CN106129226A - Light emitting diode is sent out in side - Google Patents
Light emitting diode is sent out in side Download PDFInfo
- Publication number
- CN106129226A CN106129226A CN201610790161.4A CN201610790161A CN106129226A CN 106129226 A CN106129226 A CN 106129226A CN 201610790161 A CN201610790161 A CN 201610790161A CN 106129226 A CN106129226 A CN 106129226A
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- China
- Prior art keywords
- emitting diode
- light emitting
- pin
- special
- sent out
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Links
- 238000004806 packaging method and process Methods 0.000 claims abstract 4
- 238000003466 welding Methods 0.000 claims description 3
- 238000011156 evaluation Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
Landscapes
- Packaging Frangible Articles (AREA)
- Packages (AREA)
Abstract
Description
技术领域technical field
本发明涉及发光二极管应用领域,尤其涉及一种侧发发光二极管。The invention relates to the application field of light-emitting diodes, in particular to a side-emitting light-emitting diode.
背景技术Background technique
目前,侧发发光二极管通常根据各产品结构的需要,对支架进行产品开发设计,以达到侧发光效果,其设计理念是不同尺寸的发光二极管想要达到侧发效果时,需要对各尺寸的产品进行重新设计、评估,因此,具有一定的局限性,也延长了产品的设计周期。At present, side-emitting LEDs usually develop and design the bracket according to the needs of each product structure to achieve the side-emitting effect. The design concept is that when LEDs of different sizes want to achieve the side-emitting effect, it is necessary Redesign, evaluation, therefore, has certain limitations and also prolongs the product design cycle.
发明内容Contents of the invention
为克服上述缺点,本发明的目的在于提供侧发发光二极管,已达到简化其产品的设计周期,并使其适用于市场上的正发发光二极管快速转化为侧发发光二极管的目的。In order to overcome the above disadvantages, the object of the present invention is to provide a side-emitting light-emitting diode, which has achieved the purpose of simplifying the design cycle of its products and making it suitable for the rapid conversion of forward-emitting light-emitting diodes on the market to side-emitting light-emitting diodes.
为了解决上述技术问题,本发明提供侧发发光二极管,包括芯片、封装体和设置在所述封装体外侧的两个连接正负极的PIN脚,所述PIN脚上设置有与其相同材质的异型垫片。在正发发光二极管两PIN脚上设置异型垫片,使异型垫片具有PIN脚的作用,从而使正发发光二极管快速转变为侧发发光二极管,避免了因不同尺寸而重新进行设计、评估,有效的简化和缩短了产品的设计周期,打破了局限性,使其适应性更强。In order to solve the above-mentioned technical problems, the present invention provides a side-emitting light-emitting diode, including a chip, a package body, and two PIN pins connected to the positive and negative poles arranged outside the package body, and the PIN pins are provided with special-shaped gasket. Set special-shaped pads on the two PIN pins of the forward-emitting LEDs, so that the special-shaped pads have the function of PIN pins, so that the forward-emitting LEDs can be quickly transformed into side-emitting LEDs, avoiding redesign and evaluation due to different sizes, It effectively simplifies and shortens the product design cycle, breaks the limitations and makes it more adaptable.
进一步地,所述异型垫片设置为L型或U型。使其根据不同需求进行形状的设置。Further, the special-shaped gasket is set in an L-shape or a U-shape. It can be set according to different needs.
进一步地,所述异型垫片通过焊接设置在所述PIN脚上。焊接使其更加牢固的固定,同时不影响其导电性。Further, the special-shaped gasket is arranged on the PIN foot by welding. Soldering makes it more firmly fixed without affecting its conductivity.
附图说明Description of drawings
图1为本实施例的结构示意图;Fig. 1 is the structural representation of present embodiment;
图2为本实施例的俯视示意图;Fig. 2 is the schematic top view of this embodiment;
图3为本实施例的侧视示意图;Fig. 3 is a schematic side view of the present embodiment;
图中:1-芯片;2-封装体;3-PIN脚;4-异型垫片。In the figure: 1-chip; 2-package body; 3-PIN foot; 4-special-shaped gasket.
具体实施方式detailed description
下面结合附图对本发明的较佳实施例进行详细阐述,以使本发明的优点和特征能更易于被本领域技术人员理解,从而对本发明的保护范围做出更为清楚明确的界定。The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.
