CN106179402A - A kind of preparation method of nanoporous palladium catalytic membrane - Google Patents
A kind of preparation method of nanoporous palladium catalytic membrane Download PDFInfo
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims abstract description 119
- 229910052763 palladium Inorganic materials 0.000 title claims abstract description 44
- 230000003197 catalytic effect Effects 0.000 title claims abstract description 38
- 239000012528 membrane Substances 0.000 title claims abstract description 34
- 238000002360 preparation method Methods 0.000 title claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 18
- 230000007935 neutral effect Effects 0.000 claims abstract description 13
- 239000000203 mixture Substances 0.000 claims abstract description 3
- 239000000243 solution Substances 0.000 claims description 73
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 40
- 238000007747 plating Methods 0.000 claims description 32
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 30
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 30
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 27
- ICSNLGPSRYBMBD-UHFFFAOYSA-N 2-aminopyridine Chemical compound NC1=CC=CC=N1 ICSNLGPSRYBMBD-UHFFFAOYSA-N 0.000 claims description 24
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 22
- 239000003638 chemical reducing agent Substances 0.000 claims description 21
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 21
- 235000019270 ammonium chloride Nutrition 0.000 claims description 20
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 19
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 19
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 19
- 239000008367 deionised water Substances 0.000 claims description 18
- 229910021641 deionized water Inorganic materials 0.000 claims description 18
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 16
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 16
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 14
- 238000005260 corrosion Methods 0.000 claims description 14
- 230000007797 corrosion Effects 0.000 claims description 14
- 238000005275 alloying Methods 0.000 claims description 12
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 11
- 229910017604 nitric acid Inorganic materials 0.000 claims description 11
- 230000004913 activation Effects 0.000 claims description 10
- 239000004743 Polypropylene Substances 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 8
- 229920006267 polyester film Polymers 0.000 claims description 8
- -1 polypropylene Polymers 0.000 claims description 8
- 229920001155 polypropylene Polymers 0.000 claims description 8
- 238000007788 roughening Methods 0.000 claims description 8
- 239000007864 aqueous solution Substances 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 6
- 150000002500 ions Chemical class 0.000 claims description 6
- 238000001179 sorption measurement Methods 0.000 claims description 6
- 239000011259 mixed solution Substances 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 abstract description 14
- 239000000956 alloy Substances 0.000 abstract description 14
- 239000011148 porous material Substances 0.000 abstract description 11
- 239000000126 substance Substances 0.000 abstract description 4
- 238000007772 electroless plating Methods 0.000 abstract description 2
- 239000003929 acidic solution Substances 0.000 abstract 1
- 238000006555 catalytic reaction Methods 0.000 abstract 1
- 239000012153 distilled water Substances 0.000 abstract 1
- 239000002120 nanofilm Substances 0.000 abstract 1
- 239000007783 nanoporous material Substances 0.000 abstract 1
- 239000002243 precursor Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 69
- 239000010409 thin film Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 229910000510 noble metal Inorganic materials 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000002242 deionisation method Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
- B01J23/70—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of the iron group metals or copper
- B01J23/89—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of the iron group metals or copper combined with noble metals
- B01J23/8926—Copper and noble metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J35/00—Catalysts, in general, characterised by their form or physical properties
- B01J35/40—Catalysts, in general, characterised by their form or physical properties characterised by dimensions, e.g. grain size
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J35/00—Catalysts, in general, characterised by their form or physical properties
- B01J35/60—Catalysts, in general, characterised by their form or physical properties characterised by their surface properties or porosity
- B01J35/64—Pore diameter
- B01J35/647—2-50 nm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- Nanotechnology (AREA)
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Abstract
本发明公开了一种纳米多孔钯催化膜的制备方法,属于纳米多孔材料及催化技术领域。本发明采用化学镀及去合金化的方法制备纳米多孔钯,首先在有机薄膜载体上化学沉积一层Pd基(Pd/Cu)先驱体合金纳米膜,然后通过热处理去除有机薄膜载体并均匀化合金纳米膜的化学成分,在酸性溶液中进行去合金化处理,最后在蒸馏水中洗至中性得到膜厚、孔径都为纳米量级(1‑100nm)的三维催化性自支撑纳米多孔膜。
The invention discloses a method for preparing a nanoporous palladium catalytic membrane, which belongs to the technical field of nanoporous materials and catalysis. The present invention adopts electroless plating and dealloying methods to prepare nanoporous palladium, first chemically deposits a layer of Pd-based (Pd/Cu) precursor alloy nano-film on the organic film carrier, and then removes the organic film carrier and homogenizes the alloy by heat treatment The chemical composition of the nano-membrane is dealloyed in an acidic solution, and finally washed to neutral in distilled water to obtain a three-dimensional catalytic self-supporting nano-porous membrane with a film thickness and a pore size of nanometer scale (1-100nm).
