CN106163108A - Circuit and preparation method thereof - Google Patents
Circuit and preparation method thereof Download PDFInfo
- Publication number
- CN106163108A CN106163108A CN201510170274.XA CN201510170274A CN106163108A CN 106163108 A CN106163108 A CN 106163108A CN 201510170274 A CN201510170274 A CN 201510170274A CN 106163108 A CN106163108 A CN 106163108A
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- end points
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- junction point
- loop coil
- plain conductor
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- 238000002360 preparation method Methods 0.000 title description 2
- 239000004020 conductor Substances 0.000 claims abstract description 59
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 238000000034 method Methods 0.000 claims abstract description 40
- 230000004888 barrier function Effects 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 claims abstract description 20
- 230000008569 process Effects 0.000 claims abstract description 14
- 238000005530 etching Methods 0.000 claims abstract description 13
- 238000005516 engineering process Methods 0.000 claims abstract description 10
- 238000012545 processing Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 229910000859 α-Fe Inorganic materials 0.000 claims description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229920006351 engineering plastic Polymers 0.000 claims description 6
- 229920000728 polyester Polymers 0.000 claims description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 2
- -1 phenolic aldehyde Chemical class 0.000 claims 1
- 230000007423 decrease Effects 0.000 abstract description 4
- 238000004891 communication Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- RCHKEJKUUXXBSM-UHFFFAOYSA-N n-benzyl-2-(3-formylindol-1-yl)acetamide Chemical compound C12=CC=CC=C2C(C=O)=CN1CC(=O)NCC1=CC=CC=C1 RCHKEJKUUXXBSM-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
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- Details Of Aerials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The present invention is applicable to circuit processing technique field, it is provided that the manufacture method of a kind of circuit, by making circuit on single sided board, it is intended to solve to use single sided board to complete the technical problem that circuit makes in prior art.The manufacture method of this circuit comprises the following steps: circuit etching figure, windows, metalized, bonding, bond wire wire between described first end points and described second end points, and is provided with an insulating barrier between described plain conductor and described loop coil.By etching loop coil on single substrate and by bonding technology, described toroidal inside and outside first end points and the second end points being electrically connected by plain conductor, thus realize the first end points and double-pointed electric connection inside and outside multiturn loop coil, i.e. achieve and realize the purpose that circuit connects on the same surface of single substrate, decrease technological process, and greatly reduce the manufacturing cost of antenna.
Description
Technical field
The invention belongs to circuit processing technique field, particularly relate to the manufacture method of a kind of circuit and this circuit.
Background technology
In recent years, along with wireless terminal and the development of mechanics of communication, wireless near field communication (Near Field
Communication, NFC) obtain increasing research and application.NFC technique utilizes electromagnetism sense
The principle answered, applies the electric current of alternation in transmitting terminal aerial coil, produces corresponding change of magnetic field strength
Magnetic field, receiving terminal aerial coil senses the change in magnetic field, produces the electric current of corresponding Changing Pattern, thus
Realize point-to-point data exchanging function.
The key core producing electromagnetic conversion is the coil of NFC antenna, and it is made up of multiturn coil, by
In in approximately the same plane, the circuit end points in the innermost portion of multiturn coil cannot be located at outside multiturn coil
Junction point be joined directly together, and do not cause the short circuit of turn-to-turn circuit, therefore traditional for NFC technique is according to double
The technique of panel, is connected the end points of internal layer circuit with the circuit of another plane, accomplishes in another plane
Junction point outside with multiturn coil is connected.
For reducing the cost of manufacture of NFC antenna further, the producer having at present uses single sided board to add " wire jumper "
Technique make coil: complete the major part of aerial coil by the technique of single sided board, inside and outside multiturn coil
Respectively stay next end points, after circuit carries out insulating barrier between two end points, print conduction between the two endpoints
Conducting made by material, reaches the purpose that the end points on internal layer circle road is connected with the end points on outer layer circle road.
Although such scheme reduces the manufacturing cost of antenna traces, but owing to manufacturing process existing
The techniques such as baking, causing the reduction in terms of material cost and process costs is not it is obvious that limit the party
The popularization of method.
Summary of the invention
It is an object of the invention to provide the manufacture method of a kind of circuit, by making circuit on single sided board,
Aim to solve the problem that and prior art cannot use single sided board complete the technical problem that circuit makes.
