CN106185301A - Electronic component handling apparatus and electronic component inspection device - Google Patents

Abstract

The present invention provides a kind of electronic component handling apparatus and electronic component inspection device.This electronic component inspection device possesses the handle part holding IC device and the maintaining part keeping IC device.The stream of air flowing it is formed with in maintaining part.And, in this electronic component inspection device, when making IC device fall at handle part release IC device, air is to the direction flowing different from the direction that IC device falls.

Description

Electronic component conveying device and electronic component inspection device

technical field

The present invention relates to an electronic component conveying device and an electronic component inspection device.

Background technique

Conventionally, for example, an electronic component inspection device for inspecting electrical characteristics of electronic components such as IC devices is known, and an electronic component transfer device for transferring IC devices to a holding unit of the inspection unit is incorporated in the electronic component inspection device. When inspecting an IC device, the IC device is placed on a holding portion, the IC device is positioned relative to the holding portion, and a plurality of probes (electrodes) provided on the holding portion are brought into contact with each terminal of the IC device.

It is conceivable to use a storage tool described in Patent Document 1 as a holding portion capable of such positioning. The storage jig has a quadrangular cavity in plan view for accommodating an IC device (work), and a suction hole opening toward the inside of the cavity is formed. The suction holes are arranged at the corners of the quadrangle, and the suction holes perform suction so that the IC device can be positioned by colliding with the corners. In addition, the positioning is performed after the IC device reaches the bottom surface of the cavity.

Patent Document 1: Japanese Patent Application Laid-Open No. 11-198988

However, in the storage tool described in Patent Document 1, the suction force obtained through the suction hole is only about atmospheric pressure at the maximum, and positioning may not be possible depending on the degree of distance between the suction hole and the IC device before positioning. Condition.

Contents of the invention

An object of the present invention is to provide an electronic component conveying device and an electronic component inspection device that can easily perform positioning of an electronic component by an electronic component holding unit.

Such objects are achieved by the present invention described below.

(Application example 1)

The electronic component conveying device of the present invention is characterized in that it includes: an electronic component holding unit that holds the electronic component; When the electronic component holding part releases the electronic component to drop the electronic component, the fluid flows in a direction different from the direction in which the electronic component falls.

Accordingly, when the electronic component is positioned by the electronic component holding portion, the fluid can smoothly move the electronic component to a position where the electronic component is to be positioned while the electronic component is falling. This movement facilitates positioning of electronic components.

(Application example 2)

Preferably, in the electronic component conveyance device according to the present invention, the electronic component holding part is provided with: a concave part; When the electronic component gripping portion releases the electronic component to drop the electronic component, the fluid flows in a direction to move the electronic component toward the positioning portion.

Accordingly, when the electronic component is positioned by the electronic component holding portion, the fluid can smoothly move the electronic component to a position where the electronic component is to be positioned while the electronic component is falling. This movement makes it easier to position the electronic component.

(Application example 3)

Preferably, in the electronic component conveying device according to the present invention, the electronic component holding portion has a first wall surface and a second wall surface forming a first corner portion, the first wall surface is perpendicular to the second wall surface, and the electronic component holding portion has a configuration. In the first channel through which the fluid flows at the first corner, a first vector representing the flow of the fluid flowing in the first channel is not perpendicular to the first wall surface and the second wall surface, respectively.

Thereby, the electronic component can be moved to a position to be positioned during the falling of the electronic component.

(Application example 4)

Preferably, in the electronic component conveying device according to the present invention, the electronic component holding portion has a third wall surface and a fourth wall surface constituting a second corner portion, the second corner portion is arranged at a position diagonal to the first corner portion, and the above-mentioned The electronic component holding part has a second flow path arranged at the second corner and through which the fluid flows, and the second vector representing the flow of the fluid flowing in the second flow path is not connected to the first wall surface and the first wall surface and the second flow path respectively. The second wall is orthogonal.

Thereby, the electronic component can be moved to a position to be positioned during the falling of the electronic component.

(Application example 5)

Preferably, in the electronic component delivery device of the present invention, a suction unit for sucking the fluid is connected to the first flow path, and an injection unit for ejecting the fluid is connected to the second flow path.

Thereby, when performing positioning of an electronic component, an electronic component can be moved easily.

(Application example 6)

Preferably, in the electronic component conveying device according to the present invention, the electronic component includes a main body and a plurality of terminals provided on the main body, and at least a part of the opening of the second flow path is disposed on the electronic component held by the electronic component. In a state of the component holding portion, the terminal arrangement surface of the main body portion on which the terminals are arranged is positioned vertically below.

Thereby, when positioning an electronic component, an electronic component can be floated, and an electronic component can be moved easily.

(Application example 7)

Preferably, in the electronic component conveyance device of the present invention, the electronic component holding unit holds the electronic component when inspecting the electronic component.

Thereby, electronic components can be stably inspected.

(Application example 8)

Preferably, in the electronic component transport device of the present invention, the electronic component holding unit holds the electronic component and moves it to a predetermined position.

Thereby, for example, the total transport time of electronic components can be shortened as much as possible.