Description
技术领域technical field
本发明涉及一种纳米多孔钯催化膜的制备方法,具体涉及一种三维催化性自支撑纳米多孔钯催化膜的制备方法,属于纳米多孔金属材料的制备方法技术领域。The invention relates to a preparation method of a nanoporous palladium catalytic membrane, in particular to a preparation method of a three-dimensional catalytic self-supporting nanoporous palladium catalytic membrane, belonging to the technical field of preparation methods of nanoporous metal materials.
背景技术Background technique
由于钯的原子结构特点,对很多重要反应具有优异的催化活性,催化选择性高、稳定性好,Pd催化剂在工业催化中的加氢反应、裂解反应、重整反应、脱氢反应、异构化反应和脱羧反应中具有广泛的应用;Pd催化剂在环境保护方面也具有广泛的应用前景,特别是在汽车尾气处理中可将废气中的碳氢化物、一氧化碳和氮氧化物等有毒气体转化为无害的气体;另外,Pd催化剂由于其优异的甲醇电催化活性、甲酸电催化活性及氧电还原活性,在质子交换膜燃料电池中表现出了潜在的应用价值。Due to the atomic structure characteristics of palladium, it has excellent catalytic activity for many important reactions, high catalytic selectivity and good stability. Pd catalysts also have broad application prospects in environmental protection, especially in the treatment of automobile exhaust, which can convert toxic gases such as hydrocarbons, carbon monoxide and nitrogen oxides in exhaust gases into Harmless gas; In addition, Pd catalyst has shown potential application value in proton exchange membrane fuel cells due to its excellent methanol electrocatalytic activity, formic acid electrocatalytic activity and oxygen electroreduction activity.
目前,去合金化是制备纳米多孔钯催化膜的主要方法,其制备方法通常是通过合金熔炼、轧制的方法获得一定厚度的合金薄膜,或者通过沉积(PVD、电镀等)的方法在基体(金属、陶瓷、活性炭等非有机物)膜上沉积一层合金膜,然后再对合金进行去合金化处理,在基体表面形成三维连续的纳米多孔膜。在熔炼-轧制-去合金化的方法中,由于贵金属合金的塑性极限,通常其合金薄膜的厚度≥20μm,去合金化后最终获得的多孔膜,其表面为三维连续的纳米多孔贵金属,芯部仍然为实体合金,芯部合金中的贵金属并未能获得充分地利用,且其纳米孔结构在厚度方向被芯部实体合金所阻断;对于沉积-去合金化的方法,最终获得的多孔膜,其结构为表面为三维连续纳米多孔贵金属,芯部为基体膜,其纳米孔结构在厚度方向也被基体所阻断,也并非真正意义上的三维连续纳米多孔膜。At present, dealloying is the main method to prepare nanoporous palladium catalytic membrane. The preparation method is usually to obtain a certain thickness of alloy film by alloy smelting and rolling, or by depositing (PVD, electroplating, etc.) on the substrate ( Metal, ceramics, activated carbon and other non-organic substances) film is deposited on a layer of alloy film, and then the alloy is dealloyed to form a three-dimensional continuous nanoporous film on the surface of the substrate. In the method of smelting-rolling-dealloying, due to the plasticity limit of noble metal alloys, the thickness of the alloy film is usually ≥ 20 μm. The part is still a solid alloy, the noble metal in the core alloy has not been fully utilized, and its nanopore structure is blocked by the core solid alloy in the thickness direction; for the deposition-dealloying method, the final porous The structure of the membrane is a three-dimensional continuous nanoporous noble metal on the surface, the core is a matrix membrane, and its nanopore structure is also blocked by the matrix in the thickness direction, and it is not a three-dimensional continuous nanoporous membrane in the true sense.
发明内容Contents of the invention
本发明为克服颗粒负载型催化剂的不足,提供一种新型结构的纳米多孔钯催化膜的制备方法,在有机薄膜载体上化学镀一层厚度为纳米量级的合金膜,然后通过热处理去除有机薄膜载体并均匀化合金纳米膜的化学成分,最后采用去合金化的方法获得膜厚及孔径均为纳米量级的三维纳米多孔钯催化膜。In order to overcome the shortcomings of particle-supported catalysts, the present invention provides a method for preparing a nano-porous palladium catalytic membrane with a novel structure. An alloy film with a thickness of nanometers is electrolessly plated on an organic film carrier, and then the organic film is removed by heat treatment. Carrier and homogenize the chemical composition of the alloy nano-membrane, and finally use the method of de-alloying to obtain a three-dimensional nano-porous palladium catalytic membrane with a film thickness and a pore size of nanometer scale.
