CN106163215A - Heat radiation module - Google Patents

Abstract

The invention provides a heat dissipation module, which comprises an evaporator, a copper pipe communicated with the evaporator and forming a loop, and a heat transfer medium flowing in the loop. The evaporator includes an upper cover and a lower cover which are engaged with each other and constitute a chamber. The lower cover has an insulating wall protruding toward the chamber to separate an insulating region from a heating region at the lower cover region. The upper cover has a slope inclined toward the chamber. The heat energy of the electronic element is transferred to the heat transfer medium through the heating area, so that the heat transfer medium flows out of the evaporator along the inclined plane in a single direction after absorbing the heat energy and flows in the copper pipe, so that the heat energy is transferred outwards through the copper pipe and flows back to the evaporator through the copper pipe after radiating the heat energy. The heat dissipation module provided by the invention has a good heat dissipation effect.

Description

Cooling module

technical field

The present invention relates to a heat dissipation module, and in particular to a heat dissipation module for electronic devices.

Background technique

In recent years, with the increasing development of the technology industry, electronic devices such as notebook computers (Notebook, referred to as NB), personal digital assistants (Personal Digital Assistant, referred to as PDA) and smart phones (Smart Phone) and other products have frequently appeared in daily life . Some of the electronic components mounted inside these electronic devices usually generate heat energy during operation, which affects the operating performance of the electronic devices. Therefore, a heat dissipation module or a heat dissipation element, such as a heat dissipation fan, a heat dissipation sticker, or a heat dissipation pipe, is usually arranged inside the electronic device to help dissipate the heat generated by the electronic element to the outside of the electronic device.

In the above heat dissipation module, the heat dissipation fan can effectively dissipate heat to the outside, but it consumes a lot of power, is heavy and requires a large space, which is not conducive to the application of electronic devices that pursue thin and light designs, and is prone to noise And affect the communication function attached to the electronic device. In addition, in order for the heat dissipation fan to dissipate heat through convection, the housing of the electronic device needs to be provided with openings, which will also reduce the mechanical strength of the electronic device. On the other hand, heat dissipation stickers can absorb the heat energy of electronic components to reduce the surface temperature, and its cost and space required are low, so it can be widely used in electronic devices, but it is difficult to further dissipate heat energy to the outside through other components , its cooling effect is limited. Furthermore, the heat pipe can transfer the heat energy of the electronic components to another plate, but it lacks convection, so the heat dissipation effect is limited. In this way, the heat pipe can be further combined with the evaporator and the condenser to form a circuit, and the phase change material suitable for absorbing or releasing heat energy and being converted between two phases (such as liquid and gas) can be used as a heat transfer medium in the heat pipe Circulating flow to absorb heat energy in the evaporator and release heat energy in the condenser, thereby transferring heat energy from the electronic components to the outside. However, the heat transfer medium flows in the circuit only by its own phase change, and its flow effect is poor, which in turn makes its heat dissipation effect limited.

Contents of the invention

The invention provides a heat dissipation module, which has good heat dissipation effect.

The heat dissipating module of the present invention is suitable for being arranged in an electronic device to dissipate heat to electronic components in the electronic device. The heat dissipation module includes an evaporator, copper pipes and heat transfer medium. The evaporator includes an upper cover and a lower cover. The upper cover and the lower cover are engaged with each other and constitute a chamber. The lower cover has a heat insulating wall protruding toward the chamber, so as to separate the heat insulating area and the heating area in the area of the lower cover, and the evaporator connects the electronic components through the heating area. The upper cover has a slope inclined towards the chamber, and the vertical distance between the slope and the heat insulation section is smaller than the vertical distance between the slope and the heating section. The copper tube is connected to the evaporator to form a loop, and the level of the first end of the copper tube adjacent to the heat insulating area is lower than the level of the second end of the copper tube adjacent to the heating area, so that the copper tube has a height difference. The heat transfer medium is arranged to flow in the circuit formed by the copper tube and the evaporator, in which the heat energy of the electronic components is transferred to the heat transfer medium through the heating zone, so that the heat transfer medium flows out of the evaporator along the inclined plane in a single direction after absorbing the heat energy, and The height drop of the copper tube flows in the copper tube to transfer heat energy to the outside through the copper tube, and flows back to the evaporator through the copper tube after dissipating the heat energy.