(Application example nine)

The electronic component inspection device of the present invention is characterized in that it includes: an electronic component holding unit that holds the electronic component; an electronic component holding unit that holds the electronic component; and an inspection unit that inspects the electronic component. A flow path through which a fluid flows is formed, and when the electronic component holding portion releases the electronic component to drop the electronic component, the fluid flows in a direction different from the direction in which the electronic component falls.

Accordingly, when the electronic component is positioned by the electronic component holding portion, the fluid can smoothly move the electronic component to a position where the electronic component is to be positioned while the electronic component is falling. This movement facilitates positioning of electronic components.

Description of drawings

FIG. 1 is a schematic diagram showing a first embodiment of an electronic component inspection device according to the present invention.

FIG. 2 is a diagram showing operations and the like of each unit included in the electronic component inspection apparatus shown in FIG. 1 .

3 is a horizontal cross-sectional view showing a holding portion of an inspection unit included in the electronic component inspection device shown in FIG. 1 .

4 is a horizontal cross-sectional view showing a state in which an electronic component is positioned on a holding portion of an inspection unit included in the electronic component inspection apparatus shown in FIG. 1 .

5 is a vertical cross-sectional view for explaining the operation until the electronic component is positioned on the holding portion in the electronic component inspection apparatus shown in FIG. 1 .

6 is a vertical cross-sectional view for explaining the operation until the electronic component is positioned on the holding portion in the electronic component inspection apparatus shown in FIG. 1 .

7 is a vertical cross-sectional view for explaining the operation until the electronic component is positioned on the holding portion in the electronic component inspection apparatus shown in FIG. 1 .

8 is a vertical cross-sectional view for explaining the operation until the electronic component is positioned on the holding portion in the electronic component inspection apparatus shown in FIG. 1 .

9 is a horizontal cross-sectional view showing a holding portion of a transport portion included in the electronic component inspection apparatus (second embodiment) of the present invention.

10 is a horizontal cross-sectional view showing a holding portion of an inspection portion included in the electronic component inspection apparatus (third embodiment) of the present invention.

detailed description

Hereinafter, the electronic component conveyance apparatus and the electronic component inspection apparatus of this invention are demonstrated in detail based on preferable embodiment shown in drawing.

(first embodiment)

FIG. 1 is a schematic diagram showing a first embodiment of an electronic component inspection device according to the present invention. FIG. 2 is a diagram showing operations and the like of each unit included in the electronic component inspection apparatus shown in FIG. 1 . 3 is a horizontal cross-sectional view showing a holding portion of an inspection unit included in the electronic component inspection device shown in FIG. 1 . 4 is a horizontal cross-sectional view showing a state in which an electronic component is positioned on a holding portion of an inspection unit included in the electronic component inspection apparatus shown in FIG. 1 . 5 to 8 are vertical cross-sectional views for explaining operations up to positioning the electronic component on the holding portion in the electronic component inspection apparatus shown in FIG. 1 .

In addition, in the following, for convenience of description, as shown in FIG. 1 , three axes orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. In addition, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. In addition, the direction parallel to the X axis is also referred to as "X direction", the direction parallel to the Y axis is referred to as "Y direction", and the direction parallel to the Z axis is referred to as "Z direction". In addition, the upstream side of the conveyance direction of an electronic component is only called "upstream side", and the downstream side of the conveyance direction of an electronic component is only called a "downstream side". In addition, the term "horizontal" in this specification is not limited to being completely horizontal, and includes a slightly (for example, less than about 5°) inclined state relative to the horizontal as long as it does not hinder the conveyance of electronic components. In addition, the upper side in FIGS. 5 to 8 may be referred to as "upper" or "upper", and the lower side may be referred to as "lower" or "below".

In addition, in FIGS. 3 to 8 , one of the four holding units (electronic component holding units) serving as the inspection unit is shown, and one of the four hand units of the transport unit is shown. In addition, in FIGS. 3-8, illustration of the probe etc. which contact the terminal of an electronic component in a holding part is abbreviate|omitted.

The inspection device (electronic component inspection device) 1 shown in FIG. Array) packaged IC devices, LCD (Liquid Crystal Display: liquid crystal display), CIS (CMOS Image Sensor: CMOS image sensor) and other electrical characteristics of electronic components. In addition, below, for convenience of description, the case where an IC device is used as the said electronic component to be inspected is demonstrated representatively, and it is set as "IC device 9." In the following, the IC device 9 will be described using a BGA package as an example.

First, the IC device 9 will be described.

As shown in FIGS. 5 to 8 , the IC device 9 is a BGA package, and has a main body 91 and a plurality of terminals (electrodes) 92 provided outside the main body 91 . Although the shape of the main body portion 91 is not particularly limited, it has a plate shape in the present embodiment, and has a quadrilateral shape ( Refer to Figure 4). It should be noted that in this embodiment, the quadrilateral is a square (or a rectangle).

The lower surface of the main body 91 in FIG. 5 is a terminal arrangement surface 93 , and a plurality of terminals 92 are arranged in a grid (matrix) on the terminal arrangement surface 93 . In addition, each terminal 92 is a hemispherical solder ball. In addition, the shape of each terminal 92 is of course not limited to the hemispherical shape.

Next, the inspection device 1 will be described.

As shown in FIG. 1 , the inspection device 1 includes a transport device (electronic component transport device) 10 . This transport device 10 has a positioning mechanism 100 for positioning the IC device 9 as shown in FIG. 4 .