本发明纳米多孔钯催化膜的制备方法具体包括以下步骤:The preparation method of nanoporous palladium catalytic membrane of the present invention specifically comprises the following steps:
(1)有机薄膜的预处理(1) Pretreatment of organic film
用去离子水清洗有机薄膜表面,干燥后将有机薄膜放入60~70℃的粗化液中粗化5~15min,水洗后放入40~50℃的离子钯溶液中进行活化,待钯的络离子吸附达到平衡后加入1%~5%的次亚磷酸钠。Wash the surface of the organic film with deionized water. After drying, place the organic film in a roughening solution at 60-70°C for 5-15 minutes. After washing with water, place it in an ionic palladium solution at 40-50°C for activation. Add 1%~5% sodium hypophosphite after the adsorption of complex ions reaches equilibrium.
(2)复合镀(2) Composite plating
①将次磷酸钠溶液和氯化铵溶液混合得到还原剂,还原剂中次磷酸钠的浓度为10~20g/L、氯化铵的溶度为27~54g/L; ①Mix sodium hypophosphite solution and ammonium chloride solution to obtain a reducing agent, the concentration of sodium hypophosphite in the reducing agent is 10~20g/L, and the solubility of ammonium chloride is 27~54g/L;
②在氯化钯、氯化铜溶液中依次加入盐酸、氨水制成镀液,镀液中氯化钯的浓度为1~10g/L、氯化铜的浓度为1~20g/L、氨水的浓度为160~320mL/L(即氨水的加入量)、盐酸的浓度为2~10mL/L(即盐酸的加入量),按上述比例将溶液配制完成后用氨水调节镀液的pH值为8~10;所用盐酸为市售的的质量百分比浓度为37.2wt%盐酸;氨水为市售的质量百分比浓度为28wt%的氨水; ②Add hydrochloric acid and ammonia water to the palladium chloride and copper chloride solution in turn to make a plating solution. The concentration of palladium chloride in the plating solution is 1~10g/L, the concentration of copper chloride is 1~20g/L, and the concentration of ammonia water The concentration is 160~320mL/L (that is, the amount of ammonia added), and the concentration of hydrochloric acid is 2~10mL/L (that is, the amount of hydrochloric acid added). After the solution is prepared according to the above ratio, use ammonia to adjust the pH of the plating solution to 8 ~10; hydrochloric acid used is commercially available mass percent concentration and is 37.2wt% hydrochloric acid; ammoniacal liquor is commercially available mass percent concentration and is the ammoniacal liquor of 28wt%;
③将预处理后的有机薄膜浸渍于还原剂中2~10min,取出后室温下放置1~5min,再浸渍于50~60℃的镀液中20~60min,用去离子水洗至pH值呈中性得到附着于有机薄膜上的Pd/Cu合金薄膜(厚度为1-100nm)。 ③Immerse the pretreated organic film in the reducing agent for 2~10min, take it out and place it at room temperature for 1~5min, then immerse it in the plating solution at 50~60℃ for 20~60min, wash it with deionized water until the pH value is neutral The Pd/Cu alloy film (thickness 1-100nm) attached to the organic film can be obtained.
(3)热处理(3) heat treatment
将步骤(2)中获得的附着于有机薄膜上的Pd/Cu合金薄膜干燥后放入电炉中进行热处理,去除有机薄膜后即可获得Pd/Cu合金薄膜;其中干燥温度为40~50℃,时间为1~2h;热处理温度为500~700℃,时间为1~2h。 Dry the Pd/Cu alloy film attached to the organic film obtained in step (2) and put it into an electric furnace for heat treatment. After removing the organic film, the Pd/Cu alloy film can be obtained; the drying temperature is 40~50°C, The time is 1~2h; the heat treatment temperature is 500~700℃, and the time is 1~2h.
(3)去合金化(3) dealloying
采用自由腐蚀的方法去合金化制备纳米多孔钯催化膜,即将Pd/Cu合金薄膜浸渍于硝酸中自由腐蚀去合金化,去合金化后用去离子水清洗至pH值呈中性,干燥后即可得到三维催化性自支撑纳米多孔钯催化膜。The nanoporous palladium catalytic membrane is prepared by de-alloying by free corrosion method, that is, the Pd/Cu alloy film is immersed in nitric acid for free corrosion and de-alloying, after de-alloying, it is cleaned with deionized water until the pH value is neutral, and it is ready A three-dimensional catalytic self-supporting nanoporous palladium catalytic membrane can be obtained.
本发明所述有机薄膜为聚酯薄膜和聚丙烯薄膜中的一种,厚度为1~2mm。The organic film of the present invention is one of polyester film and polypropylene film, with a thickness of 1-2mm.
