CN106273011A - Shearing device - Google Patents
Shearing device Download PDFInfo
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- CN106273011A CN106273011A CN201610325679.0A CN201610325679A CN106273011A CN 106273011 A CN106273011 A CN 106273011A CN 201610325679 A CN201610325679 A CN 201610325679A CN 106273011 A CN106273011 A CN 106273011A
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- substrate
- disjunction
- picture pick
- amputation knife
- image
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- 238000010008 shearing Methods 0.000 title claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 104
- 238000002266 amputation Methods 0.000 claims abstract description 75
- 238000001514 detection method Methods 0.000 claims abstract description 32
- 230000007423 decrease Effects 0.000 claims abstract description 25
- 230000033228 biological regulation Effects 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 abstract description 53
- 230000007246 mechanism Effects 0.000 description 16
- 238000010586 diagram Methods 0.000 description 10
- 230000003028 elevating effect Effects 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 206010021703 Indifference Diseases 0.000 description 1
- 206010033546 Pallor Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Forests & Forestry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Life Sciences & Earth Sciences (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Chemical & Material Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Image Analysis (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The present invention provides a kind of shearing device, it is possible to detects rapidly and positively and processes the most successful disjunction substrate by cut-out.The present invention is a kind of device cut off along line by substrate, it is configured to, when substrate is positioned in platform in the way of bearing of trend of ruling is consistent with the point of a knife bearing of trend of amputation knife, make amputation knife drop to regulation and decline stop position, thus by substrate-cutting, and picture pick-up device can shoot substrate while amputation knife begin to decline repeatedly, disjunction detection device is when obtaining shooting image every time, whether the Judging index value according to producing based on this acquisition image exceedes defined threshold, determines whether successfully disjunction.
Description
Technical field
The present invention relates to a kind of shearing device for substrate-cutting, particularly relate to the substrate-cutting in a kind of shearing device
Detection.
Background technology
In general, the manufacturing process of panel display board or solar cell panel etc. includes glass substrate, ceramic base
The substrate (mother substrate) that plate, semiconductor substrate etc. comprise fragile material carries out the step of disjunction.Described disjunction is widely used as follows
Method: use the scribing tool such as diamond point or break bar to form line at substrate surface, make slight crack (vertical slight crack) from this line edge
Substrate thickness direction is stretched.In the case of defining line, there is also vertical slight crack through-thickness full extension and by base
The situation of plate disjunction, but there is also the situation that vertical slight crack through-thickness only partly stretches.In the latter case, in shape
Cut-off part reason is carried out after becoming line.Cut-out processes and processes the most as follows: by being connected to substrate with the form along line
Amputation knife under press, make vertical slight crack through-thickness be in progress completely, thus by substrate along line disjunction.
As the shearing device processed for described cut-out, it is known to the shearing device of various form (referring for example to patent
Document 1).
[background technology document]
[patent documentation]
[patent documentation 1] Japanese Patent Laid-Open 2004-131341 publication
Summary of the invention
[inventing problem to be solved]
In the case of such as conventional shearing device as disclosed in patent documentation 1 is used for volume production step, the most right
In manufacturing and define the substrate of line under the same conditions, carry out cut-out process based on identical cut-out condition.Described cut-out
Condition is to determine premised on positively disjunction substrate, but owing to line forms inequality or the amputation knife generation defect of the degree of depth
Deng, even and if likely producing that processed by cut-out also cannot the unfavorable condition of disjunction substrate.
In the past, if not in a substrate being carried out all cut-out process, and by substrate after shearing device takes out of, that
To be difficult to find the generation of described unfavorable condition.And, in the case of creating described unfavorable condition, it is necessary to by this substrate
Again process for cut-out.This kind of reply becomes the main cause making yield reduce.
The present invention completes in view of described problem, its object is to provide a kind of shearing device, it is possible to rapid and true
Detect on the spot and process the most successful disjunction substrate by cut-out.
