CN106501906A - A kind of 10G PON BOSA patches - Google Patents
A kind of 10G PON BOSA patches Download PDFInfo
- Publication number
- CN106501906A CN106501906A CN201610948823.6A CN201610948823A CN106501906A CN 106501906 A CN106501906 A CN 106501906A CN 201610948823 A CN201610948823 A CN 201610948823A CN 106501906 A CN106501906 A CN 106501906A
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- Prior art keywords
- bosa
- pon
- mouth
- pin
- external equipment
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 238000004804 winding Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000004891 communication Methods 0.000 abstract description 3
- 101001094647 Homo sapiens Serum paraoxonase/arylesterase 1 Proteins 0.000 description 45
- 102100035476 Serum paraoxonase/arylesterase 1 Human genes 0.000 description 45
- 230000003287 optical effect Effects 0.000 description 22
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The present invention relates to technical field of photo communication, more particularly to a kind of 10G PON BOSA patches, including：Substrate and BOSA devices；BOSA drive circuits are integrated with substrate；BOSA devices are fitted on substrate, and BOSA devices are electrically connected with BOSA drive circuits；BOSA being provided with substrate and amplexiforming mouth, BOSA is amplexiformed mouth and is electrically connected with BOSA drive circuits, and BOSA amplexiforms mouth to be used for connecting external equipment mainboard.As BOSA devices are directly connected to external equipment mainboard, without the need for metal shell and extra metal shell fixed seat and connecting seat, it is achieved that the Miniaturization Design of PON BOSA patches, good heat dissipation effect, low cost of manufacture, and be easy to remove and repair and upgrading, promote the popularization of 10G PON technology.
Description
Technical field
The present invention relates to technical field of photo communication, more particularly to a kind of 10G PON BOSA patches.
Background technology
10G PON (Passive Optical Network, the EPON) optical module for using at present, including 10G/
1G EPON (Ethernet Passive Optical Network, Ethernet passive optical network), 10G/10G EPON, XG-
PON1 and XG-PON2 etc., mostly using SFP+ or XFP encapsulation, using metal shell, need optical module shell fixed seat and
Optical module interface block, high cost are unfavorable for that high-volume is used, hinder the popularization of 10G PON technology.Existing 10G PON optical modes
Block circuit under hot environment, will be unfavorable for air circulation, not reach radiating effect due to there is metal shell, for needing senior engineer
The requirement for making environment temperature is limited.Existing 10G PON optical modules are encapsulated using SFP+ or XFP, and plug-in light connects
Mouthful, it is unfavorable for cabling and layout, metal shell exacerbates optical mode block cost, and is unfavorable for that optical module radiates, and normal structure is designed
The size of optical module is limited, is unfavorable for that smallerization is designed.
Content of the invention
The present invention solves 10G PON optical modules in prior art and adopts SFP by providing a kind of 10G PON BOSA patches
+ or XFP encapsulation, it is unfavorable for cabling and layout, metal shell exacerbates optical mode block cost, and is unfavorable for the skill of optical module radiating
Art problem, it is achieved that the Miniaturization Design of PON BOSA patches, good heat dissipation effect, low cost promote pushing away for 10G PON technology
Extensively.
The invention provides a kind of 10G PON BOSA patches, including：Substrate and BOSA devices；
BOSA drive circuits are integrated with the substrate；
The BOSA devices are fitted on the substrate, and the BOSA devices are electrically connected with the BOSA drive circuits；
BOSA is provided with the substrate and amplexiforms mouth, the BOSA is amplexiformed mouth and is electrically connected with the BOSA drive circuits,
The BOSA is amplexiformed mouth and is connected with external equipment mainboard.
Further, the BOSA amplexiforms the row's of being provided with pin on mouth, and row's pin is electrically connected with the BOSA drive circuits
Connect；
The jack being engaged with row's pin is provided with the external equipment mainboard, and row's pin is inserted into the jack
Interior.
Further, row's pin is set to two rows.
