CN106163154A - A kind of high intensity switch - Google Patents
A kind of high intensity switch Download PDFInfo
- Publication number
- CN106163154A CN106163154A CN201610572455.XA CN201610572455A CN106163154A CN 106163154 A CN106163154 A CN 106163154A CN 201610572455 A CN201610572455 A CN 201610572455A CN 106163154 A CN106163154 A CN 106163154A
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- Prior art keywords
- high intensity
- layer
- intensity switch
- heat
- pcb board
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- 230000002787 reinforcement Effects 0.000 claims description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052782 aluminium Inorganic materials 0.000 claims description 17
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 15
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 10
- ZCCIPPOKBCJFDN-UHFFFAOYSA-N calcium nitrate Chemical compound [Ca+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ZCCIPPOKBCJFDN-UHFFFAOYSA-N 0.000 claims description 10
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims description 10
- 229910017083 AlN Inorganic materials 0.000 claims description 5
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 5
- 239000004115 Sodium Silicate Substances 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 5
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 claims description 5
- 229940069446 magnesium acetate Drugs 0.000 claims description 5
- 235000011285 magnesium acetate Nutrition 0.000 claims description 5
- 239000011654 magnesium acetate Substances 0.000 claims description 5
- 229910052863 mullite Inorganic materials 0.000 claims description 5
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 5
- 239000005060 rubber Substances 0.000 claims description 5
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 5
- 239000004408 titanium dioxide Substances 0.000 claims description 5
- IKRMZAOEXULJQX-UHFFFAOYSA-N calcium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound [Ca+2].O1B([O-])OB2OB([O-])OB1O2 IKRMZAOEXULJQX-UHFFFAOYSA-N 0.000 claims description 2
- ZZVUWRFHKOJYTH-UHFFFAOYSA-N diphenhydramine Chemical group C=1C=CC=CC=1C(OCCN(C)C)C1=CC=CC=C1 ZZVUWRFHKOJYTH-UHFFFAOYSA-N 0.000 claims description 2
- DCXXMTOCNZCJGO-UHFFFAOYSA-N tristearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCCCC DCXXMTOCNZCJGO-UHFFFAOYSA-N 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 1
- 229910052788 barium Inorganic materials 0.000 claims 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims 1
- 230000035939 shock Effects 0.000 abstract description 15
- 230000000694 effects Effects 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 description 12
- 230000008901 benefit Effects 0.000 description 9
- 230000005855 radiation Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- BREXUOXCEDKPCA-UHFFFAOYSA-N [Ca].OB(O)O Chemical compound [Ca].OB(O)O BREXUOXCEDKPCA-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L49/00—Packet switching elements
- H04L49/40—Constructional details, e.g. power supply, mechanical construction or backplane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Laminated Bodies (AREA)
- Road Signs Or Road Markings (AREA)
- Road Paving Structures (AREA)
Abstract
The open a kind of high intensity switch of the present invention, include housing, described housing is provided with two-layer, it is enhancement Layer and heat dissipating layer the most respectively, described surface of shell is provided with the network port and power interface, described enclosure interior is provided with pcb board, the first heat abstractor and the second heat abstractor, it is provided with radiating fin bottom described pcb board, heat conduction layer of paste it is provided with between described radiating fin and pcb board, being provided with microprocessor and temperature sensor on described pcb board, described microprocessor is connected with temperature sensor, the first heat abstractor and the second heat abstractor respectively；This high intensity switch good heat dissipation effect, intelligence degree are high and shock resistance is good.
Description
Technical field
The present invention relates to a kind of high intensity switch.