Based on the above, in the heat dissipation module of the present invention, the evaporator includes an upper cover with a slope and a lower cover with an insulating wall, wherein the insulating wall separates the insulating area and the heating area on the lower cover, and communicates with the evaporator to form a circuit The copper tube has a high drop, so that the heat transfer medium can flow in the circuit. In this way, the heat energy of the electronic components can be transferred to the heat transfer medium through the heating area, so that the heat transfer medium flows in the copper tube after absorbing the heat energy, and further transfers the heat energy to the outside through the copper tube. Among them, the heat transfer medium flows out of the evaporator in a single direction through the inclined plane, and generates potential energy in the copper tube through the height drop to flow out of the copper tube in a single direction, thereby increasing its flow rate and accelerating the above heat dissipation action. Accordingly, the heat dissipation module of the present invention has a good heat dissipation effect.

Description of drawings

FIG. 1 is a schematic top view of a heat dissipation module according to an embodiment of the present invention;

FIG. 2 is a schematic top view of the heat dissipation module of FIG. 1 applied to an electronic device;

Fig. 3 is an exploded view of the evaporator of Fig. 1;

Fig. 4 is a cross-sectional view of the evaporator of Fig. 3;

FIG. 5 is a schematic partial side view of the heat dissipation module in FIG. 1 .

Explanation of reference signs:

50: electronic device;

52: electronic components;

54: keyboard module;

100: cooling module;

110: evaporator;

112: upper cover;

112a: slope;

114: lower cover;

114a: insulation wall;

114b: adiabatic zone;

114c: heating zone;

116: chamber;

118: heating element;

119: liquid inlet;

120: copper tube;

122: first end;

124: second end;

130: heat transfer medium;

140: support plate;

150: fixed clip;

160: heat conduction element;

170: elastic member;

d1, d2: vertical distance;

H1, H2, H3, H4: horizontal height;

H5: liquid level height;

W1, W2: Width.

detailed description

FIG. 1 is a schematic top view of a heat dissipation module according to an embodiment of the present invention. FIG. 2 is a schematic top view of the heat dissipation module of FIG. 1 applied to an electronic device. Please refer to FIG. 1 to FIG. 2 , in this embodiment, the heat dissipation module 100 is suitable for the electronic device 50 . The electronic device 50 can be an electronic device with a single body, or an electronic device with two bodies, such as a notebook computer (notebook, NB for short), and only one body is shown in FIG. The kind of electronic device is not limited. An electronic component 52 such as a central processing unit (CPU for short) or other suitable electronic components is configured inside the electronic device 50 to perform related operations. The electronic components 52 generate heat energy during operation. Therefore, the heat dissipation module 100 of this embodiment is suitable for being disposed in the electronic device 50 to dissipate heat from the electronic components 52 in the electronic device 50 .

Specifically, in this embodiment, the heat dissipation module 100 includes an evaporator 110 , a copper tube 120 and a heat transfer medium 130 . The evaporator 110 is suitable for connecting the electronic components 52 . The copper tube 120 communicates with the evaporator 110 and forms a loop (as shown in FIGS. 1 and 2 ), and the heat transfer medium 130 flows in the loop formed by the copper tube 120 and the evaporator 110 . Thereby, the heat energy of the electronic component 52 can be transferred to the heat transfer medium 130 through the evaporator 110, so that the heat transfer medium 130 flows in the copper tube 120 after absorbing the heat energy, so as to transfer the heat energy to the outside through the copper tube 120, and dissipate the heat energy After that, it flows back to the evaporator 110 through the copper pipe 120 . Thereby, the heat transfer medium 130 can flow in the copper tube 120 to dissipate heat energy into the air through the tube wall of the copper tube 120 .

In addition, in this embodiment, the heat dissipation module 100 further includes a support plate 140 and a plurality of fixing clips 150 . The support plate 140 is disposed in the electronic device 50 , and the copper pipe 120 is fixed on the support plate 140 through the fixing clip 150 , and can be further fixed by welding, but the present invention does not limit the fixing method. In this way, the heat transfer medium 130 can not only dissipate heat energy into the air through the tube wall of the copper tube 120, but also can further transfer heat energy to the support plate 140 through the copper tube 120, and the support plate 140 with a larger heat dissipation area Dissipates rapidly into air. The support plate 140 can carry the keyboard module 54 (shown in FIG. 2 ) of the electronic device 50 in the electronic device 50, and the copper pipe 120 fixed on the support plate 140 surrounds the keyboard module 54 to avoid interference with the keyboard module. 54 configurations. In other words, in this embodiment, the heat dissipation effect of the heat dissipation module 100 can be increased through the support member 140 originally used to support the keyboard module 54 without additional configuration of other heat dissipation elements. However, the present invention does not limit the configuration of the support plate 140, which can be adjusted according to requirements. In this way, the heat dissipation module 100 can transfer the heat energy of the electronic component 52 to the outside through the heat transfer medium 130 flowing in the circuit formed by the copper tube 120 and the evaporator 110 , thereby achieving the purpose of heat dissipation.

