CN106231810A - A kind of novel busbar and preparation method thereof - Google Patents
A kind of novel busbar and preparation method thereof Download PDFInfo
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- CN106231810A CN106231810A CN201610633548.9A CN201610633548A CN106231810A CN 106231810 A CN106231810 A CN 106231810A CN 201610633548 A CN201610633548 A CN 201610633548A CN 106231810 A CN106231810 A CN 106231810A
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- busbar
- pcb
- novel
- insulant
- copper bar
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- 238000002360 preparation method Methods 0.000 title description 6
- 239000010410 layer Substances 0.000 claims abstract description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 55
- 229910052802 copper Inorganic materials 0.000 claims abstract description 55
- 239000010949 copper Substances 0.000 claims abstract description 55
- 239000011229 interlayer Substances 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 41
- 238000009413 insulation Methods 0.000 claims abstract description 38
- 238000003825 pressing Methods 0.000 claims abstract description 34
- 230000004888 barrier function Effects 0.000 claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 38
- 239000002184 metal Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 14
- 238000003466 welding Methods 0.000 claims description 14
- 229920000784 Nomex Polymers 0.000 claims description 13
- 239000004763 nomex Substances 0.000 claims description 13
- 238000012545 processing Methods 0.000 claims description 13
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000010276 construction Methods 0.000 claims description 7
- 239000003063 flame retardant Substances 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- 239000004677 Nylon Substances 0.000 claims description 5
- 229920001778 nylon Polymers 0.000 claims description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 4
- 235000015110 jellies Nutrition 0.000 claims description 4
- 239000008274 jelly Substances 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 4
- QHZSDTDMQZPUKC-UHFFFAOYSA-N 3,5-dichlorobiphenyl Chemical compound ClC1=CC(Cl)=CC(C=2C=CC=CC=2)=C1 QHZSDTDMQZPUKC-UHFFFAOYSA-N 0.000 description 21
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 8
- 238000005476 soldering Methods 0.000 description 7
- 238000007731 hot pressing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 238000005336 cracking Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004760 aramid Substances 0.000 description 3
- 229920003235 aromatic polyamide Polymers 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000012774 insulation material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
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- -1 figure Chemical compound 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
The invention discloses a kind of novel busbar, the layers below being integrated including pressing in order: insulating barrier, busbar busbar, insulant, and printed board PCB；Wherein, described insulating barrier, busbar, between the two-layer of the arbitrary neighborhood in insulant, and PCB, there is bonding sheet；Described busbar is inlayed by insulation board and copper bar and forms；Described busbar is electrically connected by interlayer conduction structure with described PCB.The embodiment of the present invention also provides for the manufacture method of corresponding a kind of novel busbar.A kind of novel busbar disclosed in technical solution of the present invention, integrated pressing and forming structure, can solve PCB, busbar are installed together caused number of drawbacks by support fixed form by prior art.
Description
Technical field
The present invention relates to busbar manufacture technology field, be specifically related to a kind of novel busbar and preparation method thereof.
Background technology
Busbar (English name busbar), also known as stack bus bar, laminated bus bar, is that a kind of single or multiple lift structure connects row,
It can be the highway of distribution system.
Current busbar, is fitted without the function of PCB (Printed Circuit Board, printed board), in system
PCB needs to be secured on busbar by a support.In prior art, it is common that after each self-forming of Busbar and PCB, with
PCB, busbar are installed together by the mode that support is fixed.
Practice finds, this kind of mode has the drawback that
1, the circuit that can not realize between PCB low voltage control layer with busbar high-voltage great-current layer is connected, PCB and busbar
Can only be connected respectively in system each via conducting wire；
2, the heavy current circuit of busbar layer, and the signal line of PCB layer, interlaced easily produce electromagnetic interference；
3, take up room relatively big, do not meet the development trend of product miniaturization；
4, due to reasons in structure, it is impossible to be processed by the existing processing technique of PCB.
Summary of the invention
The embodiment of the present invention provides a kind of novel busbar and preparation method thereof, to solve to be fixed by support in prior art
PCB, busbar are installed together caused drawbacks described above by mode.
First aspect present invention provides a kind of novel busbar,
Described novel busbar includes the layers below that pressing in order is integrated: insulating barrier, busbar busbar, insulate material
Material, and printed board PCB；
Wherein, described insulating barrier, busbar, between the two-layer of the arbitrary neighborhood in insulant, and PCB, there is bonding
Sheet；
Described busbar is inlayed by insulation board and copper bar and forms；
Described busbar is electrically connected by interlayer conduction structure with described PCB.