The present invention is achieved in that the manufacture method of a kind of circuit, comprises the following steps:
Circuit etching figure a, it is provided that single substrate, uses etch process etching line on described single substrate
Road figure, described line pattern includes loop coil that multiturn is sequentially connected with and is positioned at described loop coil
The first outer end points and the second end points, and on described single substrate, it is provided with the be connected with described line pattern
One junction point and the second junction point, described toroidal two ends are respectively described first end points and described
First junction point, described second end points is between described second junction point and described loop coil；
Window, described first end points, described second end points, described first junction point and described second are connected
Point carries out nonisulatedization process；
Metalized, to described first end points after processing of windowing, described second end points, described first company
Plate between a metal level, and described second end points and described second junction point at contact and described second junction point
Line pattern is electrically connected；
Bonding, bond wire wire between described first end points and described second end points, and at described metal
An insulating barrier it is provided with between wire and described loop coil.
Further, in a bonding step, the material of described plain conductor be gold, silver, copper, aluminum, ferrum or
Its alloy of person.
Further, in a bonding step, the quantity of described plain conductor is 1 plain conductor or many
Plain conductor.
Further, described insulating barrier is by printing dielectric ink on described loop coil or described
Pasting protective film on loop coil and obtain, or described insulating barrier is by described plain conductor is made insulation
Line, electric wire or enamel-covered wire.
Further, in the step of circuit etching figure, described single substrate can be single-sided flexible circuit
Plate, single side printed wiring board or medium substrate, the material of described medium substrate be polyester, phenolic resin or
Person's engineering plastics.
Further, described circuit is circuit or the circuit of WPC antenna of NFC antenna.
Present invention also offers a kind of circuit, including:
Single substrate, described single substrate includes join domain and the circuit shape being connected with described join domain
Becoming region, described join domain is provided with the first junction point and the second junction point；
Line pattern, is arranged at described circuit and forms region, described line pattern includes that multiturn is sequentially connected with
Loop coil and be provided with and be positioned at the first end points inside and outside described coil and the second end points, described toroidal
Two ends are respectively described first end points and described first junction point, and described second end points is positioned at described second
Between junction point and described loop coil；
Metal level, is formed at described first end points, described second end points, described first company by process of windowing
At contact and described second junction point, and at line pattern between described second end points and described second junction point
In be electrically connected；
Plain conductor, uses bonding technology to be electrically connected between described first end points and described second end points；
Insulating barrier, is arranged between described plain conductor and above-mentioned loop coil.
Further, the material of described plain conductor is gold, silver, copper, aluminum, ferrum or its alloy, described
The quantity of plain conductor is 1 plain conductor or many plain conductors.
Further, described single substrate can be single-sided flexible circuit plate, single side printed wiring board or Jie
Matter substrate, the material of described medium substrate is polyester, phenolic resin or engineering plastics.
Further, described circuit also includes that ferrite layer, described ferrite layer are covered in described plain conductor
Top is so that described plain conductor is between described ferrite layer and described loop coil.
The present invention having the technical effect that by etching loop coil also on single substrate relative to prior art
By bonding technology, described toroidal inside and outside first end points and the second end points are electrically connected by plain conductor
Connect, thus realize the first end points and double-pointed electric connection inside and outside multiturn loop coil, i.e. achieve
The same surface of single substrate realizes the purpose that circuit connects, and decreases technological process, and greatly reduces sky
The manufacturing cost of line.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme of the embodiment of the present invention, below will be to the embodiment of the present invention or existing
In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, disclosed below is attached
Figure is only some embodiments of the present invention, for those of ordinary skill in the art, is not paying creation
Property work on the premise of, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the front view that the embodiment of the present invention provides circuit；
Fig. 2 is the front view of the single substrate of circuit in the embodiment of the present invention；
Fig. 3 is the structural representation windowed a little of single substrate in the embodiment of the present invention；
Fig. 4 is circuit structural representation after bond wire wire in the embodiment of the present invention；
Fig. 5 is the structural representation of the circuit that the embodiment of the present invention provides；
Fig. 6 is that the circuit that the embodiment of the present invention provides is sticking the structural representation of ferrite layer.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with accompanying drawing and reality
Execute example, the present invention is further elaborated.Only should be appreciated that specific embodiment described herein
Only in order to explain the present invention, it is not intended to limit the present invention.
