CN106129229A - A kind of LED packaging based on quantum dot granule and preparation method thereof - Google Patents

Abstract

The invention discloses an LED packaging device based on quantum dot particles and a preparation method thereof. The device includes a carrier and an LED blue light chip arranged on the carrier, and the LED chip is sequentially covered with a fluorescent powder glue layer, a transparent glue layer and quantum dot glue The quantum dot glue layer is obtained by mixing quantum dot particles with water and oxygen barrier properties and a transparent gel material and coating them. The quantum dot particles include quantum dots, mesoporous materials and water and oxygen barrier materials. The distribution of quantum dots is In the mesoporous material, the gap between the quantum dots and the mesoporous material is filled with a water and oxygen barrier material; the gap between the quantum dots and the mesoporous material is filled with a water and oxygen barrier material, and the quantum dot particles are dispersed in the transparent After the gel material is directly coated, the chip is directly contacted and packaged, which improves the light efficiency of the LED; the LED package device in the present invention can completely express saturated wide color gamut colors, and can achieve high color rendering index and high color rendering under high color temperature. High R9 and high R11 values, not only bright colors, but also greatly improved brightness and energy efficiency.

Description

A kind of LED packaging device based on quantum dot particles and its preparation method

technical field

The invention relates to the field of lighting, in particular to an LED packaging device based on quantum dot particles and a preparation method thereof.

Background technique

At present, the well-known LED TVs all use blue light chips and yellow phosphors to produce white light. LED TV is to use white light to generate images through red, green, and blue light through color filters. Through such a backlight, people can feel white light. But the problem is that the color range of white light LED is limited, which is not enough to produce sufficient saturated colors, and the accuracy of monochromatic light is not high. The result is that the color gamut of LED TV is not high, and the color brightness is not bright enough.

The backlight has always been an indispensable part of the LCD screen. A good backlight must have a good spectrum performance, which basically determines the quality of an LCD panel. Generally, the backlight of LCD TVs using white LEDs is passed through. The red and green colors displayed through the filter are not only low in brightness but also not pure enough. This leads to the color gamut of LCD TVs, which is greatly limited by the backlight. Although precise dimming technology can increase the color gamut of TVs to a certain extent, the room for improvement is limited. The NTSC color gamut value can reach about 72%, and generally it can be increased by about 5-10% at most.

Research in recent years has found that compared with sunlight, the current white LED lights are defective. This artificial white light has a lot of high-energy photons (that is, too much blue light). There has been some medical evidence that too much blue light has adverse effects on human health.

Low color temperature, high power white LED is still the general trend of commercial GaN-based white LED development. In order to adapt to this trend, it is necessary to speed up the research and development process of red phosphors, which is of great significance for improving the color rendering index of white LEDs. However, it is regrettable that so far, the performance of all red phosphors is far from that of blue and green phosphors in terms of luminous flux performance maintenance, which is the biggest bottleneck in the development of white LEDs.

Contents of the invention

The technical problem to be solved by the present invention is to provide an LED packaging device based on quantum dot particles and a preparation method thereof.

The technical scheme that the present invention takes is:

An LED packaging device based on quantum dot particles, including a carrier and an LED blue light chip arranged on the carrier, the LED blue light chip is covered with a fluorescent powder glue layer, a transparent glue layer and a quantum dot glue layer in sequence, and the quantum dots The adhesive layer is obtained by mixing quantum dot particles with water and oxygen blocking properties and a transparent gel material, wherein the quantum dot particles include quantum dots, mesoporous materials and water and oxygen blocking materials, and the distribution of quantum dots is In the mesoporous material, the gap between the quantum dots and the mesoporous material is filled with the water and oxygen blocking material.

In some preferred embodiments, the quantum dot glue layer is also covered with a transparent glue layer.

In some preferred embodiments, the transparent adhesive layer is a silicone layer or an epoxy resin layer.

In some preferred embodiments, the transparent gel material is silica gel or epoxy resin.

In some preferred embodiments, the thickness of the quantum dot layer is 0.01-1mm.

In some preferred embodiments, the LED blue light chip is mounted on the carrier upright, upside down or vertically.

