CN106125212A - Optical module - Google Patents
Optical module Download PDFInfo
- Publication number
- CN106125212A CN106125212A CN201610634326.9A CN201610634326A CN106125212A CN 106125212 A CN106125212 A CN 106125212A CN 201610634326 A CN201610634326 A CN 201610634326A CN 106125212 A CN106125212 A CN 106125212A
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- Prior art keywords
- tec
- optical module
- driver
- critesistor
- laser
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The present invention provides a kind of optical module, including: the first thermoelectric refrigerator TEC, a TEC driver, the first laser instrument, the first critesistor, the 2nd TEC, the 2nd TEC driver, second laser, the second critesistor, the 3rd TEC and the 3rd TEC driver；Oneth TEC and the 2nd TEC is separately positioned on the 3rd TEC；3rd TEC freezes according to the control of the 3rd TEC driver or heats；First laser instrument is arranged on a TEC, first critesistor is arranged on the first laser instrument, and a TEC driver is connected with a TEC, and second laser is arranged on the 2nd TEC, second critesistor is arranged on second laser, and the 2nd TEC driver is connected with the 2nd TEC.Optical module provided by the present invention greatly improves the precision of optical module temperature, thus ensure that the precision of the wavelength control of optical module.
Description
Technical field
The present invention relates to electronic technology, particularly relate to a kind of optical module.
Background technology
At multiplexed optical wave (Wavelength Division Multiplexing is called for short WDM) EPON
In (Passive Optical Network is called for short PON) system, (Optical Line Terminal is called for short optical line terminal
OLT) between optical network unit (Optical Network Unit is called for short ONU), intensive multiplexed optical wave (Dense is used
Wavelength Division Multiplexing, is called for short DWDM) wavelength, it is achieved multidiameter delay point-to-point transmission.Use
During DWDM, the wavelength interval between adjacency channel is the narrowest, and therefore the required precision to wavelength is the highest.Therefore, for WDM PON
Optical module in system, it is necessary to optical module is able to maintain that the Wavelength stabilized of each passage, to avoid the occurrence of the wavelength between passage
Crosstalk.
In prior art, keeping Wavelength stabilized by increasing lock ripple device in optical module, specifically, lock ripple device collection swashs
The optical signal that light device sends, after the centre wavelength of chip of laser changes due to variations in temperature, lock ripple device can be by ripple
Long change feeds back to MCU, and then, under the control of MCU, adjust the temperature of chip of laser, and then make chip of laser
Wavelength is adjusted to normal range.
But, optical module of the prior art is the highest for temperature controlled precision, causes the wavelength control of optical module
Precision is the highest, it is difficult to ensure the wavelength interval between passage.
Summary of the invention
The present invention provides a kind of optical module, for solving in prior art the highest the asking of wavelength control precision to optical module
Topic.
Optical module provided by the present invention includes:
First thermoelectric refrigerator TEC, a TEC driver, the first laser instrument, the first critesistor, the 2nd TEC, second
TEC driver, second laser, the second critesistor, the 3rd TEC and the 3rd TEC driver；
A described TEC and described 2nd TEC is separately positioned on described 3rd TEC；
Described 3rd TEC freezes according to the control of described 3rd TEC driver or heats；
Described first laser instrument is arranged on a described TEC, and described first critesistor is arranged on described first laser
On device, a described TEC driver is connected with a described TEC, and a described TEC driver is according to described first critesistor
Value of feedback control described oneth TEC refrigeration or heat；
Described second laser is arranged on described 2nd TEC, and described second critesistor is arranged on described second laser
On device, described 2nd TEC driver is connected with described 2nd TEC, and described 2nd TEC driver is according to described second critesistor
Value of feedback control described 2nd TEC refrigeration or heat.
Optical module provided by the present invention, by arranging the 3rd TEC controlling macro-temperature and controlling each sharp respectively
Oneth TEC and the 2nd TEC of light device microcosmic temperature, thus greatly improve the precision of optical module temperature, thus ensure that light
The precision of the wavelength control of module, and then ensure that the wavelength interval between passage.
Accompanying drawing explanation
In order to be illustrated more clearly that the present invention or technical scheme of the prior art, below will be to embodiment or prior art
In description, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is the one of the present invention
A little embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to according to this
A little accompanying drawings obtain other accompanying drawing.