Background technology
It is a kind of network equipment forwarded for electricity (light) signal that switch means " switch ".It can be access switch
Any two network node the pathway for electrical signals that exclusively enjoys is provided.Modal switch is Ethernet switch.Other are common
Also have call voice switch, optical fiber switch etc..Exchange is the needs according to communication two ends transmission information, with manually or set
The standby method being automatically performed, delivers to information to be transmitted the general designation of technology in satisfactory corresponding route.Switch root
According to the difference of operating position, wide-area network switch and LAN switch can be divided into.The switch of wide area is exactly a kind of logical
Completing the equipment of information exchange functions in communication system, it is applied in data link layer.Switch has multiple port, each port
There is bridging functionality, a LAN or a high-performance server or work station can be connected.It practice, switch sometimes by
It is referred to as multiport bridge.In computer network system, the proposition of switching concept improves shared mode of operation.And HUB line concentration
A kind of physical layer of device shares equipment, and HUB itself can not identify MAC Address and IP address, when the A main frame in same LAN
To B main frame transmission data time, packet on the network with HUB as framework with broadcast transmission, by each station terminal
Determine whether to receive by the MAC Address of checking datagram header.It is to say, in this mode of operation, synchronization net
The communication of one group of Frame can only be transmitted, if it occur that collision must retry on network.This mode shares network broadband exactly.Logical
Saying of custom, general switch is without management function, and an inlet wire, other interfaces are received on computer the most permissible.In today,
Switch is being but more with application demand for guiding, and when selection scheme and product, user is concerned about and the most effectively protects the most very much
Card investment return.After user's proposition demand, system integrator or manufacturer provide corresponding service for its demand, then
Go again to select corresponding technology.This point is to be especially apparent in network facet performance, and users, whether key industry user is also
It is general enterprise customer, wiser at application IT technical elements, the most sane.Additionally, extensively application, the great Rong in broadband
Amount video file continue to bring out etc. all to network transmission maincenter--the performance of switch proposes new requirement.According to
Display in " 2013-2018 China switch market competition structure and investment landscape assessment report ": along with network development from
Technology humanized is applied, and transfers to from application selection technique；The fusion of network also moves towards practice from theory；The safety of network is increasingly subject to
To paying attention to.And the intellectuality of exchange network provides the method solving these problems.Network will be in integrated application, speed and covering
The aspects such as scope continue development.
The problem that existing switch exists shock resistance difference.
Summary of the invention
The technical problem to be solved in the present invention is to provide the high intensity switch that a kind of shock resistance is good.
For solving above-mentioned technical problem, the following technical scheme of the present invention:
A kind of high intensity switch, includes housing, and described housing is provided with two-layer, is enhancement Layer and heat radiation the most respectively
Layer, described surface of shell is provided with the network port and power interface, and described enclosure interior is provided with pcb board, the first heat abstractor
With the second heat abstractor, it is provided with radiating fin bottom described pcb board, between described radiating fin and pcb board, is provided with heat conduction
Layer of paste, described pcb board is provided with microprocessor and temperature sensor, described microprocessor respectively with temperature sensor, first
Heat abstractor and the second heat abstractor connect, and described enhancement Layer is by calcium sulfate 20-26 part of proportioning by weight, mullite
12-18 part, EP rubbers 10-16 part, calcium nitrate 12-18 part, magnesium acetate 10-12 part, aluminium nitride 12-20 part, titanium dioxide 8-
16 parts, chromium boride 10-14 part, benzhydryl 12-16 part, sodium silicate 10-20 part, citric acid 12-18 part, barium stearate 10-20
Part, polyphenylene sulfide 8-12 part, methacrylic acid 12-16 part and Calcium pyroborate 10-18 part are made.
Further, described enclosure interior is provided with support column, provides inner support power for housing, and then improves housing
Shock resistance.
Further, described support column is internally provided with aluminium honeycomb core, and it is big and lightweight that aluminium honeycomb core structure has intensity
Advantage.
Further, described enhancement Layer is internally provided with reinforcement, improves the intensity of housing further.
Further, described reinforcement is provided with more than one, and people can arrange suitably reinforcement according to practical situation
Muscle quantity.
Further, described enhancement Layer and heat dissipating layer are that integral type is arranged, and make structure more firm.
Further, described housing is rectangular-shaped setting.
Further, the thickness of described heat dissipating layer is 0.2cm.
Further, the thickness of described enhancement Layer is 0.3cm.
Further, the described network port is provided with more than one.