In some preferred embodiments, the carrier is any one of a ceramic substrate, a polymer material substrate or a metal substrate.

In some preferred embodiments, the quantum dot particles further include metal nanoparticles, and the metal nanoparticles are distributed in the mesoporous material.

In a further preferred embodiment, the metal nanoparticles are nano-gold, nano-silver or nano-platinum.

In some preferred embodiments, the water and oxygen blocking material is at least one of oxidized polyethylene wax, polyethylene, polystyrene, parylene, polycarbonate or polymethyl methacrylate.

In some preferred embodiments, the mesoporous material is a mesoporous silica material, a mesoporous titania material, a mesoporous zinc dioxide material, a molecular sieve or a metal organic framework compound.

The present invention also provides a method for preparing an LED packaging device based on quantum dot particles as described above, comprising the following steps:

S1: install the LED chip on the carrier;

S2: Coating a layer of phosphor powder adhesive layer on the LED blue light chip;

S3: coating a transparent adhesive layer on the fluorescent powder adhesive layer;

S4: Mix quantum dot particles and transparent gel material, and coat on the transparent adhesive layer to obtain a layer of quantum dot adhesive layer, wherein the quantum dot particles include quantum dots, mesoporous materials, and water and oxygen blocking materials. material, the quantum dots are distributed in the mesoporous material, and the gap between the quantum dots and the mesoporous material is filled with the water and oxygen blocking material.

In some preferred embodiments, the coating described in S4 is performed by spraying, dispensing or mold coating.

In some preferred embodiments, the coating described in S2 is carried out by spraying process, dispensing process, dispensing deposition process or mold process.

In some preferred embodiments, S5 is further included after S4: coating a transparent adhesive layer on the quantum dot adhesive layer.

The beneficial effects of the present invention are:

The invention provides an LED packaging device based on quantum dot particles, including a carrier, an LED blue light chip arranged on the carrier, and the LED blue light chip is covered with a fluorescent powder glue layer, a transparent glue layer and a quantum dot glue layer in sequence, The quantum dot glue layer is obtained by mixing quantum dot particles with water and oxygen blocking properties and a transparent gel material, wherein the quantum dot particles include quantum dots, mesoporous materials, and water and oxygen blocking materials. The quantum dots are distributed in the mesoporous material, and the gap between the quantum dots and the mesoporous material is filled with the water and oxygen blocking material; the present invention disperses the quantum dot particles in the transparent gel material Direct coating, using chip direct contact packaging, greatly improves the light efficiency of LED; the quantum dot particles are used to directly carry out blue LED chip contact packaging to make white LED devices, and its saturated red display index R9 value is 47-99, and the R9 value of high-quality white LED devices on the market is usually -110~-90. The LED packaging device of the present invention can fully express saturated wide color gamut colors, and can achieve high color temperature under high color temperature. Color rendering index and high R9 and high R11 values, the use of quantum dot LED packaging devices can make the NTSC color gamut value reach about 110%, not only bright colors, but also significantly improve brightness and energy efficiency. The LED packaging device of the present invention can emit a full spectrum, that is, cover the entire visible light and infrared light regions, they can limit the optical rotation properties of quantum luminescence, and release colored light with a small bandwidth, and the half-width of the emitted wavelength is below 20 nm , so it presents a more saturated light color, and the quantum efficiency can reach 80%, and there will be higher room for improvement in the future.

Description of drawings

Fig. 1 is the structural representation of the quantum dot composite fluorescent particle of embodiment 1;

Fig. 2 is the decay schematic diagram of the quantum dot particle of embodiment 1 along with LED lighting time;

Fig. 3 is the sectional view of the LED packaging device of embodiment 1;

Fig. 4 is the fluorescence intensity curve of the quantum dot particle of embodiment 2;

Fig. 5 is the sectional view of the LED packaging device of embodiment 2;

Fig. 6 is the sectional view of the LED packaging device of embodiment 3;

Fig. 7 is the sectional view of the LED packaging device of embodiment 4;

8 is a cross-sectional view of the LED packaging device of Embodiment 5;