Second aspect present invention provides the manufacture method of a kind of novel busbar, including:
Making busbar busbar, described busbar are inlayed by insulation board and copper bar and form；
Utilize bonding sheet as interlaminar bonding material, printed board PCB stacks gradually layers below: insulant, institute
State busbar and insulating barrier；
The stepped construction pressing obtained is integrated, obtains novel busbar；
Wherein, before or after the step of described pressing, make interlayer conducting structure so as to get described novel busbar
In described busbar electrically connected by interlayer conduction structure with described PCB.
Therefore, in some feasible embodiments of the present invention, for PCB and busbar, do not use the fixing side of support
Formula, but combine insulating barrier, insulant, bonding sheet etc., utilize process for pressing, the novel busbar that pressing is integrated.This is one years old
The novel busbar of body has the advantage that
1, its busbar layer can be electrically connected by interlayer conduction structure with PCB layer, it is achieved that busbar layer heavy current circuit
Interlayer circuit turn-on with PCB layer weak electric signal circuit；
2, its busbar layer and PCB layer can be reduced electromagnetic interference by insulant is spaced apart；
3, each layer has preferable bond strength, and can directly weld, and has certain tensile strength, and keeps good
Product quality, between each layer will not or the defect such as the most cracking, bubble；
4, product pressing forms, and does not use support, reduces product thickness, takes up room less；
5, the PCB technology processing of routine can be used.
To sum up, the novel busbar that technical solution of the present invention provides, support PCBA welding procedure, it is achieved that PCB and busbar
Integrated molding so that heavy current circuit and signal line are integrated on one block of plate becomes possibility, and makes busbar big
Current sheet is possibly realized with the interlayer conduction of PCB vulnerabilities scan layer, and this novel busbar structure tightly promotees, it is little to take up room, it is achieved
Miniaturization, and relative to support fixed form, there is higher reliability.
Accompanying drawing explanation
In order to be illustrated more clearly that embodiment of the present invention technical scheme, required use in embodiment being described below
Accompanying drawing is briefly described, it should be apparent that, the accompanying drawing in describing below is only some embodiments of the present invention, for ability
From the point of view of the those of ordinary skill of territory, on the premise of not paying creative work, it is also possible to obtain the attached of other according to these accompanying drawings
Figure.
Fig. 1 is the structural representation of a kind of novel busbar that some embodiments of the invention provide；
Fig. 2 is the schematic diagram of the multiple copper bars processed in some embodiments of the invention；
Fig. 3 is the top view of busbar in some embodiments of the invention；
Fig. 4 is the schematic flow sheet of the manufacture method of a kind of novel busbar that some embodiments of the invention provide；
Fig. 5 is the schematic diagram of the part-structure riveting nut of a kind of novel busbar in some embodiments of the invention；
Fig. 6 is the schematic diagram welding device in some embodiments of the invention on a kind of novel busbar；
Fig. 7 is the structural representation of conducting resinl hot pressing conduction mode in some embodiments of the invention；
Fig. 8 is the structural representation of metal column welding conduction mode in some embodiments of the invention；
Fig. 9 is the structural representation of via conduction mode in some embodiments of the invention.
Detailed description of the invention
The embodiment of the present invention provides a kind of novel busbar and preparation method thereof, is used for solving to pass through support in prior art solid
Determine mode and PCB, busbar are installed together caused drawbacks described above.
In order to make those skilled in the art be more fully understood that the present invention program, below in conjunction with in the embodiment of the present invention
Accompanying drawing, is clearly and completely described the technical scheme in the embodiment of the present invention, it is clear that described embodiment is only
The embodiment of a present invention part rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment that member is obtained under not making creative work premise, all should belong to the model of present invention protection
Enclose.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Refer to Fig. 1, the embodiment of the present invention provides a kind of novel busbar 10.
Described novel busbar 10 includes the layers below that pressing in order is integrated: insulating barrier 11, busbar busbar 12,
Insulant 13, and printed board PCB 14；
Wherein, described insulating barrier 11, busbar 12, the two-layer of the arbitrary neighborhood in insulant 13, and PCB 14 it
Between there is bonding sheet 15；
Described busbar 12 is inlayed formed by insulation board 121 and copper bar 122；
Described busbar 12 is electrically connected by interlayer conduction structure with described PCB 14.