The invention have the benefit that this high intensity switch is provided by enhancement Layer, this enhancement Layer is at each raw material
Under the effect of cooperating, it has the highest intensity, substantially increases the shock resistance of housing；It is provided by heat dissipating layer,
Improve the heat dispersion of switch；In microprocessor, temperature sensor, the first heat abstractor and the cooperation of the second heat abstractor
Arranging down, when temperature sensor detects that switch internal temperature arrives certain value, aut sign is to microprocessor, micro-
Processor controls the first heat abstractor unlatching again and dispels the heat, when temperature sensor detects that switch internal temperature is too high,
Aut sign is to microprocessor, and microprocessor controls the first heat abstractor again and the second heat abstractor is opened simultaneously, improves
Radiating effect, intelligence degree is high；By being provided with radiating fin bottom pcb board, pcb board heat radiation can be accelerated, in heat radiation
Fin is provided with heat conduction layer of paste between pcb board, and heat conduction layer of paste can be with uniform heat conduction.Additionally, enclosure interior is provided with support column,
Thering is provided inner support power, and then the shock resistance of raising housing for housing, support column is internally provided with aluminium honeycomb core, aluminum honeycomb
Cored structure has the big and lightweight advantage of intensity；Enhancement Layer is internally provided with reinforcement, improves the intensity of housing further.
Accompanying drawing explanation
Detailed description of the invention to the present invention makees further detailed description below in conjunction with the accompanying drawings, wherein:
Fig. 1 is the schematic perspective view of the present invention a kind of high intensity switch.
Fig. 2 is the structural representation of the present invention a kind of high intensity switch.
Detailed description of the invention
Embodiment 1
As shown in Figure 1-2, a kind of high intensity switch, include housing 1, described housing 1 is provided with two-layer, distinguishes from inside to outside
Being enhancement Layer 4 and heat dissipating layer 5, described housing 1 surface configuration has the network port 2 and power interface 3, and described housing 1 is internal to be arranged
There are pcb board the 6, first heat abstractor 11 and the second heat abstractor 12, bottom described pcb board 6, are provided with radiating fin 7, described scattered
It is provided with heat conduction layer of paste 8 between hot fin 7 and pcb board 6, described pcb board 6 is provided with microprocessor 9 and temperature sensor 10,
Described microprocessor 9 is connected with temperature sensor the 10, first heat abstractor 11 and the second heat abstractor 12 respectively, described housing 1
It is internally provided with support column 13, provides inner support power, and then the shock resistance of raising housing 1, described support column for housing 1
13 are internally provided with aluminium honeycomb core 14, and aluminium honeycomb core 14 structure has the big and lightweight advantage of intensity, and described enhancement Layer 4 is internal
Being provided with reinforcement 15, improve the intensity of housing further, described reinforcement 15 is provided with more than one, and people can be according to reality
Border situation, arranges suitable reinforcement 15 quantity, and described enhancement Layer 4 is arranged for integral type with heat dissipating layer 5, makes structure more steady
Gu, described housing 1 is in rectangular-shaped setting, and the thickness of described heat dissipating layer 5 is 0.2cm, and the thickness of described enhancement Layer 4 is 0.3cm,
The described network port 2 is provided with more than one, and described enhancement Layer 4 is by 20 parts of the calcium sulfate of proportioning by weight, mullite 12
Part, 10 parts of EP rubbers, calcium nitrate 12 parts, magnesium acetate 10 parts, aluminium nitride 12 parts, titanium dioxide 8 parts, chromium boride 10 parts, hexichol
Methyl 12 parts, sodium silicate 10 parts, citric acid 12 parts, barium stearate 10 parts, polyphenylene sulfide 8 parts, methacrylic acid 12 parts and boric acid
Calcium 10 parts is made.