9 is a cross-sectional view of the LED packaging device of Embodiment 6;

Figure 10 is the spectral test report of white LED lamp beads used in 4K TVs sold in the market;

Fig. 11 is a spectral test report of an LED packaging device based on quantum dot particles.

detailed description

Example 1:

For the preparation of quantum dot particles, the following three methods can be used to realize quantum dot embedding in mesoporous materials, but not limited to the following methods:

1. Use physical methods to embed quantum dots into mesoporous materials through physical swelling and solvent volatilization;

2. In-situ growth of quantum dots, that is, in-situ growth of quantum dots in mesoporous materials;

3. In-situ growth of mesoporous materials, that is, in-situ growth of mesoporous materials in quantum dot solutions.

In this example, quantum dot particles are prepared by physical methods, and quantum dots are embedded in mesoporous materials through physical swelling and solvent volatilization. The specific steps are as follows:

1. Take the mesoporous material, the mesoporous material is mesoporous silica, the particle size is 30~60μm, the mesopore diameter is 7~8nm, take 1g of mesoporous silica material and disperse it in 100mL n-hexane, soak and activate The surface of mesoporous silica, then heated to reflux, kept for 10h, and protected by an inert atmosphere;

2. The quantum dots are CdSe, with an average size of 4~6nm. Take 10mg of quantum dots and disperse them in 10mL of n-hexane, then disperse the quantum dots solution into the mesoporous silica solution, and stir for 2 hours quickly, so that the quantum dots can enter the mesoporous Silica; then remove the reflux equipment, blow in an inert atmosphere, make the solution almost completely volatilize, and then add a new solution, by constantly changing the concentration, the mesoporous silica swells in the heating solution, so that the quantum dots due to the concentration Poor and efficient entry into mesoporous silica, repeated swelling-solvent volatilization operation, the time is 1~10h; after the n-hexane is completely volatilized, it is naturally cooled under the protection of an inert gas, and then dried in a vacuum oven to obtain quantum point - mesoporous material powder;

3. Disperse 200mg of oxidized polyethylene wax into 50mL of toluene, heat until the solid melts, and obtain a clear and transparent solution;

4. Add the quantum dot-mesoporous material powder in step 2 into the oxidized polyethylene wax solution, stir quickly, and the oxidized polyethylene wax will enter the mesoporous material due to the concentration difference, filling the gap between the quantum dot and the mesoporous material, After the solvent is completely evaporated, the quantum dot composite fluorescent particles are obtained. Its structure is shown in Figure 1, 1 is a quantum dot, 2 is a mesoporous material (mesoporous silica), and 3 is a water-blocking and oxygen-blocking material (oxidized polyethylene wax).

In addition, according to steps 1 and 2, quantum dot composite fluorescent particles not filled with water and oxygen blocking materials were prepared as a comparative product.

Preparation of LED packaging devices: take the blue light LED chip and vertically install it in the bowl of the carrier, first use silver glue, flux, etc. to solidify the crystal, the carrier is an aluminum nitride ceramic substrate, bake, and then weld the wire; then use glue dispensing Process Coat the mixed material of fluorescent powder and transparent gel material on the blue LED chip and in the bowl cup of the carrier. The transparent gel material is silica gel to obtain a layer of fluorescent powder adhesive layer covering the blue LED chip. Baking; then apply a layer of silica gel on the fluorescent powder glue layer by dispensing technology, and bake in an oven; mix the quantum dot particles prepared above with silica gel, and the quantum dot particles include quantum dots, mesoporous materials and a water and oxygen blocking material, the quantum dots are distributed in the mesoporous material, the gap between the quantum dots and the mesoporous material is filled with the water and oxygen blocking material, and the mesoporous material It is a mesoporous silica material, and the water and oxygen blocking material is oxidized polyethylene wax. The mixed material of quantum dot particles and silica gel is coated on the silica gel layer by a dispensing process, and baked in an oven to obtain an LED packaging device. The cross-sectional view of the structure is shown in Figure 3.

