[go: up one dir, main page]

CN106200259A - The photomask cleaning of low sulfate radical residual concentration - Google Patents

The photomask cleaning of low sulfate radical residual concentration Download PDF

Info

Publication number
CN106200259A
CN106200259A CN201610563195.XA CN201610563195A CN106200259A CN 106200259 A CN106200259 A CN 106200259A CN 201610563195 A CN201610563195 A CN 201610563195A CN 106200259 A CN106200259 A CN 106200259A
Authority
CN
China
Prior art keywords
photomask
solution
hot water
cold water
out cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610563195.XA
Other languages
Chinese (zh)
Other versions
CN106200259B (en
Inventor
徐飞
沈健
蒋伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHANGZHOU RUIZE MICROELECTRONICS TECHNOLOGY Co Ltd
Original Assignee
CHANGZHOU RUIZE MICROELECTRONICS TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGZHOU RUIZE MICROELECTRONICS TECHNOLOGY Co Ltd filed Critical CHANGZHOU RUIZE MICROELECTRONICS TECHNOLOGY Co Ltd
Priority to CN201610563195.XA priority Critical patent/CN106200259B/en
Publication of CN106200259A publication Critical patent/CN106200259A/en
Application granted granted Critical
Publication of CN106200259B publication Critical patent/CN106200259B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82Auxiliary processes, e.g. cleaning or inspecting

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention relates to photomask cleaning technical field, more specifically, relating to the photomask cleaning of a kind of low sulfate radical residual concentration, this technique includes: SPM solution cleans, cold water wash, hot water clean, SC1 solution adds that million sound clean, add thermal diffusion, ultraviolet light irradiates, secondary hot water cleans, secondary SC1 solution adds that million sound clean, secondary cold water wash and photomask dry.Sulfate ion concentration can be dropped to below 1ppb by the photomask cleaning using the low sulfate radical residual concentration of the present invention, can be effectively improved the service life of high-end photomask, and technological operation is simple, convenient and practical, and suitable further genralrlization is applied.