Further, the BOSA to be amplexiformed and be provided with paster pin on mouth, and the paster pin drives electricity with the BOSA
Road is electrically connected with；
The pad being engaged with the paster pin is provided with the external equipment mainboard, and the paster pin is welded on
On the pad.
Further, the paster pin is set to two rows.
Further, the BOSA is amplexiformed, and the pressing pin drives electricity with the BOSA
Road is electrically connected with；
The groove being engaged with the pressing pin is provided with the external equipment mainboard, and the pressing pin is pressed together on
In the groove.
Further, the BOSA amplexiforms mouth by flexible winding displacement connection external equipment mainboard.
Further, the substrate is pcb board.
Further, the external equipment mainboard is OLT.
Further, the external equipment mainboard is ONT.
One or more technical scheme that the present invention is provided, at least possesses following beneficial effect or advantage：
The 10G PON BOSA patches that the present invention is provided, BOSA devices are electrically connected with BOSA drive circuits；Arrange on substrate
There is BOSA to amplexiform mouth, BOSA is amplexiformed mouth and is electrically connected with BOSA drive circuits, and BOSA amplexiforms mouth to be used for connecting external equipment mainboard；
BOSA devices, BOSA drive circuits and substrate collectively form 10G PON BOSA patches.Due to BOSA devices and external equipment mainboard
It is directly connected to, without the need for metal shell and extra metal shell fixed seat and connecting seat, it is achieved that it is small-sized that PON BOSA are pasted
Change design, be easy to carry, good heat dissipation effect, low cost of manufacture, and be easy to remove and repair and upgrading, promote 10G PON
The popularization of technology.The 10G PON BOSA patches that the present invention is provided, BOSA are amplexiformed mouth and can adopt plug-in unit, paster, pressing or soft
Property line mode be connected with external equipment, according to the actual requirements, flexibly select interface mode.The 10G PON that the present invention is provided
BOSA is pasted, and PCB appearance and sizes can be designed according to the layout of side circuit and wiring, is minimized beneficial to product.
Description of the drawings
Fig. 1 pastes structural representation for the 10G PON BOSA that embodiment of the present invention 1-5 is provided；
Fig. 2 is the 10G PON BOSA patch structural representations that the embodiment of the present invention 1 is provided；
Left views of the Fig. 3 for Fig. 2；
Fig. 4 is external equipment mainboard structure schematic diagram corresponding with the substrate of the BOSA of 10G PON shown in Fig. 2 patches；
Fig. 5 is the 10G PON BOSA patch structural representations that the embodiment of the present invention 2 is provided；
Left views of the Fig. 6 for Fig. 5；
Fig. 7 is external equipment mainboard structure schematic diagram corresponding with the substrate of the BOSA of 10G PON shown in Fig. 5 patches；
Fig. 8 is the 10G PON BOSA patch structural representations that the embodiment of the present invention 3 is provided；
Left views of the Fig. 9 for Fig. 8；
Figure 10 is attached to the structure that corresponding external equipment mainboard is fixed for the 10G PON BOSA that embodiment of the present invention 3-5 is provided
Schematic diagram；
Figure 11 is external equipment mainboard structure schematic diagram corresponding with the substrate of the BOSA of 10G PON shown in Fig. 8 patches；
Figure 12 pastes structural representation for the 10G PON BOSA that embodiment of the present invention 4-5 is provided.
Specific embodiment
The embodiment of the present invention solves 10GPON optical modules in prior art and adopts by providing a kind of 10G PON BOSA patches
Encapsulated with SFP+ or XFP, be unfavorable for cabling and layout, metal shell exacerbates optical mode block cost, and is unfavorable for that optical module dissipates
The technical problem of heat, it is achieved that the Miniaturization Design of PON BOSA patches, good heat dissipation effect, low cost promote 10G PON technology
Popularization.