Referring to Fig. 3, it can be seen that the obtained LED packaging device based on quantum dot particles includes a carrier 4 and an LED blue light chip 5 vertically mounted in the bowl of the carrier 4, and the LED blue light chip 5 is covered with phosphors in turn. The glue layer 6, the transparent glue layer 7 and the quantum dot glue layer 8, the thickness of the quantum dot glue layer 8 is 0.2 mm, and the transparent glue layer 7 is a silica gel layer.

The comparison product is prepared according to the above steps for LED packaged devices, and the light conversion efficiency decline situation of the quantum dot particles according to the present invention and the comparison product is analyzed, and the light conversion efficiency decline ratio is obtained as shown in Figure 2. As the lighting time increases, the figure The solid dots in the middle represent the quantum dot particles of the present invention (quantum dot particles filled with water and oxygen blocking materials), and the light conversion efficiency of the quantum dot particles of the present invention basically does not decline within one month, and the hollow dots in the figure represent The light conversion efficiency of the comparative product (quantum dot particles not filled with water-blocking and oxygen-blocking materials) gradually faded, and remained at about 60% after one month, which proves that after filling the gap between the quantum dots and the mesoporous material, the The barrier properties of the quantum dot composite fluorescent particles are improved, thereby improving their stability. Filling the gap between quantum dots and mesoporous materials with water and oxygen barrier materials can make the carrier material of quantum dots more compact, greatly improving the barrier properties of quantum dot particles, thus improving the stability of quantum dot particles; the obtained quantum dots Dot particles have high quantum efficiency; quantum dot particles have a mesoporous structure, which greatly reduces the efficiency decline or quenching caused by the aggregation of quantum dots in quantum dot particles; quantum dot particles have a barrier layer structure, which improves The temperature that the quantum dots can withstand improves the use efficiency, so that the quantum dot particles and their LED packaging devices have excellent service life.

Example 2:

The preparation of quantum dot particles containing metal nanoparticles, the specific steps are:

1. Disperse 1g of mesoporous titanium dioxide and 1mL of triangular gold nanoparticles in 100mL of n-hexane, soak and activate the surface of mesoporous titanium dioxide, then heat to reflux, keep warm for 10h, add an inert atmosphere to protect, remove the reflux system, let the solvent evaporate, and get White metal-mesoporous titanium dioxide composite particle powder;

2. Calcinate the obtained composite particle powder at 200°C under the protection of an inert atmosphere, and then redisperse it in 50mL of toluene;

3. Take 10 mg of CdSe/ZnS quantum dots with an emission wavelength of 530 nm and disperse them into 10 mL of toluene, then disperse the quantum dot solution into the metal-mesoporous titanium dioxide in step 2, and stir rapidly for 2 hours to allow the quantum dots to enter the mesoporous silica; Then remove the reflux equipment, blow in an inert atmosphere, make the solution almost completely volatilize, and then add a new solution, by constantly changing the concentration, the mesoporous silica will swell in the heating solution, so that the quantum dots will be swollen due to the poor concentration and high efficiency. into the mesoporous titanium dioxide, repeated swelling-solvent volatilization operation, the time is 1~10h; after the n-hexane is completely volatilized, it is naturally cooled under the protection of an inert gas, and then dried in a vacuum oven to obtain the quantum dot-mesoporous material powder ;

4. Disperse 100mg of polyethylene into 50mL of chloroform, heat until the solid melts, and obtain a clear and transparent solution;

5. Add the quantum dot-mesoporous material powder in step 3 into the polyethylene solution, stir quickly, polyethylene will enter the mesoporous material due to the concentration difference, fill the gap between the quantum dot and the mesoporous material, and wait for the solvent to evaporate completely , to obtain quantum dot composite fluorescent particles containing gold nanoparticles.