The function structure chart of the optical module embodiment one that Fig. 1 provides for the present invention；
The function structure chart of the optical module embodiment two that Fig. 2 provides for the present invention；
The function structure chart of the optical module embodiment three that Fig. 3 provides for the present invention；
The function structure chart of the optical module embodiment four that Fig. 4 provides for the present invention.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearer, attached below in conjunction with in the embodiment of the present invention
Figure, is clearly and completely described the technical scheme in the embodiment of the present invention, it is clear that described embodiment is the present invention
A part of embodiment rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not having
Make the every other embodiment obtained under creative work premise, broadly fall into the scope of protection of the invention.
The function structure chart of the optical module embodiment one that Fig. 1 provides for the present invention, as it is shown in figure 1, this optical module includes: the
One thermoelectric refrigerator (Thermoelectric Cooler is called for short TEC) the 1, the oneth TEC driver the 2, first laser instrument 3, first
Critesistor the 4, the 2nd TEC5, the 2nd TEC driver 6, second laser the 7, second critesistor the 8, the 3rd TEC9 and the 3rd
TEC driver 10.
Oneth TEC1 and the 2nd TEC5 is separately positioned on the 3rd TEC9.
3rd TEC9 freezes according to the control of the 3rd TEC driver 10 or heats.
First laser instrument 3 is arranged on a TEC1, and the first critesistor 4 is arranged on the first laser instrument 3, a TEC
Driver 2 is connected with a TEC1, and a TEC driver 2 controls a TEC1 refrigeration according to the value of feedback of the first critesistor 4
Or heat.
Second laser 7 is arranged on the 2nd TEC5, and the second critesistor 8 is arranged on second laser 7, the 2nd TEC
Driver 6 is connected with the 2nd TEC5, and the 2nd TEC driver 6 drives the 2nd TEC5 according to the value of feedback of the second critesistor 8.
Wherein, the first laser instrument 3 and second laser 7 all include laser diode (Laser Diode, be called for short LD) and
Backlight diode (Photo Diode is called for short PD), respectively LD1, PD1, LD2 and LD2.LD is chip of laser, laser instrument
Operating temperature is primarily referred to as the operating temperature of LD.It addition, optical module also including, (LD Driver is called for short laser driver
LDD), i.e. corresponding with the first laser instrument 3 and second laser 7 LDD1 and LDD2.Form automated power between LD and PD to control
(Auto Power Control is called for short APC) closed loop, is used for maintaining the stability of light power.
During specific works, on the one hand, the 3rd TEC9 carries out freezing or making under the control of the 3rd TEC driver 10
Heat, thus realize the control of the macro-temperature to laser instrument.On the other hand, for supporting multichannel array optical module, each logical
Heat produced by the laser instrument that road is corresponding also differs, such as, when when laser instrument A work, laser instrument B does not works, and laser instrument
Heat produced by A and laser instrument B is different, and in this case, the temperature of laser instrument A and laser instrument B is also different, i.e.
The each local temperature of optical module there may be difference, and this species diversity may cause the operation wavelength of laser instrument to change, therefore,
Oneth TEC1 and the 2nd TEC5 is set in optical module, a TEC1 and the 2nd TEC5 is arranged on the 3rd TEC9.First,
One laser instrument 3 is arranged on a TEC1, and the first critesistor 4 is arranged on the first laser instrument 3, when the temperature of the first laser instrument 3
When degree changes, variations in temperature can be fed back to, in a TEC driver 2, be driven by a TEC by the first critesistor 4
Dynamic device 2 controls a TEC1 and freezes or heat, owing to the first laser instrument 3 is arranged on a TEC1, so by the
The refrigeration of one TEC1 or heat, it is possible to make the temperature of the first laser instrument 3 keep stable, thus realize for the first laser instrument
3 accurate temperatures on microcosmic control.Secondly, second laser 7 is arranged on the 2nd TEC5, and the second critesistor 8 is arranged on
On second laser 7, when the temperature of second laser 7 changes, variations in temperature can be fed back to by the second critesistor 8
In 2nd TEC driver 6, control the 2nd TEC5 by the 2nd TEC driver 6 and freeze or heat, due to the second laser
Device 7 is arranged on the 2nd TEC5, therefore freezing or just heating so that the temperature of second laser 7 is protected by the 2nd TEC5
Keep steady fixed, thus realize the second laser 7 accurate temperature on low-light is controlled.
