[go: up one dir, main page]

CN106061546A - Microneedle system and method for the production thereof - Google Patents

Microneedle system and method for the production thereof Download PDF

Info

Publication number
CN106061546A
CN106061546A CN201580012129.7A CN201580012129A CN106061546A CN 106061546 A CN106061546 A CN 106061546A CN 201580012129 A CN201580012129 A CN 201580012129A CN 106061546 A CN106061546 A CN 106061546A
Authority
CN
China
Prior art keywords
contact pin
pin grid
wedge
breach
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580012129.7A
Other languages
Chinese (zh)
Inventor
S·舍尔
K·霍伊泽尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LTS Lohmann Therapie Systeme AG
Original Assignee
LTS Lohmann Therapie Systeme AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LTS Lohmann Therapie Systeme AG filed Critical LTS Lohmann Therapie Systeme AG
Priority claimed from PCT/EP2015/052150 external-priority patent/WO2015117938A1/en
Publication of CN106061546A publication Critical patent/CN106061546A/en
Pending legal-status Critical Current

Links

Classifications

    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61MDEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M37/00Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin
    • A61M37/0015Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin by using microneedles
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61MDEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M37/00Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin
    • A61M37/0015Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin by using microneedles
    • A61M2037/0046Solid microneedles
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61MDEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M37/00Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin
    • A61M37/0015Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin by using microneedles
    • A61M2037/0053Methods for producing microneedles

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dermatology (AREA)
  • Medical Informatics (AREA)
  • Anesthesiology (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Hematology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Media Introduction/Drainage Providing Device (AREA)

Abstract

The application relates to a method for producing a microneedle system (10), wherein from a board (21) is produced a web grating (41) which has a plurality of grating nodes (42) defined by in each case three apertures (22) and which has web grating wedges (51), and to a microneedle system comprising a board and a plurality of openings (31) delimited circumferentially by a web grating, wherein there is arranged at each opening at least one web grating wedge having a needle-shaped tip (56) which projects from the board and which is oriented at least approximately normal to the board. Web grating wedges having needle-shaped tips protrude into each aperture from at least three different directions. In order to produce openings, at least all the web grating wedges which protrude into an aperture are bent by means of a punch (72) and the needle-shaped tips thereof are oriented normal to the plane of the web grating. At least two web grating wedges are arranged at each opening, the bending lines of which are oriented non-parallel to one another. By virtue of the present application, the operational safety of a microneedle system is increased.