[solving the technological means of problem]
In order to solve described problem, the invention of technical scheme 1 is characterised by: it is will be in an interarea side formation line
The substrate become carries out the device cut off along described line, including: platform, described substrate is loaded with flat-hand position；Amputation knife, phase
Described platform is movably arranged on above described platform and forms；Picture pick-up device, it is possible to being positioned in described platform
Described substrate shoots；And disjunction detection device, shooting results based on described picture pick-up device divides described substrate
Break and detect；And described device is configured to, by described substrate with the point of a knife of described line bearing of trend Yu described amputation knife
Under the state that the consistent mode of bearing of trend is positioned in described platform, make described amputation knife drop to regulation and decline stop position,
Thus by described substrate along described line disjunction；And described picture pick-up device can while described amputation knife begin to decline with
Specific time interval shoots described substrate repeatedly；Described disjunction detection device obtains shooting image at each described picture pick-up device
Time, whether the Judging index value according to producing based on this acquisition image exceedes defined threshold, judges whether described substrate becomes
Merit disjunction.
The invention of technical scheme 2 is according to the shearing device described in technical scheme 1, it is characterised in that: described disjunction detects
Device be the shooting image to be originally taken by described picture pick-up device as benchmark image, obtain with up-to-date based on described benchmark image
The difference image of the shooting image taken, produces described Judging index value.
The invention of technical scheme 3 is according to the shearing device described in technical scheme 2, it is characterised in that: described Judging index
Value is the variance yields of the pixel value of all pixels of described difference image.
The invention of technical scheme 4 is according to the shearing device according to any one of technical scheme 1 to 3, it is characterised in that:
In the case of being judged to that described substrate is broken based on the described Judging index value using up-to-date described shooting image to produce, stop
Shooting after only utilizing picture pick-up device to carry out.
The invention of technical scheme 5 is according to the shearing device according to any one of technical scheme 1 to 4, it is characterised in that:
Although described amputation knife drop to regulation declines stop position, but described disjunction detection device is not judged to described Judging index
In the case of value exceedes described threshold value, also it is judged to that described substrate is the most broken.
The invention of technical scheme 6 is according to the shearing device according to any one of technical scheme 1 to 5, it is characterised in that: institute
Stating picture pick-up device to be mutually isolated and two picture pick-up devices setting, described disjunction detection device is to divide said two picture pick-up device
The shooting image not shot individually produces described Judging index value and compares with described threshold value, at each described Judging index
In the case of value exceedes described threshold value, it is determined that broken for described substrate.
The invention of technical scheme 7 is according to the shearing device according to any one of technical scheme 1 to 6, it is characterised in that: institute
Stating platform transparency, described picture pick-up device is arranged on below described platform and forms, described picture pick-up device across described platform to described
Substrate shoots.
[effect of invention]
Invention according to technical scheme 1 to 7, it is possible to rapidly and positively determine that substrate whether success disjunction.
Accompanying drawing explanation
Fig. 1 is the figure of the major part of the shearing device 100 representing embodiments of the present invention.
Fig. 2 is the figure of the major part of the shearing device 100 representing embodiments of the present invention.
Fig. 3 is the figure representing disjunction detection procedure.
Fig. 4 is to detect the time series chart in the case of the disjunction of substrate W during disjunction detection processes.
Fig. 5 (a), (b) are periodically to represent that cut-out processes the schematic diagram carrying out midway.
Fig. 6 is periodically to represent that cut-out processes the schematic diagram carrying out midway.
Fig. 7 (a), (b) are periodically to represent that cut-out processes the schematic diagram carrying out midway.
Fig. 8 (a), (b) are the figures schematically showing difference image.
Fig. 9 (a), (b) are to schematically show the situation near the amputation knife after disjunction completes 2 and substrate W and now
The figure of shooting image IM3.
Detailed description of the invention
＜ shearing device ＞
Fig. 1 and Fig. 2 is the figure of the major part of the shearing device 100 representing embodiments of the present invention.Shearing device 100
Possess: platform 1, be used for loading substrate W with flat-hand position；Amputation knife 2, by being pressed against substrate W and by substrate W disjunction；With
And chuck 3, it is used for fixing the substrate being positioned in platform 1.Shearing device 100 is following device: by using amputation knife 2 in advance
The substrate W being initially formed line SL implements cut-out process, makes slight crack (vertical slight crack) from this line SL towards the thickness direction of substrate W
Stretch, thus by substrate W along line SL disjunction.