In the present embodiment, by arranging the 3rd TEC controlling macro-temperature and controlling each laser instrument microcosmic temperature respectively
Oneth TEC and the 2nd TEC of degree, thus greatly improve the precision of optical module temperature, thus ensure that the wavelength of optical module
The precision controlled, and then ensure that the wavelength interval between passage.
In a kind of preferred embodiment, with further reference to Fig. 1, above-mentioned optical module also includes: heat sink 11.Heat sink 11 set
Put between the 3rd TEC9 and the first laser instrument 3.
In another embodiment, with further reference to Fig. 1, above-mentioned optical module also includes: the 3rd critesistor 12.
3rd TEC driver 10 controls the 3rd TEC9 refrigeration according to the value of feedback of the 3rd critesistor 12 or heats.
It is alternatively possible to be arranged on heat sink 11 by the 3rd critesistor 12, it is arranged on the 3rd TEC9 and due to heat sink
Between one laser instrument 3, therefore, the temperature of heat sink 11 just can react the bulk temperature of laser instrument in optical module, the 3rd temperature-sensitive electricity
Resistance 12 just can gather the macro-temperature of laser instrument by the temperature gathering heat sink 11, when the macro-temperature of laser instrument becomes
During change, variations in temperature can be fed back to the 3rd TEC driver 10, so that the 3rd TEC9 is the 3rd by the 3rd critesistor 12
Freeze under the control of TEC driver 10 or heat, to maintain stablizing of the macro-temperature of laser instrument in optical module.
In another embodiment, the 3rd TEC driver 10 is the TEC driver with disposal ability, and, the 3rd TEC drives
Dynamic device 10 is connected with the 3rd critesistor 12, so that the 3rd TEC is directly controlled by the 3rd TEC driver 10.
Specifically, when the macro-temperature of optical module laser instrument changes, variations in temperature can be fed back to the by the 3rd critesistor 12
Three TEC drivers 10, the 3rd TEC driver 10 is known when in optical module, the macro-temperature of laser instrument changes, it is possible to straight
Connect the change according to temperature and control the size driving electric current of the 3rd TEC9.
In addition to the 3rd TEC driver 10, a TEC driver 2 and the 2nd TEC driver 6 can also be to have place
The TEC driver of reason ability.
Firstly, for a TEC driver 2, a TEC driver 2 is connected with the first critesistor 4, when the first laser
When the temperature of device 3 changes, variations in temperature will be fed back to a TEC and drive by the first critesistor 4 being disposed thereon
Device 2, a TEC driver 2 is known when the temperature of the first laser instrument 3 changes, it is possible to directly come according to the change of temperature
Control the size driving electric current of a TEC1.
Secondly, for the 2nd TEC driver 6, the 2nd TEC driver 6 is connected with the second critesistor 8, when the second laser
When the temperature of device 7 changes, variations in temperature can be fed back to the 2nd TEC driver by the second critesistor 8 being disposed thereon
6, the 2nd TEC driver 6 is known when the temperature of second laser 7 changes, and can directly control according to the change of temperature
The size driving electric current of the 2nd TEC5.
The function structure chart of the optical module embodiment two that Fig. 2 provides for the present invention, as in figure 2 it is shown, in above-mentioned optical module also
Including microprocessing unit (Microcontroller Unit is called for short MCU) 13.
3rd TEC driver 10 is connected with MCU13.
3rd TEC driver 10 controls the 3rd TEC9 by MCU13.
Alternatively, MCU13 can be connected with the 3rd critesistor 12, thus comes according to the value of feedback of the 3rd critesistor 12
Generating corresponding signal and be sent to the 3rd TEC driver 10, the 3rd TEC driver 10 controls the 3rd TEC9 under the control of MCU
Driving electric current, thus ensure stablizing of the macro-temperature of laser instrument in optical module.