Description

Microneedle device and manufacture method thereof
Technical field
The present invention relates to a kind of method for manufacturing microneedle device, wherein, by substrate manufacture contact pin grid, these contact pin grid Lattice are included multiple grid node limited by three breach respectively and include multiple contact pin grid wedge, and the present invention relates to A kind of microneedle device, this microneedle device includes a substrate and includes multiple opening circumferentially defined by contact pin grid, its In, each opening is provided with at least one contact pin grid wedge, described contact pin grid wedge includes that one is stretched out from contact pin grid , the needle-shaped tip of the planar orientation being at least substantially perpendicular to contact pin grid, each contact pin grid wedge has a buckled zone, should Buckled zone includes the sweep being parallel to the planar orientation of contact pin grid, and the quantity of needle-shaped tip is at least equal to the number of opening Three times of amount.
Background technology
According to US2003/0199810A1, when manufacturing microneedle device, use the elastomeric material loaded by big punch die, Described elastomeric material bends a tip respectively in each indentation, there.Before processing, all tips refer in same direction To.If lateral load occurs in the application, then pin may bending.Microneedle device becomes unavailable.
According to DE69730971T2, the pin offset one from another can be set on opposed each side of breach.This embodiment party In formula, lateral load is likely to cause the inefficacy of microneedle device.
Summary of the invention
The present invention proposes following problem: improve the safety in operation of microneedle device.
This problem proposed utilizes the feature of independent claims to solve.To this end, during fabrication, make that there is needle-shaped tip Contact pin grid wedge stretches into each breach from the direction that at least three is different.In order to manufacture opening, at least make by punch die all The contact pin grid wedge stretched in breach bending and make their needle-shaped tip be perpendicular to contact pin grid plane orientation.
The microneedle device so manufactured is constructed such that so that be provided with at least two contact pin grid wedge on each opening, The sweep of described contact pin grid wedge is orientated the most not parallelly.Additionally, in contact pin grid, every one grid of three limited openings Lattice node.
Accompanying drawing explanation
Other details of the present invention are drawn by dependent claims and the follow-up explanation to the embodiment schematically shown.
Fig. 1 illustrates the top view of substrate;
Fig. 2 illustrates the partial, longitudinal cross-sectional of Fig. 1;
Fig. 3 illustrates the details of Fig. 2;
Fig. 4 illustrates the substrate including breach;
Fig. 5 illustrates the dimetric drawing of Fig. 4;
Fig. 6 illustrates the details of Fig. 4;
Fig. 7 illustrates the modification of Fig. 6;
Fig. 8 illustrates second modification of Fig. 6;
Fig. 9 illustrates the 3rd modification of Fig. 6;
Figure 10 illustrates the manufacture of opening;
Figure 11 illustrates the top view of punch die system;
Figure 12 illustrates the top view of mold system;
Figure 13 illustrates the punch die of the substrate including shaping;
Figure 14 illustrates the dimetric drawing of substrate after such shaping.
Detailed description of the invention
Fig. 1 illustrates that top view and Fig. 2 illustrate the longitudinal section of microneedle device (10).Such microneedle device (10) is used for Effective ingredient is introduced the internal of patient through skin from the effective ingredient storage room being not shown here.
Described effective ingredient storage room is arranged on effective ingredient carrier (11).Described effective ingredient carrier (11) has one Individual substrate (21), described substrate has a contact pin grid (41), multiple opening (31) and multiple pin (55).In this embodiment In, it is provided with in substrate (21) more than 30 openings (31).Each opening (31) is defined by eight pins (55).Each pin (55) has There is a tip (56).In the illustrated embodiment, opening (31) has the profile of closing.The most described opening is in basic configuration Aspect has octagonal structure, and described octagonal angle (32) is arranged between each pin (55).Described basic configuration also may be used To be regular or irregular triangle, quadrangle, hexagon etc..It is also contemplated that as circular, oval, avette etc. base The embodiment of this shape.
In the illustrated embodiment, substrate (21) has the length of 20 millimeters and the width of 20 millimeters.Angle is with five millimeters Angular radius rounding.The thickness of described substrate (21) is 0.1 millimeter.Described substrate is in this embodiment by austenite, rust-proofing Make with acidproof material.This e.g. material number is the X5CrNi18-10 of 14301.
67 openings (31) it are provided with in the substrate (21) shown in Fig. 1.The cross-sectional area summation of all openings (31) is at this Embodiment is substrate (21) basal plane area 40%.The cross-sectional area summation of all openings (31) is therefore more than substrate (21) Basal plane area 30%.
Described opening (31) is surrounded by contact pin grid (41).Every three openings (31) limit a grid node (42).? In each grid node (42), three contact pin (43) T-shaped it is connected with each other.