Substrate W comprises the fragile materials such as glass substrate, ceramic substrate, semiconductor substrate.Thickness and size there is no limit especially
System, for typical case, it is assumed that have the thickness of about 0.4mm～1.0mm or the size of about 50mm～300mm.
Additionally, in Fig. 1 and figure afterwards, represent the form only forming 1 line SL at substrate W, but this be for letter
Change diagram and convenient explanation, be commonly angled relative to a substrate W and form a plurality of line SL.
It addition, in Fig. 1 and Fig. 2, when representing the configuration relation of platform 1, amputation knife 2 and substrate W, mark the following right hand
It is xyz coordinate, i.e. the length direction of amputation knife 2 is set to x-axis direction, direction vertical with x-axis direction in horizontal plane is set to
Y-axis direction, is set to z-axis direction by vertical.Thus, Fig. 1 becomes the yz side-looking around about the platform 1 of shearing device 100
Figure, Fig. 2 becomes the figure of the zx side view comprised around also with regard to platform 1.
Platform 1 comprises the transparent components such as such as quartz glass, loads substrate W at its upper surface 1a being set to level.Substrate W
So that interarea (the line formation face) Wa forming the side of line SL is connected to the form of upper surface 1a, and so that line SL
The bearing of trend form consistent with the bearing of trend of the point of a knife 2a of amputation knife 2 be positioned in platform 1, and be fixed on by chuck 3
Platform 1.
Amputation knife 2 comprise such as supersteel alloy or partially stabilized zirconium oxide etc., as it is shown in figure 1, in its vertical following side
Divide and possess the point of a knife 2a that the cross section vertical with the length direction of these amputation knife 2 is roughly triangular shape.Point of a knife 2a is by substantially in 15 °
～two knife faces of about 60 ° angles are formed.
And, shearing device 100 possesses two cameras 4 (4a, 4b) below than platform 1 by vertical.Camera 4 is for example,
CCD (Charge Coupled Device, charge coupled cell) camera.Two cameras 4 (4a, 4b) are comprising amputation knife 2 (more
Specifically for point of a knife 2a) the inherent x-axis direction of vertical guide (zx face) be mutually separated by configuration and form.Each camera 4 is towards on vertical
Side's configuration, it is possible to across transparent platform 1 side on which, be more particularly to be positioned in the substrate W of platform 1 to shoot.
Preferably two cameras 4 (4a, 4b) configure as follows, i.e. compared to distance each other, prolong with along amputation knife 2
The distance of the proximal end of the line SL stretched is less.But, the coverage of each camera 4 size relative to substrate W is the least,
In this coverage, only include the part comprising the substrate W of a part of line SL.
It addition, arrange illuminating device 5 (5a, 5b) and form being appended hereto the form of each camera 4.Illuminating device 5 is with towards lead
The mode of top irradiation illumination light of hanging down configures and forms.As illuminating device 5, preferably one example is to use with the shape around each camera 4
The ring-shaped lighting that state is arranged but it also may make illuminating device in other ways.
Camera 4 (and illuminating device 5) is to carry out using when disjunction detection processes in following form.Additionally, camera 4 also may be used
Think the form used when the location of off-position.
Hereinafter, according to the configuration illustrated in Fig. 2, for convenience, sometimes two cameras 4 (4a, 4b) are referred to as
The camera 4 of left and right.
And then, although omit diagram in FIG, but as in figure 2 it is shown, shearing device 100 possesses control portion 10, platform moves
Mechanism 11, amputation knife elevating mechanism 12, input operation part 13 and display part 14.
Control portion 10 is responsible for action control or the position of following disjunction detection process, the example in each portion of shearing device 100
As realized by computer etc..Control portion 10 possesses cut-out execution process portion 21 and disjunction detection process portion 22 as its function
Property element.Cut off the position that execution process portion 21 is responsible for the action control in each portion that cut-out processes.Disjunction detection processes
Portion 22 is responsible for the position that disjunction detection processes, and described disjunction detection is processed to be used to detect processed by cut-out and the most successfully divides
Disconnected substrate W.