In addition, refer to the above steps to prepare quantum dot particles without adding nano-gold. When the absorption wavelength of nano-gold matches the emission wavelength of quantum dots, and the distance between nano-gold and quantum dots is appropriate, the metal particles can participate in luminescence through plasmon resonance. The quantum dot particles of the present invention (quantum dot particles added with gold nanoparticles) and the quantum dot particles without gold nanoparticles were analyzed respectively to obtain Fig. 4, the fluorescence of the quantum dot particles of the present invention (quantum dot particles added with gold nanoparticles) The intensity is shown in curve 1, and the fluorescence intensity of the quantum dot particles without adding nano gold is shown in curve 2. As can be seen from Figure 4, the fluorescence intensity of the quantum dot particles of the present invention (curve 1) is higher than that without adding nano gold The gold quantum dot particles (curve 2) are 1.7 times stronger. Metal nanoparticles can help quantum dots capture more blue light and improve the utilization rate of blue light. In actual production, the same light conversion effect can be obtained by adding metal nanoparticles, which can reduce the use of quantum dots, thereby reducing the use of heavy metals in quantum dots, which is more environmentally friendly. Metal nanoparticles have two mechanisms for increasing the fluorescence intensity of quantum dots: (1) The surface plasmons generated by the free electrons of nano-metal particles moving regularly under the action of an external electromagnetic field can greatly enhance the electromagnetic field around the particles. When the incident light frequency When it is consistent with the natural frequency of free electrons of metal particles, surface plasmon resonance is generated, which maximizes the local field enhancement. This enhanced local field enhances the excitation rate of quantum dots near the surface of metal particles and enhances the luminous intensity; ( 2) The coupling radiation process between metal nanoparticles and quantum dots, non-radiative energy transfer occurs between quantum dots and metal particles, and the excited quantum dots are coupled into LSPR energy, which in turn radiates to the far field.

Preparation of LED packaging devices: Take the blue LED chip and place it upside down in the bowl of the carrier, first use silver glue, flux, etc. to solidify the crystal, the carrier is an alumina ceramic substrate, bake it, and then weld the wire; then use glue dispensing to deposit The process coats the mixed material of phosphor powder and transparent gel material on the blue LED chip and in the bowl of the carrier, that is, after dispensing, use a centrifuge to centrifuge at a high speed to allow the phosphor powder to quickly precipitate in the transparent gel material, so that the phosphor powder can quickly Uniformly deposited near the surface of the blue LED chip, the transparent gel material is epoxy resin, to obtain a layer of fluorescent powder adhesive layer covering the blue LED chip, baked in an oven; Coat a layer of epoxy resin on the top, and bake in an oven; mix the quantum dot particles prepared above with epoxy resin, and apply the mixed material of quantum dot particles and epoxy resin on the epoxy resin layer by dispensing process , baked in an oven to obtain a quantum dot glue layer, the quantum dot particles include quantum dots, metal nanoparticles, mesoporous materials and water and oxygen blocking materials, and the quantum dots and the metal nanoparticles are distributed in the mesoporous In the material, the gap between the quantum dots and the mesoporous material is filled with the water-blocking and oxygen-blocking material, the mesoporous material is a mesoporous titanium dioxide material, and the water-blocking and oxygen-blocking material is polyethylene, The metal nanoparticles are gold nanoparticles; a layer of epoxy resin is coated on the quantum dot glue layer by a dispensing process to obtain an LED packaging device, and its structural cross-sectional view is shown in FIG. 5 .

Referring to Fig. 5, it can be seen that the obtained LED packaging device based on quantum dot particles includes a carrier 4 and an LED blue chip 5 flipped in the bowl of the carrier 4, and the LED blue chip 5 is sequentially covered with fluorescent light. Powder glue layer 6, transparent glue layer 7, quantum dot glue layer 8 and transparent glue layer 7, the thickness of the quantum dot glue layer 8 is 1 mm, and the transparent glue layer 7 is an epoxy resin layer. The fluorescent powder adhesive layer 6 is obtained by applying a dispensing deposition process, so the fluorescent powder is evenly deposited near the surface of the blue LED chip. On the one hand, it can better receive the light emitted by the LED chip. On the other hand, due to Phosphor powder is deposited on the bottom of the phosphor powder glue layer 6. Compared with the phosphor powder glue layer prepared by ordinary glue dispensing process, the phosphor powder is far away from the quantum dot glue layer, which can reduce the quantum dot glue layer. The temperature of 8 can make the quantum dot particles in the quantum dot glue layer have a longer service life. Preparation of a layer of transparent adhesive layer 7 on the quantum dot adhesive layer 8 can better isolate the quantum dots from the outside world, enhance the effect of oxygen and water resistance, and further improve the service life of the LED packaging device.