Wherein, described bonding sheet 15 comprises the steps that the first bonding sheet 151 between insulating barrier 11 and busbar 12, is situated between
The second bonding sheet 152 between busbar 12 and insulant 13, the 3rd between insulant 13 and PCB 14 glues
Sheeting 153.
Wherein, bonding sheet 15, mainly as interlayer cling-materials, plays heat pressure adhesive effect.
Wherein, insulating barrier 11 acts primarily as surface insulation, the effect such as fire-retardant, it is possible to be referred to as surface insulation paper.
Wherein, busbar 12, i.e. busbar or referred to as stack bus bar, it is used for carrying high pressure, big electric current.This stack bus bar, can
Super thick copper bar 122 is used to inlay with insulation board 121, then by the processes profile of milling.Described copper bar 122 can be specifically
Copper billet or copper bar etc..Generally, before pressing, copper bar 122 surface can be carried out electroplating processes, to improve its electric property.
Busbar 12 is typically provided with electric current input and lead-out terminal.
Wherein, PCB 14 is mainly used in the power current of signal transmission and stack bus bar and controls, and is low voltage control layer, carrying
Low-voltage control signal.PCB 14 can be monolayer, bilayer or multi-layer sheet, not limits here about its concrete structure.Need to refer to
Go out, the lower surface in the one side back to busbar 12 of PCB 14, i.e. figure, for components and parts solder side 141.
Wherein, insulant 13, its Main Function has two aspects, one be as busbar 12 and PCB 14 between exhausted
Intermarginal interlayer, prevents from producing between the vulnerabilities scan circuit on PCB 14 and the high-tension line on busbar 12 electrical Interference, impact
The work controlling circuit on PCB 14；Two is the supporting material as busbar 12, this is because the structure of busbar 12
Inlaying with insulation board 121 for scattered copper bar 122 and form, intensity is the highest, needs to utilize insulant 13 to carry out reinforcement, to guarantee
The bond strength of whole plate.
Wherein, described interlayer conduction structure is used for realizing between busbar 12 and described PCB 14, i.e. big circuit-line
And the electrical connection between vulnerabilities scan circuit.Optionally, described interlayer conduction structure be specifically as follows via or metal column or
Conducting resinl.
Preferably, in the embodiment of the present invention, described insulating barrier 11, busbar 12, insulant 13, PCB14, and viscous
Sheeting 15 all meets resistant to elevated temperatures requirement.The high temperature resistant temperature referring to bear reflow soldering process or solder wave process herein
Degree requirement.
For enabling novel busbar to stand the high-temperature technology of Reflow Soldering in PCBA flow process, wave-soldering, by analyzing novel mother
The laminated construction of row and resistant to elevated temperatures characteristic, verify through series of experiments, it is thus achieved that meet several insulation materials of this scheme
Material and glue system.What deserves to be explained is, PCBA is the abbreviation of English Printed Circuit Board+Assembly, say, that
PCB hollow plate is part on SMT (Surface Mount Technology, surface mounting technology), then through DIP (dual
Inline-pin package, dual-inline package) the whole processing procedure of plug-in unit.SMT typically uses Reflow Soldering, and DIP typically adopts
Use wave-soldering.
Optionally, described insulating barrier 11 can use Nomex (Nomex nylon) (NOMEX) material.Nomex (Nomex (Nomex nylon)) is a kind of
Meta-aramid, also referred to as aramid fiber 1313, feature is heat-resist, and intensity is high.It is at a temperature of 250 DEG C, and material property can be longer
Time keeps stable.Its needled product is mainly used as high-temperature-resistant filtering material and insulant.It is a kind of aromatic polyamide, logical
Being frequently referred to aromatic polyamides, the molecular structure of this material is particularly stable, and the excellent performance of NOMEX is exactly consequent, it
Possesses superior high temperature resistant, fire-retardant, nontoxic and the most electric, mechanical performance.Easy to understand, described insulating barrier 11 also may be used
To select other insulant with similar resistance to elevated temperatures.
Optionally, described insulation board 121 can use FR4 material；Described insulant 13 can also use FR4 material.
FR-4 is the code name of a kind of flame resistant material grade, and the representative meaning is that resin material allows for putting out voluntarily through fired state
A kind of material specification gone out, it is not a kind of title material, but a kind of material rate, therefore used by current general circuit plate
FR-4 grade material just has very many kinds, but majority is all with the epoxy of so-called four functions (Tera-Function)
The composite that resin is made plus filler (Filler) and glass fibre.FR-4 epoxy glass cloth laminated board, mainly
Technical characterstic and application: electrical insulation capability is stable, flatness good, smooth surface, without pit, thickness deviation standard, be suitable for application
In the product of high-performance electronic insulating requirements, such as FPC stiffening plate.Easy to understand, described insulation board 121 and/or described insulation material
Material 13 can also select other insulant with similar performance.