本发明所述粗化液为硫酸和铬酐的混合溶液,混合液中硫酸的浓度为100~300mL/L(采用市售硫酸配制),铬酐的浓度为350~450g/L ;所用硫酸为市售的质量百分数为98wt%的硫酸。The roughening solution of the present invention is the mixed solution of sulfuric acid and chromic anhydride, and the concentration of sulfuric acid in the mixed solution is 100~300mL/L (adopting commercially available sulfuric acid preparation), and the concentration of chromic anhydride is 350~450g/L; Sulfuric acid used is The commercially available mass percentage is 98wt% sulfuric acid.
本发明所述活化液的配制方式为:将氯化钯溶于氯化铵的水溶液中制成溶液A,将α-氨基吡啶溶于水中得到α-氨基吡啶水溶液,不断搅拌下将溶液A与α-氨基吡啶水溶液混合得到活化液,在活化液中氯化钯的浓度为0.3~0.6g/L,氯化铵的浓度为0.2~0.4 g/L;α-氨基吡啶的浓度为1~3 g/L。The preparation method of the activating solution of the present invention is: dissolving palladium chloride in the aqueous solution of ammonium chloride to make solution A, dissolving α-aminopyridine in water to obtain an aqueous solution of α-aminopyridine, and mixing solution A with The α-aminopyridine aqueous solution is mixed to obtain an activation solution. The concentration of palladium chloride in the activation solution is 0.3~0.6 g/L, the concentration of ammonium chloride is 0.2~0.4 g/L; the concentration of α-aminopyridine is 1~3 g/L.
本发明所述自由腐蚀去合金化法所用硝酸的浓度为60~70wt%,温度为10~30℃,时间为5~40h。The concentration of nitric acid used in the free corrosion dealloying method of the present invention is 60-70wt%, the temperature is 10-30°C, and the time is 5-40h.
发明原理:Invention principle:
(1)合金薄膜制备(1) Alloy film preparation
金属的化学镀的电化学机理是阴极金属沉积和还原剂的阳极氧化同时进行。The electrochemical mechanism of electroless plating of metals is that cathodic metal deposition and anodic oxidation of reducing agent proceed simultaneously.
阳极:anode:
阳极:anode:
根据阴阳极反应,以次磷酸钠为还原剂的化学镀钯、铜化学反应式如下:According to the reaction of cathode and anode, the chemical reaction formula of electroless palladium plating and copper plating with sodium hypophosphite as reducing agent is as follows:
(2)去合金化(2) dealloying
钯的化学性质稳定,不溶于强酸强碱,因此用硝酸作腐蚀液,硝酸只与铜发生反应,待Pd/Cu合金薄膜中铜完全腐蚀后即可获得纳米多孔钯,反应式如下:The chemical properties of palladium are stable and insoluble in strong acids and strong alkalis. Therefore, nitric acid is used as the etching solution. Nitric acid only reacts with copper. After the copper in the Pd/Cu alloy film is completely corroded, nanoporous palladium can be obtained. The reaction formula is as follows:
(3)孔结构(孔径、孔隙率)及膜厚的定量表征(3) Quantitative characterization of pore structure (pore size, porosity) and film thickness
通过有机薄膜在还原剂与镀液中反复浸润的次数调节Pd/Cu合金薄膜的厚度,每浸润一次Pd/Cu合金薄膜的厚度约增加7~10nm,最佳浸润次数为4~8次。硝酸不与钯反应而只腐蚀铜,因此膜厚度、孔径与孔隙率可通过调整氯化钯与氯化铜加入量的摩尔比例进行控制(孔径与孔隙率随氯化铜加入量的增加而增大)。The thickness of the Pd/Cu alloy film is adjusted by the number of repeated immersions of the organic film in the reducing agent and the plating solution. The thickness of the Pd/Cu alloy film increases by about 7-10nm each time the immersion is performed, and the optimal number of immersions is 4-8 times. Nitric acid does not react with palladium but only corrodes copper, so the film thickness, pore size and porosity can be controlled by adjusting the molar ratio of palladium chloride and copper chloride addition (the pore size and porosity increase with the increase of copper chloride addition. Big).
其定量关系为: Its quantitative relationship is:
式中X为钯的摩尔分数,Y为铜的摩尔分数。In the formula, X is the mole fraction of palladium, and Y is the mole fraction of copper.
本发明的有益效果:Beneficial effects of the present invention:
(1)采用去合金化方法制备的纳米多孔钯膜作为催化剂,消除了衬底的影响,有利于提高钯催化活性的稳定性。(1) The nanoporous palladium membrane prepared by the dealloying method is used as a catalyst, which eliminates the influence of the substrate and is beneficial to improve the stability of palladium catalytic activity.
