CN106129032A - Column soldered ball redistribution encapsulating structure for VLSI chip - Google Patents
Column soldered ball redistribution encapsulating structure for VLSI chip Download PDFInfo
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- CN106129032A CN106129032A CN201610673398.4A CN201610673398A CN106129032A CN 106129032 A CN106129032 A CN 106129032A CN 201610673398 A CN201610673398 A CN 201610673398A CN 106129032 A CN106129032 A CN 106129032A
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- soldered ball
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- redistribution
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- H10W72/20—
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- H10W74/10—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/5434—
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Abstract
本发明涉及一种用于超大规模集成电路芯片的柱状焊球重分布封装结构，包括塑封材料、裸片、介质层、RDL焊盘、焊球、PCB焊盘和PCB基板，其特征在于，所述的焊球为柱状焊球，焊球整体呈圆柱形。本发明的柱状几何结构焊球的重分布封装在热机械可靠性方面得到了提高。
The invention relates to a columnar solder ball redistribution packaging structure for ultra-large scale integrated circuit chips, including plastic packaging materials, bare chips, dielectric layers, RDL pads, solder balls, PCB pads and PCB substrates, characterized in that the The solder balls described above are columnar solder balls, and the solder balls are cylindrical as a whole. The redistribution package of the columnar geometry solder balls of the present invention has improved thermomechanical reliability.
Description
Technical field
The invention belongs to field of semiconductor package, be mainly used in the encapsulation of VLSI chip, relate to especially
And the redistribution encapsulating structure of a kind of column geometry soldered ball.
Background technology
Chip encapsulation technology just develops towards the direction of miniaturization and high integration.Through constantly research, Freescale is public
Department is proposed the redistribution encapsulation technology (redistributed chip packaging, RCP) of advanced person, and it utilizes redistribution layer
Instead of conventional substrate, wire bond and upside-down mounting solder ball technologies.With traditional BGA Package technology (Ball GridArray
Package, BGA) to compare, integrated level is greatly improved.
Along with encapsulation miniaturization and high integration, the thermomechanical Problem of Failure of chip package is increasingly severe, encapsulation technology
The reliable problem of thermomechanical govern the progress of encapsulation technology.In major part encapsulates, thermomechanical lost efficacy and occurred most often at connection
On the soldered ball of packaging body and pcb board, so the thermomechanical reliability of soldered ball directly decides the reliability of encapsulation.And the envelope of main flow
Dress is all using the soldered ball of spherical segment, as in figure 2 it is shown, this makes the impact on encapsulation thermomechanical reliability of the geometry of soldered ball
Problem is largely ignored in design and the development of product, and the development causing encapsulation technology is hindered.
Accordingly, it would be desirable to the geometry of soldered ball in consideration encapsulation technology, with the problem improving encapsulation thermomechanical reliability.
Summary of the invention
The present invention provides a kind of redistribution encapsulating structure, mainly uses spherical solder balls to lead solving redistribution encapsulation technology
Cause the problem that encapsulation thermal reliability is difficult to improve.The present invention is designed by the geometry of soldered ball, reduces in use
The thermal and mechanical stress of generation, the heat on soldered ball caused because device energising heat production is different with the thermal coefficient of expansion of each several part material
Mechanical strain and inelastic strain energy density, thus improve the thermomechanical reliability of RCP encapsulation, increase the use longevity of chip
Life.Technical scheme is as follows:
A kind of column soldered ball redistribution encapsulating structure for VLSI chip, including capsulation material, naked
Sheet, dielectric layer, RDL pad, soldered ball, PCB pad and PCB substrate, it is characterised in that described soldered ball is column soldered ball, soldered ball
Overall in cylinder.
The redistribution encapsulation of the column geometry mechanism soldered ball of the present invention overcomes the redistribution of conventional spherical soldered ball and is encapsulated in
In terms of reliability limitation, substantially increase redistribution encapsulation thermomechanical reliability.It is mainly reflected in: there is column geometry
The redistribution encapsulation of mechanism's soldered ball reduces in use owing to each parts thermal coefficient of expansion of encapsulation does not mate the thermomechanical caused
Stress and thermomechanical strain, also reduce inelastic strain energy in connecting packaging body and connection PCB soldered ball top layer thin layer
Accumulation, this can be greatly prolonged the fatigue life of soldered ball, improve the reliability of encapsulation；Owing to the soldered ball of column geometry adapts to
The performance that stress produces deformation is better than the spherical soldered ball of same material, welds so column soldered ball can preferably alleviate chip at high temperature
The impact of the warping phenomenon produced in termination process, thus improve the board level reliability of chip；Due also to the soldered ball of columnar microstructure
Relative to the spherical segment soldered ball of equal size openings, volume is much smaller, so required solder is also wanted, much less, and this indirectly subtracts
The cost of little encapsulation.