Optionally, described copper bar 121 can use fine copper or copper alloy.What deserves to be explained is, copper bar 121 simply trivial name
Claim, do not limit and necessarily use copper, it would however also be possible to employ other metal material.
Optionally, described bonding sheet 15 can use halogen-free flame-retardant epoxy jelly membrane material；It is a kind of resin material, tool
There are high temperature resistant, insulation, the characteristic such as fire-retardant.Easy to understand, described bonding sheet 15 can also be selected has similar resistance to elevated temperatures
Other insulating adhesive material.
Below, the busbar 12 in the embodiment of the present invention is described further.
Refer to Fig. 2, be in some embodiments of the invention, the schematic diagram of the multiple copper bars 122 processed.
Refer to Fig. 3, be in some embodiments of the invention, the top view of busbar 12.
Multiple fluting 123 can be processed on insulation board 121, be mounted in insulation board 121 slot accordingly by multiple copper bars 122
In 123, available busbar 12.
From figure 3, it can be seen that described busbar 12 includes insulation board 121 and more than one copper bar 122, described insulation
Plate 121 is suitable with the thickness of described copper bar 122, described insulation board 121 has more than one fluting 123, more than one
Copper bar 122 is embedded in more than one fluting 123 respectively.Wherein, described quite refer to that thickness is identical or close, such as
Thickness deviation controls within 0.1mm.
Generally, after copper bar 122 is embedded in certain thickness insulation board 121, can divide in insulation board 121 levels
Bonding sheet 15 is not set, temporarily plays fixation, in subsequent stacks pressing step, more respectively with PCB14, insulant 13 and
Insulating barrier 11 bonds.
It is pointed out that a kind of topology example of simply busbar 12 as shown in Figure 3, herein for busbar 12
Concrete structure not limit, it can be monolayer, it is also possible to be multilamellar, and wherein the number of copper bar 122 can be according to needing
It was determined that the size of copper bar 122, shape can also be various.
Above, the embodiment of the present invention is by insulating barrier 11, busbar busbar 12, insulant 13, and printed board
Carry out rational lamination arrangement between PCB 14, finally carry out hot-forming.Novel busbar 10 after pressing is had preferably
Bond strength, and novel busbar 10 is crossing Reflow Soldering and during Wave crest Welding device, and whole plate can bear high temperature, plate
Face, intermediate insulating material keep good, do not have the product defectses such as cracking, bubble between each insulating barrier.It addition, this kind new
The processing technique of type busbar 10, can use the PCB processing technique of routine, can realize busbar 12 heavy current circuit and PCB simultaneously
The interlayer circuit turn-on of 14 light current circuits.It is for instance possible to use following three kinds of implementation interlayer circuit turn-ons: 1.. conducting resinl
Hot pressing conduction mode；2.. copper post welding conduction mode；3. PCB sink copper plating via conduction mode.
Therefore, in some feasible embodiments of the present invention, for PCB and busbar, do not use the fixing side of support
Formula, but combine insulating barrier, insulant, bonding sheet etc., utilize process for pressing, the novel busbar that pressing is integrated.This is new
Type busbar, has the advantage that
1, its busbar layer can be electrically connected by interlayer conduction structure with PCB layer, it is achieved that busbar layer heavy current circuit
Interlayer circuit turn-on with PCB layer weak electric signal circuit；
2, its busbar layer and PCB layer can be reduced electromagnetic interference by insulant is spaced apart；
3, each layer has preferable bond strength, and uses exotic material, can stand back in follow-up PCBA processing procedure
Fluid welding or solder wave process, and keep good product quality, between each layer will not or the most cracking, bubble etc. lack
Fall into；
4, product pressing forms, and does not use support, reduces product thickness, takes up room less；
5, the PCB technology processing of routine can be used；
To sum up, the novel busbar that technical solution of the present invention provides, support the high temperature resistant technique during PCBA, it is achieved that
PCB Yu busbar integrated molding so that heavy current circuit and signal line are integrated on one block of plate becomes possibility, and makes
The interlayer conduction of the big current sheet of busbar and PCB vulnerabilities scan layer is possibly realized, this novel busbar structure tightly promotees, takies sky
Between little, it is achieved that miniaturization, and there is higher reliability relative to support fixed form.