Description

The photomask cleaning of low sulfate radical residual concentration
Technical field
The present invention relates to photomask cleaning technical field, more particularly, it relates to a kind of low sulfate radical residual concentration Photomask cleaning.
Background technology
In the whole flow process of semiconductor manufacturing, a portion is exactly the process in the middle of manufacturing from domain to wafer, i.e. Photomask or title light shield (mask) manufacture, and the manufacture of photomask is the key component of Connection between Processes, and the manufacture of photomask comprises light The cleaning of mask, the cleaning of photomask is typically with the cleaning method of sulphuric acid and hydrogen peroxide solution, above-mentioned mixed using After closing liquid cleaning, the method the most primarily now removing residual sulphate ion is as follows:
1, remove the sulfate ion of residual with high purity deionized water and the cleaning of diluted alkaline liquid, this method is mainly pin Removing the sulfate ion of photomask surface, residual concentration is at more than 10ppb;
2, removing sulfate ion with hot water, this method cannot be again when sulfate ion is reduced to finite concentration when Removing the sulfate ion that photomask is profound further, residual concentration is at more than 2ppb;
Above method for the cleaning of general normal light mask, the residual concentration of last sulfate ion at more than 2ppb, It is not met by the index request that sulfate ion is remained by high-end photomask.For this problem, a kind of low-sulfur of exploitation The photomask cleaning of acid group residual concentration is the technical problem that those skilled in the art are urgently to be resolved hurrily.
Summary of the invention
The technical problem to be solved is: for overcoming the technical problem mentioned in above-mentioned background technology, existing offer A kind of photomask cleaning of low sulfate radical residual concentration.
The technical solution adopted for the present invention to solve the technical problems is: the photomask of a kind of low sulfate radical residual concentration Cleaning, this cleaning comprises the steps:
(1) SPM solution cleans
Use SPM solution that photomask surface is always cleaned;Remove the Organic substance of photomask surface such as: photoresist, hands Finger mark, protection mould offset printing and other sol particle;Described SPM solution is H2SO4And H2O220:1~1:1 mixes by volume Close the mixed solution formed, H2SO4Mass fraction is 98%, H2O2Mass fraction is 30%;
(2) cold water wash
Under normal temperature condition, using cold water that photomask is carried out cleaning showers, cold water flow is 2.0-2.5L/min, during spray Between be 2-3min;Use rotation to add upper and lower shuttling movement spray, remove the SPM residual of photomask surface;
(3) one times hot water cleans
Using 60-80 DEG C of hot water that photomask is carried out cleaning showers, hot water flow is 1-1.5L/min, and spray time is 5- 10min;Use rotation to add upper and lower shuttling movement spray, remove photomask surface most sulfate ion residual;
(4) SC1 solution add million sound and clean
Under normal temperature condition, using SC1 solution to add million sound and photomask carries out cleaning showers, wherein, million acoustic energies are set to 50-75%, SC1 electrical conductivity of solution is ammonia and the hydrogen peroxide mixed liquor of 1000-2000 μ S/cm;Remove in cleaning process and bring into Solid particle;
(5) thermal diffusion is added
By photomask at the N of confined space2Heating in atmosphere, heat time heating time according to test result, heating-up temperature is 25-200℃;Heating-up temperature is by being controlled after sulfate ion content in test photomask, it may be assumed that by test photomask Sulfate ion concentration sets heating-up temperature, selects heating-up temperature in suitable scope.
(6) ultraviolet light irradiates
Photomask is carried out ultraviolet light Continuous irradiation 1-10min after being heated to the temperature set;By the sulfur in photomask Acid ion resolves into SO2And S;While ultraviolet light irradiates, photomask is continuous heating in step (5) design temperature, makes Sulfate radical within photomask irradiated by UV after catabolite SO2Accelerate in high temperature environments by photomask deep layer to surface Diffusion motion, ultraviolet light irradiates and terminates to heat to terminate simultaneously.
(7) secondary hot water cleans
Using 60-80 DEG C of hot water that photomask is carried out cleaning showers, hot water flow is 1-1.5L/min, and spray time is 5- 10min;Use rotation to add upper and lower shuttling movement spray, clean the sulfur diffused out after photomask is heated by step (5) further The SO that acid ion and step (6) ultraviolet light decompose out after irradiating2And S;
(8) secondary SC1 solution adds million sound cleanings
Under normal temperature condition, using SC1 solution to add million sound and photomask carries out cleaning showers, wherein, million acoustic energies are set to 50-75%, SC1 electrical conductivity of solution is ammonia and the hydrogen peroxide mixed liquor of 1000-2000 μ S/cm;Remove in cleaning process and bring into Solid particle;
(9) secondary cold water wash
Under normal temperature condition, using cold water that photomask is carried out cleaning showers, cold water flow is 2.0-2.5L/min, during spray Between be 2-3min;Use rotation to add upper and lower shuttling movement spray, remove the ammonia radical ion of photomask surface residual;
(10) photomask dries
Under room temperature condition, with 900-1200 turn/photomask dries by the speed of min.
Further, in step described in technique scheme (4) and step (8), the configuration of SC1 solution is: first use water and Ammonia configuration electrical conductivity is the solution of 300-600 μ S/cm, and then adding hydrogen peroxide configuration and forming electrical conductivity is 1000-2000 μ The mixed liquor of S/cm;The wavelength that wavelength is not higher than 193nm of described step (6) medium ultraviolet light.
Beneficial effect: compared with prior art, uses the photomask cleaning of the low sulfate radical residual concentration of the present invention Sulfate ion concentration can be dropped to below 1ppb, can be effectively improved the service life of high-end photomask, technological operation is simple, side Just practical, suitable further genralrlization is applied.
Accompanying drawing explanation
In describing embodiment below, the required accompanying drawing used does and introduces simply.
Fig. 1 show sulfate radical residual concentration comparison diagram on the processing step gained photomask using embodiment one, two, three;