Platform moving mechanism 11 is to make platform 1 mechanism of movement (in xy face) in horizontal plane.Specifically, it is possible to carry out
Mobile in rotary moving with using vertical as rotary shaft of translation on y-axis direction.Platform moving mechanism 11 is held according to cut-out
The control instruction in row process portion 21 carries out action, thus carries out cutting off the movement of object's position and line SL relative to amputation knife 2
Position alignment.
Amputation knife elevating mechanism 12 is the mechanism making amputation knife 2 lift in vertical when cut-out processes.By making
The action of described amputation knife elevating mechanism 12, amputation knife 2 are free to advance or retreat relative to the substrate W being positioned in platform 1.Roughly, press
According to cutting off the control instruction in execution process portion 21, amputation knife elevating mechanism 12 makes that as shown in arrow AR1 in Fig. 1 of amputation knife 2
Sample decline, and be connected to rule formation face Wa the i.e. substrate W of opposing face non-line formation face Wb, line SL upper position
Putting, thus, substrate W is broken along line SL.
In more detail, when cut-out processes, amputation knife 2 (strictly speaking for its point of a knife 2a) are the initial position z from regulation
=z0 drops to arrive the height and position being set in height and position z=z1 z=z2 further below than non-line formation face Wb
Till stop position (decline stop position).Additionally, distance | z2-z0 | of z=z0 to z=z2 to be referred to as the press-in of amputation knife 2
Amount.
Input operation part 13 is for such as lower portion: comprises such as keyboard or mouse, touch panel etc., and is used for for shearing device
The user of 100 inputs various execution instruction or treatment conditions etc. to shearing device 100.
Display part 14 is used to show the display processing menu or operating state etc. of shearing device 100.
＜ disjunction detection processes ＞
Say it follows that the disjunction detection carried out in having the shearing device 100 of composition as above is processed
Bright.The disjunction detection of present embodiment process approximately as: in the execution that cut-out processes, with the continuous land productivity of specific time interval
The Image Acquisition (take in, capture) of substrate W is carried out with these two cameras of the camera 4 of left and right, and based on acquired picture material,
Determine whether to have carried out the disjunction of substrate W.
Fig. 3 is the figure representing disjunction detection procedure.It addition, Fig. 4 is to detect dividing of substrate W in disjunction detection process
Time series chart in the case of Duan.
First, in order to carry out cut-out process, in advance substrate W mounting is fixed on platform 1, carries out the state that positions
Under, indicating according to from the action cutting off execution process portion 21, amputation knife elevating mechanism 12 makes amputation knife 2 from its initial position z
=z0 declines (step S1) towards z-axis negative direction.
It addition, start synchronously with the decline of described amputation knife 2, the camera 4 of left and right is given by disjunction detection process portion 22
Perform instruction, to carry out the Image Acquisition of prespecified time interval.Respond the camera 4 of the described left and right performing instruction respectively
Irradiate illumination light by illuminating device 5 (5a, 5b), and first obtain the 1st shooting image (step S2), afterwards, be judged to
Period before substrate W is broken, using i=2 (step S3) as initial value, obtain i-th (i=at set time intervals
2,3,4) shooting image (step S4).
Then, whenever the camera 4 of left and right obtain i-th (i=2,3,4) shooting image time, disjunction detection process
Portion 22, just with this shooting image as object, carries out whether substrate W produces the determination processing (step S5) of disjunction.
Determination processing is to carry out in the following way: every the shooting image obtained respectively for the camera 4 of left and right, individual
Not using the 1st shooting image as benchmark image, it is determined that have indifference point with i-th shooting image of up-to-date acquisition.Specifically
For, produce the 1st shooting image and the difference image of i-th shooting image, for the difference image of the camera 4 from left and right
Both, it is determined that pixel value based on this difference image and whether the Judging index value that produces exceedes stipulated standard (threshold value) (step
S6)。
The setting means of Judging index value it is contemplated that various countermeasure, in the present embodiment, owning difference image
Variance (the σ of the pixel value of pixel2) as Judging index value, this variance yields is set threshold value.Threshold value is redefined for: assuming that
If utilizing amputation knife 2 to produce along the difference image in the case of the disjunction of line SL at substrate W, then generally should be able to
The variance yields exceeded.