Accompanying drawing explanation
The RCP encapsulating structure of Fig. 1 column geometry soldered ball
The geometry of the spherical soldered ball of Fig. 2
The geometry of Fig. 3 column soldered ball
The vertical structure of Fig. 4 column soldered ball RCP encapsulation
The top view of 1/4th models constructed by Fig. 5
Inelastic strain energy density population distribution figure on soldered ball in Fig. 6 column soldered ball RCP encapsulation
The top view that in Fig. 7 column soldered ball RCP encapsulation, inelastic strain energy density is distributed on soldered ball
The upward view that in Fig. 8 column soldered ball RCP encapsulation, inelastic strain energy density is distributed on soldered ball
Description of reference numerals: 1 is capsulation material；2 is nude film (silicon chip)；3 is dielectric layer；4 is RDL pad；5 is soldered ball；6
It it is PCB pad；7 is PCB substrate；R is the radius of soldered ball opening；H is the height of soldered ball.
Detailed description of the invention
The present invention will be described with embodiment below in conjunction with the accompanying drawings.
Conventional redistribution encapsulation technology flow process is: first, nude film active face is positioned on substrate downwards, and uses asphalt mixtures modified by epoxy resin
Fat encapsulates；Then baseplate material is got rid of；Redistribution process, i.e. rearrangement holding wire, power and ground；Implant ball afterwards
Shape soldered ball；Finally cut the single chip of journey open.
In order to agree with mutually with conventional redistribution encapsulation flow process, the relative dimensions parameter according to original spherical solder balls is needed
Design and the column soldered ball of manufacture corresponding size.The radius R of the soldered ball openings of sizes of column soldered ball, i.e. soldered ball opening and soldered ball
Highly H with will soldered ball spherical with old process Central Plains soldered ball openings of sizes and height keep consistent, soldered ball entirety Cheng Zhuzhuan, this
Sample column soldered ball could agree with original weight distribution encapsulation flow process.During planting ball, column soldered ball soldered ball is implanted on pad,
Use suitable solder technology that chip is welded on pcb board again during last actual application.
The structure of the present invention is shown as shown in Figure 1, Figure 3 and Figure 4, and Fig. 1 is general effect figure, and Fig. 3 is the geometry of soldered ball, figure
4 is generally longitudinally structure.This structure include from top to bottom capsulation material 1, nude film (silicon chip) 2, by dielectric layer 3 and RDL pad 4 structure
Redistribution layer, SAC soldered ball 5, PCB pad 6 and the PCB substrate 7 become.Wherein, capsulation material is wrapped in nude film wherein, to silicon chip
Protected effect；Capsulation material is the thinnest, can increase its capacity of heat transmission, reduces its thermal resistance；Plastic packaging area ratio nude film face
Long-pending big, below extra area, the fan-out area having dielectric layer and holding wire to constitute, complete the redistribution merit of power supply and restricting the number line
Energy；Soldered ball is connected with redistribution layer by RDL pad, is connected with PCB substrate by PCB pad.
SAC305 column soldered ball selected by soldered ball, and this is Pb-free solder ball, little to environmental hazard；The solder ball shape of column is relative
In spherical soldered ball, there is less soldered ball volume, be greatly saved the cost of soldered ball.In planting ball and welding process, conjunction to be selected
Suitable soldering paste and temperature, and use suitable solder technology, the columnar shape of strict guarantee soldered ball not to change, competence exertion this
Bright advantage.