In addition to the 3rd TEC driver 10, a TEC driver 2 and the 2nd TEC driver 6 can also respectively with
MCU13 connects, and controls the driving electric current of the TEC of correspondence under the control of MCU.The optical module embodiment that Fig. 3 provides for the present invention
The function structure chart of three, as it is shown on figure 3, a TEC driver 2 and the 2nd TEC driver 6 are connected with MCU13 respectively, meanwhile,
First critesistor 4 is connected with MCU13, and the second critesistor 8 is connected with MCU13.
When the temperature of the first laser instrument 3 changes, the first critesistor 4 being disposed thereon will be by variations in temperature
Feed back to MCU13, MCU13 and send signal according to value of feedback to a TEC driver 2, so that TEC driver 2 basis
The signal of MCU13 controls the driving electric current of a TEC1, and then realizes controlling for the temperature of the first laser instrument 3.
When the temperature of second laser 7 changes, the second critesistor 8 being disposed thereon will be by variations in temperature
Feed back to MCU13, MCU13 and send signal according to value of feedback to the 2nd TEC driver 6, so that the 2nd TEC driver 6 basis
The signal of MCU13 controls the driving electric current of the 2nd TEC5, and then realizes controlling for the temperature of second laser 7.
The function structure chart of the optical module embodiment four that Fig. 4 provides for the present invention, as shown in Figure 4, in above-mentioned optical module also
Including the first grating region 14 and the second grating region 15.
First grating region 14 is arranged on the first laser instrument 3, and the first grating region 14 is connected with MCU13.
Second grating region 15 is arranged on second laser 7, and the second grating region 15 is connected with MCU13.
During specific works, the feedback that MCU13 sends respectively according to the first critesistor 4 and the second critesistor 8
Value, controls the first grating region 14 and input current of the second grating region 15 so that the first grating region 14 and the second grating respectively
District 15 all can only allow specific wavelength to pass through, thus is further ensured that stablizing of the operation wavelength of each laser instrument.
It addition, use grating region maintains the power consumption that stably will not increase optical module of the operation wavelength of laser instrument,
To ensure the low-power consumption of optical module.
It should be noted that TEC driver the 2, the 2nd TEC driver 6 and the 3rd TEC driver 10 in Fig. 4
All controlled by MCU, but when in optical module, grating region is set, it is also possible to by TEC driver the 2, a 2nd TEC driver
6 and the 3rd TEC driver 10 be both configured to the TEC driver with disposal ability, its annexation is referred to aforesaid
Embodiment.
Alternatively, owing to the size of wavelength can be determined by voltage and current, therefore, it can in advance by the school preset
Standard forms the corresponding relation between voltage and current, and is saved in MCU by this corresponding relation, in optical module work process
In, when the operation wavelength that variations in temperature causes laser instrument changes, can pass through between the voltage and current pre-saved
Corresponding relation ensure stablizing of wavelength.
In the present embodiment, each laser instrument arranges a grating region, when the operation wavelength of laser instrument changes,
The characteristic of grating region can be controlled by MCU and ensure the stablizing of operation wavelength of laser instrument, thus promote optical module further
The precision of wavelength control.
In a kind of optional embodiment, the laser instrument in above-mentioned optical module includes: the first laser instrument, second laser,
3rd laser instrument and the 4th laser instrument.
Alternatively, the first grating region 14 and the second grating region 15 can be Distributed Bragg Reflection (Distributed
Bragg Reflector, is called for short DBR) grating region.
Last it is noted that various embodiments above is only in order to illustrate technical scheme, it is not intended to limit；To the greatest extent
The present invention has been described in detail by pipe with reference to foregoing embodiments, it will be understood by those within the art that: it depends on
So the technical scheme described in foregoing embodiments can be modified, or the most some or all of technical characteristic is entered
Row equivalent；And these amendments or replacement, do not make the essence of appropriate technical solution depart from various embodiments of the present invention technology
The scope of scheme.