(2)本发明获得的纳米多孔钯膜厚、孔径均为纳米量级且具有三维自支撑催化性,在催化过程中,不仅其双膜面具有催化作用,而且气体在膜厚方向上可透过该纳米多孔膜而被催化转化,从而实现贵金属纳米多孔膜的三维催化性,极大地提高了纳米多孔钯催化膜的催化性能和利用率。(2) The thickness and pore diameter of the nanoporous palladium film obtained by the present invention are both on the order of nanometers and have three-dimensional self-supporting catalytic properties. Through the nanoporous membrane, it is catalyzed and converted, so as to realize the three-dimensional catalytic performance of the noble metal nanoporous membrane, and greatly improve the catalytic performance and utilization rate of the nanoporous palladium catalytic membrane.
附图说明Description of drawings
图1为纳米多孔钯催化膜制备的工艺流程图。Figure 1 is a process flow diagram for the preparation of nanoporous palladium catalytic membrane.
具体实施方式detailed description
下面结合具体实施例对本发明作进一步详细说明,但本发明的保护范围并不限于所述内容。The present invention will be described in further detail below in conjunction with specific examples, but the protection scope of the present invention is not limited to the content described.
实施例1Example 1
(1)有机薄膜的预处理(1) Pretreatment of organic film
用去离子水清洗厚度为1mm的聚酯薄膜表面,干燥后将聚酯薄膜放入60℃的粗化液(其中硫酸:150mL/L,铬酐:350g/L)中粗化5min,水洗后放入40℃的离子钯溶液(其中氯化钯:0.3g/L,氯化铵:0.2 g/L,α-氨基吡啶:1 g/L)中进行活化,待钯的络离子吸附达到平衡后加入1%的次亚磷酸钠。Wash the surface of the polyester film with a thickness of 1 mm with deionized water, and after drying, place the polyester film in a roughening solution at 60°C (including sulfuric acid: 150mL/L, chromic anhydride: 350g/L) for 5 minutes, and wash it with water. Put it into ionic palladium solution (including palladium chloride: 0.3g/L, ammonium chloride: 0.2 g/L, α-aminopyridine: 1 g/L) at 40°C for activation until the complex ion adsorption of palladium reaches equilibrium Then add 1% sodium hypophosphite.
(2)复合膜(2) Composite film
①将次磷酸钠溶液和氯化铵溶液混合得到还原剂,还原剂中次磷酸钠的浓度为10g/L、氯化铵的溶度为27g/L;1. sodium hypophosphite solution and ammonium chloride solution are mixed to obtain reducing agent, the concentration of sodium hypophosphite in the reducing agent is 10g/L, the solubility of ammonium chloride is 27g/L;
②在氯化钯、氯化铜溶液中依次加入盐酸、氨水制成镀液,镀液中氯化钯的浓度为5.3g/L、氯化铜的浓度为8g/L、氨水的浓度为160mL/L、盐酸的浓度为10mL/L,按上述比例将溶液配制完成后用氨水调节镀液的pH值为8。② Add hydrochloric acid and ammonia water to the palladium chloride and copper chloride solution in turn to make a plating solution. The concentration of palladium chloride in the plating solution is 5.3g/L, the concentration of copper chloride is 8g/L, and the concentration of ammonia water is 160mL /L, the concentration of hydrochloric acid is 10mL/L, and the pH value of the plating solution is adjusted to 8 with ammonia water after the solution is prepared according to the above ratio.
③将预处理后的聚酯薄膜浸渍于还原剂中10min,取出后室温下放置2min,再浸渍于60℃的镀液中20min,用去离子水清洗至pH值呈中性得到附着于有机薄膜上的纳米厚度的Pd/Cu合金薄膜。③Immerse the pretreated polyester film in the reducing agent for 10 minutes, take it out, and place it at room temperature for 2 minutes, then immerse it in the plating solution at 60°C for 20 minutes, wash it with deionized water until the pH value is neutral, and then adhere to the organic film. nanometer-thick Pd/Cu alloy film.
(3)热处理(3) heat treatment
将步骤(2)③中获得的附着于有机薄膜上的Pd/Cu合金薄膜在40℃干燥1h后放入电炉中进行热处理(热处理温度为500℃,时间为1h),去除有机薄膜后即可获得Pd/Cu合金薄膜。Dry the Pd/Cu alloy film attached to the organic film obtained in step (2) ③, dry it at 40°C for 1 hour, then put it into an electric furnace for heat treatment (heat treatment temperature is 500°C, time is 1 hour), and remove the organic film. A Pd/Cu alloy thin film was obtained.
