CN106167913A - Plating bath device - Google Patents

Abstract

The embodiment of the invention discloses an electroplating bath device, which comprises a bath body, an orifice plate, an electroplating liquid flow pipe, two groups of anode boxes and two spoilers, wherein the orifice plate is arranged on the bath body; wherein, the pore plate and the bottom of the groove body form a space for accommodating the electroplating solution flow pipe, and a plurality of holes are arranged on the pore plate; the electroplating solution flow pipe penetrates through one wall surface of the tank body so as to inject electroplating solution into the tank body; the two groups of anode boxes are respectively arranged in the tank body and close to two opposite wall surfaces; the two spoilers are arranged between the two groups of anode boxes and externally connected with a power mechanism so as to push the two spoilers to move back and forth and disturb the electroplating solution in the tank body; a circuit board fixture can be accommodated between the two spoilers to clamp the circuit board to be plated.

Description

Plating tank device

technical field

The invention relates to an electroplating tank device, in particular to an electroplating tank device with disturbance capability, which is suitable for the electroplating process of circuit boards.

Background technique

The miniaturization of printed circuit boards (or circuit boards for short) also faces many difficulties in the manufacturing process. Therefore, the miniaturization of related semiconductor circuits has become the research focus of many technicians of electronic products and mobile technology in recent years. For example, the copper plating step commonly used in the circuit board manufacturing process has become an important technical threshold in the miniaturization technology. In terms of the current common copper plating technology, a circuit board is immersed in a copper plating solution, and then electrolytic copper is filled into the circuit board through electrolysis. Micro vias, plated through holes (PTH), high aspect ratio (aspect ratio, AR) copper pillars (Cu-pillar) or evenly and flatly cover a specific surface area. However, with the miniaturization of circuit boards, smaller vias, higher aspect ratios, and copper pillars or fine line patterning have become barriers that must be overcome in order to ensure the performance and functionality of circuit boards. Taking the current high density interconnection (HDI) circuit board manufacturing process as an example, how to completely fill the micro-vias with electrolytic copper without leaving voids is a key issue, not only to improve the quality of the circuit board , but also reduce costs and improve process yield.

The existing circuit board electroplating method adopts vertical continuous electroplating, and the fluid control of the electroplating tank is designed as a jet flow method. The dry film is sprayed away from the plate to be plated; in addition, the plate to be plated is usually clamped by double clamps or four clamps, which can easily lead to uneven conduction and flow field, resulting in missing bump and uniform copper column plating. results with poor accuracy and thus cannot be applied to mass production. Furthermore, the existing electroplating tank body is relatively large, and the amount of electroplating solution required for copper plating is large, which increases the production cost. Therefore, the existing technology is often limited by the practical limit of the copper pillar plating aspect ratio of about 1:1 and the practical limit of the fine wire plating of about 15um×15um. It is not enough for high-demand miniaturized circuit boards.

On the other hand, because the circuit board manufacturing process in this field is very different and complicated, many process equipments are often only applicable to a specific step in a specific manufacturing process, and different steps in the same manufacturing process or even steps in different manufacturing processes cannot communicate with each other. Therefore, not only the equipment investment is expensive, but also a larger manufacturing space is required to place the equipment to execute the process.

In view of this, how to improve the design of the electroplating tank to increase the flexibility of use for different processes or steps, and to reduce the size of the tank to reduce the amount of electroplating solution required to reduce the cost is an important issue in this field.

Contents of the invention

Embodiments of the present invention propose an electroplating tank; the electroplating tank includes a tank body, an orifice plate, an electroplating liquid flow pipe, two sets of anode boxes and two spoilers; wherein, the orifice plate is arranged near the bottom of the tank body The place forms a space with the bottom of the tank body to accommodate the electroplating solution flow tube, and the orifice plate is provided with a plurality of holes; the electroplating solution flow tube is penetrated by a wall of the tank body to inject the electroplating solution into the The tank body; the two groups of anode boxes are respectively arranged on the two opposite walls of the tank body, and each group of anode boxes also includes an insoluble anode (insoluble anode) and an anode shield (anode shield). The anode cover is set face to face; the two spoilers are set between the two groups of anode boxes, and each spoiler also includes a plurality of spoilers, and two connecting rods respectively connect the upper and lower sides of the multi-piece spoilers. The ends are connected and fixed, and the two spoilers are externally connected with a power mechanism to push the two spoilers to move back and forth to disturb the electroplating solution in the tank; a circuit board can be accommodated between the two spoilers The fixture is used to hold the circuit board to be plated.

