CN106346885B - 一种载带用上盖带 - Google Patents
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Abstract
本发明属于电子元器件包装领域，涉及一种载带用上盖带，包括用于提供支撑力的基材层、位于所述基材层下方的热封层以及连接所述基材层与所述热封层的连接层，连接层包括如下质量百分比的组分：20‑75%的主料，所述主料为乙烯‑丙烯酸甲酯、乙烯‑丙烯酸乙酯、乙烯‑丙烯酸丁酯、乙烯‑丙烯酸共聚物和乙烯‑丙烯酸‑马来酸酐三元共聚物中的一种或几种混合物；15‑40%聚乙烯；5‑25%的改性乙烯‑辛烯共聚物；5‑20%的改性SEBS。本发明采用特定配方的连接层代替传统的胶黏剂，避免了胶黏剂中有毒物质的使用，减少了环境污染；也进一步提高了连接效果，简化了上盖带的生产工艺；并且连接层，还能够很好的减缓上盖带剥离时产生的震动，保持载带剥离的平稳性。
Description
技术领域
本发明属于电子元器件包装领域，涉及一种载带用上盖带。
背景技术
上盖带，即热封覆盖于载带上连续成型的容纳电子元器件的凹部，形成闭包式空间。上盖带一般为多层结构，由聚酯薄膜（PET）为基材，经电晕放电等表面处理后再层叠热塑性树脂层。在层叠热塑性树脂层时，一般会需要粘合层来粘接基材层与后续的热塑性树脂层。粘结层一般采用聚氨酯胶黏剂（简称AC剂），AC剂涂覆需使用到乙酸乙酯作为溶剂，乙酸乙酯虽为低毒性物质，但始终对环境有一定污染，且容易残留在成品上；AC剂层涂覆时为液体状，因此需要烘干后才能继续后续程序，损耗电源。
发明内容
为了解决现有上盖带存在的上述缺陷，本发明提供一种载带用上盖带，选用特定组分组成的连接层，连接基材层和热封层，连接效果好，对环境无污染，且不用烘干，简化上盖带的生产工艺，节约生产成本。
本发明采用如下的技术方案：
一种载带用上盖带，包括用于提供支撑力的基材层、位于所述基材层下方的热封层以及连接所述基材层与所述热封层的连接层，连接层包括如下质量百分比的组分：
20-75%的主料，所述主料为乙烯-丙烯酸甲酯、乙烯-丙烯酸乙酯、乙烯-丙烯酸丁酯、乙烯-丙烯酸共聚物和乙烯-丙烯酸-马来酸酐三元共聚物中的一种或几种混合物；15-40%聚乙烯；5-25%的改性乙烯-辛烯共聚物；5-20% 的改性SEBS。
上述技术方案中，摈弃胶黏剂，研究出一种全新的组分形成的连接层，直接对基材层和热封层起到连接作用，既环保，连接效果又更好，无需烘干工艺；上述方案中的组分形成的连接层与大部分材质的基材层和热封层都具有良好的连接效果，并且能保证剥离时连接层与热封层之间不会分离。
此外采用传统胶黏剂的上盖带，在剥离时，会产生震动，影响载带的稳定，电子元器件容易跳出，上述方案中的组分形成的连接层，还能够很好的减缓上盖带剥离时产生的震动，保持载带的平稳性。
作为优选，连接层包括20-75%的乙烯-丙烯酸甲酯和乙烯-丙烯酸-马来酸酐三元共聚物的混合物、15-40%聚乙烯、5-25%的改性乙烯-辛烯共聚物、5-20% 的改性SEBS。上述方案所得到的连接层，不管是连接还是防震，都能有很好的效果。
作为优选，所述聚乙烯采用通过接枝单体进行接枝改性的改性聚乙烯，此方案改性后的聚乙烯用于连接层中，与其它组分的配合度更高，有利于提高连接层的防震作用。
作为优选，所述接枝单体包含顺丁二烯酸酐、丙烯酸、丙烯酸甲酯、丙烯酸丁酯和甲基丙烯酸缩水甘油酯中的一种或几种混合物。
作为优选，接枝改性的所述改性聚乙烯的接枝率为2～10%，接枝率过低，不仅连接效果差，连接力得不到保证，剥离时容易与热封层分离；接枝率过高的话，防震作用不明显。
作为优选，所述聚乙烯包含低密度聚乙烯、线性低密度聚乙烯和茂金属聚乙烯中的一种或几种的混合物，进一步优选为低密度聚乙烯、茂金属聚乙烯按重量比为1:0.5-1.5的比例混合，所得到的连接层，韧性更好，有利于保证上盖带稳定的剥离。
作为优选，所述改性乙烯-辛烯共聚物采用通过顺丁二烯酸酐接枝改性的改性乙烯-辛烯共聚物，与改性的聚乙烯共同作用，有利于提高连接层与基材层和热封层的连接效果。
作为优选，接枝改性的改性乙烯-辛烯共聚物的接枝率2～8%。
作为优选，所述改性SEBS采用通过顺丁二烯酸酐接枝改性的改性SEBS，与改性的乙烯-辛烯共聚物共同作用，大大提高了连接层的防震作用。
作为优选，接枝改性的改性SEBS的接枝率5～15%。