That is, the inspection device 1 includes a supply unit 2 , a supply side alignment unit 3 , a conveyance unit 4 , an inspection unit 5 , a recovery side alignment unit 6 , a recovery unit 7 , and a control unit 8 that controls these units. In addition, the inspection device 1 has a base (Base) 11 on which the supply unit 2, the supply-side alignment unit 3, the transport unit 4, the inspection unit 5, the collection-side alignment unit 6, and the collection unit 7 are arranged, and the supply-side alignment unit 3 is housed. , the conveyance unit 4 , the inspection unit 5 , and the recovery-side alignment unit 6 cover the cover 12 on the base 11 . In addition, the base surface 111 which is the upper surface of the base 11 is almost horizontal, and the structural members of the supply side alignment part 3 , the transport part 4 , the inspection part 5 , and the recovery side alignment part 6 are arranged on the base surface 111 . In addition, the inspection apparatus 1 may have a heater, a combustion chamber, and the like for heating the IC device 9 as necessary.

Such an inspection apparatus 1 is configured such that the supply unit 2 supplies the IC devices 9 to the supply side alignment unit 3, the supply side alignment unit 3 arranges the supplied IC devices 9, and the transport unit 4 transports the arranged IC devices 9 to the inspection unit 5. The inspection unit 5 inspects the transported IC devices 9 , the transport unit 4 transports and arranges the inspected IC devices 9 to the collection-side alignment unit 6 , and the collection unit 7 collects the IC devices 9 arranged at the collection-side alignment unit 6 . According to such an inspection apparatus 1 , supply, inspection, and collection of IC devices 9 can be automatically performed. In the inspection device 1, the conveyance device 10 is constituted by the supply unit 2, the supply-side arrangement unit 3, the conveyance unit 4, a part of the inspection unit 5, the recovery-side arrangement unit 6, the recovery unit 7, the control unit 8, and the like. The transport device 10 performs transport of the IC device 9 , positioning of the IC device 9 to the holding unit 51 of the inspection unit 5 by the positioning mechanism 100 , and the like.

Hereinafter, configurations of the transport unit 4 , the inspection unit 5 , and the positioning mechanism 100 will be described.

Conveyor

As shown in FIG. 2 , the conveyance unit 4 conveys the IC devices 9 arranged on the placement operation table 341 of the supply-side array unit 3 to the inspection unit 5 , and conveys the IC devices 9 that have been inspected by the inspection unit 5 . To the unit of the recovery side alignment section 6. Such a transport unit 4 includes a shuttle 41 , a supply robot 42 , an inspection robot 43 , and a collection robot 44 .

Shuttle

The shuttle 41 is used to transport the IC devices 9 placed on the loading table 341 to the vicinity of the inspection section 5 and to transport the inspected IC devices 9 inspected by the inspection section 5 to the vicinity of the collection side alignment section 6. of the shuttle. In such a shuttle 41 , four pockets (pockets) (holding portions) 411 formed of recesses for accommodating the IC device 9 are formed in a line in the X direction. In addition, the shuttle 41 is guided by a linear motion guide, and can reciprocate in the X direction by a drive source such as a linear motor.

supply manipulator

The supply robot 42 is a robot that conveys the IC device 9 placed on the loading operation table 341 to the shuttle 41 . Such a supply robot 42 has a support frame 421 supported by the base 11, a movable frame 422 supported by the support frame 421 and capable of reciprocating in the Y direction relative to the support frame 421, and four hands supported by the movable frame 422. Unit (manipulator) 423. Each hand unit 423 is equipped with a lifting mechanism and a suction nozzle, and can hold the IC device 9 by suction.

Check the manipulator

The inspection robot 43 is a robot that transports the IC device 9 stored in the shuttle 41 to the inspection unit 5 (see FIGS. 5 to 7 ), and transports the IC device 9 that has been inspected from the inspection unit 5 to the shuttle 41. . In addition, the inspection manipulator 43 can also press the IC device 9 to the inspection unit 5 during inspection, and apply a predetermined inspection pressure to the IC device 9 (see FIG. 8 ). Such an inspection manipulator 43 has a support frame 431 supported by the base 11, a movable frame 432 supported by the support frame 431 and capable of reciprocating in the Y direction relative to the support frame 431, and four hands supported by the movable frame 432. Unit (holding robot) (electronic component holding unit) 433 .

Each hand unit 433 is provided with a lifting mechanism and a suction nozzle 434 (see FIG. 5 ), and can grip (hold) the IC device 9 by suction. Since the hand units 433 are the same, one of them will be described below.

The hand unit 433 has a shape corresponding to the concave portion 55 of the holding portion 51 of the inspection portion 5 described later when viewed from the Z direction (vertical direction). Specifically, the hand unit 433 has a quadrangular shape when viewed from the Z direction, and is slightly smaller than the inner peripheral portion of the concave portion 55 . In addition, in this embodiment, the quadrilateral is a square (or a rectangle). The hand unit 433 is arranged at a position at a predetermined distance from the holding portion 51 when the IC device 9 is dropped into the recess 55 of the holding portion 51, whereby the recess 55 can be covered by the hand unit 433 (see FIGS. Figure 8).