FIG. 3 is an exploded view of the evaporator of FIG. 1 . FIG. 4 is a cross-sectional view of the evaporator of FIG. 3 . FIG. 5 is a schematic partial side view of the heat dissipation module in FIG. 1 . Wherein, Fig. 5 enlarges and briefly shows part of the size of the evaporator 110, and the content shown is used to express the flow mode of the heat transfer medium 130 in the copper tube 120 and the evaporator 110 (as a schematic purpose), rather than using To limit the specific structural size of the heat dissipation module of the present invention. In this embodiment, the evaporator 110 of the heat dissipation module 100 has a special design so that the aforementioned heat transfer medium 130 circulates in a single direction in the loop formed by the copper tube 120 and the evaporator 110 to increase its flow rate. When the flow rate of the heat transfer medium 130 in the loop increases, the rate at which it absorbs heat energy in the evaporator 110 and dissipates heat energy in the copper tube 120 also increases. Therefore, as long as the design of the heat dissipation module 100 is conducive to increasing the flow rate of the heat transfer medium 130 , the heat dissipation efficiency of the heat dissipation module 100 can be improved.

Please refer to FIG. 3 to FIG. 5 , in this embodiment, the evaporator 110 includes an upper cover 112 and a lower cover 114 . The upper cover 112 and the lower cover 114 can be made of metal and fixed together by welding, but the invention is not limited thereto. The upper cover 112 and the lower cover 114 are engaged with each other and form a chamber 116 . The lower cover 114 has an insulating wall 114a protruding toward the chamber 116 to separate the insulating area 114b and the heating area 114c in the lower cover 114 . In other words, the protruding insulating wall 114a can distinguish two areas on the lower cover 114 that are located on opposite sides thereof and can be used to store the heat transfer medium 130 (ie, the insulating area 114b and the heating area 114c). The heat transfer medium 130 flows into the evaporator 110 from the copper pipe 120 and is distributed in the heat insulating area 114 b and the heating area 114 c, and the evaporator 110 is connected to the electronic component 52 through the heating area 114 c. In addition, the evaporator 110 also includes a plurality of heating elements 118 . The heating element 118 is, for example, a metal post with good thermal conductivity (such as a copper post), which is disposed on the heating area 114c of the lower cover 114 and protrudes toward the chamber 116 to increase the heating area of the heating area 114c. In other words, the heating zone 114c of the evaporator 110 can absorb more heat energy through the heating element 118 , thereby increasing the rate at which the heat energy is transferred to the heat transfer medium 130 through the heating zone 114c.

Furthermore, in this embodiment, the heat dissipation module 100 further includes a heat conducting element 160 (shown in FIG. 5 ) and a plurality of elastic pieces 170 (shown in FIGS. 1 and 2 ). The heat conduction member 160 is, for example, a thermal interface material (TIM for short), which is arranged between the electronic component 52 and the heating area 114c to fill the gap between the electronic component 52 and the heating area 114c, and help the electronic component 52 The thermal energy is transferred to the heating zone 114c. The elastic member 170 is, for example, a metal shrapnel, which is disposed on the evaporator 110 and presses the electronic component 52 to provide pressure so that the electronic component 52, the heat conducting member 160 and the heating area 114c are in close contact. Thereby, the heat energy generated by the electronic component 52 during operation can be transferred to the heat transfer medium 130 through the heating area 114 c, and the transfer efficiency can be improved through the heat conducting member 160 and the elastic member 170 . However, the present invention does not limit the use of the heat conducting element 160 and the elastic element 170 , which can be adjusted according to requirements.

