CN106163131A - The hybrid process technique of surface mount elements and pcb board - Google Patents
The hybrid process technique of surface mount elements and pcb board Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 24
- 238000005476 soldering Methods 0.000 claims abstract description 81
- 229910000679 solder Inorganic materials 0.000 claims abstract description 41
- 238000005516 engineering process Methods 0.000 claims abstract description 24
- 239000003292 glue Substances 0.000 claims abstract description 23
- 238000003466 welding Methods 0.000 claims abstract description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000004806 packaging method and process Methods 0.000 claims abstract description 5
- 238000004026 adhesive bonding Methods 0.000 claims description 10
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 230000001680 brushing effect Effects 0.000 claims description 3
- 238000003672 processing method Methods 0.000 abstract description 12
- 230000007547 defect Effects 0.000 abstract description 9
- 239000010410 layer Substances 0.000 description 16
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
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Abstract
本发明涉及贴片元件的混合加工工艺及PCB板，其中混合加工工艺包括以下步骤：A、在单板贴片元件封装阶段，采用锡膏完成贴片元件的回流焊焊接，同时采用红胶对贴片元件进行粘接固定；B、再对单板进行波峰焊接。本发明由于采用了锡膏完成贴片元件回流焊焊接，使得贴片元件初步固定在单板上，因此能克服单独采用波峰焊所带来的空焊、连锡、掉件等缺陷；而且由于采用回流焊对贴片元件进行初步的固定，再采用波峰焊对贴片元件进行了进一步的固定，使得在单板加工过程中无需使用工装对焊接面的贴片元件进行保护遮挡，因此能避免现有技术加工方式中存在的由于工装自身的厚度对单板元件布局密度的影响，可以满足产品高密度的布局需求。
The present invention relates to a mixed processing technology of chip components and a PCB board, wherein the mixed processing technology includes the following steps: A. In the packaging stage of single-board chip components, solder paste is used to complete the reflow soldering of the chip components, and at the same time, red glue is used to SMD components are bonded and fixed; B, and then wave soldering is performed on the veneer. Because the present invention uses solder paste to complete the reflow soldering of the chip components, the chip components are initially fixed on the single board, so it can overcome the defects such as empty soldering, tin connection, and missing parts caused by wave soldering alone; and because Reflow soldering is used to initially fix the SMD components, and then wave soldering is used to further fix the SMD components, so that there is no need to use tooling to protect the SMD components on the welding surface during the single board processing, so it can avoid Due to the influence of the thickness of the tooling itself on the layout density of the single-board components in the prior art processing method, it can meet the high-density layout requirements of the product.
Description
技术领域technical field
本发明涉及电子技术领域，更具体地说，涉及一种贴片元件的混合加工工艺及PCB板。The invention relates to the field of electronic technology, and more specifically, relates to a mixed processing technology of chip components and a PCB board.
背景技术Background technique
贴片元件是电子产品中最为常用的器件类型之一，对于贴片元件的加工，目前行业内主要有回流焊与波峰焊两种成熟的加工工艺，即分别对应印锡、印胶两种加工方式。由于两种加工方式所需要使用的工艺辅料完全不同，同时结合钢网印刷的方式，对于单板上布局在同一面的贴片元件，只能采用其中一种加工工艺。也就是说，正常情况下，板上任意一个贴片元件，只能选择回流焊或波峰焊加工。SMD components are one of the most commonly used device types in electronic products. For the processing of SMD components, there are currently two mature processing technologies in the industry, reflow soldering and wave soldering, which correspond to tin printing and rubber printing respectively. Way. Since the process auxiliary materials required by the two processing methods are completely different, and combined with the stencil printing method, only one of the processing technologies can be used for the SMD components arranged on the same side of the single board. That is to say, under normal circumstances, any patch component on the board can only be processed by reflow soldering or wave soldering.
其中，回流焊工艺是先通过钢网将锡膏印刷在板上器件封装中的焊盘上，之后使用贴片机将元件贴装在板上相应的位置，最后通过回流炉完成焊接固定，即在单板SMT阶段完成加工。Among them, the reflow soldering process is to first print the solder paste on the pads in the device package on the board through the stencil, then use the placement machine to mount the components on the corresponding position on the board, and finally complete the soldering and fixing through the reflow furnace, that is, The processing is completed at the single board SMT stage.