Fig. 2 show sulfate radical residual concentration comparison diagram on the processing step gained photomask using embodiment one, four, five.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is further described, and the full content of the composition represented by example below does not limits In necessary to the solution as the invention described in claim.The method that in embodiment, residual concentration is measured is: will The high purity deionized water of 500ml, is heated to 90 DEG C, is put into by photomask in hot water and boils 2h, utilizes ion chromatograph to measure in water Sulfate ion concentration.
Embodiment one
The photomask cleaning of the present invention, this cleaning comprises the steps:
(1) SPM solution cleans and uses SPM solution always to clean photomask surface;Described SPM solution is H2SO4With H2O2The mixed solution that 3:1 is mixed to form by volume;
Under (2) cold water wash normal temperature conditions, using cold water that photomask is carried out cleaning showers, cold water flow is 2L/ Min, spray time is 3min;
(3) hot water clean and use 80 DEG C of hot water that photomask is carried out cleaning showers, and hot water flow is 1.3L/min, Spray time is 5min;
(4) SC1 solution add 3MHZ million sound and clean under normal temperature condition, use SC1 solution to add 3MHZ million sound to photomask Carrying out cleaning showers, wherein, million acoustic energies are set to 75%, and SC1 electrical conductivity of solution is the ammonia of 1500 μ S/cm and hydrogen peroxide mixes Close liquid;
(5) thermal diffusion is added by photomask at the N of confined space2Heating in atmosphere, heat time heating time is 10min, by light Mask temperature is heated to 80 DEG C;
(6) ultraviolet light irradiates and photomask carries out after being heated to 80 DEG C 172nm ultraviolet light Continuous irradiation 3min;Simultaneously Photomask is at 80 DEG C of continuous heating 3min of temperature;
(7) secondary hot water cleans and uses 80 DEG C of hot water that photomask is carried out cleaning showers, and hot water flow is 1.3L/min, Spray time is 5min;
(8), under secondary SC1 solution adds 3MHZ million sound cleaning normal temperature condition, SC1 solution is used to add 3MHZ million sound to photomask Carrying out cleaning showers, wherein, million acoustic energies are set to 75%, and SC1 electrical conductivity of solution is the ammonia of 1500 μ S/cm and hydrogen peroxide mixes Close liquid;
(9) under secondary cold water wash normal temperature condition, using cold water that photomask is carried out cleaning showers, cold water flow is 2.0L/min, spray time is 3min;
(10), under photomask dries room temperature condition, with the speed of 1000 turns/min, photomask is dried.Wherein, step (4) With the configuration of SC1 solution in step (8) it is: first use water and ammonia to configure the solution that electrical conductivity is 500 μ S/cm, add the most again Enter hydrogen peroxide configuration and form the mixed liquor that electrical conductivity is 1500 μ S/cm.
Embodiment two
A kind of photomask cleaning removing sulfate radical, this cleaning step:
(1) SPM solution cleans and uses SPM solution always to clean photomask surface;Described SPM solution is H2SO4With H2O2The mixed solution that 3:1 is mixed to form by volume;
Under (2) cold water wash normal temperature conditions, using cold water that photomask is carried out cleaning showers, cold water flow is 2L/ Min, spray time is 3min;
(3) hot water clean and use 80 DEG C of hot water that photomask is carried out cleaning showers, and hot water flow is 1.3L/min, Spray time is 5min;
(4) SC1 solution add 3MHZ million sound and clean under normal temperature condition, use SC1 solution to add 3MHZ million sound to photomask Carrying out cleaning showers, wherein, million acoustic energies are set to 75%, and SC1 electrical conductivity of solution is the ammonia of 1500 μ S/cm and hydrogen peroxide mixes Close liquid;
(5) ultraviolet light irradiates and photomask carries out 172nm ultraviolet light Continuous irradiation 3min;
(6) secondary hot water cleans and uses 80 DEG C of hot water that photomask is carried out cleaning showers, and hot water flow is 1.3L/min, Spray time is 5min;
(7), under secondary SC1 solution adds 3MHZ million sound cleaning normal temperature condition, SC1 solution is used to add 3MHZ million sound to photomask Carrying out cleaning showers, wherein, million acoustic energies are set to 75%, and SC1 electrical conductivity of solution is the ammonia of 1500 μ S/cm and hydrogen peroxide mixes Close liquid;
(8) under secondary cold water wash normal temperature condition, using cold water that photomask is carried out cleaning showers, cold water flow is 2.0L/min, spray time is 3min;
(9), under photomask dries room temperature condition, with the speed of 1000 turns/min, photomask is dried.Wherein, step (4) With the configuration of SC1 solution in step (7) it is: first use water and ammonia to configure the solution that electrical conductivity is 500 μ S/cm, add the most again Enter hydrogen peroxide configuration and form the mixed liquor that electrical conductivity is 1500 μ S/cm
Embodiment three
A kind of photomask cleaning removing sulfate radical, this cleaning step:
(1) SPM solution cleans and uses SPM solution always to clean photomask surface;Described SPM solution is H2SO4With H2O2The mixed solution that 3:1 is mixed to form by volume;
Under (2) cold water wash normal temperature conditions, using cold water that photomask is carried out cleaning showers, cold water flow is 2L/ Min, spray time is 3min;
(3) hot water clean and use 80 DEG C of hot water that photomask is carried out cleaning showers, and hot water flow is 1.3L/min, Spray time is 5min;
(4) SC1 solution add 3MHZ million sound and clean under normal temperature condition, use SC1 solution to add 3MHZ million sound to photomask Carrying out cleaning showers, wherein, million acoustic energies are set to 75%, and SC1 electrical conductivity of solution is the ammonia of 1500 μ S/cm and hydrogen peroxide mixes Close liquid;
(5) secondary hot water cleans and uses 80 DEG C of hot water that photomask is carried out cleaning showers, and hot water flow is 1.3L/min, Spray time is 5min;
(6), under secondary SC1 solution adds 3MHZ million sound cleaning normal temperature condition, SC1 solution is used to add 3MHZ million sound to photomask Carrying out cleaning showers, wherein, million acoustic energies are set to 75%, and SC1 electrical conductivity of solution is the ammonia of 1500 μ S/cm and hydrogen peroxide mixes Close liquid;
(7) under secondary cold water wash normal temperature condition, using cold water that photomask is carried out cleaning showers, cold water flow is 2.0L/min, spray time is 3min;
(8), under photomask dries room temperature condition, with the speed of 1000 turns/min, photomask is dried.Wherein, step (4) With the configuration of SC1 solution in step (6) it is: first use water and ammonia to configure the solution that electrical conductivity is 500 μ S/cm, add the most again Enter hydrogen peroxide configuration and form the mixed liquor that electrical conductivity is 1500 μ S/cm.