The present embodiment have the beneficial effect that this high intensity switch is provided by enhancement Layer, this enhancement Layer is at each raw material
Cooperate effect under, it has the highest intensity, substantially increases the shock resistance of housing；It is provided by heat radiation
Layer, improves the heat dispersion of switch；At microprocessor, temperature sensor, the first heat abstractor and the second heat abstractor
Being equipped with down, when temperature sensor detects that switch internal temperature arrives certain value, aut sign is to micro-process
Device, microprocessor controls the first heat abstractor unlatching again and dispels the heat, when temperature sensor detects switch internal temperature mistake
Gao Shi, aut sign to microprocessor, microprocessor controls the first heat abstractor again and the second heat abstractor is opened simultaneously,
Improving radiating effect, intelligence degree is high；By being provided with radiating fin bottom pcb board, pcb board heat radiation can be accelerated,
Radiating fin is provided with heat conduction layer of paste between pcb board, and heat conduction layer of paste can be with uniform heat conduction；Enclosure interior is provided with support column,
Thering is provided inner support power, and then the shock resistance of raising housing for housing, support column is internally provided with aluminium honeycomb core, aluminum honeycomb
Cored structure has the big and lightweight advantage of intensity；Enhancement Layer is internally provided with reinforcement, improves the intensity of housing further.
Embodiment 2
As shown in Figure 1-2, a kind of high intensity switch, include housing 1, described housing 1 is provided with two-layer, distinguishes from inside to outside
Being enhancement Layer 4 and heat dissipating layer 5, described housing 1 surface configuration has the network port 2 and power interface 3, and described housing 1 is internal to be arranged
There are pcb board the 6, first heat abstractor 11 and the second heat abstractor 12, bottom described pcb board 6, are provided with radiating fin 7, described scattered
It is provided with heat conduction layer of paste 8 between hot fin 7 and pcb board 6, described pcb board 6 is provided with microprocessor 9 and temperature sensor 10,
Described microprocessor 9 is connected with temperature sensor the 10, first heat abstractor 11 and the second heat abstractor 12 respectively, described housing 1
It is internally provided with support column 13, provides inner support power, and then the shock resistance of raising housing 1, described support column for housing 1
13 are internally provided with aluminium honeycomb core 14, and aluminium honeycomb core 14 structure has the big and lightweight advantage of intensity, and described enhancement Layer 4 is internal
Being provided with reinforcement 15, improve the intensity of housing further, described reinforcement 15 is provided with more than one, and people can be according to reality
Border situation, arranges suitable reinforcement 15 quantity, and described enhancement Layer 4 is arranged for integral type with heat dissipating layer 5, makes structure more steady
Gu, described housing 1 is in rectangular-shaped setting, and the thickness of described heat dissipating layer 5 is 0.2cm, and the thickness of described enhancement Layer 4 is 0.3cm,
The described network port 2 is provided with more than one, and described enhancement Layer 4 is by 23 parts of the calcium sulfate of proportioning by weight, mullite 15
Part, 13 parts of EP rubbers, calcium nitrate 15 parts, magnesium acetate 11 parts, aluminium nitride 16 parts, titanium dioxide 12 parts, chromium boride 12 parts, hexichol
Methyl 14 parts, sodium silicate 15 parts, citric acid 15 parts, barium stearate 15 parts, polyphenylene sulfide 10 parts, methacrylic acid 14 parts and boric acid
Calcium 14 parts is made.
The present embodiment have the beneficial effect that this high intensity switch is provided by enhancement Layer, this enhancement Layer is at each raw material
Cooperate effect under, it has the highest intensity, substantially increases the shock resistance of housing；It is provided by heat radiation
Layer, improves the heat dispersion of switch；At microprocessor, temperature sensor, the first heat abstractor and the second heat abstractor
Being equipped with down, when temperature sensor detects that switch internal temperature arrives certain value, aut sign is to micro-process
Device, microprocessor controls the first heat abstractor unlatching again and dispels the heat, when temperature sensor detects switch internal temperature mistake
Gao Shi, aut sign to microprocessor, microprocessor controls the first heat abstractor again and the second heat abstractor is opened simultaneously,
Improving radiating effect, intelligence degree is high；By being provided with radiating fin bottom pcb board, pcb board heat radiation can be accelerated,
Radiating fin is provided with heat conduction layer of paste between pcb board, and heat conduction layer of paste can be with uniform heat conduction；Enclosure interior is provided with support column,
Thering is provided inner support power, and then the shock resistance of raising housing for housing, support column is internally provided with aluminium honeycomb core, aluminum honeycomb
Cored structure has the big and lightweight advantage of intensity；Enhancement Layer is internally provided with reinforcement, improves the intensity of housing further.