(4)去合金化(4) dealloying
采用自由腐蚀的方法去合金化制备纳米多孔钯催化膜,即将Pd/Cu合金薄膜浸渍于温度为10℃,浓度为65wt%浓硝酸中进行自由腐蚀去合金化,去合金化时间为40h,去合金化后用去离子水清洗至pH值呈中性,在40℃下干燥1h,即可得到三维催化性自支撑纳米多孔钯催化膜,其膜厚为2.7nm,孔径为7.2nm,孔隙率为72.7%。The nanoporous palladium catalytic membrane is prepared by free corrosion method dealloying, that is, the Pd/Cu alloy film is immersed in concentrated nitric acid at a temperature of 10°C and a concentration of 65wt% for free corrosion dealloying, and the dealloying time is 40h. After alloying, wash with deionized water until the pH value is neutral, and dry at 40°C for 1 hour to obtain a three-dimensional catalytic self-supporting nanoporous palladium catalytic membrane with a film thickness of 2.7nm and a pore diameter of 7.2nm. was 72.7%.
实施例2Example 2
(1)有机薄膜的预处理(1) Pretreatment of organic film
用去离子水清洗厚度为2mm的聚酯薄膜表面,干燥后将聚酯薄膜放入65℃的粗化液(其中稀硫酸:200mL/L,铬酐:400g/L)中粗化8min,水洗后放入45℃的离子钯溶液(其中氯化钯:0.4 g/L,氯化铵:0.3 g/L,α-氨基吡啶:2 g/L)中进行活化,待钯的络离子吸附达到平衡后加入2%的次亚磷酸钠。Wash the surface of the polyester film with a thickness of 2mm with deionized water, and after drying, place the polyester film in a roughening solution at 65°C (including dilute sulfuric acid: 200mL/L, chromic anhydride: 400g/L) for 8 minutes, and wash with water. Then put it into 45°C ionic palladium solution (including palladium chloride: 0.4 g/L, ammonium chloride: 0.3 g/L, α-aminopyridine: 2 g/L) for activation, until the complex ion adsorption of palladium reaches Add 2% sodium hypophosphite after equilibrium.
(2)复合镀(2) Composite plating
①将次磷酸钠溶液和氯化铵溶液混合得到还原剂,还原剂中次磷酸钠的浓度为15g/L、氯化铵的溶度为36g/L;1. sodium hypophosphite solution and ammonium chloride solution are mixed to obtain reducing agent, the concentration of sodium hypophosphite in the reducing agent is 15g/L, the solubility of ammonium chloride is 36g/L;
②在氯化钯、氯化铜溶液依次加入盐酸、氨水制成镀液,镀液中氯化钯的浓度为5g/L、氯化铜的浓度为10g/L、氨水的浓度为200mL/L、盐酸的浓度为4mL/L,按上述比例将溶液配制完成后用氨水调节镀液的pH值为9。②Add hydrochloric acid and ammonia water to the palladium chloride and copper chloride solution in turn to make a plating solution. The concentration of palladium chloride in the plating solution is 5g/L, the concentration of copper chloride is 10g/L, and the concentration of ammonia water is 200mL/L 1. The concentration of hydrochloric acid is 4mL/L, after the solution is prepared according to the above ratio, the pH value of the plating solution is adjusted to 9 with ammonia water.
③将预处理后的聚酯薄膜浸渍于还原剂中5min,取出后室温下放置3min,再浸渍于55℃的镀液中30min,用去离子水清洗至pH值呈中性得到附着于有机薄膜上的纳米厚度的Pd/Cu合金薄膜。③Immerse the pretreated polyester film in the reducing agent for 5 minutes, take it out and place it at room temperature for 3 minutes, then immerse it in the plating solution at 55°C for 30 minutes, and wash it with deionized water until the pH value is neutral to obtain the adhesion to the organic film. nanometer-thick Pd/Cu alloy film.
(3)热处理(3) heat treatment
将步骤(2)③中获得的附着于有机薄膜上的Pd/Cu合金薄膜在45℃干燥1.5h后放入电炉中进行热处理(热处理温度为600℃,时间为1.5h),去除有机薄膜后即可获得Pd/Cu合金薄膜。Dry the Pd/Cu alloy film attached to the organic film obtained in step (2)③ at 45°C for 1.5h, then put it into an electric furnace for heat treatment (heat treatment temperature is 600°C, time is 1.5h), after removing the organic film A Pd/Cu alloy thin film can be obtained.