Above-described embodiment one is according to present invention process step;Embodiment two is heating to be expanded on the basis of embodiment one Take a walk and suddenly remove;Cancel continuous heating when ultraviolet light irradiates;Embodiment three is by ultraviolet lighting on the basis of embodiment two Penetrate step to remove.After three kinds of processing steps, on photomask, sulfate radical residual concentration is 0.77ppb, 1.56ppb, 1.87ppb, Test result as shown in Figure 1, from accompanying drawing, uses the process step of the invention, and sulfate ion residual concentration has the biggest Reduction amplitude, residual concentration be less than 1ppb.
Embodiment four
The photomask cleaning of the present invention, this cleaning comprises the steps:
(1) SPM solution cleans and uses SPM solution always to clean photomask surface;Described SPM solution is H2SO4With H2O2The mixed solution that 5:1 is mixed to form by volume;
Under (2) cold water wash normal temperature conditions, using cold water that photomask is carried out cleaning showers, cold water flow is 2L/ Min, spray time is 3min;
(3) hot water clean and use 80 DEG C of hot water that photomask is carried out cleaning showers, and hot water flow is 1.3L/min, Spray time is 5min;
(4) SC1 solution add 3MHZ million sound and clean under normal temperature condition, use SC1 solution to add 3MHZ million sound to photomask Carrying out cleaning showers, wherein, million acoustic energies are set to 75%, and SC1 electrical conductivity of solution is the ammonia of 1500 μ S/cm and hydrogen peroxide mixes Close liquid;
(5) thermal diffusion is added by photomask at the N of confined space2Heating in atmosphere, heat time heating time is 10min, heating Temperature is 160 DEG C;
(6) ultraviolet light irradiates and photomask carries out after being heated to 160 DEG C 172nm ultraviolet light Continuous irradiation 3min;Simultaneously Photomask is at 160 DEG C of continuous heating 3min of temperature;
(7) secondary hot water cleans and uses 80 DEG C of hot water that photomask is carried out cleaning showers, and hot water flow is 1.3L/min, Spray time is 5min;
(8), under secondary SC1 solution adds 3MHZ million sound cleaning normal temperature condition, SC1 solution is used to add 3MHZ million sound to photomask Carrying out cleaning showers, wherein, million acoustic energies are set to 75%, and SC1 electrical conductivity of solution is the ammonia of 1500 μ S/cm and hydrogen peroxide mixes Close liquid;
(9) under secondary cold water wash normal temperature condition, using cold water that photomask is carried out cleaning showers, cold water flow is 2.0L/min, spray time is 3min;
(10), under photomask dries room temperature condition, with the speed of 1000 turns/min, photomask is dried.Wherein, step (4) With the configuration of SC1 solution in step (8) it is: first use water and ammonia to configure the solution that electrical conductivity is 500 μ S/cm, add the most again Enter hydrogen peroxide configuration and form the mixed liquor that electrical conductivity is 1500 μ S/cm.
Embodiment five
The photomask cleaning of the present invention, this cleaning comprises the steps:
(1) SPM solution cleans and uses SPM solution always to clean photomask surface;Described SPM solution is H2SO4With H2O2The mixed solution that 5:1 is mixed to form by volume;
Under (2) cold water wash normal temperature conditions, using cold water that photomask is carried out cleaning showers, cold water flow is 2L/ Min, spray time is 3min;
(3) hot water clean and use 80 DEG C of hot water that photomask is carried out cleaning showers, and hot water flow is 1.3L/min, Spray time is 5min;
(4) SC1 solution add 3MHZ million sound and clean under normal temperature condition, use SC1 solution to add 3MHZ million sound to photomask Carrying out cleaning showers, wherein, million acoustic energies are set to 75%, and SC1 electrical conductivity of solution is the ammonia of 1500 μ S/cm and hydrogen peroxide mixes Close liquid;
(5) thermal diffusion is added by photomask at the N of confined space2Heating in atmosphere, heat time heating time is 10min, heating Temperature is 160 DEG C;
(6) ultraviolet light irradiates and after being heated to the temperature set, photomask is carried out 172nm ultraviolet light Continuous irradiation 10min;With photomask at 160 DEG C of continuous heating 10min of temperature;
(7) secondary hot water cleans and uses 80 DEG C of hot water that photomask is carried out cleaning showers, and hot water flow is 1.3L/min, Spray time is 10min;
(8), under secondary SC1 solution adds 3MHZ million sound cleaning normal temperature condition, SC1 solution is used to add 3MHZ million sound to photomask Carrying out cleaning showers, wherein, million acoustic energies are set to 75%, and SC1 electrical conductivity of solution is the ammonia of 1500 μ S/cm and hydrogen peroxide mixes Close liquid;
(9) under secondary cold water wash normal temperature condition, using cold water that photomask is carried out cleaning showers, cold water flow is 2.0L/min, spray time is 3min;
(10), under photomask dries room temperature condition, with the speed of 1000 turns/min, photomask is dried.Wherein, step (4) With the configuration of SC1 solution in step (8) it is: first use water and ammonia to configure the solution that electrical conductivity is 500 μ S/cm, add the most again Enter hydrogen peroxide configuration and form the mixed liquor that electrical conductivity is 1500 μ S/cm.
Above-described embodiment four and five, processing step is identical with embodiment one, have modified technological parameter.Embodiment four is being implemented Following technological parameter is have modified: the H that 1.SPM solution cleans on the basis of one2SO4And H2O2Volume ratio;2. add adding of thermal diffusion Heat time and heating-up temperature.Embodiment five is implementing to have modified on the basis of one following technological parameter: 1.SPM solution cleans H2SO4And H2O2Volume ratio;2. add heat time heating time and the heating-up temperature of thermal diffusion;3. the time that ultraviolet light irradiates;4. second heat The spray time that water cleans.The sulfate radical residual ion concentration of the embodiment four that draws of experiment and embodiment five is: 0.50ppb and 0.26ppb, three kinds of results contrast are as shown in Figure 2.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses the present invention. Multiple amendment to these embodiments will be apparent from for those skilled in the art, as defined herein General Principle can realize without departing from the spirit or scope of the present invention in other embodiments.Therefore, the present invention It is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein and features of novelty phase one The widest scope caused.

