intelligent manufacturing fields such as mechanical processing, material forming, and mechanical performance analysis. Point-to-point IoT connection between the measured object and the control object.

Embodiment two:

This embodiment is basically the same as Embodiment 1, especially in that:

In this embodiment, see FIG. 5 , the intelligent device for detecting processing parameters in the impact state is installed on the side or the ground of the workpiece, see FIG. 5 . During installation, the position of the flexible substrate 1 is adjusted to establish a coordinate system between the reference of the positioning mark 11 of the flexible substrate 1 and the reference of the machine tool. During machining, the fixture is at rest. Parameters such as acceleration, vibration, attitude and other parameters collected by the impact load collected by the MEMS sensor 3 are sent to the microprocessor 5 through the interface circuit 4, and the microprocessor 5 is connected to the microcontroller 2, and the measured data is signal modulated and processed. It is transmitted to the local computer through the wireless transmission module, and the local computer uploads to the cloud or server to analyze and process the collected data.

The embodiments of the present invention have been described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned embodiments, and various changes can also be made according to the purpose of the invention of the present invention. The changes, modifications, substitutions, combinations or simplifications should be equivalent replacement methods, as long as they meet the purpose of the present invention, as long as they do not deviate from the technical principle and inventive concept of the intelligent device for detecting processing parameters under the impact state of the present invention. Belong to the protection scope of the present invention.

Claims (6)

1. the intelligent apparatus of parameter detecting are cut under a kind of impact conditions, it is characterised in that：Including flexible base board (1) and flexible envelope Lid (8), flexible lidstock (8) is packaged to the front of flexible base board (1), forms encapsulating structure, the back side shape of flexible base board (1) Into joint portion is installed, installing joint portion can be fixed combination with the installation position of target part to be measured, in encapsulating structure annular seal space Indoor setting cutting parameter Intelligent Measurement device device unit, cutting parameter Intelligent Measurement device device unit is mainly by being installed on Microcontroller (2), MEMS sensor (3) on the front of flexible base board (1), interface circuit (4), microprocessor (5), channel radio News module (6) and power module (7) are constituted, and microcontroller (2) is connected with microprocessor (5) signal, carry out two-way data with Signal transmission, microprocessor (5) is connected by interface circuit (4) with MEMS sensor (3) signal, microcontroller (2) also with nothing Line communication module (6) signal connects, and power module (7) is connected with microcontroller signal, and the power module (7) is cutting parameter The electronic devices and components of Intelligent Measurement device device unit are powered, and MEMS sensor (3) can be to target part to be measured under impact conditions Each cutting parameter carry out contactless independent measurement, then cutting parameter Intelligent Measurement device device unit carries out data and adopts Collection, process and transmission, and sent to outside signalling arrangement by wireless communication module (6), cutting parameter Intelligent Measurement device dress Put unit and also the information and data from external signal equipment is received by wireless communication module (6).

2. the intelligent apparatus of parameter detecting are cut according to claim 1 under impact conditions, it is characterised in that：At least provided with 3 Individual Mark positioning mark (11) is distributed in positive three setting positions of flexible base board (1), is that the back side of flexible base board (1) is installed Positioned at the installation position of target part to be measured, the front of flexible base board (1) is provided with the pin phase with each electronic devices and components The lead and pad of connection, at flexible base board (1) back side viscose glue or frame for movement connecting portion are provided with, and make flexible base board (1) and quilt The installation position of measurement object is connected.

3. the intelligent apparatus of parameter detecting are cut according to claim 2 under impact conditions, it is characterised in that：Each Mark positioning Mark (11) is distributed in each correspondence corner positions on flexible base board (1) front, and each Mark positioning mark (11) does not collinearly arrange, realizes Flexible base board (1) is proofreaded with the geometry location or benchmark of the installation position of measured object.

4. the intelligent apparatus of parameter detecting are cut according to claim 1 under impact conditions, it is characterised in that：Wireless telecommunications mould Block (6) connection i roots are mutually the transmitting antenna (61) of 360/i degree, and i is at least 4, makes wireless communication module (6) and local computer Or machining center carries out low coverage data and signal transmission.

5. the intelligent apparatus of parameter detecting are cut under the impact conditions according to any one in Claims 1 to 5, and its feature exists In：MEMS sensor (3) at least includes that MEMS gyroscope, mems accelerometer, MEMS magnetometers, displacement transducer and temperature are passed Any one sensor in sensor or arbitrarily several sensor combinations, for measure angular acceleration, acceleration, angle, displacement, The physical quantitys such as speed, temperature.

6. the intelligent apparatus of parameter detecting are cut under the impact conditions according to any one in Claims 1 to 5, and its feature exists In：Microcontroller (2) is used as centralized control unit, real-time control microprocessor (5), wireless communication module (6), power module (7), interface circuit (4) connects downwards multiple MEMS sensors (3), connects up microprocessor (5), realize the process of data with Transmission, power module (7) can provide the deposit of electric energy and using management, and flexible lidstock (8) is encapsulated using flexible organic film, Waterproof and dustproof, proof and electric leakage-proof safety are provided.