Contact pin grid (41) is in a plane, and contact pin grid wedge (51) is perpendicular to this plane earth and highlights from this plane. In the view of Fig. 2, described contact pin grid wedge is downwardly projected.Each contact pin grid wedge (51) has one and is connected to contact pin grid (41) buckled zone (52) on and a pin (55), with reference to Fig. 3.The tip (56) of each pin (55) is configured to relative to contact pin grid The longitudinal plane symmetry of the central authorities through opening (31) axis (33) along substrate thickness direction orientation of lattice wedge (51).Each connects The thickness of sheet grid wedge (51) is equal to the thickness of substrate (21).Buckled zone (52) has constant bending radius, described bending half Footpath is such as equal to the thickness of contact pin grid wedge (51).Contact pin grid wedge (51) the most at least with the 80% of their length from contact pin Grid (41) highlights.In this embodiment, pin (55) at least stretches out from contact pin grid (41) with 0.6 millimeter.
Opening (31) is provided with at least three contact pin grid wedge (51).In the present embodiment, each described opening (31) Defined by contact pin grid wedge (51) of equal number.The sweep (53) of at least two contact pin grid wedge (51) is in different directions Point to.The two sweep has an intersection point.In this embodiment, the straight sweep of each two buckled zone (52) has phase Same direction.
The manufacture of microneedle device (10) illustrates in figs. 4-6 and in figures 10-14.Raw material is e.g. by above-mentioned material system The flat substrate (21) of the constant thickness become.In this embodiment, this substrate has the square basal plane at the angle with rounding.Substrate (21) can also be configured to circle, angular, oval etc..
First breach (22) is introduced in this sheet material.This is carried out by punching press, cut, corrosion etc..Each breach (22) such as it is arranged in adjacent row as illustrate in figures 4 and 5.Each row offsets one from another with a point position for half.Often The centrage (23) of three breach adjacent one another are (22) forms a wedge with the equilateral triangle as basal plane.Here, Two adjacent breach (22) centre distance each other with 15% more than the circle diameter of a single breach (22).
Fig. 6 illustrates the details of breach (22).This breach there is middle section (24) and such as eight set radial to centrage Breach section (25) that put, that expand outwardly.Each described breach section (25) is symmetrical relative to the radius of breach (22), its In, each described radius angle (26) outside with of breach (22) is intersected.
Such as after stamping-out, initial substrate (21) remains with contact pin grid (41) and breach section (25) it Between remain with contact pin grid wedge (51).Such as in the top view of Fig. 6, it is arranged on breach for contact pin grid wedge (51) of triangle (22) stretch out from contact pin grid (41) between each angle (26) and with the length of such as 0.75 millimeter.Each contact pin grid wedge (51) width is 0.3 millimeter in this top view.In described top view, in this embodiment, all contact pin grid wedges (51) area is the 34% of the area of the basic configuration determined by angle (26) of breach (22).All contact pin grid wedge (51) Area be breach (22) at this between the 25% to 50% of the most octagonal basic configuration.Based on this dimension scale, The danger damaging contact pin grid wedge (51) is there is not when manufacturing breach (22).
Each breach (22) is so arranged each other so that contact pin grid wedge (51) is not mutually aligned.Top view at Fig. 4 In, in each gap, breach section is mutually aligned.In adjacent gap, contact pin grid wedge (51) is adjacent to one Arrange breach section (25).
Fig. 7-9 illustrates multiple modification of the structure of breach (22).In the figure 7, the basic configuration of breach (22) has ten Angle (26).This basic configuration includes that contact pin grid wedge (51) is relative to the longitudinal plane symmetry of the central authorities of breach (22).In this enforcement In example, each contact pin grid wedge (51) is also disposed between two angles (26) of breach (22).Replace angle (26), it is also possible in institute State and between contact pin grid wedge (51), arch is set.
The breach (22) that figure 8 illustrates has two long limits opposite each other (27,28).A long limit (27) wherein It is provided with single contact pin grid wedge (51).Go up on another long limit (28) and this arranges two contact pin grid wedges with staggering (51)。
Fig. 9 illustrates the breach including six contact pin grid wedge (51).Each two contact pin grid wedge (51) is in this top view Point on a common point of vertical central fore-and-aft plane.Replace angle (26), set between each contact pin grid wedge (51) Put arcuate member (29).
Substrate (21) including breach (22) is such as put in bending press, with reference to Figure 10.Bending press has a mould Tool system (61) and a punch die system (71).With reference to Figure 12, mold system (61) has multiple space in this embodiment (62).The quantity in described space (62) is equal to the quantity of the breach (22) of substrate (21).The cross section in single space (62) is eight Dihedral.There is rounding (63), referring also to Figure 10 on space (62) edge thereon.This rounding (63) has such as 0.2 millimeter Radius.The cross-sectional area of the inside in space (62) is less than the cross-sectional area of the basic configuration of breach (22) with rounding (63).