In addition, a tube connected to a suction pump (not shown) is connected to the suction nozzle 434 , and the IC device 9 is suctioned by the operation of the suction pump. In addition, the driving of the suction pump is controlled by the control unit 8 .

Recycling manipulator

The collection robot 44 is a robot that transports the IC device 9 that has been inspected by the inspection unit 5 to the collection side alignment unit 6 . Such a recovery robot 44 has a support frame 441 supported by the base 11, a moving frame 442 supported by the support frame 441 and capable of reciprocating in the Y direction relative to the support frame 441, and four hands supported by the moving frame 442. Unit (manipulator) 443. Each hand unit 443 is equipped with a lifting mechanism and a suction nozzle, and can hold the IC device 9 by suction.

Such a transport unit 4 transports the IC device 9 as follows. First, the shuttle 41 moves to the left in the drawing, and the supply robot 42 transports the IC device 9 on the loading operation table 341 to the shuttle 41 (STEP1). Next, the shuttle 41 moves toward the center, and the inspection manipulator 43 transports the IC device 9 on the shuttle 41 to the inspection part 5 (STEP2). Next, the inspection robot 43 transports the IC device 9 that has been inspected by the inspection unit 5 to the shuttle 41 (STEP 3 ). Next, the shuttle 41 moves to the right in the figure, and the recovery manipulator 44 transports the inspected IC devices 9 on the shuttle 41 to the recovery-side arrangement unit 6 . By repeating such STEP1 to STEP3 , the IC device 9 can be transported to the collection-side arrangement unit 6 via the inspection unit 5 .

The configuration of the transport unit 4 has been described above. However, as a configuration of the transport unit 4, if the IC device 9 on the mounting operation table 341 can be transported to the inspection unit 5, and the IC device 9 that has been inspected can be transported to The recovery side alignment part 6 is not particularly limited. For example, the shuttle 41 may also be omitted, and any one of the supply manipulator 42, the inspection manipulator 43, and the recovery manipulator 44 may be used to carry out transportation from the loading operation table 341 to the inspection unit 5, and arrange from the inspection unit 5 to the recovery side. Part 6 of the transport.

inspection department

The inspection unit 5 is a unit for inspecting and testing the electrical characteristics of the IC device 9 . As shown in FIG. 2 , the inspection section 5 has four holding sections 51 where the IC devices 9 are arranged. A plurality of probes (not shown) electrically connected to terminals of the IC device 9 are respectively provided on these holding portions 51 . Each probe is electrically connected to the control unit 8 . During inspection of the IC device 9 , one IC device 9 is arranged (held) in one holding portion 51 . The respective terminals 92 of the IC device 9 disposed on the holding portion 51 are pressed by the hand unit 433 of the inspection manipulator 43 against the respective probes with a predetermined inspection pressure. Accordingly, each terminal 92 of the IC device 9 is electrically connected (contacted) to each probe, and the IC device 9 is inspected via the probe. The inspection of the IC device 9 is performed based on the program stored in the control unit 8 . In addition, the holding part 51 will be described in detail later.

control department

The control unit 8 includes, for example, an inspection control unit and a drive control unit. The inspection control unit performs control such as inspection of electrical characteristics of the IC device 9 arranged in the inspection unit 5 based on a program stored in a memory not shown, for example. In addition, the drive control unit, for example, controls the driving of each of the supply unit 2, the supply side alignment unit 3, the transport unit 4, the inspection unit 5, the collection side alignment unit 6, and the collection unit 7, and carries out the transportation of the IC device 9 and the delivery of the IC device 9 to the collection unit 7. Positioning of the holding portion 51 and the like are controlled.

positioning mechanism

Next, the positioning mechanism 100 will be described, but since the positioning mechanisms 100 of the four holding units 51 of the inspection unit 5 are the same, one of them will be described below.

As shown in FIGS. 3 to 8 , the positioning mechanism 100 includes a holding part 51 having a holding part main body 510 , two pipe bodies 135 and 136 , two valves 145 and 146 , two pumps 155 and 156 , and a hand unit 433 . The lumens of the pipe bodies 135 and 136 are channels through which the air G (fluid) flows. In addition, a portion (one end portion) of the pipe bodies 135 and 136 inserted into a wall portion 53 described below of the holding portion main body 510 is a structural member of the holding portion 51 . That is, the holding part 51 holding the IC device 9 is constituted by the holding part main body 510 , the portion (one end part) of the pipe bodies 135 and 136 inserted into the wall part 53 , and the like.

As shown in FIGS. 5 to 8 , the holding unit main body 510 includes a substrate 54 having a holding surface (electronic component holding surface) 52 for holding the IC device 9 , and a wall portion 53 provided on the substrate so as to surround the holding surface 52 . . It should be noted that the holding surface 52 is parallel to the XY plane.

In addition, the shape of the wall portion 53 is not particularly limited, but in the present embodiment, the wall portion 53 has a quadrangular frame shape and is formed on the outer peripheral portion of the substrate 54 . That is, when viewed from the Z direction, the shape of the inner surface and the shape of the outer surface of the wall portion 53 are respectively quadrangular. In addition, in this embodiment, the quadrilateral is a square or a rectangle. As a result, a rectangular concave portion 55 is formed in the holding portion main body 510 when viewed from the Z direction. The bottom surface of the concave portion 55 is the holding surface 52 .

