CN105930894A - Electronic label packaging process - Google Patents
Electronic label packaging process Download PDFInfo
- Publication number
- CN105930894A CN105930894A CN201610221458.9A CN201610221458A CN105930894A CN 105930894 A CN105930894 A CN 105930894A CN 201610221458 A CN201610221458 A CN 201610221458A CN 105930894 A CN105930894 A CN 105930894A
- Authority
- CN
- China
- Prior art keywords
- rfid
- electronic label
- pcb board
- packaging process
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses an electronic label packaging process. The electronic label packaging process includes the following steps that: a plurality of PCB with antenna lines are manufactured; an RFID chip is fixed on the surface of each PCB through an adhesive dispensing fixation mode; based on a gold wire bonding connection mode, each RFID chip is connected with a corresponding PCB through gold wires, so that a plurality of RFID units can be formed; an overall packaging mode is adopted to package the RFID chips and the gold wires of the plurality of RFID units and the PCB through a packaging material so as to form an integrated body; and each RFID unit is segmented, so that individual RFID finished products can be formed. An electronic label obtained through adopting the electronic label packaging process has the advantages of high and low temperature resistance, acid and alkali resistance, water resistance and anti-dust performance. The electronic label packaging process is convenient to use and can be universally applied to various fields as a component; and products loaded on a material belt can be automatically assembled, so that efficiency can be improved.
Description
Technical field
The present invention relates to a kind of technical field of electronic encapsulation, particularly relate to one
Radio frequency identification tag package technique.
Background technology
Electronic tag (RFID), also known as radio-frequency (RF) tag, transponder, data medium, is read
Read that device is also called sensing device, scanning device, read head, communicator, read write line (depend on
Whether can be with wireless rewrite data in electronic tag).Between electronic tag and reader
The space (contactless) being realized radiofrequency signal by coupling element is coupled, logical in coupling
In road, according to sequential relationship, it is achieved the transmission of energy and data exchange.
The basic structure of electronic tag is label antenna and electronic chip, electronic chip by
Coupling element and chip composition, each label has unique electronic code, high power capacity
Electronic tag has the writeable memory space of user, is attached on object identify target pair
As, label antenna is used for transmission of video signal, read with corresponding realizing electronic tag
Read device and carry out communication for information.
At present, the packaged type of electronic tag mainly uses circuit board to slot, in groove
Chip placement, then glue dispensing and packaging, or directly use flexible material pasting chip.These
All there are some defects in packaged type:
The first packaged type, electronic tag uses four-layer circuit board fluting, in groove
Chip placement glue dispensing and packaging, glue for dispensing glue expands with heat and contract with cold large percentage, thus affects
The performance of electronic tag and life-span, the most this packaged type volume is big, uses not side
Just, PCB technology is complicated simultaneously.
The second directly uses flexible material pasting chip, and the RFID of flexible material uses
When the mode of adhesive sticker bonding is fixed, firmness is poor, is weak to reuse.It addition,
Flexible material is mainly the rings such as adhesive sticker and metal antenna, non-refractory, soda acid, water
Border, material waste is serious simultaneously, and increases environmental pressure.
In a word, the RFID that existing packaging technology is obtained substantially belongs to customize class,
Different industries poor universality.
Summary of the invention
In order to overcome drawbacks described above, the invention provides a kind of radio frequency identification tag package work
Skill, easy to use, can be general to various fields as element.
The present invention is to solve that its technical problem be the technical scheme is that
A kind of radio frequency identification tag package technique, comprises the following steps:
Step 1, makes the pcb board of multiple band antenna traces；
Step 2, on each pcb board by the way of a glue is fixing, by a RFID
Chip is fixed on the surface of each described pcb board；
Step 3, by the way of playing gold thread connection, by each described RFID chip
Linked together by gold thread with corresponding pcb board, form multiple RFID mono-
Unit；
Step 4, uses the mode of overall package, by the RFID of multiple RFID unit
Chip and gold thread, and described pcb board entirely through encapsulating material be packaged into one；
Step 5, cuts each described RFID unit, forms single RFID
Finished product.
As a further improvement on the present invention, in described step 4, described encapsulation material
Material is epoxy resin.
The invention has the beneficial effects as follows: high-low temperature resistant, acid and alkali-resistance, dust water-fast, anti-
Etc. wider array of environment；Easy to use, can be general to various fields as element；Dress
Product after material strip, it is achieved automatic assembling, efficiency improves.
Accompanying drawing explanation
Fig. 1 is embodiment of the present invention step 1 structural representation；
Fig. 2 is embodiment of the present invention step 2 structural representation；
Fig. 3 is embodiment of the present invention step 3 structural representation.