RCP encapsulating structure for checking column soldered ball has more preferably thermomechanical reliability relative to spherical soldered ball, to Fig. 1
Structural analysis, it is contemplated that the symmetry of encapsulation, set up the 1/4th limited of column soldered ball and spherical soldered ball RCP encapsulation respectively
Meta-model, as shown in Figure 4 and Figure 5, Fig. 4 shows encapsulation vertical structure, and the top view of Fig. 5 shows and encapsulates the relative of each parts
Size, silicon chip is 2 × 2 × 0.3mm3, it is positioned at the top of 16 soldered balls of internal layer, is fan-out area above the soldered ball of outer layer, in Fig. 2
In soldered ball opening radius R, ball height H and Fig. 3 of spherical soldered ball, the opening radius R of column soldered ball, ball height H keep phase
With, opening radius R is 0.13mm, and ball height is 0.24mm, and soldered ball pitch is 0.5mm.Emulate its three times-40 DEG C-125 DEG C
Under conditions of thermal cycle, the size of inelastic strain energy density in skin layer at soldered ball key point, characterizes the reliable of encapsulation
Property.Inelastic strain energy density its thermomechanical reliability the least is the best.Column soldered ball RCP encapsulation simulation result such as Fig. 6,
Shown in Fig. 7 and Fig. 8, Fig. 6 is inelastic strain energy density population distribution on column soldered ball；Fig. 7 is top view, it is known that for weldering
For the upper surface that ball is connected with packaging body, the inelastic strain energy in the upper surface thin layer of the corner soldered ball below silicon chip is close
Angle value is maximum；Fig. 8 is look up figure, can know for the lower surface that soldered ball is connected with pcb board, encapsulation overall corner soldered ball
Inelastic strain energy density values in lower surface thin layer is maximum.RCP encapsulation 1/4th models of spherical soldered ball weld with column
Ball RCP encapsulation 1/4th model emulation results are consistent.Therefore silicon chip lower comer soldered ball and encapsulation overall corner soldered ball are heavily to divide
Two key point soldered balls of cloth encapsulation, and inelastic strain energy density values and envelope in silicon chip lower comer soldered ball upper surface thin layer
Inelastic strain energy density values in the lower surface thin layer of dress overall corner soldered ball is two the crucial ginsengs characterizing RCP encapsulation
Number.Non-resilient energy density values in two kinds of structural model emulation two key point solder ball surface thin layers of gained is as shown in table 1, post
Shape soldered ball RCP structure below silicon chip in soldered ball upper surface thin layer non-resilient energy density than spherical soldered ball RCP encapsulating structure
Reducing about 28.3%, in the soldered ball lower surface thin layer of encapsulation overall corner, non-resilient energy density encapsulates than spherical soldered ball RCP
Structure reduces about 33.3%.This shows, the geometry of soldered ball is from conventional spherical column of changing into, the heat engine of RCP encapsulation
Tool reliability is improved, and the chip life-span accordingly increases.
The RCP of the conventional spherical soldered ball of table 1 and column soldered ball encapsulates the most non-resilient at key point soldered ball upper surface thin layer answering
Become energy density values
Claims (1)
1. for the column soldered ball redistribution encapsulating structure of VLSI chip, including capsulation material, nude film,
Dielectric layer, RDL pad, soldered ball, PCB pad and PCB substrate, it is characterised in that described soldered ball is column soldered ball, soldered ball is overall
In cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610673398.4A CN106129032A (en) | 2016-08-14 | 2016-08-14 | Column soldered ball redistribution encapsulating structure for VLSI chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610673398.4A CN106129032A (en) | 2016-08-14 | 2016-08-14 | Column soldered ball redistribution encapsulating structure for VLSI chip |
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| CN106129032A true CN106129032A (en) | 2016-11-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610673398.4A Pending CN106129032A (en) | 2016-08-14 | 2016-08-14 | Column soldered ball redistribution encapsulating structure for VLSI chip |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1817538A (en) * | 2004-12-05 | 2006-08-16 | 国际商业机器公司 | Solder interconnect structure and method using injection molded solder |
| CN102222629A (en) * | 2010-04-16 | 2011-10-19 | 台湾积体电路制造股份有限公司 | Semiconductor device and method for manufacturing the same |
| CN102709282A (en) * | 2011-04-28 | 2012-10-03 | 成都芯源系统有限公司 | Multi-chip packaging structure, converter module and packaging method |
| CN102832187A (en) * | 2011-06-16 | 2012-12-19 | 台湾积体电路制造股份有限公司 | Wafer level chip scale package with reduced stress on solder balls |
-
2016
- 2016-08-14 CN CN201610673398.4A patent/CN106129032A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1817538A (en) * | 2004-12-05 | 2006-08-16 | 国际商业机器公司 | Solder interconnect structure and method using injection molded solder |
| CN102222629A (en) * | 2010-04-16 | 2011-10-19 | 台湾积体电路制造股份有限公司 | Semiconductor device and method for manufacturing the same |
| CN102709282A (en) * | 2011-04-28 | 2012-10-03 | 成都芯源系统有限公司 | Multi-chip packaging structure, converter module and packaging method |
| CN102832187A (en) * | 2011-06-16 | 2012-12-19 | 台湾积体电路制造股份有限公司 | Wafer level chip scale package with reduced stress on solder balls |
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