In addition, the four surfaces erected with respect to the holding surface 52 , that is, the first wall surface 553 , the second wall surface 554 , the third wall surface 555 , and the fourth wall surface 556 constitute the inner surface of the concave portion 55 . Adjacent wall surfaces of the first wall surface 553 to the fourth wall surface 556 are perpendicular to each other. Moreover, the first wall surface 553 and the second wall surface 554 form a first corner 551 at right angles, and the third wall 555 and the fourth wall 556 are arranged at positions opposite to the first corner 551 to form a second corner at right angles. 552. In this embodiment, as shown in FIG. 4 , one corner 94 of the four corners of the IC device 9 is brought into collision contact with the first corner 551 for positioning. In this manner, in the holding portion 51 , the first corner portion 551 is set as a reference point (positioning portion) for positioning the IC device 9 within the holding portion 51 .

An inclined surface 531 is formed on the upper portion of the inner peripheral portion of the wall portion 53 so that the inner side is lower than the outer side. This makes it easy to insert the IC device 9 into the recess 55 along the inclined surface 531 and arrange it on the holding surface 52 when the IC device 9 is placed on the holding portion 51 .

In addition, one end portions of the pipe bodies 135 and 136 are connected to the wall portion 53 of the holding portion main body 510 . In this case, one end portions of the pipe bodies 135 and 136 are arranged at opposite corners of the quadrilateral, respectively. An opening (opening) 1351 at one end of the tube body 135 is arranged at the first corner 551 and opened, and an opening (opening) 1361 at one end of the tube 136 is arranged at the second corner 552 and opened.

In this embodiment, the portion (one end) of the tube 135 inserted into the wall 53 constitutes the first flow path, and the portion (one end) of the tube 136 inserted into the wall 53 constitutes the second flow path. As shown in FIGS. 3 and 4 , the first vector V ₁ representing the flow of the air G flowing in the first flow path is not perpendicular to the first wall surface 553 and the second wall surface 554 , respectively. That is, the angle formed by the first vector V ₁ and the first wall 553 is 45°, and the angle formed by the first vector V ₁ and the second wall 554 is also 45°. In addition, the second vector V ₂ indicating the flow of the fluid flowing in the second channel is also not perpendicular to the first wall surface 553 and the second wall surface 554 . That is, the angle formed by the second vector V ₂ and the first wall 553 is 45°, and the angle formed by the second vector V ₂ and the second wall 554 is also 45°. As shown in FIG. 6 , since the first vector V ₁ and the second vector V ₂ are oriented in the same direction, the IC device 9 can be easily moved to the first reference point for positioning when the IC device 9 is falling. One corner 551 side.

It should be noted that when the top view shape of the IC device 9 is a square, the angle formed by the first vector V1 and the _first wall surface 553 is 45°, but the top view shape of the IC device 9 is a quadrilateral other than a square. (For example, in the case of a rectangle), the angle formed by the first vector V ₁ and the first wall surface 553 is not 45°, but a diagonal direction.

As shown in FIG. 6 , the openings 1351 and 1361 are arranged below the terminal arrangement surface 93 in the Z direction when the IC device 9 is held by the holding portion 51 . With such an arrangement, the IC device 9 can be floated by the airflow in the concave portion 55 , and the IC device 9 can be sufficiently moved to the first corner portion 551 side when positioning the IC device 9 .

In addition, in this embodiment, although the positional relationship of the Z direction of the opening 1351 and the opening 1361 is the same position, it is not limited to this, and may be a different position. In this case, it is preferable that the opening 1361 is located above the opening 1351 in the Z direction. This configuration is effective when the IC device 9 is to be pushed to the side of the holding surface 52 of the concave portion 55 .

In addition, although the size of the opening 1351 and the opening 1361 are the same in this embodiment, they are not limited thereto and may be different. In this case, opening 1351 is preferably smaller than opening 1361 .

In addition, as shown in FIGS. 3 and 4 , the inner diameters of the pipe bodies 135 and 136 on the downstream side may be reduced.

A pump 155 is connected to the other end of the pipe body 135 which is different from the one end. In addition, a valve 145 is provided in the middle of the pipe body 135 . On the other hand, a pump 156 is connected to the other end portion of the pipe body 136 different from the one end portion. In addition, a valve 146 is provided in the middle of the pipe body 136 . The pump 156 is an injection unit that injects the air G, and the pump 155 is a suction unit that sucks the air G. As shown in FIG. When the air G is injected from the pump 156 by the operation of the pump 156 , the air G flows in the pipe body 136 and is injected from the opening 1361 into the concave portion 55 . Also, when the pump 155 sucks the air G by the operation of the pump 155 , the air G in the recess 55 is sucked (discharged) from the opening 1351 , and the air G flows in the tube body 135 and is discharged to the outside. In addition, the pump for jetting the air G can be replaced with a compressed air generation source such as a compressor or a gas cylinder.

In addition, the suction force obtained through the opening 1351 exceeds the atmospheric pressure at most, and the IC device 9 can be positioned regardless of the magnitude of friction between the holding surface 52 of the concave portion 55 and the IC device 9 .