Embodiment two,
Refer to Fig. 4, the embodiment of the present invention provides the manufacture method of a kind of novel busbar, it may include:
400, selection and blanking:
In the embodiment of the present invention, by analyzing the laminated construction of novel busbar and resistant to elevated temperatures characteristic, through a series of
Experimental verification, it is thus achieved that meet several insulant and the glue system of this scheme.
As it is shown in figure 1, novel busbar 10 includes layers below: insulating barrier 11, busbar busbar 12, insulant 13, with
And printed board PCB 14；Between each layer adjacent more than and, also there is bonding sheet 15；Busbar12 is by insulation board 121 and copper bar
122 inlay and form.
Optionally, described insulation board 121 and described insulant 13 use FR4 material；
Optionally, described insulating barrier 11 uses Nomex (Nomex nylon) (NOMEX) material；
Optionally, described bonding sheet 15 uses halogen-free flame-retardant epoxy jelly membrane material；
In this step, can be by above-mentioned selection blanking, including copper bar, insulating barrier, insulant and bonding sheet etc..
401, making busbar busbar, described busbar is inlayed by insulation board and copper bar and forms.
Refer to Fig. 2 and Fig. 3, in some embodiments of the invention, the step making busbar comprises the steps that
S1, offer insulation board 121 and more than one copper bar 122, described insulation board 121 and the thickness of described copper bar 122
Quite；
S2, more than one fluting 123 that processing is mated with more than one copper bar 122 on insulation board 121；
S3, above for one copper bar 122 is embedded in respectively more than one fluting 123 in, prepare busbar
busbar 12。
Optionally, may also include that S4, be respectively provided with bonding sheet in insulation board 121 levels having inlayed copper bar 122
15, the i.e. first bonding sheet 151 and the second bonding sheet 152.
Optionally, insulation board 121 can be arranged hole 124, location and dodge hole 125, in order to follow-up interlayer location and interlayer
Conducting.
402, utilize bonding sheet as interlaminar bonding material, printed board PCB stacks gradually layers below: insulate material
Material, described busbar and insulating barrier.
Refer to Fig. 1, the laminated construction of novel busbar 10 comprises the steps that insulating barrier 11, the first bonding sheet 151, busbar
12, the second bonding sheet 152, insulant 13, the 3rd bonding sheet 153, and PCB 14.
Wherein, bonding sheet 15, as mainly as interlayer cling-materials, plays heat pressure adhesive effect, and other each layer depends on viscous
Sheeting 15 realizes Coating combination.On insulation board 121 arrange hole, location 124 and dodge hole 125, it is simple to connector, paster install
On PCB 14.Owing to busbar 12 structure is that scattered copper bar 122 is inlayed with insulation board 121 and formed, intensity is the highest, insulation
Material 13 is used for busbar 12 is carried out reinforcement, it is ensured that the bond strength of whole plate.It addition, insulant 13 also serves as
Dielectric spacer layer between busbar 12 and PCB 14, prevents the vulnerabilities scan circuit on PCB 14 and the height on busbar 12
Electrical Interference is produced, it is ensured that vulnerabilities scan circuit normally works between line ball road.PCB 14 is arranged on the bottom of composite plate, PCB
The lower surface of 14 is components and parts solder side 141, and this structure is present to ensure that PCBA adds the upper stannum effect of the connector in man-hour.
403, the stepped construction pressing obtained is integrated, obtains novel busbar.
In this step, use hot-press equipment molding that the stepped construction of step 403 is carried out pressing.Optionally, bonding processes
Multiple stage, different stages can be divided into can to use different parameters.
404, before or after the step of described pressing, make interlayer conducting structure so as to get described novel busbar
In described busbar electrically connected by interlayer conduction structure with described PCB.
In the embodiment of the present invention, described interlayer conduction structure is preferably via or metal column or conducting resinl.According to interlayer
The difference of conducting structure particular type, the step making interlayer conducting structure can perform before or after the step of pressing.
Optionally, after pressing, the novel busbar after molding can be performed PCBA flow process, described novel busbar is passed through
PCBA welding procedure welding device.
Optionally, as it is shown in figure 5, after pressing and forming, the part-structure of novel busbar may need riveting nut 16 so that
Installing device.
Optionally, as shown in Figure 6, it is the schematic diagram of PCBA welding procedure welding device, wherein, 17 indication plug unit terminals.