(3)去合金化(3) dealloying
采用自由腐蚀的方法去合金化制备纳米多孔钯合金薄膜,即将Pd/Cu合金薄膜浸渍于温度为20℃,浓度为66wt%硝酸中进行自由腐蚀去合金化,去合金化时间为15h,去合金化后用去离子水清洗至pH值呈中性,在45℃下干燥1h,即可得到三维催化性自支撑纳米多孔钯催化膜,其膜厚为2.5nm,孔径为7.5nm,孔隙率为75%。Prepare the nanoporous palladium alloy thin film by free corrosion method dealloying, that is, immerse the Pd/Cu alloy film in nitric acid with a temperature of 20 °C and a concentration of 66wt% for free corrosion and dealloying, and the dealloying time is 15h. After deionization, wash with deionized water until the pH value is neutral, and dry at 45°C for 1 hour to obtain a three-dimensional catalytic self-supporting nanoporous palladium catalytic membrane with a film thickness of 2.5nm, a pore diameter of 7.5nm, and a porosity of 75%.
实施例3Example 3
(1)有机薄膜的预处理(1) Pretreatment of organic film
用去离子水清洗厚度为1mm的聚丙烯薄膜表面,干燥后将聚丙烯薄膜放入65℃的粗化液(其中硫酸:200mL/L,铬酐:400g/L)中粗化10min,水洗后放入45℃的离子钯溶液(其中氯化钯:0.5 g/L,氯化铵:0.3 g/L,α-氨基吡啶:2 g/L)中进行活化,待钯的络离子吸附达到平衡后加入3%的次亚磷酸钠。Wash the surface of the polypropylene film with a thickness of 1 mm with deionized water, and after drying, place the polypropylene film in a roughening solution at 65°C (including sulfuric acid: 200mL/L, chromic anhydride: 400g/L) for 10 minutes, and wash it with water. Put it into ionic palladium solution (including palladium chloride: 0.5 g/L, ammonium chloride: 0.3 g/L, α-aminopyridine: 2 g/L) at 45°C for activation until the complex ion adsorption of palladium reaches equilibrium Then add 3% sodium hypophosphite.
(2)复合镀(2) Composite plating
①将次磷酸钠溶液和氯化铵溶液混合得到还原剂,还原剂中次磷酸钠的浓度为15g/L、氯化铵的溶度为45g/L;1. sodium hypophosphite solution and ammonium chloride solution are mixed to obtain reducing agent, the concentration of sodium hypophosphite in the reducing agent is 15g/L, the solubility of ammonium chloride is 45g/L;
②在氯化钯、氯化铜溶液依次加入盐酸、氨水制成镀液,镀液中氯化钯的浓度为7g/L、氯化铜的浓度为12.5g/L、氨水的浓度为240mL/L、盐酸的浓度为6mL/L,按上述比例将溶液配制完成后用氨水调节镀液的pH值为9。② Add hydrochloric acid and ammonia water to the palladium chloride and copper chloride solutions in turn to make a plating solution. The concentration of palladium chloride in the plating solution is 7g/L, the concentration of copper chloride is 12.5g/L, and the concentration of ammonia water is 240mL/L. L, the concentration of hydrochloric acid is 6mL/L, adjusts the pH value of plating solution to be 9 with ammoniacal liquor after the solution preparation is finished by above-mentioned ratio.
③将预处理后的聚丙烯薄膜浸渍于还原剂中7min,取出后室温下放置4min,再浸渍于55℃的镀液中40min,用去离子水清洗至pH值呈中性得到附着于有机薄膜上的纳米厚度的Pd/Cu合金薄膜。③Immerse the pretreated polypropylene film in the reducing agent for 7 minutes, take it out and place it at room temperature for 4 minutes, then immerse it in the plating solution at 55°C for 40 minutes, and wash it with deionized water until the pH value is neutral to obtain the adhesion to the organic film. nanometer-thick Pd/Cu alloy film.
(3)热处理(3) heat treatment
将步骤(2)③中获得的附着于有机薄膜上的Pd/Cu合金薄膜在45℃干燥1.5h后放入电炉中进行热处理(热处理温度为600℃,时间为1.5h),去除有机薄膜后即可获得Pd/Cu合金薄膜。Dry the Pd/Cu alloy film attached to the organic film obtained in step (2)③ at 45°C for 1.5h, then put it into an electric furnace for heat treatment (heat treatment temperature is 600°C, time is 1.5h), after removing the organic film A Pd/Cu alloy thin film can be obtained.
(3)去合金化(3) dealloying
采用自由腐蚀的方法去合金化制备纳米多孔钯合金薄膜,即将Pd/Cu合金薄膜浸渍于温度为20℃,浓度为67wt%g硝酸中进行自由腐蚀去合金化,去合金化时间为25h,去合金化后用去离子水清洗至pH值呈中性,在45℃下干燥1.5h,即可得到三维催化性自支撑纳米多孔钯催化膜,其膜厚为1.43nm,孔径为8.57nm,孔隙率为85%。Prepare the nanoporous palladium alloy film by free corrosion method dealloying, that is, immerse the Pd/Cu alloy film in nitric acid with a temperature of 20 °C and a concentration of 67wt%g for free corrosion dealloying, and the dealloying time is 25h. After alloying, wash with deionized water until the pH value is neutral, and dry at 45°C for 1.5 hours to obtain a three-dimensional catalytic self-supporting nanoporous palladium catalytic membrane with a film thickness of 1.43nm and a pore diameter of 8.57nm. The rate is 85%.