In addition, the inner cavity of the tubular body 135 can be opened and closed by opening and closing the valve 145 , and the inner cavity of the tubular body 136 can be opened and closed by opening and closing the valve 146 . In addition, if valves 145 and 146 whose openings can be adjusted are used, the flow rate of the air G flowing in the pipe bodies 135 and 136 can be adjusted by adjusting the openings described above. That is, the injection pressure or the injection flow rate of the air G can be adjusted by adjusting the opening degree of the valve 146 . In addition, the suction pressure or suction flow rate of the air G can be adjusted by adjusting the opening degree of the valve 145 . Therefore, the valve 146 constitutes an adjustment unit that adjusts the injection pressure or the injection flow rate of the air G, and the valve 145 constitutes an adjustment unit that adjusts the suction pressure or the suction flow rate of the air G.

In addition, the injection pressure of the air G and the suction pressure of the air G may be the same or different. When the injection pressure of the air G is different from the suction pressure of the air G, it is preferable that the injection pressure of the air G is higher than the suction pressure of the air G.

In addition, the flow rate of the air G flowing in the tube bodies 135 and 136 can also be adjusted by adjusting the outputs of the pumps 155 and 156 . In addition, the driving of the pumps 155 and 156 and the valves 145 and 146 is controlled by the control unit 8 .

Next, the operation in the case of positioning the IC device 9 on the holding portion 51 will be described.

First, as shown in FIG. 5 , the IC device 9 is held by the hand unit 433 , and the IC device 9 is inserted into a predetermined position in the concave portion 55 of the holding portion 51 . In the present embodiment, the lower end of the hand unit 433 is arranged at the upper end in the recess 55, and the hand unit 433 is stopped. Thus, the recess 55 is covered by the hand unit 433 . Thereby, leakage of the air G from the recess 55 can be suppressed, and IC device 9 can be prevented from flying out of the recess 55 due to air flow.

Next, as shown in FIG. 6 , the IC device 9 is released from the hand unit 433 , that is, detached. Thereby, the IC device 9 starts to fall freely in the concave portion 55 . In addition, as described above, the air G is ejected from the tube body 136 and the air G is sucked from the tube body 135 as the hand unit 433 releases the IC device 9 , that is, in synchronization with the release operation. Thus, when the IC device 9 falls, the air G flows in a direction different from the direction in which the IC device 9 falls, that is, the air G pushes the IC device 9 toward the first corner 551 even if the IC device 9 faces the first corner. The direction in which the part 551 side moves flows. Then, the IC device 9 is pushed toward the first corner 551 by the air flow (wind pressure) during the free fall so that the corner 94 collides with the first corner 551 , and reaches the holding surface 52 in this state. Through the above operation, the positioning of the IC device 9 is completed (see FIG. 7 ).

In this way, in the holding portion 51, when the IC device 9 is positioned, the flow of the air G in the direction in which the air G passes through the first corner portion 551 is generated during the falling of the IC device 9, thereby enabling The IC device 9 is smoothly moved to the positioning reference point. Thereby, positioning of the IC device 9 is easily performed.

In addition, as shown in FIG. 7 , it is preferable to maintain such a flow of the air G at least until the IC device 9 is placed on the holding surface 52 .

In addition, as described above, the IC device 9 is lifted by the air flow in the recessed portion 55 . In this way, the air time of the IC device 9 can be obtained, and therefore, the IC device 9 can be fully leaned against the first corner 551 , which facilitates the positioning of the IC device 9 .

Next, as shown in FIG. 8 , the hand unit 433 is lowered from the state shown in FIG. 7 , and the IC device 9 is pressed downward by the hand unit 433 . By pressing the hand unit 433, each terminal 92 of the IC device 9 is electrically connected to each probe. After that, inspection of the IC device 9 is performed.

(second embodiment)

9 is a horizontal cross-sectional view showing a holding portion of a transport portion included in the electronic component inspection apparatus (second embodiment) of the present invention.

Hereinafter, a second embodiment of an electronic component conveying device and an electronic component inspection device according to the present invention will be described with reference to this figure, but the description will focus on differences from the above-mentioned embodiment, and the description of the same matters will be omitted.

This embodiment is the same as the above-mentioned first embodiment except that the arrangement position of the positioning mechanism is different.

As shown in FIG. 9 , in this embodiment, the positioning mechanism 100 is arranged to hold uninspected IC devices 9 and move them to the vicinity of the inspection section 5, and to hold and move inspected IC devices 9 to the collection side. On the shuttle member 41 near the arrangement part 6. The positioning mechanisms 100 in the pockets 411 of the shuttle 41 are the same, so one of them will be described below.

The positioning mechanism 100 is connected to the shuttle member 41 and has two tubes 165 and 166 communicating with the groove 411 , two valves 175 and 176 , and two pumps 185 and 186 . The inner cavity of the tube body 165 is the first flow path for sucking the air G, and the inner cavity of the tube body 166 is the second flow path for ejecting the air G.