Claims (9)
1. an optical module, it is characterised in that including: the first thermoelectric refrigerator TEC, a TEC driver, the first laser instrument,
First critesistor, the 2nd TEC, the 2nd TEC driver, second laser, the second critesistor, the 3rd TEC and the 3rd TEC
Driver；
A described TEC and described 2nd TEC is separately positioned on described 3rd TEC；
Described 3rd TEC freezes according to the control of described 3rd TEC driver or heats；
Described first laser instrument is arranged on a described TEC, and described first critesistor is arranged on described first laser instrument,
A described TEC driver is connected with a described TEC, anti-according to described first critesistor of a described TEC driver
Feedback value controls a described TEC refrigeration or heats；
Described second laser is arranged on described 2nd TEC, and described second critesistor is arranged on described second laser,
Described 2nd TEC driver is connected with described 2nd TEC, anti-according to described second critesistor of described 2nd TEC driver
Feedback value controls described 2nd TEC refrigeration or heats.
Optical module the most according to claim 1, it is characterised in that described optical module also includes: the 3rd critesistor；
Described 3rd TEC driver controls described 3rd TEC refrigeration according to the value of feedback of described 3rd critesistor or heats.
Optical module the most according to claim 2, it is characterised in that described 3rd TEC driver is to have disposal ability
TEC driver；
Described 3rd TEC driver is connected with described 3rd critesistor.
Optical module the most according to claim 2, it is characterised in that described optical module also includes: microprocessing unit MCU；
Described 3rd TEC driver is connected with described MCU；
Described 3rd TEC driver controls described 3rd TEC by described MCU.
5. according to the optical module described in any one of claim 1-4, it is characterised in that described optical module also includes: the first grating region
And second grating region；
Described first grating region is arranged on described first laser instrument, and described first grating region is connected with MCU；
Described second grating region is arranged on described second laser, and described second grating region is connected with MCU.
Optical module the most according to claim 1, it is characterised in that described optical module also includes: heat sink；
Described heat sink it is arranged between described 3rd TEC and described first laser instrument.
Optical module the most according to claim 1, it is characterised in that at least one laser instrument described includes: the first laser instrument,
Second laser, the 3rd laser instrument and the 4th laser instrument.
Optical module the most according to claim 5, it is characterised in that described first grating region and described second grating region are
Distributed Bragg Reflection DBR grating region.
Optical module the most according to claim 1, it is characterised in that described laser instrument includes laser diode LD and photoelectricity
Diode PD, forms automated power and controls APC closed loop between described LD and described PD.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610634326.9A CN106125212B (en) | 2016-08-05 | 2016-08-05 | Optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610634326.9A CN106125212B (en) | 2016-08-05 | 2016-08-05 | Optical module |
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| Publication Number | Publication Date |
|---|---|
| CN106125212A true CN106125212A (en) | 2016-11-16 |
| CN106125212B CN106125212B (en) | 2019-01-01 |
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| CN201610634326.9A Active CN106125212B (en) | 2016-08-05 | 2016-08-05 | Optical module |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107942449A (en) * | 2017-11-24 | 2018-04-20 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN109188614A (en) * | 2018-08-28 | 2019-01-11 | 武汉电信器件有限公司 | Dual carrier integrated optical device and optical-electric module |
| CN110542957A (en) * | 2019-09-02 | 2019-12-06 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112054848A (en) * | 2019-06-17 | 2020-12-08 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN115693396A (en) * | 2021-07-30 | 2023-02-03 | 山东华光光电子股份有限公司 | Constant-voltage red light semiconductor laser module with stable power output and preparation method and application thereof |
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| US20140185312A1 (en) * | 2012-12-29 | 2014-07-03 | Duane Louderback | Method and apparatus for implementing optical modules in high temperatures |
| CN104717018A (en) * | 2015-03-25 | 2015-06-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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| US20140185312A1 (en) * | 2012-12-29 | 2014-07-03 | Duane Louderback | Method and apparatus for implementing optical modules in high temperatures |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107942449A (en) * | 2017-11-24 | 2018-04-20 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
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| CN112054848A (en) * | 2019-06-17 | 2020-12-08 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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| CN110542957A (en) * | 2019-09-02 | 2019-12-06 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN115693396A (en) * | 2021-07-30 | 2023-02-03 | 山东华光光电子股份有限公司 | Constant-voltage red light semiconductor laser module with stable power output and preparation method and application thereof |
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| Publication number | Publication date |
|---|---|
| CN106125212B (en) | 2019-01-01 |
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