波峰焊工艺是先通过钢网将红胶印刷在板上器件封装中焊盘之间的绿油区域，之后使用贴片机将元件贴装在板上相应的位置，再通过回流炉加热完成红胶的固化，最后通过波峰炉完成焊接固定，即在单板波峰焊阶段完成加工。The wave soldering process is to first print the red glue on the green oil area between the pads in the device package on the board through the steel mesh, and then use the placement machine to mount the components on the corresponding position on the board, and then heat through the reflow furnace to complete the red glue. The curing of the glue, and finally the welding and fixing are completed through the wave furnace, that is, the processing is completed in the wave soldering stage of the veneer.
上述现有技术中，采用回流焊加工存在以下缺陷：In the above-mentioned prior art, there are following defects in the reflow soldering process:
(1)、对于采用双面回流+选择性波峰焊加工方式的单板，为避免贴片元件的焊锡受到高温后熔化导致元件掉落，波峰焊阶段需要对焊接面所有的贴片元件使用工装进行保护遮挡，同时工装要对插装元件管脚等需要焊接的区域开口处理，由于工装自身需要一定的厚度，这就对贴片元件与插件管脚之间的距离有一定的要求，通常情况下至少需要3mm，从而在很大程度上无法满足布局密度较高的单板的元件布局需求；(1) For single boards that adopt the double-sided reflow + selective wave soldering processing method, in order to prevent the solder of the SMD components from melting after being exposed to high temperature and causing the components to drop, it is necessary to use tooling for all the SMD components on the soldering surface during the wave soldering stage For protection and shielding, at the same time, the tooling should open the area that needs to be welded, such as the pins of the plug-in components. Since the tooling itself needs a certain thickness, there is a certain requirement for the distance between the patch component and the pins of the plug-in. Usually, At least 3mm is required, so it cannot meet the component layout requirements of single boards with high layout density to a large extent;
(2)、对于采用双面回流加工方式的单板，即单板其中一面的贴片元件需要经过两次回流焊，由于回流焊的高温会导致单板其中一面已经完成回流焊接的贴片元件焊点的焊锡熔化，因此如果相应贴片元件的重量相对较大，则回流焊后会出现掉件的现象。(2) For a single board that adopts double-sided reflow processing, that is, the SMD components on one side of the single board need to go through two reflow soldering, because the high temperature of the reflow soldering will cause the SMD components that have been reflow soldered on one side of the single board The solder of the solder joint melts, so if the weight of the corresponding SMD component is relatively large, there will be a phenomenon of falling parts after reflow soldering.
采用波峰焊加工存在以下缺陷：The use of wave soldering processing has the following defects:
(1)、对于采用双面贴装+常规波峰焊加工方式的单板，其中一面的贴片元件在SMT阶段通过红胶粘接固定，之后在波峰焊接段完成焊接。但是往往由于器件布局，波峰焊设备自身等一系列因素，导致波峰焊后贴片元件容易出现空焊、连锡、掉件等焊接缺陷。(1) For the single board that adopts double-sided mounting + conventional wave soldering processing method, the SMT components on one side are fixed by red glue in the SMT stage, and then the soldering is completed in the wave soldering section. However, often due to a series of factors such as device layout and wave soldering equipment itself, after wave soldering, SMD components are prone to soldering defects such as empty soldering, tin connection, and missing parts.
(2)、贴片元件的波峰焊接对封装有一定的要求，也就是说不是所有封装类型的贴片元件均适合波峰焊接。如BGA/QFP/PLCC/Chip0402及以下等封装类型的贴片元件无法通过波峰焊加工，而只能采用回流焊加工，从而在一定程度上影响单板的整体布局。(2) The wave soldering of SMD components has certain requirements on the package, that is to say, not all package types of SMD components are suitable for wave soldering. SMD components such as BGA/QFP/PLCC/Chip0402 and below package types cannot be processed by wave soldering, but can only be processed by reflow soldering, which affects the overall layout of the board to a certain extent.