In addition, in this embodiment, the thermal conductivity of the heat insulating wall 114 a is lower than that of other parts of the lower cover 114 . Wherein, the heat insulating wall 114 a is, for example, another member made of heat insulating material and fixed on the lower cover 114 , thereby reducing its thermal conductivity. Alternatively, the insulating wall 114a may also be a partially formed protruding structure on the lower cover 114, and then cover its surface facing the chamber 116 with an insulating material, thereby reducing its thermal conductivity. However, in other unshown embodiments, the heat insulating wall may also be a structure in which the lower cover 114 integrally protrudes into the cavity 116 , without having a material different from that of the lower cover 116 . The present invention does not limit the composition and thermal conductivity of the insulating wall 114a. Preferably, the width W1 of the heat insulating wall 114 a is greater than one third of the width W2 of the lower cover 114 . Thereby, the thermal insulation wall 114a can effectively reduce the thermal energy transferred from the heating zone 114c to the thermal insulation zone 114b. In other words, the thermal energy of the electronic component 52 is not easily transferred to the thermal insulation area 114b due to the barrier of the thermal insulation wall 114a, so the heat energy absorbed by the heat transfer medium 130 located in the heating area 114c is more than that absorbed by the heat transfer medium 130 located in the thermal insulation area 114b .

On the other hand, in the present embodiment, the upper cover 112 has a slope 112 a inclined toward the chamber 116 . The lateral extent of the inclined plane 112a corresponds to the insulating area 114b, the insulating wall 114a and the heating area 114c, and the vertical distance d1 between the inclined plane 112a and the insulating area 114b is smaller than the vertical distance d2 between the inclined plane 112a and the heating area 114c. In other words, when the heat insulating region 114b of the lower cover 114 is located at the same level as the heating region 114c, the level of one side of the slope 112a corresponding to the heat insulating region 114b is lower than the level of the other side of the slope 112a corresponding to the heating region 114c, and the cavity Chamber 116 has a larger volume corresponding to heating zone 114c. In this way, the heat energy of the electronic component 52 is transferred to the heat transfer medium 130 through the heating zone 114c, so that the heat transfer medium 130 flows along the slope 112a from the side with a lower level to the other side with a higher level after absorbing the heat energy. , and then flow out of the evaporator 110. In other words, through the design of the slope 112a, the heat transfer medium 130 can flow out of the evaporator 110 in a single direction along the slope 112a after absorbing heat energy in the heating zone 114c, thereby increasing the flow rate of the heat transfer medium 130 .

Furthermore, in this embodiment, the copper tube 120 has a first end 122 and a second end 124 opposite to each other. The copper pipe 120 is connected to the heat insulating area 114b by the first end 122, and is connected to the heating area 114c by the second end 124, thereby forming a closed loop, so that the heat transfer medium 130 can flow in the loop and pass through the evaporator 110 and the Copper pipe 120. Wherein, the horizontal height H1 of the first end 122 of the copper pipe 120 adjacent to the thermal insulation area 114b is lower than the horizontal height H2 (marked in FIG. 5 ) of the second end 124 of the copper pipe 120 adjacent to the heating area 114c, so that the copper pipe 120 has a height drop. In this way, the heat energy of the electronic component 52 is transferred to the heat transfer medium 130 through the heating zone 114c, so that the heat transfer medium 130 flows out of the evaporator 110 in a single direction along the slope 112a after absorbing the heat energy, and passes through the height difference of the copper tube 120 on the copper tube 120. The heat flows inside the tube 120 to transfer the heat energy to the outside through the copper tube 120 , and flows back to the evaporator 110 through the copper tube 120 after dissipating the heat energy, so as to complete a cooling cycle.

Specifically, in this embodiment, the circuit formed by the copper tube 120 and the evaporator 110 is in a vacuum state to lower the boiling point of the heat transfer medium 130 and cause the heat transfer medium 130 to undergo a phase change through thermal energy in the circuit. The heat transfer medium 130 is, for example, water or cold coal, but the present invention is not limited thereto. The heat transfer medium 130 can absorb heat energy in the evaporator 110 and flow in the copper tube 120 to dissipate heat energy, and the heat transfer medium 130 undergoes a phase change when absorbing or dissipating heat energy. Furthermore, the heat transfer medium 130 undergoes a phase change from liquid to gas after absorbing heat energy in the evaporator 110 . Wherein, the heat transfer medium 130 in the heating zone 114c absorbs more heat energy than the heat transfer medium 130 in the heat insulating zone 114b, so that the heat transfer medium 130 in the heating zone 114c is more likely to undergo a phase change into a gaseous state. In addition, the heating zone 114c corresponds to the side with a higher level on the slope 112a, and the second end 124 of the copper tube 120 corresponds to the heating zone 114c. In this way, the heat transfer medium 130 transformed into a gaseous state can easily flow out of the evaporator 110 along the slope 112 a toward the side with a higher level, and further flow into the copper pipe 120 from the second end 124 . Thereby, the heat transfer medium 130 in the evaporator 110 changes into a gaseous state and flows into the copper tube 120 through the second end 124 along the slope 112 a in a single direction.