Refer to Fig. 1 to Fig. 5, the manufacture method of the circuit that the embodiment of the present invention provides comprises the following steps:
Circuit etching figure 12 a, it is provided that single substrate 10, uses etch process at described single substrate 10
Upper circuit etching figure 12, described line pattern 12 include loop coil 122 that multiturn is sequentially connected with and
It is positioned at the first end points 124 and the second end points 126 inside and outside described loop coil 122, and at described one side base
Plate 10 is provided with the first junction point 14 and the second junction point 16 being connected with described line pattern 12, described
Two ends of loop coil 122 are respectively described first end points 124 and described first junction point 14, described
Second end points 126 is between described second junction point 16 and described loop coil 122；
Window, to described first end points 124, described second end points 126, described first junction point 14 and institute
State the second junction point 16 and carry out nonisulatedization process；
Metalized, to described first end points 124 after processing of windowing, described second end points 126, described
A metal level (not shown), and described second end points is plated at first junction point 14 and described second junction point 16
It is electrically connected in line pattern between 126 and described second junction point 16；
Bonding, bond wire wire 30 between described first end points 124 and described second end points 126, and
An insulating barrier (not shown) it is provided with between described plain conductor 30 and described loop coil 122.
The manufacture method of the circuit that the embodiment of the present invention provides is by etching loop coil on single substrate 10
122 and by bonding technology by the first end points 124 and the second end points 126 inside and outside described loop coil 122
Electrically connected by plain conductor 30, thus realize the first end points 124 and second inside and outside multiturn loop coil 122
The electric connection of end points 126, i.e. achieves and realizes the purpose that circuit connects on the same surface of single substrate 10,
Decrease technological process, and greatly reduce the manufacturing cost of antenna.
Refer to Fig. 2, in this embodiment, described first junction point 14 and described second junction point 16 set
It is placed in the outside of described loop coil 122, to be connected with outside line.
In this embodiment, the quantity of described first end points 124 and described second end points 126 can be respectively
1, it is also possible to be multiple, its quantity is not intended to, be capable of electrical connection and reduce processing cost be
Preferably.
Refer to Fig. 5, in this embodiment, bonding (Wire Bonding) is a kind of use lametta,
Utilizing heat, pressure, ultrasonic energy is the tight seam of end points after making metal lead wire and metalized, real
Electric interconnection between existing end points and the information mutual communication of junction point.Under preferable control condition, between lead-in wire and end points
Electronics can be occurred to share or the phase counterdiffusion of atom, so that realizing the bonding in atom magnitude between two kinds of metals.
In a bonding step, the length of described plain conductor 30 is slightly larger than described first end points 124 and described second end
Distance between point 126, is advisable not affecting bonding technology, the thickness of this plain conductor 30 and width
It is advisable realizing electrical connection.
In this embodiment, in the step of metalized, the material of described metal level can be gold, silver,
The conductive materials such as copper, aluminum or its alloy.
Refer to Fig. 5, further, in a bonding step, the material of described plain conductor 30 be gold, silver,
Copper, aluminum, ferrum or its alloy.It is appreciated that and utilizes plain conductor 30 to be connected to described first end points 124
And between described second end points 126, so that described loop coil 122 and the first junction point 14 and described second
Junction point 16 electrically connects, thus forms circuit on single substrate 10, and technique is simple.
Preferably, in a bonding step, the quantity of described plain conductor 30 be 1 plain conductor 30 or
Many plain conductors 30.
Refer to Fig. 2, further, described insulating barrier is by printing on described loop coil 122 absolutely
Edge ink or on described loop coil 122 pasting protective film and obtain, or described insulating barrier be by will
Described plain conductor 30 makes covered wire, electric wire or enamel-covered wire.It is appreciated that described insulating barrier is formed at
Between described loop coil 122 and described plain conductor 30, its coverage can be the first end points 124
For the region of placement plain conductor 30 between the second end points 126, described plain conductor 30 is arranged at
Described insulating barrier upper surface is to connect described first end points 124 and described end points, thus realizes single substrate 10
The connection of upper circuit.This insulating barrier is the insulated hull being coated on outside described plain conductor 30, to ensure described gold
Belong to and be in state of insulation between wire 30 and described loop coil 122.
Further, in the step of circuit etching figure 12, described single substrate 10 can be that one side is soft
Property circuit board, single side printed wiring board or medium substrate, the material of described medium substrate is polyester, phenolic aldehyde
Resin or engineering plastics.
Refer to Fig. 6, further, described circuit is circuit or the line of WPC antenna of NFC antenna
Road.In other embodiments, described circuit can be that other arbitrarily include the circuit of multiturn coil.Permissible
Understand ground, for NFC antenna, also include the step attaching ferrite layer 50, described ferrite layer 50 shape
The top of metallic circuit described in Cheng Yu is so that described metallic circuit is positioned at described loop coil 122 and above-mentioned ferrum oxygen
Between body layer 50.