Below, the Making programme of interlayer conduction structure is described further:
In the embodiment of the present invention, the big current network of busbar comprises the steps that with the conducting technique of PCB light current network
1, conducting resinl hot pressing conduction mode:
Refer to Fig. 7, be the structural representation using conducting resinl 21 conducting.For ease of understanding, figure eliminates novel mother
Each layer bonding sheet 15 of row.
Can calculate corresponding according to size of current I of carrying needed for interlayer conduction, and the specific insulation ρ of conducting resinl
Conducting sectional area S, arranges an equal amount of dew copper face and pad in copper bar 122 and PCB 14 relevant position.By busbar 12,
Conducting resinl 21, PCB 14 hot pressing by the way of lamination.
Visible, use the manner, described making interlayer conducting structure comprises the steps that
Before printed board PCB stacks gradually the step of layers below, described busbar arranges dew copper face, in institute
State the relevant position on PCB and pad is set, and offer in the relevant position of described insulant and described bonding sheet and dodge hole；
The step stacking gradually layers below on printed board PCB also includes: between described dew copper face and described pad
Conducting resinl is set so that after described pressing step, the described dew copper face on described busbar and the described weldering on described PCB
Dish is electrically connected by described conducting resinl.
2, metal column welding conduction mode:
Refer to Fig. 8, be the structural representation using metal column 22 conducting.For ease of understanding, figure eliminates novel mother
Each layer bonding sheet 15 of row.
Can arrange metal column 22, such as copper post on copper bar 122, middle insulant 13 insulating barrier such as grade is arranged accordingly
Dodging hole, the relevant position of PCB arranges the pad of corresponding size, puts in wave-soldering and welds, by metal column 22 after hot pressing
It is integrated with pad solder.
Visible employing the manner, described making interlayer conducting structure comprises the steps that
Before printed board PCB stacks gradually the step of layers below, described busbar arranges metal column, in institute
State the relevant position on PCB and pad with holes is set, and offer in the relevant position of described insulant and described bonding sheet and keep away
Allow hole；Making after described pressing step, the described metal column on described busbar is through the described band eyelet welding on described PCB
Dish；
After the step of described pressing, weld described metal column and described pad with holes by solder wave process so that
Described busbar is electrically connected by described metal column with described PCB.
3, PCB sink copper plating via conduction mode:
Refer to Fig. 9, be the structural representation using via 23 conducting.For ease of understanding, figure eliminates novel mother
Each layer bonding sheet 15 of row.
Can arrange pad on PCB 14, relevant position such as insulant 13 insulating barrier such as grade arranges and dodges hole.After product hot pressing,
Relevant position processing blind hole, puts into and carries out heavy copper plating in electroplating bath, form via 23, thus realize busbar's Yu PCB
Circuit connects.
Visible employing the manner, described making interlayer conducting structure includes:
Described after the step of described pressing, a processing blind hole at the described PCB place on described novel busbar,
Described busbar is arrived in the bottom of described blind hole, metallizes described blind hole, prepare via so that described busbar with
Described PCB is electrically connected by described via.
Above, the manufacture method of a kind of novel busbar that the embodiment of the present invention provides is described in detail, about the party
Method and the more descriptions of novel busbar related to thereof, refer to the content described in embodiment one.
Therefore, in some feasible embodiments of the present invention, for PCB and busbar, do not use the fixing side of support
Formula, but combine insulating barrier, insulant, bonding sheet etc., utilize process for pressing, the novel busbar that pressing is integrated.This is new
Type busbar, has the advantage that
1, its busbar layer can be electrically connected by interlayer conduction structure with PCB layer, it is achieved that busbar layer heavy current circuit
Interlayer circuit turn-on with PCB layer weak electric signal circuit；
2, its busbar layer and PCB layer can be reduced electromagnetic interference by insulant is spaced apart；
3, each layer has preferable bond strength, and uses exotic material, can stand back in follow-up PCBA processing procedure
Fluid welding or solder wave process, and keep good product quality, between each layer will not or the most cracking, bubble etc. lack
Fall into；
4, product pressing forms, and does not use support, reduces product thickness, takes up room less；
5, the PCB technology processing of routine can be used；
To sum up, the novel busbar that technical solution of the present invention provides, support the high temperature resistant technique during PCBA, it is achieved that
PCB Yu busbar integrated molding so that heavy current circuit and signal line are integrated on one block of plate becomes possibility, and makes
The interlayer conduction of the big current sheet of busbar and PCB vulnerabilities scan layer is possibly realized, this novel busbar structure tightly promotees, takies sky
Between little, it is achieved that miniaturization, and there is higher reliability relative to support fixed form.