Additionally, the reason that the shooting results of two cameras 4 based on left and right isolation carries out judging respectively is, if it is determined that
For producing disjunction on the position captured by these cameras 4, then think and the most positively produce disjunction between two positions,
Even if not shooting the entirety (or entirety of line SL) of substrate W, it is also possible to detect the disjunction of substrate W.
(for YES (YES) in step S6) in the case of the Judging index value being judged to both left and right exceeds threshold value, it is determined that
Disjunction success (step S7) for substrate W.The premise of described judgement is: in the period not producing disjunction, owing to substrate W does not occurs
Change, therefore i-th shooting image with the 1st shooting image should be identical, generation disjunction after, due to substrate W state not
With, therefore shooting image becomes different from the 1st shooting image.
In the diagram, it is judged to the successful situation of disjunction (detecting the situation of disjunction) when illustrating i=N.Additionally, carry out
The time point of described judgement, stops the camera 4 about utilizing and carries out Image Acquisition.It is to say, in bat based on up-to-date shooting
Taking the photograph spectral discrimination is time point broken for substrate W, stops the shooting after the camera 4 about utilizing is carried out.But, amputation knife
Even if 2 continue to drop to arrive prespecified decline stop position (z=z2) after substrate W is broken, it is back to afterwards
Initial position.
In the case of the Judging index value being not judged to both left and right exceedes stipulated standard (threshold value) (step S6 is
NO (no)), and in the case of amputation knife 2 arrival decline stop position (step S8 being YES), although for the action of disjunction
(cut-out action) completes, but still is judged to the most broken (disjunction failure) (step S9).In the case of described, stop so that declining
After the lower mode in position (z=z2) sets intrusion again, again carry out cut-out process.Additionally, be not judged to left and right
In the case of both Judging index values exceed stipulated standard (threshold value), the Judging index value that there is both left and right is all not up to base
Accurate situation and only one of which reach the situation of benchmark.The latter is equivalent to the substrate W situation that only local is broken.It addition, cut
The position of breaking 2 such as by following form specific go out: disjunction detection process portion 22 obtain be located at amputation knife elevating mechanism 12 not
Diagram encoder pulse value or from the height and position detection position of the not shown amputation knife 2 being arranged on shearing device 100
Put the signal etc. that sensor provides.
In the case of the Judging index value being not judged to both left and right exceedes stipulated standard (threshold value) (step S6 is
NO), and amputation knife 2 do not arrive (for NO in step S8) in the case of declining stop position, and generally, cut-out action not yet completes.
So, after amputation knife 2 begin to decline, in the case of without process upper limit time set in advance (step S10 is
NO), being set to i=i+1 (step S11), the camera 4 about utilization carries out Image Acquisition next time.
Here, so-called process upper limit time, as long as referring to normal (no matter whether disjunction becomes for the down maneuver of amputation knife 2
Merit), just infer that should arrive decline to the period amputation knife 2 through this time after amputation knife 2 begin to decline stops position
The time put, and in view of during cut-out action intrusion set in advance and amputation knife elevating mechanism 12 make amputation knife 2 decline
Speed and time of setting.
So, in the case of processing upper limit time (step S10 being YES), it is assumed that the decline situation of amputation knife 2
Producing some abnormal, therefore cut off execution process portion 21 and stop cut-out process, substrate detection process portion 22 also stops substrate detection
Process.Then, operator amputation knife 2 or the state of amputation knife elevating mechanism 12 are suitably confirmed.Additionally, from opening that cut-out processes
Time beginning is risen with or without the time through being the not shown meter being located at shearing device 100 by substrate detection process portion 22 suitably reference
Time device value judge.
It follows that for described determination processing, the change carrying out situation processed with cut-out is the most more specifically said
Bright.Fig. 5 to Fig. 7 is the schematic diagram of the carrying out midway periodically representing that cut-out processes, also schematic earth's surface in Fig. 5 and Fig. 7
Show the shooting image acquired in camera 4.It addition, Fig. 8 is the figure schematically showing difference image.