(3)、由于主要依靠焊端两侧面上锡，贴片元件的波峰焊封装通常会较回流焊封装大一些，这会在一定程度上增加元件在单板上的布局空间，降低单板的整体布局密度。(3) Since it mainly relies on tin on both sides of the solder end, the wave soldering package of the SMD component is usually larger than the reflow soldering package, which will increase the layout space of the component on the board to a certain extent and reduce the board. Overall layout density.
(4)、贴片元件的波峰焊接对其在板上的布局方向有严格的要求，如SOP封装，必须保证轴向与波峰焊方向一致，否则就会由于元件本体自身的阴影效应造成其中一侧的管脚焊接不良，这也会在一定程度上对单板的整体布局，布线造成影响。(4) The wave soldering of SMD components has strict requirements on the layout direction on the board. For example, SOP package must ensure that the axial direction is consistent with the wave soldering direction, otherwise one of them will be caused by the shadow effect of the component itself. Poor soldering of the pins on the side will also affect the overall layout and wiring of the board to a certain extent.
综上所述，现有技术中贴片元件的两种加工方式各有利弊，回流焊加工方式直通率固然较高，但是由于工装保护空间的限制，无法满足高密度布局单板的实际需求；波峰焊的加工方式固然在一定程度上可以满足高密度单板的布局需求，但是由于制程加工直通率相对较低，导致产品返修率较高，无法有效保证产品的加工品质。随着电子产品朝着高密度、微型化的方向发展，单板的布局密度肯定会越来越高。因此需要一种全新的加工方式，既可以满足贴片元件的焊接质量，又可以满足产品高密度布局的需求。To sum up, the two processing methods of SMT components in the prior art have their own advantages and disadvantages. The reflow processing method has a higher pass-through rate, but due to the limitation of tooling protection space, it cannot meet the actual needs of high-density layout veneers; Although the processing method of wave soldering can meet the layout requirements of high-density single boards to a certain extent, due to the relatively low pass-through rate of the process, the product repair rate is high, and the processing quality of the product cannot be effectively guaranteed. With the development of electronic products in the direction of high density and miniaturization, the layout density of single boards will definitely become higher and higher. Therefore, a new processing method is needed, which can not only meet the welding quality of SMD components, but also meet the needs of high-density layout of products.
发明内容Contents of the invention
本发明要解决的技术问题在于，针对现有技术的上述缺陷，提供一种焊接质量高、满足产品高密度布局需求的贴片元件的混合加工工艺。The technical problem to be solved by the present invention is to provide a hybrid processing technology for patch components with high welding quality and meeting the high-density layout requirements of products, aiming at the above-mentioned defects of the prior art.
本发明的另一目的在于，提供一种采用上述贴片元件的混合加工工艺生产的PCB板。Another object of the present invention is to provide a PCB board produced by adopting the mixed processing technology of the above patch components.
本发明解决其技术问题所采用的技术方案是：The technical solution adopted by the present invention to solve its technical problems is:
构造一种贴片元件的混合加工工艺，其中，包括以下步骤：Construct a hybrid processing technology for patch components, which includes the following steps:
A、在单板贴片元件封装阶段，采用锡膏完成贴片元件的回流焊焊接，同时采用红胶对贴片元件进行粘接固定；A. In the packaging stage of single-board patch components, solder paste is used to complete the reflow soldering of the patch components, and red glue is used to bond and fix the patch components;
B、再对单板进行波峰焊接。B. Perform wave soldering on the veneer again.
本发明所述的混合加工工艺，其中，所述步骤A包括：Mixing processing technology of the present invention, wherein, described step A comprises:
A1、对贴片元件封装中的焊盘进行印锡处理；A1. Print tin on the pads in the SMD component package;
A2、对贴片元件封装的绿油区域进行刷胶处理；A2. Apply glue to the green oil area of the patch component package;
A3、完成贴片元件的贴装；A3. Complete the placement of SMD components;
A4、通过回流炉完成贴片元件的初步焊接固定。A4. Complete the preliminary welding and fixing of the patch components through the reflow furnace.
本发明所述的混合加工工艺，其中，所述步骤A2中，对贴片元件封装的绿油区域进行刷胶处理时，避开焊盘上的锡膏区域，以免红胶接触到锡膏。In the hybrid processing technique of the present invention, in the step A2, when applying glue to the green oil area of the chip component package, avoid the solder paste area on the pad, so as to prevent the red glue from contacting the solder paste.