参见附图1-3所示,侧发发光二极管,包括芯片1、封装体2和设置在封装体2外侧的两个分别连接正负极的PIN脚3,PIN脚3上设置有与其相同材质的异型垫片4,异型垫片4可设置为L型或U型,也可以根据具体要求进行形状的设定,异型垫片4通过焊接设置在PIN脚3上。Referring to Figures 1-3, the side-emitting light-emitting diode includes a chip 1, a package body 2, and two PIN pins 3 connected to the positive and negative poles on the outside of the package body 2, and the PIN pin 3 is provided with the same material. The special-shaped gasket 4, the special-shaped gasket 4 can be set to L-shaped or U-shaped, and the shape can also be set according to specific requirements. The special-shaped gasket 4 is arranged on the PIN pin 3 by welding.
以上实施方式只为说明本发明的技术构思及特点,其目的在于让熟悉此项技术的人了解本发明的内容并加以实施,并不能以此限制本发明的保护范围,凡根据本发明精神实质所做的等效变化或修饰,都应涵盖在本发明的保护范围内。The above embodiments are only to illustrate the technical concept and characteristics of the present invention. All equivalent changes or modifications shall fall within the protection scope of the present invention.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610790161.4A CN106129226A (en) | 2016-08-31 | 2016-08-31 | Light emitting diode is sent out in side |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610790161.4A CN106129226A (en) | 2016-08-31 | 2016-08-31 | Light emitting diode is sent out in side |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106129226A true CN106129226A (en) | 2016-11-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610790161.4A Pending CN106129226A (en) | 2016-08-31 | 2016-08-31 | Light emitting diode is sent out in side |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106129226A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002223002A (en) * | 2001-01-26 | 2002-08-09 | Nichia Chem Ind Ltd | Package molding and light emitting device |
| CN1893130A (en) * | 2005-07-04 | 2007-01-10 | 三星电机株式会社 | Side-view light emitting diode having improved side-wall reflection structure |
| CN202871852U (en) * | 2012-09-04 | 2013-04-10 | 琉明斯光電科技股份有限公司 | surface mount light emitting diode |
| CN103988323A (en) * | 2011-06-08 | 2014-08-13 | 首尔半导体株式会社 | Light emitting diode package |
| CN104037297A (en) * | 2013-03-04 | 2014-09-10 | 深圳市聚飞光电股份有限公司 | Pedestal, LED support, LED and pedestal manufacturing method |
| CN204834671U (en) * | 2015-07-10 | 2015-12-02 | 深圳市聚飞光电股份有限公司 | Luminous LED support of side and luminous LED of side |
| CN205159362U (en) * | 2015-10-28 | 2016-04-13 | 博罗承创精密工业有限公司 | Interior concealed sidelight source LED support |
| CN206040694U (en) * | 2016-08-31 | 2017-03-22 | 苏州市悠文电子有限公司 | Emitting diode is sent out to side |
-
2016
- 2016-08-31 CN CN201610790161.4A patent/CN106129226A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002223002A (en) * | 2001-01-26 | 2002-08-09 | Nichia Chem Ind Ltd | Package molding and light emitting device |
| CN1893130A (en) * | 2005-07-04 | 2007-01-10 | 三星电机株式会社 | Side-view light emitting diode having improved side-wall reflection structure |
| CN103988323A (en) * | 2011-06-08 | 2014-08-13 | 首尔半导体株式会社 | Light emitting diode package |
| CN202871852U (en) * | 2012-09-04 | 2013-04-10 | 琉明斯光電科技股份有限公司 | surface mount light emitting diode |
| CN104037297A (en) * | 2013-03-04 | 2014-09-10 | 深圳市聚飞光电股份有限公司 | Pedestal, LED support, LED and pedestal manufacturing method |
| CN204834671U (en) * | 2015-07-10 | 2015-12-02 | 深圳市聚飞光电股份有限公司 | Luminous LED support of side and luminous LED of side |
| CN205159362U (en) * | 2015-10-28 | 2016-04-13 | 博罗承创精密工业有限公司 | Interior concealed sidelight source LED support |
| CN206040694U (en) * | 2016-08-31 | 2017-03-22 | 苏州市悠文电子有限公司 | Emitting diode is sent out to side |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161116 |