Furthermore, in this implementation, since the copper tube 120 has a height difference, the heat transfer medium 130 can easily spontaneously flow from the second end 124 adjacent to the heating area 114c and having a higher level H2 to the adjacent heat insulating area 114b through potential energy. And the first end 122 with a lower horizontal height H1. The heat transfer medium 130 flows in the copper tube 120 to dissipate the heat energy into the air through the copper tube 120 , or further transfers to the support plate 140 to dissipate into the air. The heat transfer medium 130 undergoes a phase change from a gaseous state to a liquid state after dissipating heat energy, and then flows through the copper pipe 120 from the first end 122 to the evaporator 110 again. In this way, the heat transfer medium 130 transformed into a liquid state absorbs the heat energy transmitted from the electronic component 52 to the heating zone 114c in the evaporator 110 again and transforms into a gaseous state, and after being transformed into a gaseous state, it passes along the slope 112a again from the corresponding heating region 114c and the second end 124 with a higher level H2 flows into the copper pipe 120 , and flows in the copper pipe 120 through the height difference of the copper pipe 120 and transfers heat energy to the outside through the copper pipe 120 . In this way, the heat transfer medium 130 continues to flow in the circuit formed by the evaporator 110 and the copper tube 120 in the above manner, so that the heat energy of the electronic component 52 can be continuously dissipated into the air to achieve heat dissipation.

Moreover, since the heat transfer medium 130 flows in a single direction, that is, the heat transfer medium 130 flows into the evaporator 110 from the first end 122 of the copper tube 120 and flows out of the evaporator 110 from the second end 124 of the copper tube 120, so the heat transfer The medium 130 first flows into the heat insulating region 114b, and then overflows the heat insulating region 114b and the heat insulating wall 114a to flow into the heating region 114c. In addition, in this embodiment, the thermal insulation wall 114a has a microstructure not shown, such as a powder, mesh or groove structure, so as to transmit the heat transfer medium 130 located in the thermal insulation zone 114b to the heating zone 114c, but it also The surface may be smooth, but the invention is not limited thereto. In this way, when the liquid level of the heat transfer medium 130 in the heat insulation area 114b does not exceed the level of the heat insulation wall 114a, so that the heat transfer medium 130 cannot flow into the heating area 114c in the above manner, the liquid heat transfer medium 130 can still It is transferred to the heating zone 114c through capillary action between it and the microstructures on the insulating wall 114a. In other words, the configuration of microstructures on the thermal insulation wall 114 a helps to continuously replenish the liquid heat transfer medium 130 from the thermal insulation region 114 b to the heating region 114 c, so as to increase the circulation capacity of the heat transfer medium 130 .

In order to improve the characteristics of the heat transfer medium 130 flowing in a single direction in the loop formed by the evaporator 110 and the copper tube 120, in this embodiment, the first end 122 of the copper tube 120 adjacent to the heat insulating region 114b and the evaporator 110 The horizontal height H3 of the liquid inlet 119 is lower than the horizontal height H4 of the heat insulating wall 114a. In this way, after dissipating heat energy and turning into a liquid heat transfer medium 130, the heat-insulating wall 114a can effectively The thermal energy transmitted from the electronic component 52 to the heating zone 114c is blocked from being further transmitted to the heat-insulating zone 114b, so that the heat transfer medium 130 in the heating zone 114c is more likely to absorb thermal energy and undergo a phase change into a gaseous state, and flow out of the evaporator 110 along the slope 112a. Flows into the copper tube 120 from the second end 124 .

Similarly, in this embodiment, the horizontal height H3 of the liquid inlet 119 between the first end 122 of the copper tube 120 adjacent to the heat insulating region 114b and the evaporator 110 is lower than the liquid level of the heat transfer medium 130 in the heat insulating region 114b H5. In other words, the heat transfer medium 130 that dissipates heat energy and turns into liquid flows into the evaporator 110 through the first end 122 of the copper tube 120 adjacent to the heat insulating region 114b, and is distributed after the heat insulating region 114b and the heating region 114c, and is located in the heat insulating region 114b and maintained The liquid heat transfer medium 130 covers the liquid inlet 119, so that the heat transfer medium 130 that absorbs heat energy in the evaporator 110 and turns into a gas will not reversely flow from the liquid inlet 119 to the first end 122 of the copper tube 120, and tends to flow along the slope 112a to the second end 124 of the copper tube 120 . The above designs are all helpful to improve the characteristic of the heat transfer medium 130 flowing in a single direction in the loop formed by the evaporator 110 and the copper tube 120 . As long as the flow rate of the heat transfer medium 130 in the loop is effectively increased, the heat dissipation effect of the heat dissipation module 100 is also improved. Accordingly, the heat dissipation module 100 of this embodiment has a good heat dissipation effect.