实施例4Example 4
(1)有机薄膜的预处理(1) Pretreatment of organic film
用去离子水清洗厚度为2mm的聚丙烯薄膜表面,干燥后将聚丙烯薄膜放入70℃的粗化液(其中硫酸:300mL/L,铬酐:450g/L)中粗化12min,水洗后放入50℃的离子钯溶液(其中氯化钯:0.6 g/L,氯化铵:0.4 g/L,α-氨基吡啶:3 g/L)中进行活化,待钯的络离子吸附达到平衡后加入5%的次亚磷酸钠。Wash the surface of the polypropylene film with a thickness of 2 mm with deionized water, and after drying, place the polypropylene film in a roughening solution at 70°C (including sulfuric acid: 300mL/L, chromic anhydride: 450g/L) for 12 minutes, and wash it with water. Put it into an ionic palladium solution (including palladium chloride: 0.6 g/L, ammonium chloride: 0.4 g/L, α-aminopyridine: 3 g/L) at 50°C for activation until the complex ion adsorption of palladium reaches equilibrium Then add 5% sodium hypophosphite.
(2)复合镀(2) Composite plating
①将次磷酸钠溶液和氯化铵溶液混合得到还原剂,还原剂中次磷酸钠的浓度为20g/L、氯化铵的溶度为54g g/L;1. sodium hypophosphite solution and ammonium chloride solution are mixed to obtain reducing agent, the concentration of sodium hypophosphite in the reducing agent is 20g/L, the solubility of ammonium chloride is 54g g/L;
②在氯化钯、氯化铜溶液依次加入盐酸、氨水制成镀液,镀液中氯化钯的浓度为8g/L、氯化铜的浓度为20g/L、氨水的浓度为240mL/L、盐酸的浓度为8mL/L,按上述比例将溶液配制完成后用氨水调节镀液的pH值为10。② Add hydrochloric acid and ammonia water to the palladium chloride and copper chloride solution in turn to make a plating solution. The concentration of palladium chloride in the plating solution is 8g/L, the concentration of copper chloride is 20g/L, and the concentration of ammonia water is 240mL/L 1. The concentration of hydrochloric acid is 8mL/L, and the pH value of the plating solution is adjusted to 10 with ammonia water after the solution is prepared according to the above ratio.
③将预处理后的聚丙烯薄膜浸渍于还原剂中2min,取出后室温下放置5min,再浸渍于50℃的镀液中60min,用去离子水清洗至pH值呈中性得到附着于有机薄膜上的纳米厚度的Pd/Cu合金薄膜。③Immerse the pretreated polypropylene film in the reducing agent for 2 minutes, take it out and place it at room temperature for 5 minutes, then immerse it in the plating solution at 50°C for 60 minutes, and wash it with deionized water until the pH value is neutral to obtain the adhesion to the organic film. nanometer-thick Pd/Cu alloy film.
(3)热处理(3) heat treatment
将步骤(2)③中获得的附着于有机薄膜上的Pd/Cu合金薄膜在50℃干燥2h后放入电炉中进行热处理(热处理温度为700℃,时间为2h),去除有机薄膜后即可获得Pd/Cu合金薄膜。Dry the Pd/Cu alloy film attached to the organic film obtained in step (2)③, dry it at 50°C for 2 hours, then put it into an electric furnace for heat treatment (heat treatment temperature is 700°C, time is 2 hours), and remove the organic film. A Pd/Cu alloy thin film was obtained.
(3)去合金化(3) dealloying
采用自由腐蚀的方法去合金化制备纳米多孔钯合金薄膜,即将Pd/Cu合金薄膜浸渍于温度为30℃,浓度为68wt%硝酸中进行自由腐蚀去合金化,去合金化时间为5h,去合金化后用去离子水清洗至pH值呈中性,在50℃下干燥2h,即可得到三维催化性自支撑纳米多孔钯催化膜,其膜厚为2nm,孔径为8nm,孔隙率为80%。Prepare the nanoporous palladium alloy thin film by free corrosion method for alloying, that is, immerse the Pd/Cu alloy thin film in nitric acid with a temperature of 30°C and a concentration of 68wt% for free corrosion and alloying, and the alloying time is 5h. After deionization, wash with deionized water until the pH value is neutral, and dry at 50°C for 2 hours to obtain a three-dimensional catalytic self-supporting nanoporous palladium catalytic membrane with a film thickness of 2nm, a pore diameter of 8nm, and a porosity of 80%. .
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