Referring to Fig. 1-Figure 12, a kind of 10G PON BOSA patches are embodiments provided, including：Substrate 3 and BOSA devices
Part 2；The related chips such as BOSA drive circuits and device are integrated with substrate 3；BOSA devices 2 are fitted on the substrate 3, BOSA devices
2 are electrically connected with BOSA drive circuits；BOSA being provided with substrate 3 and amplexiforming mouth 1, BOSA amplexiforms mouth 1 with BOSA drive circuits electricity
Property connection, BOSA amplexiforms the connection of mouth 1 external equipment mainboard 5, external equipment mainboard 5 be OLT (Optical Line Terminal,
Optical line terminal), ONT (Optical Network Terminal, ONT Optical Network Terminal) or other optic communication devices.
10G PON BOSA patches provided in an embodiment of the present invention, BOSA devices 2 are directly connected to external equipment mainboard 5, nothing
Need metal shell and extra metal shell fixed seat and connecting seat, it is achieved that the Miniaturization Design of PONBOSA patches, radiating effect
Really good, low cost of manufacture, and be easy to remove and repair and upgrading.The present invention is provided with reference to specific embodiment
10G PON BOSA patches are illustrated：
Embodiment 1
Referring to Fig. 2-Fig. 4, in the 10G PON BOSA patches that the present embodiment is provided, substrate 3 adopts pcb board, integrated in pcb board
There are BOSA drive circuits；BOSA devices 2 are fitted on pcb board, and BOSA devices 2 are electrically connected with BOSA drive circuits；On pcb board
It is provided with BOSA and amplexiforms mouth 1, BOSA is amplexiformed mouth 1 and is electrically connected with BOSA drive circuits, BOSA amplexiforms the connection external equipment master of mouth 1
Plate 5, external equipment mainboard 5 adopt OLT.BOSA amplexiforms the row's of being provided with pin 4 on mouth 1, and row's pin 4 is set to two rows, row's pin 4 and BOSA
Drive circuit is electrically connected with；The jack 6 being engaged with row's pin 4 is provided with external equipment mainboard 5, and row's pin 4 is inserted into jack 6
Interior, BOSA devices 2 are fitted on pcb board.
Embodiment 2
Referring to Fig. 5-Fig. 7, in the 10G PON BOSA patches that the present embodiment is provided, substrate 3 adopts pcb board, integrated in pcb board
There are BOSA drive circuits；BOSA devices 2 are fitted on pcb board, and BOSA devices 2 are electrically connected with BOSA drive circuits；On pcb board
It is provided with BOSA and amplexiforms mouth 1, BOSA is amplexiformed mouth 1 and is electrically connected with BOSA drive circuits, BOSA amplexiforms the connection external equipment master of mouth 1
Plate 5, external equipment mainboard 5 adopt ONT.BOSA is amplexiformed and is provided with paster pin 7 on mouth 1, and paster pin 7 is set to two rows, patch
Piece pin 7 is electrically connected with BOSA drive circuits.The pad 8 being engaged with paster pin 7 is provided with external equipment mainboard 5,
Paster pin 7 is welded on pad 8, and BOSA devices 2 are fitted on pcb board.
Embodiment 3
Referring to Fig. 8-Figure 11, in the 10G PON BOSA patches that the present embodiment is provided, substrate 3 adopts collection in pcb board, pcb board
Into there is BOSA drive circuits；BOSA devices 2 are fitted on pcb board, and BOSA devices 2 are electrically connected with BOSA drive circuits；Pcb board
On be provided with BOSA and amplexiform mouth 1, BOSA is amplexiformed mouth 1 and is electrically connected with BOSA drive circuits, and BOSA amplexiforms the connection external equipment of mouth 1
Mainboard 5, external equipment mainboard 5 adopt OLT.BOSA is amplexiformed and is provided with pressing pin 9 on mouth 1, and pressing pin 9 drives electricity with BOSA
Road is electrically connected with；The groove 10 being engaged with pressing pin 9 is provided with external equipment mainboard 5, and pressing pin 9 is pressed together on groove
In 10, BOSA devices 2 are fitted on pcb board.10G PON BOSA patches are fixed in external setting by external stability buckle again
On standby mainboard, this mode facilitates the maintenance of optical module, dismounting, and easily carries out module upgrade, and external stability buckle is adopted
Plastics or normal screws, low cost, clever structure are promoted beneficial to high-volume.