The beneficial effect of the present invention is that the design of the electroplating tank proposed by the embodiments of the present invention can increase the use of flexibility to be suitable for different processes or steps, and reduce the cost of the tank by reducing the amount of electroplating solution required.

Description of drawings

FIG. 1 is a schematic cross-sectional view of an embodiment of an electroplating tank of the present invention.

FIG. 2 is a top view of the embodiment of FIG. 1 .

FIG. 3 is a schematic diagram showing the flow direction of the electroplating solution in the embodiment of FIG. 1 .

Wherein, the reference signs are explained as follows:

110 tank

120 Electroplating flow tube

121 Electroplating solution outflow hole

130-well plate

131 holes

140 anode box

150 Spoilers

151 spoiler

160 circuit board fixture

detailed description

Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily understand. The described creation can be implemented in various variations, but should not be limited to these examples. The present invention omits the description of the well-known part, and the same reference numerals represent the same elements in the present invention.

FIG. 1 is a schematic cross-sectional view of an embodiment of an electroplating tank according to the present invention. The electroplating tank is cut to reveal its internal composition. As shown in FIG. 1 , the electroplating tank of this embodiment includes a tank body 110 , an electroplating solution flow pipe 120 , an orifice plate 130 , two sets of anode boxes 140 and two spoilers 150 . Wherein, the tank body 110 is an upper-opening tank body, and the upper edge of its wall surface can be placed; The electroplating solution flow pipe 120 is set, and a plurality of holes 131 are arranged on the orifice plate 130; the electroplating solution flow pipe 120 is penetrated by a wall surface of the tank body 110, so as to inject the electroplating solution into the tank body 110, and the electroplating solution can be Through the multiple holes 131 on the orifice plate 130, it flows from bottom to top; the two groups of anode boxes 140 are respectively arranged on both sides of the tank body 110, close to the opposite two walls, and each group of anode boxes 140 also includes an insoluble An anode (insoluble anode) and an anode shield (anode shield) (not shown in the figure), the anode shields of the two groups of anode boxes are arranged face to face; the two spoilers 150 are arranged between the two groups of anode boxes 140, Each spoiler 150 also includes a plurality of spoilers 151, and the upper and lower ends of the plurality of spoilers 151 are respectively connected and fixed by two connecting rods, and the two spoilers 150 are externally connected to a power mechanism (in the figure not shown), to push the two spoilers 150 to move back and forth, so as to disturb the electroplating solution in the tank body 110; a circuit board jig (not shown in the figure) can be accommodated between the two spoilers 150 shown) to hold the board to be plated.

It is worth noting that the two groups of anode boxes 140, the two spoilers 150 and the circuit board fixture (not shown) holding the circuit board to be plated can all be inserted into the tank body 110 from above the tank body 110, And put it on the upper edge of the wall of the tank body in a hanging manner. Furthermore, the part of the electroplating solution flow pipe 120 below the orifice plate 130 is provided with a plurality of upwardly facing electroplating solution outflow holes 121 for uniform inflow of the electroplating solution from a place close to the bottom of the tank body 110 .