本发明所述的混合加工工艺，其中，所述步骤A3中，对所述贴片元件进行贴装时，使得贴片元件同时接触所述焊盘上的锡膏和红胶。In the hybrid processing technique of the present invention, in the step A3, when mounting the patch components, the patch components are simultaneously in contact with the solder paste and red glue on the pad.
本发明所述的混合加工工艺，其中，所述步骤A1的印锡处理中采用第一钢网，所述步骤A2的刷胶处理中采用第二钢网；其中，The mixed processing technology of the present invention, wherein the first stencil is used in the tin printing process of the step A1, and the second stencil is used in the glue brushing process of the step A2; wherein,
所述第一钢网厚度小于所述第二钢网厚度。The thickness of the first stencil is smaller than the thickness of the second stencil.
本发明所述的混合加工工艺，其中，所述第一钢网厚度为0.1～0.12mm。In the hybrid processing technique of the present invention, the thickness of the first steel mesh is 0.1-0.12 mm.
本发明所述的混合加工工艺，其中，所述第二钢网厚度为0.25～0.3mm。According to the hybrid processing technology of the present invention, the thickness of the second steel mesh is 0.25-0.3 mm.
本发明还提供了一种采用如前述任一项所述的混合加工工艺生产的PCB板，包括单板及其上的贴片元件，其中，所述贴片元件与所述单板之间同时有锡膏焊接层和红胶粘接层。The present invention also provides a PCB board produced by the mixed processing technology as described in any one of the foregoing, including a single board and patch components on it, wherein the patch component and the single board are simultaneously There are solder paste soldering layer and red glue bonding layer.
本发明所述的PCB板，其中，所述锡膏焊接层位于所述贴片元件引脚两端，所述红胶粘接层位于两个所述锡膏焊接层之间。In the PCB board of the present invention, the solder paste soldering layer is located at both ends of the pins of the patch component, and the red glue bonding layer is located between the two solder paste soldering layers.
本发明所述的PCB板，其中，所述红胶粘接层厚度大于所述锡膏焊接层厚度。In the PCB board of the present invention, the thickness of the red glue bonding layer is greater than the thickness of the solder paste welding layer.
本发明的有益效果在于：由于采用了锡膏完成贴片元件回流焊焊接，使得贴片元件初步固定在单板上，因此能克服单独采用波峰焊所带来的空焊、连锡、掉件等缺陷；而且由于采用回流焊对贴片元件进行初步的固定，再采用波峰焊对贴片元件进行了进一步的固定，使得在单板加工过程中无需使用工装对焊接面的贴片元件进行保护遮挡，因此能避免现有技术加工方式中存在的由于工装自身的厚度对单板元件布局密度的影响，可以满足产品高密度的布局需求。The beneficial effect of the present invention is that: due to the use of solder paste to complete the reflow soldering of the chip components, the chip components are initially fixed on the single board, so it can overcome the problems of empty soldering, tin connection and missing parts caused by wave soldering alone and other defects; and because the SMD components are initially fixed by reflow soldering, and then the SMD components are further fixed by wave soldering, so that there is no need to use tooling to protect the SMD components on the welding surface during the single board processing Therefore, it can avoid the influence of the thickness of the tooling itself on the layout density of the veneer components in the processing method of the prior art, and can meet the high-density layout requirements of the product.
附图说明Description of drawings
下面将结合附图及实施例对本发明作进一步说明，附图中：The present invention will be further described below in conjunction with accompanying drawing and embodiment, in the accompanying drawing:
图1是采用本发明较佳实施例的贴片元件的混合加工工艺生产的单个贴片元件示意图；Fig. 1 is the single patch component schematic diagram that adopts the mixed processing technology of patch component of preferred embodiment of the present invention to produce;
图2是本发明较佳实施例的贴片元件的混合加工工艺中焊盘及其锡膏结构示意图。Fig. 2 is a schematic diagram of the solder pad and its solder paste structure in the mixed processing technology of the chip component according to the preferred embodiment of the present invention.