Embodiment 4
Referring to Fig. 1 and Figure 12, in the 10G PON BOSA patches that the present embodiment is provided, substrate 3 adopts collection in pcb board, pcb board
Into there is BOSA drive circuits；BOSA devices 2 are fitted on pcb board, and BOSA devices 2 are electrically connected with BOSA drive circuits；Pcb board
On be provided with BOSA and amplexiform mouth 1, BOSA is amplexiformed mouth 1 and is electrically connected with BOSA drive circuits, and BOSA amplexiforms the connection external equipment of mouth 1
Mainboard 5, external equipment mainboard 5 adopt OLT, BOSA to amplexiform mouth 1 by the flexible connection of winding displacement 11 OLT.10G PON BOSA are pasted again
It is fixed on external equipment mainboard by external stability buckle.
Embodiment 5
Referring to Fig. 1 and Figure 12, in the 10G PON BOSA patches that the present embodiment is provided, substrate 3 adopts collection in pcb board, pcb board
Into there is BOSA drive circuits；BOSA devices 2 are fitted on pcb board, and BOSA devices 2 are electrically connected with BOSA drive circuits；Pcb board
On be provided with BOSA and amplexiform mouth 1, BOSA is amplexiformed mouth 1 and is electrically connected with BOSA drive circuits, and BOSA amplexiforms the connection external equipment of mouth 1
Mainboard 5, external equipment mainboard 5 adopt ONT, BOSA to amplexiform mouth 1 by the flexible connection of winding displacement 11 ONT.10G PON BOSA are pasted again
It is fixed on external equipment mainboard by external stability buckle.
Referring to Fig. 1-Figure 12, one or more technical scheme provided in an embodiment of the present invention, at least possesses following beneficial effect
Fruit or advantage：
10G PON BOSA patches provided in an embodiment of the present invention, BOSA devices 2 are electrically connected with BOSA drive circuits；Substrate
BOSA being provided with 3 and amplexiforming mouth 1, BOSA is amplexiformed mouth 1 and is electrically connected with BOSA drive circuits, and it is outer for connecting that BOSA amplexiforms mouth 1
Portion equipment mainboard 5；BOSA devices 2, BOSA drive circuits and substrate 3 collectively form 10G PON BOSA patches.Due to BOSA devices 2
It is directly connected to external equipment mainboard 5, without the need for metal shell and extra metal shell fixed seat and connecting seat, it is achieved that
The Miniaturization Design of PON BOSA patches, good heat dissipation effect, low cost of manufacture, and be easy to remove and repair and upgrading, promote
The popularization of 10G PON technology.10G PON BOSA patches provided in an embodiment of the present invention, BOSA are amplexiformed mouth 1 and can adopt plug-in unit, patch
Piece, pressing or flexible circuitry mode are connected with external equipment, according to the actual requirements, flexibly select interface mode.Of the invention real
The 10G PON BOSA patches of example offer are applied, PCB appearance and sizes can be designed according to the layout of side circuit and wiring, beneficial to product
Product are minimized.
It should be noted last that, above specific embodiment only in order to technical scheme to be described and unrestricted,
Although being described in detail to the present invention with reference to example, it will be understood by those within the art that, can be to the present invention
Technical scheme modify or equivalent, without deviating from the spirit and scope of technical solution of the present invention, which all should be covered
In the middle of scope of the presently claimed invention.
Claims (10)
1. a kind of 10G PON BOSA are pasted, it is characterised in that included：Substrate and BOSA devices；
BOSA drive circuits are integrated with the substrate；
The BOSA devices are fitted on the substrate, and the BOSA devices are electrically connected with the BOSA drive circuits；
BOSA is provided with the substrate and amplexiforms mouth, the BOSA is amplexiformed mouth and is electrically connected with the BOSA drive circuits, described
BOSA amplexiforms mouth to be used for being connected with external equipment mainboard.