To sum up, in the heat dissipation module of the present invention, the evaporator includes an upper cover with an inclined plane and a lower cover with an insulating wall, wherein the insulating wall separates the insulating area and the heating area on the lower cover, and the area between the inclined plane and the insulating area The vertical distance is smaller than the vertical distance between the slope and the heating zone. Furthermore, the copper pipe connected to the evaporator and forming the loop has a height difference, and the heat transfer medium can flow in the loop. In this way, the heat energy of the electronic components can be transferred to the heat transfer medium through the heating area, so that the heat transfer medium flows in the copper tube after absorbing the heat energy, and further transfers the heat energy to the outside through the copper tube. Among them, the heat transfer medium flows out of the evaporator in a single direction through the inclined plane, and generates potential energy in the copper tube through the height drop to flow out of the copper tube in a single direction, thereby increasing its flow rate and accelerating the above heat dissipation action. Accordingly, the heat dissipation module of the present invention has a good heat dissipation effect.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the various embodiments of the present invention. scope.

Claims (10)

1. A heat dissipation module, characterized in that it is suitable for being configured in an electronic device to dissipate heat to electronic components in the electronic device, and the heat dissipation module includes: The evaporator includes an upper cover and a lower cover, the upper cover and the lower cover are engaged with each other and form a chamber, and the lower cover has an insulating wall protruding toward the chamber to separate the out of the heat insulation zone and the heating zone, and the evaporator is connected to the electronic component through the heating zone, the upper cover has a slope inclined toward the chamber, and the vertical distance between the slope and the heat insulation zone is less than The vertical distance between the slope and the heating zone; A copper pipe is connected to the evaporator and forms a loop, and the level of the first end of the copper pipe adjacent to the heat insulation area is lower than the level of the second end of the copper pipe adjacent to the heating area, so that providing the copper pipe with a height drop; and The heat transfer medium is configured to flow in the circuit formed by the copper tube and the evaporator, wherein the heat energy of the electronic component is transferred to the heat transfer medium through the heating zone, so that the heat transfer medium After absorbing the heat energy, it flows out of the evaporator in a single direction along the slope, and flows in the copper pipe through the height drop of the copper pipe, so that the heat energy passes through the copper pipe to the outside Transfer, and flow back to the evaporator through the copper tube after dissipating the heat energy. 2 . The heat dissipation module according to claim 1 , wherein the heat transfer medium undergoes a phase change from liquid to gas after absorbing the heat energy in the evaporator, and flows out of the evaporation along the slope. device, and flow in the copper tube to transfer the heat energy to the outside to produce a phase change from gaseous to liquid. 3. The heat dissipation module according to claim 1, wherein the evaporator comprises a plurality of heating elements, which are arranged in the heating area of the lower cover and protrude toward the chamber, so as to increase the The heating area of the heating zone. 4. The heat dissipation module according to claim 1, wherein the level of the liquid inlet between the first end of the copper pipe adjacent to the heat insulation area and the evaporator is lower than that of the heat insulation The horizontal height of the wall. 5. The heat dissipation module according to claim 1, wherein the level of the liquid inlet between the first end of the copper pipe adjacent to the thermal insulation area and the evaporator is lower than that of the heat dissipation module. The liquid level of the heat medium in the heat insulation area. 6. The heat dissipation module according to claim 1, wherein the width of the heat insulating wall is greater than one-third of the width of the lower cover. 7 . The heat dissipation module according to claim 1 , wherein the heat insulation wall has a microstructure to transfer the heat transfer medium located in the heat insulation area to the heating area. 8 . 8 . The heat dissipation module according to claim 1 , wherein the thermal conductivity of the heat insulating wall is lower than that of other parts of the lower cover. 9. The heat dissipation module according to claim 1, further comprising: The support plate is arranged in the electronic device, and the copper tube is fixed on the support plate, so that the heat transfer medium transfers the heat energy to the support plate through the copper tube. 10 . The heat dissipation module according to claim 9 , wherein the support plate carries a keyboard module of the electronic device, and the copper pipe fixed on the support plate surrounds the keyboard module. 11 .