Fig. 5 (a) represents that amputation knife 2 do not arrive the state of substrate W after beginning to decline.As long as being in this state, then such as Fig. 5
B, shown in (), the form of the image that shooting image IM1 exists the situation of line SL with the center being only apparent in substrate W obtains.
Additionally, the Shape Representation point of a knife 2a the most diagrammatically intersected with two knife faces, but as shown in Fig. 5 (a), more
Specifically, point of a knife 2a becomes fore-end and has the curved surface of certain radius of curvature.
It addition, the difference image of the 1st shooting image and i-th shooting image can also be with two images generally object
And the form produced, for deciding that the viewpoint of high speed of process, in the present embodiment, only by coverage (Fig. 5 (b)
In for a part of scope of shooting image IM1) a part of region, more particularly for shooting image produces the line of disjunction
The formation areas adjacent of SL is set as producing process subject area ROI during difference image, only to described process subject area ROI
Produce difference image.
As long as amputation knife 2 do not arrive substrate W, the shooting image being substantially the same with the shooting image IM1 shown in Fig. 5 (b)
Just repeatedly obtained as i-th shooting image.It is to say, the 1st shooting image and the picture material of i-th shooting image
Almost without difference.Therefore, amputation knife 2 do not arrive the difference image of period of substrate W as the pixel value substantially 0 of all pixels
Image and produce.Fig. 8 (a) schematically shows the difference image D1 of described situation.Additionally, the difference image shown in Fig. 8 (a)
D1 regards the image as whole pallor color as according to the situation of diagram, but the difference image D1 of reality is only using as difference value
It is that the form of the image that the pixel of the brightness that the brightness in the case of 0 sets extends by entire surface obtains.This difference image D1's
Variance yields is not judged as exceeding threshold value.So, as shooting image IM1, shoot image, just in step S6 as long as obtaining
In continue to be judged as NO.Additionally, so-called step S8 is judged as that YES arrives the situation of step S9, refer to arrive at amputation knife 2
Decline the period before stop position, the situation the most repeatedly obtaining with shooting the shooting image that image IM1 is substantially the same.
The amputation knife 2 continuing to decline are connected to substrate W the most as shown in Figure 6.If after being connected to substrate W
Continue to make amputation knife 2 decline, then substrate W can be exerted a force by amputation knife 2, in substrate W, as shown in arrow AR2 in Fig. 6, hang down
Straight slight crack CR stretches from line SL.And, along with described vertical slight crack CR stretches, substrate W is pulled away to the left and right, final as Fig. 7
A broken as shown in () is two monolithics W1, W2.Now, two monolithics W1, W2 are with the shape extended by amputation knife 2
Formula is mutually isolated to the left and right, thus, forms clearance G between.So, as shown in Fig. 7 (b), shooting image now
IM2 obtains with the form showing the picture of the state that there is clearance G between two monolithics W1, W2.
Fig. 8 (b) represent obtain the shooting image IM2 shown in Fig. 7 (b) as in the case of i-th shooting image with Fig. 5
(about processing subject area ROI) difference image D2 of shooting image IM1 shown in (b).At the difference diagram shown in Fig. 8 (b)
As, in D2, being formed and be apparent in the region RE1 being equivalent to line SL of shooting image IM1 and formed with the folder form every this region
The region RE2 being equivalent to clearance G that manifests in shooting image IM2.Additionally, the difference image D2 shown in Fig. 8 (b) is always
Schematically image, in actual difference image D2, region RE1 and region RE2 the most only with comprise the other side
The region that neighboring area is different brightness.
In the case of obtaining difference image D2, the variance yields as the Judging index value thus calculated exceedes threshold value.As
Fruit obtains in the camera 4 of left and right and shoots image as shooting image IM2, then the Judging index value of left and right all exceedes threshold
Value, it is judged that for disjunction success.
In the present embodiment, after amputation knife 2 begin to decline, the camera 4 about utilization shoots cut-out at predetermined intervals
Cutter 2, and be directly based upon shooting image determine whether produce disjunction, therefore, when produce disjunction time, it is possible in nearly real time, more
Described disjunction situation is grasped specifically when the state that produced by disjunction two monolithics W1, W2 are extended by amputation knife 2.Separately
Outward, although arriving for amputation knife 2 and declining stop position but the not successful situation of disjunction, it is also possible to carry out cut-out action just
After soon grasp described situation, therefore, it is possible to be promptly changed being again switched off after intrusion.