Embodiment 3
As shown in Figure 1-2, a kind of high intensity switch, include housing 1, described housing 1 is provided with two-layer, distinguishes from inside to outside
Being enhancement Layer 4 and heat dissipating layer 5, described housing 1 surface configuration has the network port 2 and power interface 3, and described housing 1 is internal to be arranged
There are pcb board the 6, first heat abstractor 11 and the second heat abstractor 12, bottom described pcb board 6, are provided with radiating fin 7, described scattered
It is provided with heat conduction layer of paste 8 between hot fin 7 and pcb board 6, described pcb board 6 is provided with microprocessor 9 and temperature sensor 10,
Described microprocessor 9 is connected with temperature sensor the 10, first heat abstractor 11 and the second heat abstractor 12 respectively, described housing 1
It is internally provided with support column 13, provides inner support power, and then the shock resistance of raising housing 1, described support column for housing 1
13 are internally provided with aluminium honeycomb core 14, and aluminium honeycomb core 14 structure has the big and lightweight advantage of intensity, and described enhancement Layer 4 is internal
Being provided with reinforcement 15, improve the intensity of housing further, described reinforcement 15 is provided with more than one, and people can be according to reality
Border situation, arranges suitable reinforcement 15 quantity, and described enhancement Layer 4 is arranged for integral type with heat dissipating layer 5, makes structure more steady
Gu, described housing 1 is in rectangular-shaped setting, and the thickness of described heat dissipating layer 5 is 0.2cm, and the thickness of described enhancement Layer 4 is 0.3cm,
The described network port 2 is provided with more than one, and described enhancement Layer 4 is by 26 parts of the calcium sulfate of proportioning by weight, mullite 18
Part, 16 parts of EP rubbers, calcium nitrate 18 parts, magnesium acetate 12 parts, aluminium nitride 20 parts, titanium dioxide 16 parts, chromium boride 14 parts, hexichol
Methyl 16 parts, sodium silicate 20 parts, citric acid 18 parts, barium stearate 20 parts, polyphenylene sulfide 12 parts, methacrylic acid 16 parts and boric acid
Calcium 18 parts is made.
The present embodiment have the beneficial effect that this high intensity switch is provided by enhancement Layer, this enhancement Layer is at each raw material
Cooperate effect under, it has the highest intensity, substantially increases the shock resistance of housing；It is provided by heat radiation
Layer, improves the heat dispersion of switch；At microprocessor, temperature sensor, the first heat abstractor and the second heat abstractor
Being equipped with down, when temperature sensor detects that switch internal temperature arrives certain value, aut sign is to micro-process
Device, microprocessor controls the first heat abstractor unlatching again and dispels the heat, when temperature sensor detects switch internal temperature mistake
Gao Shi, aut sign to microprocessor, microprocessor controls the first heat abstractor again and the second heat abstractor is opened simultaneously,
Improving radiating effect, intelligence degree is high；By being provided with radiating fin bottom pcb board, pcb board heat radiation can be accelerated,
Radiating fin is provided with heat conduction layer of paste between pcb board, and heat conduction layer of paste can be with uniform heat conduction；Enclosure interior is provided with support column,
Thering is provided inner support power, and then the shock resistance of raising housing for housing, support column is internally provided with aluminium honeycomb core, aluminum honeycomb
Cored structure has the big and lightweight advantage of intensity；Enhancement Layer is internally provided with reinforcement, improves the intensity of housing further.
The above, the only detailed description of the invention of the present invention, but protection scope of the present invention is not limited thereto, and any
The change expected without creative work or replacement, all should contain within the scope of the present invention.