With reference to Figure 11, punch die system (71) has multiple punch die (72).These are in this embodiment with the punch die of type (72) there is octagonal cross section in this embodiment.Spanner mouth aperture (Schl ü sselweite) is such as than mold system (61) double thickness of substrate (21) that the correspondingly-sized in space (62) is narrow.The tip (73) of each punch die (72) is configured to The pyramidal frustum bodily form.Tip angle for example, 30 degree.
In bending press, punch die system (71) is to mold system (61) closing motion.Substrate (21) is such as by compression Device is maintained in its position.Punch die (72) contacts contact pin grid wedge (51) and sinks in mould (62).Here, contact pin grid Wedge (51) bends along the rounding (63) of corresponding mould (62).Described shaping can cold or thermally be carried out.Corresponding buckled zone (52) there is a straight sweep (53).All of sweep (53) is in a common plane, and described plane is parallel Plane in the upside (44) of contact pin grid (41).The sweep (53) of contact pin grid wedge (51) therefore has four different sides To.Region deformation adjacent one another are is not made because of arrangement based on breach (22) and orientation, so contact pin grid (41) its static strength is kept.The bending that there is not contact pin grid wedge (51) is dangerous.Simple for geometry instrument can be used In producing breach (22) and being used for shaping.Each breach (22) is the most only used to a unique punch die (72).By this Punch die (72), manufactures all such as eight pins (55) in a unique punch die stroke from contact pin grid wedge (51).
When punch die (72) sinks in mould (62) further, contact pin grid wedge (51) deforms further, until described punching Mould is perpendicular to the plane of contact pin grid (41) and stretches out.The tip (56) of contact pin grid wedge (51) is now towards deviating from contact pin grid (41) Plane direction point to.This figure 13 illustrates.According to manufacturing process, can be by punch die (72) in the predetermined time interval phase Between be maintained in this position or make contact pin grid wedge (51) slightly excess stretch.
Contact pin grid wedge (51) forms pin (55) now, and described pin surrounds opening (31) and downwards in the view of Figure 14 Stretch out.Such as pin (55) stretches out from contact pin grid (41) with the length of 0.6 millimeter.In the embodiment of Figure 14, by above-mentioned chi In the case of based on very little, the substrate area of every square millimeter arranges 1.2 pins.Made by the substrate (21) according to Figure 4 and 5 In the microneedle device (10) made, every square millimeter of substrate area arranges 1.4 pins (55).The area of references openings (31), at this In embodiment, every square millimeter of open cross-sectional area has at least three pin (55) and most advanced and sophisticated (56).The gross area example of opening (31) As bigger than the 30% of the basal plane area of substrate (21).
In order to use microneedle device (10), described microneedle device is installed to patient together with the effective ingredient storage room set assembled Skin on and thrust in described skin.Here, user applies the power being substantially orientated along the direction of pin (55).Pin (55) Overcome the resistance of upper skin layer and thrust in skin.The resistance of such as skin and/or the power of deflection applied by user can The shearing force being applied on pin (55) can be caused.
The different direction of sweeps based on each pin (55) (53), does not exists when using described microneedle device (10) The bending of pin (55) or the danger of bending.All pins (55) therefore thrust in the skin of patient.
After application microneedle device (10), effective ingredient thrusts the skin of tensioning micropin (55) through opening (31) In skin.Here, the gross area of opening (31) is the biggest with the ratio of the basal plane area of substrate (21), then the volume flow of effective ingredient The biggest.Such as rising along with ratio, volume flow the most proportionally raises.The layout along closed outline based on pin (55) Structure, can be in the case of the pin (55) of equal number, and be chosen as by the area of contact pin grid (41) than opening (31) is total Area is little.This factor such as can be less than 2.5.
In order to manufacture microneedle device (10), only need two workflows.In two workflows, each instrument is implemented respectively One unique stroke motion.Microneedle device (10) therefore can quickly and without problems be made.Described microneedle device is the most right It is applicable in a large amount of production.
It is also recognized that the different embodiments mentioned are mutually combined.
Reference numerals list
10 microneedle devices
11 effective ingredient carriers
21 substrates
22 breach
23 centrages
24 middle sections
25 breach sections
26 jiaos
27 long limits
28 long limits
29 arcuate member
31 openings
32 jiaos
33 axis
41 contact pin grids
42 grid nodes
43 contact pin
On the upside of in the of 44
51 contact pin grid wedges
52 buckled zones
53 sweeps
55 pins, micropin
56 most advanced and sophisticated, needle-shaped tip
61 mold systems
62 spaces, mould
63 roundings
71 punch die systems
72 punch dies
73 punch dies are most advanced and sophisticated
74 stroke directions
75 longitudinal seamed edges
76 die faces