Claims (3)

1. a photomask cleaning for low sulfate radical residual concentration, is characterized in that: this cleaning comprises the steps:
(1) SPM solution cleans
Use SPM solution that photomask surface is always cleaned;Described SPM solution is H2SO4And H2O220:1~1:1 by volume The mixed solution being mixed to form, H2SO4Mass fraction is 98%, H2O2Mass fraction is 30%;
(2) cold water wash
Under normal temperature condition, using cold water that photomask is carried out cleaning showers, cold water flow is 2.0-2.5L/min, and spray time is 2-3min;
(3) one times hot water cleans
Using 60-80 DEG C of hot water that photomask is carried out cleaning showers, hot water flow is 1-1.5L/min, and spray time is 5- 10min;
(4) SC1 solution add million sound and clean
Under normal temperature condition, using SC1 solution to add million sound and photomask carries out cleaning showers, wherein, million acoustic energies are set to 50%- 75%, SC1 electrical conductivity of solution is ammonia and the hydrogen peroxide mixed liquor of 1000-2000 μ S/cm;
(5) thermal diffusion is added
By photomask at the N of confined space2Heating in atmosphere, heating-up temperature is 25-200 DEG C, and temperature can be according to technological requirement Being set, heat time heating time is the time that photomask reaches design temperature;
(6) ultraviolet light irradiates
Photomask is carried out ultraviolet light Continuous irradiation 1-10min after being heated to the temperature set;Photomask is in irradiating ultraviolet light While, in the range of step (5) design temperature, carry out continuous heating;Ultraviolet light irradiates and terminates to heat also to terminate simultaneously;
(7) secondary hot water cleans
Using 60-80 DEG C of hot water that photomask is carried out cleaning showers, hot water flow is 1-1.5L/min, and spray time is 5- 10min;
(8) secondary SC1 solution adds million sound cleanings
Under normal temperature condition, using SC1 solution to add million sound and photomask carries out cleaning showers, wherein, million acoustic energies are set to 50- 75%, SC1 electrical conductivity of solution is ammonia and the hydrogen peroxide mixed liquor of 1000-2000 μ S/cm;
(9) secondary cold water wash
Under normal temperature condition, using cold water that photomask is carried out cleaning showers, cold water flow is 2.0-2.5L/min, and spray time is 2-3min;
(10) photomask dries
Under room temperature condition, with 900-1200 turn/photomask dries by the speed of min.
The photomask cleaning of a kind of low sulfate radical residual concentration the most according to claim 1, is characterized in that: described step Suddenly in (4) and step (8), the configuration of SC1 solution is: first use water and solution that ammonia configuration electrical conductivity is 300-600 μ S/cm, Then add hydrogen peroxide configuration and form the mixed liquor that electrical conductivity is 1000-2000 μ S/cm.
The photomask cleaning of a kind of low sulfate radical residual concentration the most according to claim 1, is characterized in that: described step Suddenly the wavelength that wavelength is not higher than 193nm of (6) medium ultraviolet light.
CN201610563195.XA 2016-07-15 2016-07-15 The photomask cleaning process of low-sulfur acid group residual concentration Active CN106200259B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610563195.XA CN106200259B (en) 2016-07-15 2016-07-15 The photomask cleaning process of low-sulfur acid group residual concentration