When viewed from the Z direction, the groove 411 is square (or rectangular), and the opening 1651 of the pipe body 165 is arranged at the first corner 417 formed by the first wall surface 413 and the second wall surface 414 as the inner surface of the groove 411 . In addition, the opening 1661 of the pipe body 166 is arranged at the second corner portion 418 formed by the third wall surface 415 and the fourth wall surface 416 which are inner surfaces of the groove 411 . It should be noted that, in the shuttle 41 , the first corner portion 417 is set as a reference point (positioning portion) for positioning the IC device 9 within the groove 411 .

Moreover, the angle formed by the first vector V ₁ representing the flow of the air G flowing in the first flow path and the first wall surface 413 is 45°, and the angle formed by the first vector V ₁ and the second wall surface 414 is also 45°. °. In addition, the angle formed by the second vector V ₂ representing the flow of the fluid flowing in the second flow path and the first wall surface 413 is 45°, and the angle formed by the second vector V ₂ and the second wall surface 414 is also 45°. °.

It should be noted that when the top view shape of the IC device 9 is a square, the angle formed by the first vector V1 and the _first wall surface 413 is 45°, but the top view shape of the IC device 9 is a quadrilateral other than a square. (For example, in the case of a rectangle), the angle formed by the first vector V ₁ and the first wall surface 413 is not 45°, but a diagonal direction.

As described above, even with the positioning mechanism 100 disposed on the shuttle 41, it is possible to easily move the IC device 9 to the position when the IC device 9 falls into the groove 411, almost the same as the first embodiment. The side of the first corner 417 serves as a reference point for positioning. Thereby, positioning of the IC device 9 can be performed easily.

(third embodiment)

10 is a horizontal cross-sectional view showing a holding portion of an inspection portion included in the electronic component inspection apparatus (third embodiment) of the present invention.

Hereinafter, a third embodiment of an electronic component conveying device and an electronic component inspection device according to the present invention will be described with reference to this figure, but the description will focus on differences from the above-mentioned embodiment, and the description of the same matters will be omitted.

This embodiment is the same as the first embodiment described above except for the difference in the structure of the positioning mechanism.

As shown in FIG. 10 , in this embodiment, the positioning mechanism 100 has four pipes 131 , 132 , 133 and 134 connected to the holding part 51 , four valves 141 , 142 , 143 and 144 , and four pumps 151 , 152, 153, and 154. The lumens of the tube bodies 131 to 134 are channels through which air (fluid) flows. In addition, openings (openings) 1311 , 1321 , 1331 , and 1341 at one ends of the pipe bodies 131 to 134 are open on the inner surface of the wall portion 53 . In addition, the portion (one end) of the pipe body 131 inserted into the wall 53 constitutes a first flow path, and the portion (one end) of the pipe body 132 inserted into the wall 53 constitutes another first flow path. In addition, the portion (one end) of the pipe body 133 inserted into the wall 53 constitutes a second flow path, and the portion (one end) of the pipe body 134 inserted into the wall 53 constitutes another second flow path.

In this embodiment, one end of the tubes 131 and 132 is disposed near the first corner 551 of the recess 55 , and one end of the pipes 133 and 134 is disposed near the second corner 552 of the recess 55 . And, one end of the pipe body 131 is perpendicular to the first wall surface 553 forming the inner surface of the recess 55, one end of the pipe body 132 is perpendicular to the second wall surface 554 forming the inner surface of the recess 55, and one end of the pipe body 133 is perpendicular to the inner surface of the recess 55. The third wall surface 555 constituting the inner surface of the concave portion 55 is perpendicular to the third wall surface 555 , and one end portion of the pipe body 134 is perpendicular to the fourth wall surface 556 constituting the inner surface of the concave portion 55 .

Thus, the angle formed by the first vector V ₁ representing the flow of fluid flowing at one end of the pipe body 131 and the first vector V ₁ representing the flow of fluid flowing at one end of the pipe body 132 is 90°. Accordingly, a vector obtained by combining both vectors is a vector in a direction that directs the IC device 9 toward the first corner portion 551 . In addition, the angle formed by the second vector V ₂ representing the flow of fluid flowing at one end of the pipe body 133 and the second vector V ₂ representing the flow of fluid flowing at one end of the pipe body 134 is 90°. Accordingly, a vector obtained by combining both vectors is also a vector that directs the IC device 9 toward the first corner portion 551 .

With the positioning mechanism 100 that generates such a vector, as in the first embodiment, the falling IC device 9 can be moved to the side of the first corner portion 551 as a reference point for positioning, so that the IC device can be easily aligned. 9 positioning.

In addition, in the positioning mechanism 100, the flow path direction of one end of the tube body 131 and the flow path direction of one end of the tube body 132 may intersect. The direction of the flow path at one end may cross. That is, the angle formed by the first vector V ₁ representing the flow of fluid flowing at one end of the pipe body 131 and the first vector V ₁ representing the flow of fluid flowing at one end of the pipe body 132 is not 0° and 180°. °, the angle formed by the second vector V ₂ representing the flow of fluid flowing at one end of the pipe body 133 and the second vector V ₂ representing the flow of fluid flowing at one end of the pipe body 134 is not 0° And 180° is enough.

As mentioned above, the electronic component conveyance apparatus and the electronic component inspection apparatus of this invention were demonstrated based on the embodiment shown in figure, but this invention is not limited to this, Each part which comprises an electronic component conveyance apparatus and an electronic component inspection apparatus can be replaced with the Each part of arbitrary structure showing the same function. In addition, arbitrary structures may be added.