Claims (10)
1. a high intensity switch, it is characterised in that: including housing, described housing is provided with two-layer, distinguishes from inside to outside
Being enhancement Layer and heat dissipating layer, described surface of shell is provided with the network port and power interface, and described enclosure interior is provided with PCB
Plate, the first heat abstractor and the second heat abstractor, be provided with radiating fin, described radiating fin and pcb board bottom described pcb board
Between be provided with heat conduction layer of paste, described pcb board is provided with microprocessor and temperature sensor, described microprocessor respectively with temperature
Degree sensor, the first heat abstractor and the second heat abstractor connect, and described enhancement Layer is by the calcium sulfate 20-of proportioning by weight
26 parts, mullite 12-18 part, EP rubbers 10-16 part, calcium nitrate 12-18 part, magnesium acetate 10-12 part, aluminium nitride 12-20 part,
Titanium dioxide 8-16 part, chromium boride 10-14 part, benzhydryl 12-16 part, sodium silicate 10-20 part, citric acid 12-18 part, tristearin
Acid barium 10-20 part, polyphenylene sulfide 8-12 part, methacrylic acid 12-16 part and Calcium pyroborate 10-18 part are made.
High intensity switch the most according to claim 1, it is characterised in that: described enclosure interior is provided with support column.
High intensity switch the most according to claim 2, it is characterised in that: described support column is internally provided with aluminum honeycomb
Core.
High intensity switch the most according to claim 1, it is characterised in that: described enhancement Layer is internally provided with reinforcement.
High intensity switch the most according to claim 4, it is characterised in that: described reinforcement is provided with more than one.
High intensity switch the most according to claim 1, it is characterised in that: described enhancement Layer and heat dissipating layer are that integral type sets
Put.
High intensity switch the most according to claim 1, it is characterised in that: described housing is rectangular-shaped setting.
High intensity switch the most according to claim 1, it is characterised in that: the thickness of described heat dissipating layer is 0.2cm.
High intensity switch the most according to claim 1, it is characterised in that: the thickness of described enhancement Layer is 0.3cm.
High intensity switch the most according to claim 1, it is characterised in that: the described network port is provided with more than one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610572455.XA CN106163154B (en) | 2016-07-20 | 2016-07-20 | A kind of high intensity interchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610572455.XA CN106163154B (en) | 2016-07-20 | 2016-07-20 | A kind of high intensity interchanger |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106163154A true CN106163154A (en) | 2016-11-23 |
| CN106163154B CN106163154B (en) | 2019-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610572455.XA Expired - Fee Related CN106163154B (en) | 2016-07-20 | 2016-07-20 | A kind of high intensity interchanger |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108684165A (en) * | 2018-06-15 | 2018-10-19 | 芜湖华特电子科技有限公司 | A kind of industrial production and processing integrated machine |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004040069A (en) * | 2002-07-01 | 2004-02-05 | Chin Kuang Luo | Heat dissipation device |
| CN1487786A (en) * | 2003-08-04 | 2004-04-07 | 台达电子工业股份有限公司 | Uniform temperature device |
| CN104861419A (en) * | 2015-05-23 | 2015-08-26 | 青岛海蓝海洋复合功能材料科技有限公司 | High-strength protective armor for automotive floor |
| CN105634749A (en) * | 2014-10-27 | 2016-06-01 | 新宇迅驰信息技术（天津）有限公司 | Switch reducing dust entrance |
-
2016
- 2016-07-20 CN CN201610572455.XA patent/CN106163154B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004040069A (en) * | 2002-07-01 | 2004-02-05 | Chin Kuang Luo | Heat dissipation device |
| CN1487786A (en) * | 2003-08-04 | 2004-04-07 | 台达电子工业股份有限公司 | Uniform temperature device |
| CN105634749A (en) * | 2014-10-27 | 2016-06-01 | 新宇迅驰信息技术（天津）有限公司 | Switch reducing dust entrance |
| CN104861419A (en) * | 2015-05-23 | 2015-08-26 | 青岛海蓝海洋复合功能材料科技有限公司 | High-strength protective armor for automotive floor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108684165A (en) * | 2018-06-15 | 2018-10-19 | 芜湖华特电子科技有限公司 | A kind of industrial production and processing integrated machine |
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| CN106163154B (en) | 2019-04-09 |
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