Example 3:

Using the preparation method of quantum dot particles as described in Example 2, using mesoporous zinc dioxide material as the mesoporous material, using nano-silver as the metal nanoparticle, and polystyrene as the water and oxygen blocking material, the prepared quantum dots Point particles, including quantum dots, metal nanoparticles, mesoporous materials and water and oxygen blocking materials, the quantum dots and the metal nanoparticles are distributed in the mesoporous material, and the quantum dots and the mesoporous The gap between the materials is filled with the water and oxygen blocking material.

Preparation of LED packaging devices: the blue LED chip is installed in the bowl of the carrier, first use silver glue, white glue, etc. to solidify the crystal, the carrier is a copper substrate, bake, and then weld the wire; then use the dispensing process to glue the phosphor and The mixed material of the transparent gel material is coated on the blue LED chip and in the bowl of the carrier, the transparent gel material is silica gel, and a layer of fluorescent powder adhesive layer covering the blue LED chip is obtained, and baked in an oven; The dispensing process coats a layer of silica gel on the fluorescent powder adhesive layer and bakes in an oven; mixes the quantum dot particles prepared above with silica gel, and coats the mixed material of quantum dot particles and silica gel on the silica gel layer by dispensing process Step 1: Baking in an oven to obtain a quantum dot layer; and then applying a glue dispensing process to coat a layer of silica gel on the quantum dot layer to obtain an LED packaging device. The structural cross-sectional view is shown in Figure 6.

Referring to Fig. 6, it can be seen that the obtained LED packaging device based on quantum dot particles includes a carrier 4 and an LED blue light chip 5 that is mounted in the bowl of the carrier 4, and the LED blue light chip 5 is sequentially covered with phosphor powder. Adhesive layer 6, transparent adhesive layer 7, quantum dot adhesive layer 8 and transparent adhesive layer 7, the thickness of the quantum dot adhesive layer 8 is 0.3 mm, and the transparent adhesive layer 7 is a silica gel layer. A layer of transparent adhesive layer 7 prepared on the quantum dot adhesive layer 8 can better isolate the quantum dots from the outside world, enhance the effect of oxygen and water resistance, and further improve the service life of the LED packaging device.

Example 4:

Using the preparation method of quantum dot particles as described in Example 2, molecular sieves are used as mesoporous materials, nano-platinum is selected for metal nanoparticles, and the water and oxygen blocking material is parylene. The prepared quantum dot particles include: Quantum dots, metal nanoparticles, mesoporous materials, and water and oxygen blocking materials, the quantum dots and the metal nanoparticles are distributed in the mesoporous materials, and the gap between the quantum dots and the mesoporous materials The gap is filled with the water and oxygen blocking material.

Preparation of LED packaging devices: the blue LED chip is vertically mounted on the carrier, first use silver glue, co-gold, etc. to solidify the crystal, the carrier is an aluminum substrate, bake, and then wire bond; then use the spraying process to spray the phosphor and transparent gel The material mixture is coated on the blue LED chip, the transparent gel material is silica gel, and a layer of fluorescent powder adhesive layer covering the blue LED chip is obtained, baked in an oven; and then sprayed on the fluorescent powder adhesive layer Coating a layer of silica gel and baking in an oven; mixing the quantum dot particles prepared above with silica gel, coating the mixed material of quantum dot particles and silica gel on the silica gel layer by spraying process, and baking in an oven to obtain a quantum dot adhesive layer and then apply a spraying process to coat a layer of silica gel on the quantum dot layer to obtain an LED packaging device, as shown in Figure 7.

Using the spraying process to coat the quantum dot particles and silica gel mixed material on the silica gel layer has a significant advantage over other coating processes. The other coating processes are that the quantum dots in the prepared quantum dot glue layer are randomly distributed. The light emitted from the fluorescent powder adhesive layer does not hit the quantum dots 100%, but the quantum dot particles can be neatly and densely arranged on the upper surface of the silica gel layer by spraying, so the quantum dot particles can receive close to 100%. Hundreds of light can improve the efficiency of quantum dot particles.