具体实施方式detailed description
本发明较佳实施例的贴片元件的混合加工工艺包括以下步骤：S1、在单板贴片元件封装阶段，采用锡膏完成贴片元件的回流焊焊接，同时采用红胶对贴片元件进行粘接固定；S2、对采用回流焊后的单板进行波峰焊接。由于在步骤S1中采用了锡膏完成贴片元件回流焊焊接，使得贴片元件初步固定在单板上，因此能克服单独采用波峰焊所带来的空焊、连锡、掉件等缺陷；而且由于在步骤S1中采用回流焊对贴片元件进行初步的固定，在步骤S2采用波峰焊对贴片元件进行了进一步的固定，使得在单板加工过程中无需使用工装对焊接面的贴片元件进行保护遮挡，因此能避免现有技术加工方式中存在的由于工装自身的厚度对单板元件布局密度的影响，可以在很大程度上减小贴片元件与插件管脚之间的距离，有效节省单板布局空间，提高单板的布局密度，可以满足单板高密度的布局需求。The mixed processing technology of the chip component of the preferred embodiment of the present invention comprises the following steps: S1, in the packaging stage of the single-board chip component, use solder paste to complete the reflow soldering of the chip component, and use red glue to carry out the reflow soldering of the chip component Bonding and fixing; S2, performing wave soldering on the veneer after reflow soldering. Since the solder paste is used to complete the reflow soldering of the chip components in step S1, the chip components are initially fixed on the single board, so defects such as empty soldering, tin connection, and missing parts caused by wave soldering alone can be overcome; Moreover, since the SMD components are initially fixed by reflow soldering in step S1, the SMD components are further fixed by wave soldering in step S2, so that there is no need to use tooling to attach the SMD components on the welding surface during the processing of the single board. The components are protected and shielded, so it can avoid the influence of the thickness of the tooling itself on the layout density of the veneer components in the existing processing methods, and can greatly reduce the distance between the patch components and the plug-in pins. Effectively save board layout space, increase the layout density of the board, and meet the high-density layout requirements of the board.
进一步地，上述步骤S1具体包括以下步骤：S11、对贴片元件封装中的焊盘进行印锡处理；S12、对贴片元件封装的绿油区域进行刷胶处理，优选采用红胶；S13、完成贴片元件的贴装；S14、通过回流炉完成贴片元件在单板上的初步焊接固定。在步骤S14中，通过回流炉进行焊接时，红胶先固化，锡膏后熔融，因此可以一次加热完成对贴片元件两种形式的固定。对于不适合采用波峰焊的封装类型贴片元件，在此步骤中即可完成焊接；对于适合波峰焊的贴片元件，在步骤S2中的波峰焊过程中，可以进一步加固。因此，本实施例中的混合加工工艺应用范围极广泛。Further, the above step S1 specifically includes the following steps: S11, performing tin printing on the pads in the chip component package; S12, applying glue to the green oil area of the chip component package, preferably using red glue; S13, Finishing the mounting of the chip components; S14, completing the preliminary welding and fixing of the chip components on the single board through the reflow furnace. In step S14, when soldering through a reflow furnace, the red glue solidifies first, and the solder paste melts later, so the two types of fixing of the patch components can be completed by one heating. For packaged SMD components that are not suitable for wave soldering, soldering can be completed in this step; for SMD components suitable for wave soldering, further reinforcement can be performed during the wave soldering process in step S2. Therefore, the application range of the hybrid processing technology in this embodiment is extremely wide.
在上述步骤S11中，锡膏的厚度直接影响焊接质量，因此锡膏不能太厚，也不能太薄。在步骤S12中，刷胶层不能太厚也不能太薄，由于贴片元件中间部分相对于具有焊盘的两端凹陷，因此刷胶层的厚度应大于两侧锡膏的厚度，因此需要采用厚度大于第一钢网的第二钢网对贴片元件封装的绿油区域进行刷胶处理。In the above step S11, the thickness of the solder paste directly affects the soldering quality, so the solder paste cannot be too thick or too thin. In step S12, the adhesive layer should be neither too thick nor too thin. Since the middle part of the patch component is recessed relative to the two ends with pads, the thickness of the adhesive layer should be greater than the thickness of the solder paste on both sides, so it is necessary to use The second stencil with a thickness greater than the first stencil brushes the green oil area of the SMT component package.