Even if additionally, it also holds that carrying out the most continuously after amputation knife 2 just begin to decline unlike described order
Shooting, as long as shooting amputation knife 2 arrive the state of the substrate W after declining stop position, also just is able to determine whether successfully disjunction.
But, after the inventor of the present invention makes great efforts to study, it is thus understood that described form is difficult to determine whether successfully disjunction well.
Fig. 9 is to be schematically illustrated as illustrating this point and amputation knife 2 after the disjunction that represents completes are (actual with substrate W
Upper for monolithic W1 and W2) the situation of vicinity and the figure of now shooting image IM3 acquired in camera 4.
The amputation knife 2 arriving decline stop position after by substrate W disjunction are risen by amputation knife elevating mechanism 12.By
This, if amputation knife 2 are isolated with monolithic W1 and W2, then monolithic W1 and W2 by amputation knife about 2 extension can be as Fig. 9 before this
As shown in (a) close to each other, the clearance G produced between the two is eliminated.And, line is namely defined in disjunction face
SL and the position of vertical slight crack CR, monolithic W1 and W2 contacts.Fig. 9 (b) is obtained by camera 4 in the case of schematically showing this
Shooting image IM3.As shown in Fig. 9 (b), shooting image IM3 is with at the position overlapping vertical slight crack being originally defined line SL
The form of the picture of CR obtains, but as image for, similar with the shooting image IM1 shown in Fig. 5 (b).So, even if with described
Order similarly produces difference image, and carries out judgement based on threshold value, it is also difficult to positively determine that the most successful disjunction.
In contrast, in the context of this application, by specifying that the shooting time of camera 4 is spaced aptly, kth is opened
The disjunction that shooting image cannot capture is (in more detail for amputation knife 2 by two monolithics produced by the disjunction by substrate W
The state that W1, W2 extend to the left and right), it is possible to caught by kth+1 the shooting image next obtained, therefore, pass through
Determination processing based on described kth+1 shooting image, it is possible to positively determine that whether substrate W produces disjunction.
Additionally, about camera 4 shooting time be spaced, the such as decrease speed at amputation knife 2 be 50mm/sec～
In the case of 150mm/sec, intrusion are 0.1mm～0.2mm, it is preferably set to about 10msec～50msec.
Above, as illustrated, according to the shearing device of present embodiment, perform to make vertical slight crack stretch along line
Cut-out when processing, process synchronously with described cut-out, using specific time interval shooting as the substrate of disjunction object, and based on
Each shooting results judges whether substrate produces disjunction, thereby, it is possible to rapidly and positively determine that substrate whether success disjunction.
＜ change case ＞
Described embodiment is utilize mutually isolated two camera to shoot but it also may replace, and be
One camera (picture pick-up device) shooting defines the scope of line SL wholly or largely, and sentences based on its shooting results
The fixed form processed.Or, it is also possible to the form of the camera for using more than three.
It addition, in said embodiment, based on the 1st shooting image and the difference image of i-th shooting image, carry out
Whether carried out the judgement of disjunction but it also may replace and be will shooting image directly as judge object form.
[explanation of symbol]
1 platform
2 amputation knife
2a point of a knife
3 chucks
4 (4a, 4b) camera
5 (5a, 5b) illuminating device
10 control portions
11 platform moving mechanisms
12 amputation knife elevating mechanisms
13 input operation part
14 display parts
21 cut off execution process portion
22 disjunction detection process portions
100 shearing devices
The vertical slight crack of CR
D1, D2 difference image
G gap
IM1～IM3 shoots image
ROI processes subject area
SL rules
W substrate
Wa rules formation face
Wb non-line formation face
Claims (7)
1. a shearing device, it is characterised in that:
It is the device carrying out the substrate forming line in an interarea side along described line cutting off, including:
Platform, loads described substrate with flat-hand position；
Amputation knife, are movably arranged on above described platform relative to described platform and form；
Picture pick-up device, it is possible to the described substrate being positioned in described platform is shot；And
Disjunction detection device, the disjunction of described substrate is detected by shooting results based on described picture pick-up device；And
Described shearing device is configured to, and is being extended with the point of a knife of described amputation knife with the bearing of trend of described line by described substrate
Under the state that the consistent mode in direction is positioned in described platform, make described amputation knife drop to regulation and decline stop position, thus,
Described substrate is carried out disjunction along described line；And
Described picture pick-up device can repeatedly shoot described substrate while described amputation knife begin to decline with specific time interval；
Described disjunction detection device, when each described picture pick-up device obtains shooting image, produces according to based on this acquisition image
Judging index value whether exceed defined threshold, judge the whether success disjunction of described substrate.