This class formation will be the development trend of following stack bus bar in terms of function application and assembly space saving.Along with electricity
The development of the large power supplies such as electrical automobile, communication base station, server, robot, control circuit concentrates on power module circuit
In one novel busbar system, decrease on the connection to electronic unit, equipment is loaded down with trivial details, improve reliability, achieve little
Type.Production development for follow-up novel laminated busbar structure provides opportunity.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in certain embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for aforesaid each method embodiment, in order to be briefly described, therefore it is all expressed as a series of
Combination of actions, but those skilled in the art should know, the present invention is not limited by described sequence of movement, because depending on
According to the present invention, some step can use other order or carry out simultaneously.Secondly, those skilled in the art also should know,
Embodiment described in this description belongs to preferred embodiment, and involved action and module the not necessarily present invention musted
Must.
Novel busbar of one provided the embodiment of the present invention above and preparation method thereof is described in detail, but with
The explanation of upper embodiment is only intended to help to understand method and the core concept thereof of the present invention, should not be construed as the limit to the present invention
System.Those skilled in the art, according to the thought of the present invention, in the technical scope that the invention discloses, can readily occur in
Change or replacement, all should contain within protection scope of the present invention.
Claims (10)
1. a novel busbar, it is characterised in that
Described novel busbar includes the layers below that pressing in order is integrated: insulating barrier, busbar busbar, insulant, with
And printed board PCB；
Wherein, described insulating barrier, busbar, between the two-layer of the arbitrary neighborhood in insulant, and PCB, there is bonding sheet；
Described busbar is inlayed by insulation board and copper bar and forms；
Described busbar is electrically connected by interlayer conduction structure with described PCB.
Novel busbar the most according to claim 1, it is characterised in that
Described insulation board and described insulant use FR4 material；
Described insulating barrier uses Nomex (Nomex nylon) NOMEX material；
Described bonding sheet uses halogen-free flame-retardant epoxy jelly membrane material；
Described interlayer conduction structure is via or metal column or conducting resinl.
Novel busbar the most according to claim 1, it is characterised in that
Described busbar includes insulation board and more than one copper bar, and described insulation board is suitable with the thickness of described copper bar, described absolutely
Having more than one fluting on listrium, the above copper bar of one is embedded in more than one fluting respectively.
4. the manufacture method of a novel busbar, it is characterised in that including:
Making busbar busbar, described busbar are inlayed by insulation board and copper bar and form；
Utilize bonding sheet as interlaminar bonding material, printed board PCB stacks gradually layers below: be insulant, described
Busbar and insulating barrier；
The stepped construction pressing obtained is integrated, obtains novel busbar；
Wherein, before or after the step of described pressing, make interlayer conducting structure so as to get described novel busbar in
Described busbar is electrically connected by interlayer conduction structure with described PCB.
Method the most according to claim 4, it is characterised in that described making busbar busbar includes:
Thering is provided insulation board and more than one copper bar, described insulation board is suitable with the thickness of described copper bar；
Described insulation board is processed more than one fluting that copper bar above with one mates；
Above for one copper bar is embedded in respectively in more than one fluting, prepares busbar busbar.
Method the most according to claim 4, it is characterised in that
Described insulation board and described insulant use FR4 material；
Described insulating barrier uses Nomex (Nomex nylon) NOMEX material；
Described bonding sheet uses halogen-free flame-retardant epoxy jelly membrane material.
Method the most according to claim 4, it is characterised in that
Described interlayer conduction structure is via or metal column or conducting resinl.
Method the most according to claim 7, it is characterised in that described making interlayer conducting structure includes:
Before printed board PCB stacks gradually the step of layers below, described busbar arranges dew copper face, described
Relevant position on PCB arranges pad, and offers in the relevant position of described insulant and described bonding sheet and dodge hole；
The step stacking gradually layers below on printed board PCB also includes: arrange between described dew copper face and described pad
Conducting resinl so that after described pressing step, the described dew copper face on described busbar leads to the described pad on described PCB
Cross the electrical connection of described conducting resinl.
Method the most according to claim 7, it is characterised in that described making interlayer conducting structure includes:
Before printed board PCB stacks gradually the step of layers below, described busbar arranges metal column, described
Relevant position on PCB arranges pad with holes, and offers in the relevant position of described insulant and described bonding sheet and dodge
Hole；Making after described pressing step, the described metal column on described busbar is through the described band eyelet welding on described PCB
Dish；
After the step of described pressing, weld described metal column and described pad with holes by solder wave process so that described
Busbar is electrically connected by described metal column with described PCB.