Referring to Fig. 7, it can be seen that the obtained LED packaging device based on quantum dot particles includes a carrier 4 and an LED blue chip 5 vertically mounted on the carrier 4, and the LED blue chip 5 is sequentially covered with phosphor glue. Layer 6, transparent glue layer 7, quantum dot glue layer 8 and transparent glue layer 7, the thickness of the quantum dot glue layer 8 is 0.01 mm, and the transparent glue layer 7 is a silica gel layer.

Example 5:

Using the preparation method of quantum dot particles as described in Example 2, using a metal organic framework compound as a mesoporous material, using nano-platinum as a metal nanoparticle, and polycarbonate as a water and oxygen blocking material, the prepared quantum dot particles , including quantum dots, metal nanoparticles, mesoporous materials and water and oxygen blocking materials, the quantum dots and the metal nanoparticles are distributed in the mesoporous material, between the quantum dots and the mesoporous material The gap between them is filled with the water and oxygen blocking material.

Preparation of LED packaging devices: the blue LED chip is flipped on the carrier, first use silver glue, solder paste, co-gold, etc. to solidify the crystal, the carrier is a PPA substrate, bake, and then weld the wire; then use the spraying process to spray the phosphor and The transparent gel material mixed material is coated on the blue LED chip, the transparent gel material is silica gel, and a layer of fluorescent powder adhesive layer covering the blue LED chip is obtained, and the oven is baked; the mold is made by direct compression molding The process prepares a layer of silica gel on the fluorescent powder adhesive layer, that is, prepares a mold, injects transparent gel material into the mold, and then buckles the LED unit obtained in S2 into the mold, and the LED blue light chip Completely immersed in the transparent gel material, solidified and demoulded, covered with a layer of transparent adhesive layer on the fluorescent powder adhesive layer, baked in an oven; mixed the quantum dot particles prepared above with silica gel to make a mold, and directly pressed The molding process uses quantum dot particles and silica gel to prepare a layer of quantum dot layer on the silica gel layer, and then bakes it in an oven; then make a mold, and use a direct compression molding process to prepare a layer of silica gel layer on the quantum dot layer , to obtain an LED packaged device, the cross-sectional view of which is shown in FIG. 8 .

Referring to Fig. 8, it can be seen that the obtained LED packaging device based on quantum dot particles includes a carrier 4 and an LED blue chip 5 flip-mounted on the carrier 4, and the LED blue chip 5 is sequentially covered with phosphor glue. Layer 6, transparent glue layer 7, quantum dot glue layer 8 and transparent glue layer 7, the thickness of the quantum dot glue layer 8 is 1 mm, and the transparent glue layer 7 is a silica gel layer.

Embodiment 6:

Using the preparation method of quantum dot particles as described in Example 2, using mesoporous silica material as the mesoporous material, using nano-gold as the metal nanoparticle, and polymethyl methacrylate as the water and oxygen blocking material, the prepared The quantum dot particles include quantum dots, metal nanoparticles, mesoporous materials and water and oxygen blocking materials, the quantum dots and the metal nanoparticles are distributed in the mesoporous materials, and the quantum dots and the The gap between the mesoporous materials is filled with the water and oxygen blocking material.

Preparation of LED packaging devices: the blue LED chip is mounted on the carrier, first use silver glue, white glue, etc. to solidify the crystal, the carrier is a PCT substrate, bake, and then wire bond; then use the mold process to combine the phosphor and transparent gel material The mixed material is coated on the blue LED chip, the transparent gel material is silica gel, and a layer of fluorescent powder glue layer covering the blue light LED chip is obtained, and baked in an oven; Layer a silica gel layer, and bake in an oven; mix the quantum dot particles prepared above with silica gel to make a mold, and use a direct compression molding process to prepare a layer of quantum dot glue layer on the silica gel layer with quantum dot particles and silica gel mixed materials, and bake in an oven Baking; making a mold again, and preparing a layer of silica gel on the quantum dot glue layer by direct compression molding process to obtain an LED packaging device, the structural cross-sectional view of which is shown in Figure 9.