Shearing device the most according to claim 1, it is characterised in that:
Described disjunction detection device be the shooting image to be originally taken by described picture pick-up device as benchmark image, based on described
The difference image of the shooting image of benchmark image and up-to-date acquisition and produce described Judging index value.
Shearing device the most according to claim 2, it is characterised in that:
Described Judging index value is the variance yields of the pixel value of all pixels of described difference image.
Shearing device the most according to any one of claim 1 to 3, it is characterised in that:
It is being judged to the feelings that described substrate is broken based on the described Judging index value using up-to-date described shooting image to produce
Under condition, stop utilizing the shooting after picture pick-up device.
Shearing device the most according to any one of claim 1 to 3, it is characterised in that:
Although described amputation knife drop to regulation decline stop position, but described disjunction detection device be not judged to described in sentence
Determine in the case of desired value exceedes described threshold value, to be also judged to that described substrate is the most broken.
Shearing device the most according to any one of claim 1 to 3, it is characterised in that:
Two picture pick-up devices that described picture pick-up device is mutually isolated and sets,
Described disjunction detection device is that the shooting image shot said two picture pick-up device respectively individually produces described judgement
Desired value also compares with described threshold value, is judged to described base in the case of each described Judging index value exceedes described threshold value
Plate is broken.
Shearing device the most according to any one of claim 1 to 3, it is characterised in that:
Described platform transparency,
Described picture pick-up device is arranged on below described platform and forms,
Described substrate is shot by described picture pick-up device across described platform.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015129403A JP6520466B2 (en) | 2015-06-29 | 2015-06-29 | Break device |
| JP2015-129403 | 2015-06-29 |
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| CN106273011A true CN106273011A (en) | 2017-01-04 |
| CN106273011B CN106273011B (en) | 2020-09-08 |
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| CN201610325679.0A Active CN106273011B (en) | 2015-06-29 | 2016-05-17 | Cutting device |
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| Country | Link |
|---|---|
| JP (1) | JP6520466B2 (en) |
| KR (1) | KR102493063B1 (en) |
| CN (1) | CN106273011B (en) |
| TW (1) | TWI703101B (en) |
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| CN108793713A (en) * | 2018-06-27 | 2018-11-13 | 武汉华星光电技术有限公司 | It is a kind of for the cutting machine of glass-cutting substrate and the cutting method of glass substrate |
| CN109231806A (en) * | 2018-10-18 | 2019-01-18 | 常州大学怀德学院 | A kind of glass stopped loss in production cuts out the turnaround system and method for wide fault |
| CN112309971A (en) * | 2019-07-29 | 2021-02-02 | 三星钻石工业股份有限公司 | Cutting method of brittle material substrate |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102579235B1 (en) * | 2017-10-27 | 2023-09-14 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Method for segmenting substrate having metal film |
| TWI797352B (en) | 2018-10-30 | 2023-04-01 | 日商三星鑽石工業股份有限公司 | rupture device |
| JPWO2022045077A1 (en) * | 2020-08-28 | 2022-03-03 |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201702197A (en) | 2017-01-16 |
| JP2017013255A (en) | 2017-01-19 |
| JP6520466B2 (en) | 2019-05-29 |
| TWI703101B (en) | 2020-09-01 |
| KR20170002277A (en) | 2017-01-06 |
| KR102493063B1 (en) | 2023-01-27 |
| CN106273011B (en) | 2020-09-08 |
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