优选地，上述第一钢网厚度为0.1～0.12mm，第二钢网厚度为0.25～0.3mm。Preferably, the thickness of the first steel mesh is 0.1-0.12 mm, and the thickness of the second steel mesh is 0.25-0.3 mm.
进一步地，上述步骤S12中，对贴片元件封装的绿油区域进行刷胶处理时，避开焊盘上的锡膏区域，以免红胶接触到锡膏而影响焊接质量。Further, in the above step S12, when brushing the green oil area of the chip component package, avoid the solder paste area on the pad, so as to prevent the red glue from contacting the solder paste and affecting the soldering quality.
进一步地，上述步骤S13中，对贴片元件进行贴装时，需要保证贴片元件同时接触焊盘上的锡膏和红胶。如果任何一部分接触不良，都会导致该贴片元件的焊接质量，因此贴片过程中应精确操作。Further, in the above step S13, when mounting the chip components, it is necessary to ensure that the chip components are in contact with the solder paste and red glue on the pad at the same time. If any part is in poor contact, it will lead to the soldering quality of the patch component, so it should be operated precisely during the patch process.
在本发明另一实施例中，还提供了一种采用如前述任一实施例中的混合加工工艺生产的PCB板，包括单板及其上的贴片元件，如图1和图2所示，其中贴片元件20与单板之间同时有锡膏焊接层111和红胶粘接层12。由于同时具有锡膏焊接层111和红胶粘接层12，因此不会存在单独采用波峰焊所带来的空焊、连锡、掉件等缺陷；而且使得在单板加工过程中无需使用工装对焊接面的贴片元件进行保护遮挡，因此能避免现有技术加工方式中存在的由于工装自身的厚度对单板元件布局密度的影响，可以满足PCB产品高密度的布局需求。In another embodiment of the present invention, there is also provided a PCB board produced by a mixed processing technology as in any of the preceding embodiments, including a single board and patch components on it, as shown in Figure 1 and Figure 2 , wherein there is a solder paste welding layer 111 and a red glue bonding layer 12 between the chip component 20 and the single board. Since it has the solder paste soldering layer 111 and the red glue bonding layer 12 at the same time, there will be no defects such as empty soldering, tin connection, and missing parts caused by wave soldering alone; and it makes it unnecessary to use tooling in the process of veneer processing The patch components on the welding surface are protected and shielded, so the influence of the thickness of the tooling itself on the layout density of the single board components in the prior art processing method can be avoided, and the high-density layout requirements of PCB products can be met.
上述实施例中，具体地，如图1和图2所示，根据前述混合加工工艺和贴片元件自身封装特点，锡膏焊接层111设置在焊盘11上，位于贴片元件引脚两端，红胶粘接层12位于两个锡膏焊接层111之间。In the above-mentioned embodiment, specifically, as shown in Fig. 1 and Fig. 2, according to the above-mentioned mixed processing technology and the packaging characteristics of the SMD component itself, the solder paste soldering layer 111 is arranged on the pad 11, and is located at both ends of the SMD component pins. , the red glue bonding layer 12 is located between the two solder paste soldering layers 111 .
上述实施例中，具体地，如图1和图2所示，根据前述混合加工工艺可知，红胶粘接层12厚度大于锡膏焊接层111厚度，以保证对贴片元件20的焊接质量，避免空焊、连锡、掉件等焊接缺陷。In the above-mentioned embodiment, specifically, as shown in FIG. 1 and FIG. 2 , according to the aforementioned mixed processing technology, the thickness of the red glue bonding layer 12 is greater than the thickness of the solder paste soldering layer 111, so as to ensure the welding quality of the chip component 20, Avoid welding defects such as empty welding, tin connection, and missing parts.
综上，本发明方案通过回流焊+波峰焊的混合加工方式实现板上贴片元件的焊接加工，可以有效满足对产品焊接质量和高密度布局的实际需求，最大限度地实现产品设计与制程加工的平衡。To sum up, the solution of the present invention realizes the welding processing of the chip components on the board through the mixed processing method of reflow soldering + wave soldering, which can effectively meet the actual needs of product welding quality and high-density layout, and realize product design and process processing to the greatest extent. balance.
应当理解的是，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，而所有这些改进和变换都应属于本发明所附权利要求的保护范围。It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should belong to the protection scope of the appended claims of the present invention.
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