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610563195.XA CN106200259B (en) 2016-07-15 2016-07-15 The photomask cleaning process of low-sulfur acid group residual concentration

Publications (2)

Publication Number Publication Date
CN106200259A true CN106200259A (en) 2016-12-07
CN106200259B CN106200259B (en) 2019-08-06

Family

ID=57476022

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610563195.XA Active CN106200259B (en) 2016-07-15 2016-07-15 The photomask cleaning process of low-sulfur acid group residual concentration

Country Status (1)

Country Link
CN (1) CN106200259B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220357647A1 (en) * 2021-04-29 2022-11-10 Skc Solmics Co., Ltd. Blank mask and photomask using the same
CN116274069A (en) * 2022-11-11 2023-06-23 湖南普照信息材料有限公司 Method for cleaning mask plate glass substrate
CN116850889A (en) * 2023-06-19 2023-10-10 苏州桔云科技有限公司 Current detection type multi-stock solution concentration automatic proportioning process

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW508642B (en) * 2001-10-24 2002-11-01 Taiwan Semiconductor Mfg Clean method of phase shifting mask
JP2005202135A (en) * 2004-01-15 2005-07-28 Seiko Epson Corp Photomask cleaning method, photomask manufacturing method, and photomask handling method.
KR20060001419A (en) * 2004-06-30 2006-01-06 주식회사 하이닉스반도체 Manufacturing method of mask for exposure
US20070012335A1 (en) * 2005-07-18 2007-01-18 Chang Hsiao C Photomask cleaning using vacuum ultraviolet (VUV) light cleaning
TW200705120A (en) * 2005-03-21 2007-02-01 Pkl Co Ltd Device and method for cleaning photomask
JP2009145827A (en) * 2007-12-18 2009-07-02 Tsukuba Semi Technology:Kk Mask cleaning apparatus and mask cleaning method
CN102033416A (en) * 2009-09-27 2011-04-27 中芯国际集成电路制造(上海)有限公司 Method for washing light mask