In addition, the electronic component conveyance apparatus and the electronic component inspection apparatus of this invention may be the apparatus which combined arbitrary two or more structures (features) in each said embodiment.

In addition, of course, the number and arrangement of the grooves of the shuttle, the number and arrangement of the hand units of the supply manipulator, the number and arrangement of the hand units of the inspection manipulator, and the arrangement of the hand units of the recovery manipulator The arrangement number and arrangement form, and the arrangement number and arrangement form of the holding units of the inspection unit are not limited to the configuration shown in FIG. 2 .

In addition, in each of the above-described embodiments, the electronic component holding portion has both the first flow path and the second flow path, but the present invention is not limited to this, and the second flow path may be omitted.

In addition, in the above-mentioned embodiments, air is used as the fluid, but in the present invention, it is not limited to this, and various fluids such as nitrogen, argon, carbon dioxide, fluorine-based gases, and mixed gases including these gases can be used. Insulating gas and other gases.

DESCRIPTION OF SYMBOLS: 1...inspection device, 10...conveying device, 100...positioning mechanism, 11...base, 111...base surface, 12...cover, 2...supply unit, 3...supply-side alignment unit, 341...placement operation table , 4...conveyor, 41...shuttle, 411...groove, 413...first wall, 414...second wall, 415...third wall, 416...fourth wall, 417...first corner, 418... Second corner, 42...supply manipulator, 421...supporting frame, 422...moving frame, 423...hand unit, 43...inspecting manipulator, 431...supporting frame, 432...moving frame, 433...hand unit, 434...adsorption Nozzle, 44...Recovery manipulator, 441...Support frame, 442...Movement frame, 443...Hand unit, 5...Inspection part, 51...Holding part, 510...Holding part main body, 52...Holding surface, 53...Wall part, 531 ...inclined surface, 54...substrate, 55...recess, 551...first corner, 552...second corner, 553...first wall, 554...second wall, 555...third wall, 556...fourth wall, 6...recovery side arrangement part, 7...recovery part, 8...control part, 9...IC device, 91...main part, 92...terminal, 93...terminal arrangement surface, 94...corner part, 131, 132, 133, 134, 135, 136, 165, 166... pipe body, 1311, 1321, 1331, 1341, 1351, 1361, 1651, 1661... opening, 141, 142, 143, 144, 145, 146, 175, 176... valve, 151, 152 , 153, 154, 155, 156, 185, 186...pump, G...air, V1... _first vector, V2... _second vector.

Claims (9)

1. An electronic component delivery device, characterized in that it has: an electronic component holding unit that holds the electronic component; and an electronic component holding section that holds the electronic component, A flow path through which a fluid flows is formed in the electronic component holding portion, When the electronic component holding portion releases the electronic component to drop the electronic component, the fluid flows in a direction different from the direction in which the electronic component falls. 2. The electronic component transport device according to claim 1, wherein: The electronic component holding part is provided with: recesses; and a positioning part arranged in the concave part, the positioning part positions the electronic component when the electronic component abuts against it, When the electronic component gripping portion releases the electronic component to drop the electronic component, the fluid flows in a direction to move the electronic component toward the positioning portion. 3. The electronic component transport device according to claim 1 or 2, wherein: The electronic component holding portion has a first wall surface and a second wall surface constituting a first corner portion, the first wall is perpendicular to the second wall, The electronic component holding portion has a first flow path disposed at the first corner portion through which the fluid flows, The first vector representing the flow of the fluid flowing in the first flow path is not perpendicular to the first wall surface and the second wall surface, respectively. 4. The electronic component transport device according to claim 3, wherein: The electronic component holding portion has a third wall surface and a fourth wall surface constituting a second corner portion, the second corner portion being arranged at a position diagonal to the first corner portion, The electronic component holding portion has a second flow path disposed at the second corner portion through which the fluid flows, The second vector representing the flow of the fluid flowing in the second flow path is not perpendicular to the first wall surface and the second wall surface, respectively. 5. The electronic component transport device according to claim 4, wherein: A suction unit for sucking the fluid is connected to the first flow path, An injection unit that injects the fluid is connected to the second flow path. 6. The electronic component delivery device according to claim 4 or 5, wherein: The electronic component includes a main body and a plurality of terminals provided on the main body, At least a part of the opening of the second flow path is arranged vertically below a terminal arrangement surface of the main body part on which the terminals are arranged in a state where the electronic component is held by the electronic component holding part. . 7. The electronic component transport device according to any one of claims 1 to 6, wherein: The electronic component holding portion holds the electronic component while inspecting the electronic component. 8. The electronic component transport device according to any one of claims 1 to 7, wherein: The electronic component holding unit holds the electronic component and moves it to a predetermined position. 9. An electronic component inspection device, comprising: an electronic component holding unit, which holds the electronic component; an electronic component holding portion that holds the electronic component; and an inspection section that inspects the electronic components, A flow path through which a fluid flows is formed in the electronic component holding portion, When the electronic component holding portion releases the electronic component to drop the electronic component, the fluid flows in a direction different from the direction in which the electronic component falls.