Refer to Fig. 1 to Fig. 5, the circuit that the embodiment of the present invention provides includes:
Single substrate 10, described single substrate 10 include join domain 11 and with described join domain 11
The circuit being connected forms region 15, and described join domain 11 is provided with the first junction point 14 and the second junction point 16；
Line pattern 12, is arranged at described circuit and forms region 15, described line pattern 12 includes multiturn
The loop coil 122 that is sequentially connected with also is provided with the first end points 124 and the second end points being positioned at inside and outside described coil
126, two ends of described loop coil 122 are respectively described first end points 124 and described first junction point
14, described second end points 126 is between described second junction point 16 and described loop coil 122；
Metal level (not shown), is formed at described first end points 124, described second end points by process of windowing
126, at described first junction point 14 and described second junction point 16, and described second end points 126 is with described
It is electrically connected in line pattern between second junction point 16；
Plain conductor 30, uses bonding technology to be electrically connected at described first end points 124 and described second end points
Between 126；
Insulating barrier (not shown), is arranged between described plain conductor 30 and above-mentioned loop coil 122.
The circuit that the embodiment of the present invention provides is by arranging loop coil 122 and passing through key on single substrate 10
Close technique and the first end points 124 and the second end points 126 inside and outside described loop coil 122 are passed through plain conductor
30 electrical connections, thus realize the first end points 124 and electricity of the second end points 126 inside and outside multiturn loop coil 122
Property connect, i.e. achieve realize on the same surface of single substrate 10 circuit connect purpose, decrease technique
Flow process, and greatly reduce the manufacturing cost of antenna.
Refer to Fig. 2, in this embodiment, described first junction point 14 and described second junction point 16 set
It is placed in the outside of described loop coil 122, to be connected with outside line.Preferably, described first connects
Point 14 and described second junction point 16 are the golden finger of this circuit.
In this embodiment, the quantity of described first end points 124 and described second end points 126 can be respectively
1, it is also possible to be multiple, its quantity is not intended to, be capable of electrical connection and reduce processing cost be
Preferably.
Refer to Fig. 5, in this embodiment, the length of described plain conductor 30 is slightly larger than described first end points
Distance between 124 and described second end points 126, is advisable not affecting bonding technology, and this metal is led
The thickness of line 30 and width are advisable to realize electrical connection.
In this embodiment, the material of described metal level can be the conduction materials such as gold, silver, copper or its alloy
Material.
Refer to Fig. 5, in this embodiment, described insulating barrier is by printing on described loop coil 122
Brush dielectric ink or on described loop coil 122 pasting protective film and obtain, or described insulating barrier is logical
Cross and described plain conductor 30 is made covered wire, electric wire or enamel-covered wire.Described insulating barrier is formed at described ring
Between shape coil 122 and described plain conductor 30, its coverage can be the first end points 124 to the second end
For the region of placement plain conductor 30 between point 126, described plain conductor 30 is arranged at described insulation
Layer upper surface is to connect described first end points 124 and described end points, thus realizes circuit on single substrate 10
Connect.This insulating barrier can also be the insulated hull being coated on outside described plain conductor 30, to ensure described metal
It is in state of insulation between wire 30 and described loop coil 122.
Refer to Fig. 5, further, the material of described plain conductor 30 be gold, silver, copper, aluminum, ferrum or
Its alloy of person, the quantity of described plain conductor 30 is 1 plain conductor 30 or many plain conductors 30.
It is appreciated that and utilizes plain conductor 30 to be connected between described first end points 124 and described second end points 126,
So that described loop coil 122 electrically connects with the first junction point 14 and described second junction point 16, thus
Forming circuit on single substrate 10, technique is simple.
Further, described single substrate 10 can be single-sided flexible circuit plate, single side printed wiring board or
Medium substrate, the material of described medium substrate is polyester, phenolic resin or engineering plastics.
In this embodiment, the described circuit in the various embodiments described above can be NFC antenna circuit or
The circuit of WPC antenna.In other embodiments, described circuit can be that other arbitrarily include multiturn coil
Circuit.
Refer to Fig. 6, further, described circuit also includes ferrite layer 50, described ferrite layer 50
It is covered in above described plain conductor 30 so that described plain conductor 30 is positioned at described ferrite layer 50 with described
Between loop coil 122.For NFC antenna, also include the step attaching ferrite layer 50, described ferrum
Oxysome layer 50 is formed at the top of described metallic circuit so that described metallic circuit is positioned at described loop coil 122
And between above-mentioned ferrite layer 50.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all at this
Any amendment, equivalent and the improvement etc. made within bright spirit and principle, should be included in the present invention
Protection domain within.