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW508642B (en) * 2001-10-24 2002-11-01 Taiwan Semiconductor Mfg Clean method of phase shifting mask
JP2005202135A (en) * 2004-01-15 2005-07-28 Seiko Epson Corp Photomask cleaning method, photomask manufacturing method, and photomask handling method.
KR20060001419A (en) * 2004-06-30 2006-01-06 주식회사 하이닉스반도체 Manufacturing method of mask for exposure
TW200705120A (en) * 2005-03-21 2007-02-01 Pkl Co Ltd Device and method for cleaning photomask
US20070012335A1 (en) * 2005-07-18 2007-01-18 Chang Hsiao C Photomask cleaning using vacuum ultraviolet (VUV) light cleaning
JP2009145827A (en) * 2007-12-18 2009-07-02 Tsukuba Semi Technology:Kk Mask cleaning apparatus and mask cleaning method
CN102033416A (en) * 2009-09-27 2011-04-27 中芯国际集成电路制造(上海)有限公司 Method for washing light mask

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220357647A1 (en) * 2021-04-29 2022-11-10 Skc Solmics Co., Ltd. Blank mask and photomask using the same
US12461439B2 (en) * 2021-04-29 2025-11-04 Sk Enpulse Co., Ltd. Blank mask and photomask using the same
CN116274069A (en) * 2022-11-11 2023-06-23 湖南普照信息材料有限公司 Method for cleaning mask plate glass substrate
CN116850889A (en) * 2023-06-19 2023-10-10 苏州桔云科技有限公司 Current detection type multi-stock solution concentration automatic proportioning process

Also Published As

Publication number Publication date
CN106200259B (en) 2019-08-06

Similar Documents

Publication Publication Date Title
CN106200259A (en) The photomask cleaning of low sulfate radical residual concentration
JP2013506313A5 (en)
CN102033416B (en) Method for cleaning photomask
CN103092009B (en) Removing method of photoresist used as masking layer of plasma injection
CN103480598B (en) Silicon wafer cleaning method for preparing high-efficiency solar cell and cleaning equipment
JP3611196B2 (en) Method for removing organic material from a substrate
MX2011002799A (en) PROCEDURE FOR SUBSTRATE TREATMENT, SUBSTRATE AND TREATMENT DEVICE TO PERFORM THE PROCEDURE.
CN101397499B (en) TaN material etching solution and TaN material etching method
JP2009145827A (en) Mask cleaning apparatus and mask cleaning method
CN104392898A (en) Method for cleaning passivated GaAs wafer surface
Waldfried et al. Cleaning solutions for p-MSQ low-k device applications
TWI542405B (en) Condensate treatment equipment for organic gaseous pollutants
TW200723391A (en) Surface treatment method for substrate, cleaning method for substrate and program
CN102043355A (en) Method for removing photoresist
CN101154046B (en) Manufacturing method for double-mosaic structure
CN104966673A (en) An interface passivation method for improving Al2O3/InP MOS capacitor interface characteristics and leakage characteristics
Olawumi et al. Modification of Ultra Low-k Dielectric Films by O2 and CO2 Plasmas
CN110737171B (en) Nano pattern and preparation method thereof, and preparation method of nano structure
US8252515B2 (en) Method for removing photoresist
CN111952164A (en) A method for removing photoresist from bottom layer of MOS tube
CN100501916C (en) Method for preventing electric charge generation in high-voltage device process
Hattori et al. Novel single-wafer single-chamber dry and wet hybrid system for stripping and in situ cleaning of high-dose ion-implanted photoresists
CN105870000B (en) Solar cell photoelectric absorbs conversion layer film forming post-treatment agent and application method
Kesters et al. Towards fully aqueous ozone wet strip of 193 nm photoresist stack using UV pre-treatments in low-k patterning applications
Cheng et al. Heat, moisture and chemical resistance on low dielectric constant (low-k) film using Diethoxymethylsilane (DEMS) prepared by plasma enhanced chemical vapor deposition

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant