CN106498227A - 一种铜合金的制备方法 - Google Patents
一种铜合金的制备方法 Download PDFInfo
- Publication number
- CN106498227A CN106498227A CN201610997786.8A CN201610997786A CN106498227A CN 106498227 A CN106498227 A CN 106498227A CN 201610997786 A CN201610997786 A CN 201610997786A CN 106498227 A CN106498227 A CN 106498227A
- Authority
- CN
- China
- Prior art keywords
- copper alloy
- copper
- preparation
- magnesium
- iron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610997786.8A CN106498227B (zh) | 2014-11-11 | 2014-11-11 | 一种铜合金的制备方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410629939.4A CN104328304B (zh) | 2014-11-11 | 2014-11-11 | 一种高强高导导线用铜合金及其制备方法 |
| CN201610997786.8A CN106498227B (zh) | 2014-11-11 | 2014-11-11 | 一种铜合金的制备方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410629939.4A Division CN104328304B (zh) | 2014-11-11 | 2014-11-11 | 一种高强高导导线用铜合金及其制备方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106498227A true CN106498227A (zh) | 2017-03-15 |
| CN106498227B CN106498227B (zh) | 2018-01-30 |
Family
ID=52403109
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610997787.2A Expired - Fee Related CN106544533B (zh) | 2014-11-11 | 2014-11-11 | 一种高强高导导线用铜合金的制备方法 |
| CN201610997786.8A Active CN106498227B (zh) | 2014-11-11 | 2014-11-11 | 一种铜合金的制备方法 |
| CN201410629939.4A Active CN104328304B (zh) | 2014-11-11 | 2014-11-11 | 一种高强高导导线用铜合金及其制备方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610997787.2A Expired - Fee Related CN106544533B (zh) | 2014-11-11 | 2014-11-11 | 一种高强高导导线用铜合金的制备方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410629939.4A Active CN104328304B (zh) | 2014-11-11 | 2014-11-11 | 一种高强高导导线用铜合金及其制备方法 |
Country Status (1)
| Country | Link |
|---|---|
| CN (3) | CN106544533B (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114990376A (zh) * | 2022-06-02 | 2022-09-02 | 浙江大学 | 一种三元高强高导铜合金及其制备方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106222484A (zh) * | 2016-07-20 | 2016-12-14 | 合肥恒研智能科技有限公司 | 一种嵌入式工控机壳体用高强度合金 |
| CN107204320B (zh) * | 2017-05-25 | 2019-11-29 | 京东方科技集团股份有限公司 | 金属导线、薄膜晶体管及制作方法、阵列基板和显示装置 |
| JP2020133000A (ja) * | 2019-02-20 | 2020-08-31 | 三菱マテリアル株式会社 | 銅合金材、整流子片、電極材 |
| CN114606414B (zh) * | 2022-03-11 | 2022-12-02 | 北京理工大学 | 一种高导电率再生铝合金导线及其制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6152332A (ja) * | 1984-08-21 | 1986-03-15 | Toshiba Corp | ボンデイングワイヤ− |
| CN101629254A (zh) * | 2009-06-25 | 2010-01-20 | 中南大学 | 一种多元复合微合金化的高强高导铜合金及其制备 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101265536A (zh) * | 2007-03-12 | 2008-09-17 | 北京有色金属研究总院 | 高强高导铜合金及其制备方法 |
| CN104004939A (zh) * | 2014-06-13 | 2014-08-27 | 甘肃大鑫铜业有限责任公司 | 高强高导铜合金及其制备方法 |
-
2014
- 2014-11-11 CN CN201610997787.2A patent/CN106544533B/zh not_active Expired - Fee Related
- 2014-11-11 CN CN201610997786.8A patent/CN106498227B/zh active Active
- 2014-11-11 CN CN201410629939.4A patent/CN104328304B/zh active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6152332A (ja) * | 1984-08-21 | 1986-03-15 | Toshiba Corp | ボンデイングワイヤ− |
| CN101629254A (zh) * | 2009-06-25 | 2010-01-20 | 中南大学 | 一种多元复合微合金化的高强高导铜合金及其制备 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114990376A (zh) * | 2022-06-02 | 2022-09-02 | 浙江大学 | 一种三元高强高导铜合金及其制备方法 |
| CN114990376B (zh) * | 2022-06-02 | 2023-08-22 | 浙江大学 | 一种三元高强高导铜合金及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104328304B (zh) | 2017-01-11 |
| CN106544533A (zh) | 2017-03-29 |
| CN104328304A (zh) | 2015-02-04 |
| CN106498227B (zh) | 2018-01-30 |
| CN106544533B (zh) | 2018-09-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Pan Lifeng Inventor after: Sun Leping Inventor after: Liu Jianping Inventor after: Yu Jianhua Inventor after: Dai Qitao Inventor after: Lu Han Inventor after: Chen Yifeng Inventor after: Li Lin Inventor before: Yan Chenglong |
|
| CB03 | Change of inventor or designer information | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180105 Address after: 315338 Tzu Dong Avenue, Cixi Binhai Economic Development Zone, Ningbo, Zhejiang Province, No. 1688 Applicant after: Gezhouba Dam Cheats (Ningbo) Metal Industry Co., Ltd. Address before: 241007 Anhui city of Wuhu province Jiujiang Economic Development Zone East Road No. 3 leap Applicant before: WUHU MINTAI COPPER INDUSTRY CO., LTD. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No.1688, CiDong Avenue, Cixi Binhai Economic Development Zone, Ningbo City, Zhejiang Province Patentee after: Ningbo zhanci New Material Technology Co.,Ltd. Address before: No.1688, CiDong Avenue, Cixi Binhai Economic Development Zone, Ningbo City, Zhejiang Province Patentee before: GEZHOUBA ZHANCI (NINGBO) METAL INDUSTRY CO.,LTD. |
|
| CP01 | Change in the name or title of a patent holder |