Method the most according to claim 7, it is characterised in that described making interlayer conducting structure includes:
One processing blind hole at the described PCB place on described novel busbar, the bottom of described blind hole arrives at described busbar,
Described blind hole is metallized, prepares via so that described busbar is electrically connected by described via with described PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610633548.9A CN106231810A (en) | 2016-08-04 | 2016-08-04 | A kind of novel busbar and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610633548.9A CN106231810A (en) | 2016-08-04 | 2016-08-04 | A kind of novel busbar and preparation method thereof |
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Family
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| CN201610633548.9A Pending CN106231810A (en) | 2016-08-04 | 2016-08-04 | A kind of novel busbar and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106954343A (en) * | 2017-04-14 | 2017-07-14 | 深圳市牧泰莱电路技术有限公司 | A kind of preparation method of the busbar circuit board of thick conductor layer |
| CN107068255A (en) * | 2017-03-21 | 2017-08-18 | 广东易电能源科技有限公司 | High-voltage and low-voltage composite busbar and manufacturing method of high-voltage and low-voltage composite busbar |
| CN107147061A (en) * | 2017-06-16 | 2017-09-08 | 贵州振华华联电子有限公司 | A kind of block terminal |
| CN107172826A (en) * | 2017-06-15 | 2017-09-15 | 深圳市泰和安科技有限公司 | A kind of preparation method of the printed circuit board (PCB) with copper post |
| CN109494336A (en) * | 2018-11-09 | 2019-03-19 | 深圳众力新能源科技有限公司 | A kind of new energy car battery packet composite bus bar and production method |
| CN109587949A (en) * | 2019-01-11 | 2019-04-05 | 深圳市南瑞华腾新能源有限公司 | High voltage distribution installation PCB construction and its manufacturing method |
| EP3480832A1 (en) * | 2017-11-07 | 2019-05-08 | Rogers BVBA | Electrical energy storage device and method for producing an electrical energy storage device |
| CN113286420A (en) * | 2020-10-28 | 2021-08-20 | 华为技术有限公司 | Circuit bearing plate, power distribution unit and equipment |
| CN114666976A (en) * | 2022-03-18 | 2022-06-24 | 诚亿电子（嘉兴）有限公司 | A kind of PCB board with integrated busbar and preparation process thereof |
| CN115206600A (en) * | 2022-07-12 | 2022-10-18 | 浙江赛英电力科技有限公司 | A composite busbar for radio frequency remote module and its manufacturing process |
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| CN107068255A (en) * | 2017-03-21 | 2017-08-18 | 广东易电能源科技有限公司 | High-voltage and low-voltage composite busbar and manufacturing method of high-voltage and low-voltage composite busbar |
| CN106954343B (en) * | 2017-04-14 | 2019-02-01 | 深圳市牧泰莱电路技术有限公司 | A kind of production method of the busbar circuit board of thickness conductor layer |
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| CN107172826A (en) * | 2017-06-15 | 2017-09-15 | 深圳市泰和安科技有限公司 | A kind of preparation method of the printed circuit board (PCB) with copper post |
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| CN107147061A (en) * | 2017-06-16 | 2017-09-08 | 贵州振华华联电子有限公司 | A kind of block terminal |
| US10872729B2 (en) | 2017-11-07 | 2020-12-22 | Rogers Bvba | Electrical energy storage device and method for producing an electrical energy storage device |
| EP3480832A1 (en) * | 2017-11-07 | 2019-05-08 | Rogers BVBA | Electrical energy storage device and method for producing an electrical energy storage device |
| CN109494336A (en) * | 2018-11-09 | 2019-03-19 | 深圳众力新能源科技有限公司 | A kind of new energy car battery packet composite bus bar and production method |
| CN109587949A (en) * | 2019-01-11 | 2019-04-05 | 深圳市南瑞华腾新能源有限公司 | High voltage distribution installation PCB construction and its manufacturing method |
| CN113286420A (en) * | 2020-10-28 | 2021-08-20 | 华为技术有限公司 | Circuit bearing plate, power distribution unit and equipment |
| CN114666976A (en) * | 2022-03-18 | 2022-06-24 | 诚亿电子（嘉兴）有限公司 | A kind of PCB board with integrated busbar and preparation process thereof |
| CN115206600A (en) * | 2022-07-12 | 2022-10-18 | 浙江赛英电力科技有限公司 | A composite busbar for radio frequency remote module and its manufacturing process |
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