FIG. 2 is a top view of the embodiment of FIG. 1 . As shown in Figure 2, the electroplating tank includes a tank body 110, an electroplating liquid flow pipe 120, an orifice plate 130, two sets of anode boxes 140 and two spoilers 150, and a circuit board fixture 160 is shown in the figure to hold the The circuit board to be plated is placed between the two spoilers 150 . It should be noted that the plurality of spoilers 151 of the two spoilers 150 are arranged in parallel, and can form an angle with the connecting rod, so as to achieve the best effect of spoiling the flow. It should be noted that the power mechanism (not shown) connected to the two turbulators 150 to push the turbulators 150 can perform regular reciprocating movements at a low frequency. For example, in a preferred embodiment , the frequency can be between 0-10Hz. The purpose of this disturbance is to discharge the hydrogen generated during the electroplating process from the replating solution. Moreover, the return movement of the two spoilers 150 can move up and down or left and right along a direction parallel to the surface of the circuit board to be plated.

FIG. 3 is a schematic diagram showing the flow direction of the electroplating solution in the embodiment of FIG. 1 . As shown in Figure 3, after the electroplating solution flows out from the plurality of electroplating solution outflow holes 131 provided upwards in the electroplating solution flow pipe 120, it can flow from bottom to top from the plurality of holes 131 of the orifice plate 130, and then the The flow direction from bottom to top is disturbed by the two turbulators 150 , so that it can evenly flow on the surface of the circuit board to be plated and improve the effect of electroplating.

To sum up, the design of the electroplating tank proposed by the embodiments of the present invention can increase the use of flexibility to be suitable for different processes or steps, and reduce the size of the tank to reduce the amount of electroplating solution required to reduce the cost.

Therefore, the electroplating tank of the present invention can indeed achieve the desired purpose and effect by means of the proposed technical scheme, and meets the novelty of the invention patent, the necessary conditions of creativity and practicability.

However, the above-mentioned drawings and descriptions are only preferred embodiments of the present invention, and are not intended to limit the implementation of the present invention. All changes or modifications made by those skilled in the art according to the spirit of the present invention , should be covered within the scope of the following claims in this case.

Claims (9)

1. a plating bath arrangement, comprises:

One cell body, an orifice plate, an electroplate liquid flow tube, two groups of anode cassette and two flow spoilers；

Wherein, this orifice plate is arranged at this cell body place close to bottom, forms a space with this electroplate liquid flow tube accommodating, this orifice plate arranges multiple hole bottom this cell body；

This electroplate liquid flow tube is penetrated by this cell body wall, so that an electroplate liquid is injected this cell body；

These two groups of anode cassette are respectively arranged at the both sides in this cell body, near two relative walls；

This two flow spoiler is arranged between these two groups of anode cassette, this two flow spoiler can an external actuating unit to promote this two flow spoiler to carry out returning the movement covered, so that the electroplate liquid in cell body is carried out disturbance；A circuit board tool can be housed to clamp circuit board to be plated between this two flow spoiler.

2. plating bath arrangement as claimed in claim 1, wherein this is often organized anode cassette and also comprises a soluble anode and an anode shade, and the anode shade of these two groups of anode cassette is arranged face-to-face.

3. plating bath arrangement as claimed in claim 1, this flow spoiler the most each also comprises multi-disc spoiler, this multi-disc spoiler is for be arrangeding in parallel, and is linked at the two ends up and down of this multi-disc spoiler fixing respectively by two connecting rods, can shape have angle between this multi-disc spoiler and this connecting rod.

4. plating bath arrangement as claimed in claim 1, what wherein this two flow spoiler was external covers movement in order to promoting the actuating unit of flow spoiler to carry out returning of rule in low-frequency mode.

5. plating bath arrangement as claimed in claim 4, wherein this low frequency is between 0-10Hz.

6. plating bath arrangement as claimed in claim 4, wherein returning of this two flow spoiler covers movement, up and down or can move left and right along the direction parallel with the surface of this circuit board to be plated.

7. plating bath arrangement as claimed in claim 1, wherein this electroplate liquid flow tube is positioned at the part below this orifice plate and also sets up multiple electroplate liquid tap hole upward.

8. plating bath arrangement as claimed in claim 1, wherein these two groups of anode cassette and this two flow spoiler all can be placed in the upper limb of this cell body wall with suspending way.

9. plating bath arrangement as claimed in claim 1, wherein this circuit board tool can be placed in the upper limb of this cell body wall with suspending way.