2. 10G PON BOSA as claimed in claim 1 are pasted, it is characterised in that the BOSA amplexiforms the row's of being provided with pin on mouth,
Row's pin is electrically connected with the BOSA drive circuits；
The jack being engaged with row's pin is provided with external equipment mainboard, and row's pin is inserted in the jack.
3. 10G PON BOSA as claimed in claim 2 are pasted, it is characterised in that row's pin is set to two rows.
4. 10G PON BOSA as claimed in claim 1 patch, it is characterised in that the BOSA is amplexiformed
Pin, the paster pin are electrically connected with the BOSA drive circuits；
The pad being engaged with the paster pin is provided with external equipment mainboard, and the paster pin is welded on the pad
On.
5. 10G PON BOSA as claimed in claim 4 are pasted, it is characterised in that the paster pin is set to two rows.
6. 10G PON BOSA as claimed in claim 1 patch, it is characterised in that the BOSA is amplexiformed
Pin, the pressing pin are electrically connected with the BOSA drive circuits；
The groove being engaged with the pressing pin is provided with external equipment mainboard, and the pressing pin is pressed together on the groove
Interior.
7. 10G PON BOSA as claimed in claim 1 are pasted, it is characterised in that the BOSA is amplexiformed mouth and connected by flexible winding displacement
Connect external equipment mainboard.
8. 10G PON BOSA as claimed in claim 1 are pasted, it is characterised in that the substrate is pcb board.
9. 10G PON BOSA patches as described in any one of claim 1-8, it is characterised in that the external equipment mainboard is
OLT.
10. 10G PON BOSA patches as described in any one of claim 1-8, it is characterised in that the external equipment mainboard is
ONT.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610948823.6A CN106501906A (en) | 2016-10-26 | 2016-10-26 | A kind of 10G PON BOSA patches |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610948823.6A CN106501906A (en) | 2016-10-26 | 2016-10-26 | A kind of 10G PON BOSA patches |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106501906A true CN106501906A (en) | 2017-03-15 |
Family
ID=58323053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610948823.6A Pending CN106501906A (en) | 2016-10-26 | 2016-10-26 | A kind of 10G PON BOSA patches |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106501906A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102468295A (en) * | 2010-10-28 | 2012-05-23 | 英飞凌科技股份有限公司 | Semiconductor module having an insert and method for producing a semiconductor module having an insert |
| US20120148185A1 (en) * | 2010-12-13 | 2012-06-14 | Wen-Tzung Chen | Receptacle-type bi-directional optical module and electronic apparatus thereof |
| CN103338591A (en) * | 2013-06-04 | 2013-10-02 | 青岛海信宽带多媒体技术有限公司 | A paster-type optical module |
| CN103857170A (en) * | 2012-11-28 | 2014-06-11 | 置富存储科技(深圳)有限公司 | Extension PCB |
| CN206209159U (en) * | 2016-10-26 | 2017-05-31 | 博为科技有限公司 | A kind of 10G PON BOSA patches |
-
2016
- 2016-10-26 CN CN201610948823.6A patent/CN106501906A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102468295A (en) * | 2010-10-28 | 2012-05-23 | 英飞凌科技股份有限公司 | Semiconductor module having an insert and method for producing a semiconductor module having an insert |
| US20120148185A1 (en) * | 2010-12-13 | 2012-06-14 | Wen-Tzung Chen | Receptacle-type bi-directional optical module and electronic apparatus thereof |
| CN103857170A (en) * | 2012-11-28 | 2014-06-11 | 置富存储科技(深圳)有限公司 | Extension PCB |
| CN103338591A (en) * | 2013-06-04 | 2013-10-02 | 青岛海信宽带多媒体技术有限公司 | A paster-type optical module |
| CN206209159U (en) * | 2016-10-26 | 2017-05-31 | 博为科技有限公司 | A kind of 10G PON BOSA patches |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170315 |
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