通过实施上述技术方案，本发明具有如下有益效果：本发明采用特定配方的连接层代替传统的胶黏剂，避免了胶黏剂中有毒物质的使用，减少了环境污染；也进一步提高了连接效果，简化了上盖带的生产工艺；并且连接层，还能够很好的减缓上盖带剥离时产生的震动，保持载带剥离的平稳性。
具体实施方式
下面结合具体实施例，对本发明作进一步详细说明。
实施例1：
一种载带用上盖带，包括用于提供支撑力的基材层、位于所述基材层下方的热封层以及连接所述基材层与所述热封层的连接层，所述连接层包括如下质量百分比的组分：75%的乙烯-丙烯酸甲酯、15%聚乙烯、5%的改性乙烯-辛烯共聚物、5% 的改性SEBS。
实施例2：
一种载带用上盖带，包括用于提供支撑力的基材层、位于所述基材层下方的热封层以及连接所述基材层与所述热封层的连接层，所述连接层包括如下质量百分比的组分：50%的主料，所述主料为乙烯-丙烯酸甲酯和乙烯-丙烯酸丁酯的混合物、25%改性聚乙烯、15%的改性乙烯-辛烯共聚物、10%的改性SEBS；其中，聚乙烯为低密度聚乙烯，通过接枝单体进行接枝改性，接枝率为8%，接枝单体包含顺丁二烯酸酐、丙烯酸和丙烯酸甲酯；乙烯-辛烯共聚物采用通过顺丁二烯酸酐接枝进行改性得到改性乙烯-辛烯共聚物，接枝率2%；SEBS采用通过顺丁二烯酸酐接枝改性得到改性SEBS，接枝率10%。
实施例3：
一种载带用上盖带，包括用于提供支撑力的基材层、位于所述基材层下方的热封层以及连接所述基材层与所述热封层的连接层，基材层采用PET，连接层包括如下质量百分比的组分：20%的主料，所述主料为乙烯-丙烯酸丁酯、乙烯-丙烯酸共聚物和乙烯-丙烯酸-马来酸酐三元共聚物的混合物、40%改性聚乙烯、25%的改性乙烯-辛烯共聚物、15%的改性SEBS；其中，低密度聚乙烯、茂金属聚乙烯按重量比为1:0.5-1.5的比例混合，本实施例中，两者的混合比为1：1，通过接枝单体进行接枝改性，接枝率为10%，接枝单体为甲基丙烯酸缩水甘油酯；乙烯-辛烯共聚物采用通过顺丁二烯酸酐接枝进行改性得到改性乙烯-辛烯共聚物，接枝率6%；SEBS采用通过顺丁二烯酸酐接枝改性得到改性SEBS，接枝率15%。
实施例4：
一种载带用上盖带，包括用于提供支撑力的基材层、位于所述基材层下方的热封层以及连接所述基材层与所述热封层的连接层，基材层采用PET，连接层包括如下质量百分比的组分：50%的主料，所述主料为乙烯-丙烯酸乙酯、乙烯-丙烯酸丁酯、乙烯-丙烯酸共聚物和乙烯-丙烯酸-马来酸酐三元共聚物的混合物、20%改性聚乙烯、10%的改性乙烯-辛烯共聚物、20%的改性SEBS；其中，聚乙烯为线性低密度聚乙烯，通过接枝单体进行接枝改性，接枝率为2%，接枝单体包含顺丁二烯酸酐、丙烯酸和甲基丙烯酸缩水甘油酯；乙烯-辛烯共聚物采用通过顺丁二烯酸酐接枝进行改性得到改性乙烯-辛烯共聚物，接枝率8%；SEBS采用通过顺丁二烯酸酐接枝改性得到改性SEBS，接枝率5%。
Claims (4)
1.一种载带用上盖带，包括用于提供支撑力的基材层、位于所述基材层下方的热封层以及连接所述基材层与所述热封层的连接层，其特征在于，所述连接层包括如下质量百分比的组分：
20-75%的主料，所述主料为乙烯-丙烯酸甲酯、乙烯-丙烯酸乙酯、乙烯-丙烯酸丁酯、乙烯-丙烯酸共聚物和乙烯-丙烯酸-马来酸酐三元共聚物中的一种或几种混合物；
15-40%聚乙烯；
5-25%的改性乙烯-辛烯共聚物；
5-20% 的改性SEBS；
所述聚乙烯采用通过接枝单体进行接枝改性的改性聚乙烯；
所述接枝单体包含顺丁二烯酸酐、丙烯酸、丙烯酸甲酯、丙烯酸丁酯和甲基丙烯酸缩水甘油酯中的一种或几种混合物；
接枝改性的所述改性聚乙烯的接枝率为2～10%；
所述改性乙烯-辛烯共聚物采用通过顺丁二烯酸酐接枝改性的改性乙烯-辛烯共聚物；接枝改性的改性乙烯-辛烯共聚物的接枝率2～8%。
2.根据权利要求1所述一种载带用上盖带，其特征在于，所述聚乙烯包含低密度聚乙烯、线性低密度聚乙烯和茂金属聚乙烯中的一种或几种的混合物。
3.根据权利要求1所述一种载带用上盖带，其特征在于，所述改性SEBS采用通过顺丁二烯酸酐接枝改性的改性SEBS。
4.根据权利要求3所述一种载带用上盖带，其特征在于，接枝改性的改性SEBS的接枝率5～15%。
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| CN102348609A (zh) * | 2009-03-13 | 2012-02-08 | 电气化学工业株式会社 | 覆盖膜 |
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