Claims (10)
1. the manufacture method of a circuit, it is characterised in that comprise the following steps:
Circuit etching figure a, it is provided that single substrate, uses etch process etching line on described single substrate
Road figure, described line pattern includes loop coil that multiturn is sequentially connected with and is positioned at described loop coil
The first outer end points and the second end points, and on described single substrate, it is provided with the be connected with described line pattern
One junction point and the second junction point, described toroidal two ends are respectively described first end points and described
First junction point, described second end points is between described second junction point and described loop coil；
Window, described first end points, described second end points, described first junction point and described second are connected
Point carries out nonisulatedization process；
Metalized, to described first end points after processing of windowing, described second end points, described first company
Plate between a metal level, and described second end points and described second junction point at contact and described second junction point
Line pattern is electrically connected；
Bonding, bond wire wire between described first end points and described second end points, and at described metal
An insulating barrier it is provided with between wire and described loop coil.
2. the manufacture method of circuit as claimed in claim 1, it is characterised in that in a bonding step, institute
The material stating plain conductor is gold, silver, copper, aluminum, ferrum or its alloy.
3. the manufacture method of circuit as claimed in claim 1, it is characterised in that in a bonding step, institute
The quantity stating plain conductor is 1 plain conductor or many plain conductors.
4. the manufacture method of circuit as claimed in claim 1, it is characterised in that described insulating barrier is to pass through
On described loop coil print dielectric ink or on described loop coil pasting protective film and obtain, or
Described insulating barrier is by described plain conductor is made covered wire, electric wire or enamel-covered wire.
5. the manufacture method of circuit as claimed in claim 1, it is characterised in that at circuit etching figure
In step, described single substrate can be single-sided flexible circuit plate, single side printed wiring board or medium substrate,
The material of described medium substrate is polyester, phenolic resin or engineering plastics.
6. the manufacture method of circuit as claimed in claim 1, it is characterised in that described circuit is NFC
The circuit of antenna or the circuit of WPC antenna.
7. a circuit, it is characterised in that including:
Single substrate, described single substrate includes join domain and the circuit shape being connected with described join domain
Becoming region, described join domain is provided with the first junction point and the second junction point；
Line pattern, is arranged at described circuit and forms region, described line pattern includes that multiturn is sequentially connected with
Loop coil and be provided with and be positioned at the first end points inside and outside described coil and the second end points, described toroidal
Two ends are respectively described first end points and described first junction point, and described second end points is positioned at described second
Between junction point and described loop coil；
Metal level, is formed at described first end points, described second end points, described first company by process of windowing
At contact and described second junction point, and at line pattern between described second end points and described second junction point
In be electrically connected；
Plain conductor, uses bonding technology to be electrically connected between described first end points and described second end points；
Insulating barrier, is arranged between described plain conductor and above-mentioned loop coil.
8. circuit as claimed in claim 7, it is characterised in that the material of described plain conductor be gold, silver,
Copper, aluminum, ferrum or its alloy, the quantity of described plain conductor is 1 plain conductor or many metals are led
Line.
9. circuit as claimed in claim 7, it is characterised in that described single substrate can be single-sided flexible
Circuit board, single side printed wiring board or medium substrate, the material of described medium substrate is polyester, phenolic aldehyde tree
Fat or engineering plastics.
10. circuit as claimed in claim 7, also includes that ferrite layer, described ferrite layer are covered in institute
State above plain conductor so that described plain conductor is between described ferrite layer and described loop coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510170274.XA CN106163108A (en) | 2015-04-10 | 2015-04-10 | Circuit and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510170274.XA CN106163108A (en) | 2015-04-10 | 2015-04-10 | Circuit and preparation method thereof |
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|---|---|
| CN106163108A true CN106163108A (en) | 2016-11-23 |
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| CN201510170274.XA Pending CN106163108A (en) | 2015-04-10 | 2015-04-10 | Circuit and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109103585A (en) * | 2018-07-10 | 2018-12-28 | 深圳市科迪诺电子技术有限公司 | A kind of NFC and WPC twin coil antenna and production technology |
| CN109216900A (en) * | 2017-06-30 | 2019-01-15 | 比亚迪股份有限公司 | Near-field communication aerial |
| CN109390676A (en) * | 2017-08-04 | 2019-02-26 | 比亚迪股份有限公司 | Near-field communication aerial |
| CN113939096A (en) * | 2020-06-29 | 2022-01-14 | 深圳市鑫臻鼎科技有限公司 | A kind of NFC antenna board production process |
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