Referring to Fig. 9, it can be seen that the obtained LED packaging device based on quantum dot particles includes a carrier 4 and an LED blue chip 5 flip-mounted on the carrier 4, and the LED blue chip 5 is sequentially covered with phosphor glue. Layer 6, transparent glue layer 7, quantum dot glue layer 8 and transparent glue layer 7, the thickness of the quantum dot glue layer 8 is 0.1 mm, and the transparent glue layer 7 is a silica gel layer.

Take the white LED lamp beads used in the 4K TVs sold in the market and the LED packaging device prepared according to the method of the present invention for spectrum testing, and the spectrum test results are as shown in Figure 10 and Figure 11. It can be seen that the white light lamps sold in the market The Ra value of the LED lamp bead at high color temperature is 56.3, the R9 value is -113, and the R11 value is 40, while the Ra value of the LED packaging device prepared by the method of the present invention is 90.8 at high color temperature, and the R9 value is 87. , R11 value is 94. The R9 and R11 values of the LED device of the present invention are much higher than those of conventional white LED devices, can fully express saturated wide color gamut colors, and can achieve high color rendering index and high R9 value under high color temperature, using quantum dot LED packaging The device can make the NTSC color gamut value reach about 110%, not only the color is bright, but the brightness and energy efficiency are significantly improved, and it solves the lack of R9 (red light) and R11 (green light) bands of conventional white LEDs. .

Claims (10)

1. a LED packaging based on quantum dot granule, including carrier and the LED blue chip being located on carrier, it is special Levy and be, described LED blue chip is covered with fluorescent material glue-line, substratum transparent and quantum dot glue-line, described quantum dot glue successively Layer be mixed by quantum dot granule and transparent gel material after coat and obtain, wherein, described quantum dot granule includes quantum dot, Jie Porous materials and the oxygen barrier material that blocks water, described quantum dot is distributed in described mesoporous material, at described quantum dot and described mesoporous material Gap between material blocks water oxygen barrier material described in being filled with.

LED packaging based on quantum dot granule the most according to claim 1, it is characterised in that described quantum dot glue Substratum transparent also it is covered with on layer.

LED packaging based on quantum dot granule the most according to claim 1 and 2, it is characterised in that described transparent adhesive tape Layer is layer of silica gel or epoxy resin layer.

LED packaging based on quantum dot granule the most according to claim 1 and 2, it is characterised in that described transparent solidifying Glue material is silica gel or epoxy resin.

LED packaging based on quantum dot granule the most according to claim 1 and 2, it is characterised in that described quantum dot The thickness of glue-line is 0.01-1mm.

LED packaging based on quantum dot granule the most according to claim 1 and 2, it is characterised in that described LED is blue Optical chip formal dress, upside-down mounting or be vertically loaded on described carrier.

7. a preparation method for the LED packaging based on quantum dot granule as described in any one of claim 1-6, it is special Levy and be, comprise the following steps:

S1: LED chip is loaded on carrier；

S2: coat layer of fluorescent powder glue-line on described LED blue chip；

S3: at described fluorescent material glue-line overlying layer of transparent glue-line；

S4: take quantum dot granule and transparent gel material mixing, be coated on described substratum transparent, obtain one layer of quantum dot glue Layer, wherein, described quantum dot granule includes quantum dot, mesoporous material and the oxygen barrier material that blocks water, and described quantum dot is distributed in described In mesoporous material, the gap between described quantum dot and described mesoporous material be filled with described in block water oxygen barrier material.

The preparation method of LED packaging based on quantum dot granule the most according to claim 7, it is characterised in that real Executing the coating described in S4 is to use spraying coating process, gluing process or mould process coating.

The preparation method of LED packaging based on quantum dot granule the most according to claim 7, it is characterised in that real Executing the coating described in S2 is to use spraying coating process, gluing process, some glue depositing operation or mould process coating.

The preparation method of LED packaging based on quantum dot granule the most according to claim 7, it is characterised in that S5 is also included: on described quantum dot glue-line, coat layer of transparent glue-line after described S4.