Claims (7)

1. the method being used for manufacturing microneedle device (10), wherein,
-being manufactured contact pin grid (41) by substrate (21), this contact pin grid includes multiple being limited by three breach (22) respectively Grid node (42) and include multiple contact pin grid wedge (51),
-make each contact pin grid wedge (51) with needle-shaped tip (56) stretch into each breach (22) from the direction that at least three is different In, and
-in order to manufacture opening (31), at least make whole contact pin grid wedge (51) stretched in breach (22) by punch die (72) Bending and the plane making their needle-shaped tip (56) be perpendicular to contact pin grid (41) orient.
2. the method manufacturing microneedle device (10) according to being used for described in claim 1, it is characterised in that punch die (72) has edge Longitudinal seamed edge (75) that its stroke directions (74) is orientated, wherein, each two longitudinal direction seamed edge (75) defines a smooth die face (78)。
3. the method manufacturing microneedle device (10) according to being used for described in claim 1, it is characterised in that will have breach (22) Substrate (21) be placed on mold system (61), described mold system includes that at least one has the space of polygonal crosssection (62)。
4. microneedle device (10), including a substrate (21) and include multiple opening circumferentially defined by contact pin grid (41) (31), wherein,
Being provided with at least one contact pin grid wedge (51) on each opening (31), described contact pin grid wedge includes one from contact pin That grid (41) stretches out, be at least substantially perpendicular to the needle-shaped tip (56) of the planar orientation of contact pin grid (41),
Each contact pin grid wedge (51) has a buckled zone (52), and this buckled zone includes the plane being parallel to contact pin grid (41) The sweep (53) of orientation, and
The quantity of needle-shaped tip (56) at least equal to three times of quantity of opening (31),
It is characterized in that,
-on each opening (31), it is provided with at least two contact pin grid wedge (51), the sweep (53) of described contact pin grid wedge It is orientated the most not parallelly, and
-in contact pin grid (41), every three openings (31) limit a grid node (42).
5. according to the microneedle device (10) described in claim 4, it is characterised in that total cross-sectional area of opening (31) is at least base The 30% of plate basal plane area.
6. according to the microneedle device (10) described in claim 4,
It is characterized in that, the sweep (53) of contact pin grid wedge (51) that each two is adjacent is just intersecting at a point.
7. according to the microneedle device (10) described in claim 4,
It is characterized in that, all needle-shaped tip (56) are all parts for pin (55), and these parts the most substantially have identical length Degree.
CN201580012129.7A 2014-02-10 2015-02-03 Microneedle system and method for the production thereof Pending CN106061546A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE141544817 2014-02-10
DE14154481.7 2014-02-10
PCT/EP2015/052150 WO2015117938A1 (en) 2014-02-10 2015-02-03 Microneedle system and method for the production thereof

Publications (1)

Publication Number Publication Date
CN106061546A true CN106061546A (en) 2016-10-26

Family

ID=57484338

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580012129.7A Pending CN106061546A (en) 2014-02-10 2015-02-03 Microneedle system and method for the production thereof

Country Status (1)

Country Link
CN (1) CN106061546A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111918691A (en) * 2018-03-30 2020-11-10 实验室和人们 Multifunctional microneedle
CN112423828A (en) * 2018-05-18 2021-02-26 浦项工科大学校产学协力团 Transdermal drug delivery patch and method for producing same
CN112423829A (en) * 2018-05-18 2021-02-26 浦项工科大学校产学协力团 Transdermal drug delivery patch and method for producing same
CN112891724A (en) * 2020-12-28 2021-06-04 上海交通大学 Micro-needle array with plastic micro-bending and preparation method thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997048440A1 (en) * 1996-06-18 1997-12-24 Alza Corporation Device for enhancing transdermal agent delivery or sampling
WO1999029365A1 (en) * 1997-12-11 1999-06-17 Alza Corporation Device for enhancing transdermal agent flux
WO2003048031A2 (en) * 2001-11-30 2003-06-12 Alza Corporation Methods and apparatuses for forming microprojection arrays
CN1206004C (en) * 1997-12-11 2005-06-15 阿尔扎有限公司 Device for enhancing transdermal agent flux
US20070161964A1 (en) * 2006-01-10 2007-07-12 Yuzhakov Vadim V Microneedle array, patch, and applicator for transdermal drug delivery
CN101120101A (en) * 2004-04-13 2008-02-06 阿尔扎公司 Device and method for transdermal delivery of multiple vaccines
WO2008067290A2 (en) * 2006-11-28 2008-06-05 Yuzhakov Vadim V Tissue conforming microneedle array and patch for transdermal drug delivery or biological fluid collection
CN100571643C (en) * 2003-10-31 2009-12-23 阿尔扎公司 The self-driven applicator that is used for microprotrusion array
WO2012018486A2 (en) * 2010-07-26 2012-02-09 Seventh Sense Biosystems, Inc. Rapid delivery and/or receiving of fluids

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997048440A1 (en) * 1996-06-18 1997-12-24 Alza Corporation Device for enhancing transdermal agent delivery or sampling
WO1997048442A1 (en) * 1996-06-18 1997-12-24 Alza Corporation Device for enhancing transdermal agent delivery or sampling
WO1997048441A1 (en) * 1996-06-18 1997-12-24 Alza Corporation Device for enhancing transdermal sampling
WO1999029365A1 (en) * 1997-12-11 1999-06-17 Alza Corporation Device for enhancing transdermal agent flux
CN1206004C (en) * 1997-12-11 2005-06-15 阿尔扎有限公司 Device for enhancing transdermal agent flux
WO2003048031A2 (en) * 2001-11-30 2003-06-12 Alza Corporation Methods and apparatuses for forming microprojection arrays
CN100571643C (en) * 2003-10-31 2009-12-23 阿尔扎公司 The self-driven applicator that is used for microprotrusion array
CN101120101A (en) * 2004-04-13 2008-02-06 阿尔扎公司 Device and method for transdermal delivery of multiple vaccines
US20070161964A1 (en) * 2006-01-10 2007-07-12 Yuzhakov Vadim V Microneedle array, patch, and applicator for transdermal drug delivery
WO2008067290A2 (en) * 2006-11-28 2008-06-05 Yuzhakov Vadim V Tissue conforming microneedle array and patch for transdermal drug delivery or biological fluid collection
WO2012018486A2 (en) * 2010-07-26 2012-02-09 Seventh Sense Biosystems, Inc. Rapid delivery and/or receiving of fluids

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111918691A (en) * 2018-03-30 2020-11-10 实验室和人们 Multifunctional microneedle
CN112423828A (en) * 2018-05-18 2021-02-26 浦项工科大学校产学协力团 Transdermal drug delivery patch and method for producing same
CN112423829A (en) * 2018-05-18 2021-02-26 浦项工科大学校产学协力团 Transdermal drug delivery patch and method for producing same
CN112423828B (en) * 2018-05-18 2022-10-21 浦项工科大学校产学协力团 Transdermal drug delivery patch and method of making the same
US12036378B2 (en) 2018-05-18 2024-07-16 Postech Academy-Industry Foundation Transdermal drug delivery patch and manufacturing method thereof
US12121618B2 (en) 2018-05-18 2024-10-22 Postech Academy-Industry Foundation Transdermal drug delivery patch and manufacturing method thereof
CN112891724A (en) * 2020-12-28 2021-06-04 上海交通大学 Micro-needle array with plastic micro-bending and preparation method thereof

Similar Documents

Publication Publication Date Title
US10105526B2 (en) Microneedle system and method for the production thereof
CN106061546A (en) Microneedle system and method for the production thereof
US1044283A (en) Die for forming metal staying-strips.
JP6947829B2 (en) Fastening system and fastening equipment
CN101700697B (en) Multidirectional stressed plastic tensile grate, manufacturing method thereof and the plastic sheet
EP2775248B1 (en) Fixing gasket in plate type heat exchanger
KR102217703B1 (en) Heat exchange plate for plate-type heat exchanger and plate-type heat exchanger provided with said heat exchange plate
JPWO2020098645A5 (en)
CN107848237B (en) Paper cup, method and apparatus for manufacturing the same
EP2627837B1 (en) Reinforcement element for casting comprising ring shaped portions and reinforcement with such reinforcement elements
US6387534B1 (en) Random packing element
CN207344725U (en) Punching cutter
HK1224964A1 (en) Microneedle system and method for the production thereof
US11192058B2 (en) Honeycomb body for exhaust gas aftertreatment
JP2005349427A (en) Flange forming method
EP2618089B1 (en) Heat exchanger and method for producing a heat exchanger
DE102020106116B4 (en) plate
CN206226136U (en) stator punching
EP2631585B1 (en) Heat exchanger and method for producing a heat exchanger
US9550227B2 (en) Press molding machine
TWI389626B (en) Mylar with specific shape
JP2023178875A (en) Fastening component and manufacturing method thereof, and mold device
EP2674718A2 (en) Asymmetric plate heat exchanger
US1001514A (en) Method of making ornamental perforated designs.
CN101574851A (en) Mylar film

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1224964

Country of ref document: HK

RJ01 Rejection of invention patent application after publication

Application publication date: 20161026

RJ01 Rejection of invention patent application after publication
REG Reference to a national code

Ref country code: HK

Ref legal event code: WD

Ref document number: 1224964

Country of ref document: HK