In conjunction with accompanying drawing, make the following instructions:
1 pcb board 2 RFID chip
3 gold thread 4 epoxy resin
11 antenna traces 12 glue
Detailed description of the invention
In conjunction with accompanying drawing, the present invention is elaborated, but protection scope of the present invention is not
It is limited to following embodiment, i.e. in every case with scope of the present invention patent and description
The simple equivalence change made with modify, the most still belong to patent covering scope of the present invention it
In.
A kind of radio frequency identification tag package technique, comprises the following steps:
Step 1, refering to Fig. 1, makes the pcb board 1 of multiple band antenna traces 11；
Step 2, refering to Fig. 2, first puts glue 12, then by RFID on each pcb board
Chip 2 is fixed on this pcb board；
Step 3, by the way of playing gold thread connection by each RFID chip 2 with
The pcb board 1 of its correspondence is linked together by gold thread 3, forms multiple RFID mono-
Unit, refering to Fig. 2 (being a RFID unit in figure)；
Step 4, refering to Fig. 3, uses the mode of overall package, by multiple RFID
The RFID chip of unit and gold thread, and described pcb board is entirely through epoxy resin
4 are packaged into one；
Step 5, cuts each described RFID unit, forms single RFID
Finished product.
Radio frequency identification tag package technique of the present invention, first, because of pcb board core material also
It is epoxy resin composition, so using epoxy encapsulation that its adhesion can be made more firm
Gu.Epoxy resin deflection is little, and high temperature can arrive 200 degrees Celsius, acid and alkali-resistance, resistance to
The wider array of environment such as water, anti-dust.Secondly, easy to use, can answer as element
Use various field.Ready-made RFID module can be by injection or the side embedded
Formula can be accomplished in difformity or material according to the demand of terminal.As: medical treatment, wash
Wash, logistics, the energy, retail, storekeeper etc..Thirdly, it is also possible to according to demand
Adjust thickness, size.Make flexibly, convenient customization.The epoxy resin of Molding
Thickness is according to die adjustment.Size is that the demand according to terminal adjusts cut lengths
's.Thirdly, after cutting, element size is consistent, can realize filling band, after filling band
Product, it is achieved automatic assembling, efficiency improve.Finally, can circulate or weigh
Multiple use, the electronic tag made has high-low temperature resistant, acid and alkali-resistance, powder water-fast, anti-
The wider array of environment such as dirt, thus without the function destroying its chip.
Claims (2)
1. a radio frequency identification tag package technique, it is characterised in that comprise the following steps:
Step 1, makes the pcb board of multiple band antenna traces；
Step 2, on each pcb board by the way of a glue is fixing, by a RFID
Chip is fixed on the surface of each described pcb board；
Step 3, by the way of playing gold thread connection, by each described RFID chip
Linked together by gold thread with corresponding pcb board, form multiple RFID mono-
Unit；
Step 4, uses the mode of overall package, by the RFID of multiple RFID unit
Chip and gold thread, and described pcb board entirely through encapsulating material be packaged into one；
Step 5, cuts each described RFID unit, forms single RFID
Finished product.
Radio frequency identification tag package technique the most according to claim 1, its feature exists
In: in described step 4, described encapsulating material is epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610221458.9A CN105930894A (en) | 2016-04-11 | 2016-04-11 | Electronic label packaging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610221458.9A CN105930894A (en) | 2016-04-11 | 2016-04-11 | Electronic label packaging process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105930894A true CN105930894A (en) | 2016-09-07 |
Family
ID=56840246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610221458.9A Pending CN105930894A (en) | 2016-04-11 | 2016-04-11 | Electronic label packaging process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105930894A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101587845A (en) * | 2008-05-21 | 2009-11-25 | 资茂科技股份有限公司 | Packaging method and packaging structure of electronic volume label and control method of personnel in dust-free room |
| CN101609514A (en) * | 2008-06-20 | 2009-12-23 | 上海中京电子标签集成技术有限公司 | A kind of method for preparing electric tag with high efficiency |
| CN201859471U (en) * | 2010-11-03 | 2011-06-08 | 上海祯显电子科技有限公司 | Antenna-embedded minisize radio frequency electronic label module |
| JP2013043037A (en) * | 2011-08-26 | 2013-03-04 | Sato Knowledge & Intellectual Property Institute | Rfid tag for laundry |
-
2016
- 2016-04-11 CN CN201610221458.9A patent/CN105930894A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101587845A (en) * | 2008-05-21 | 2009-11-25 | 资茂科技股份有限公司 | Packaging method and packaging structure of electronic volume label and control method of personnel in dust-free room |
| CN101609514A (en) * | 2008-06-20 | 2009-12-23 | 上海中京电子标签集成技术有限公司 | A kind of method for preparing electric tag with high efficiency |
| CN201859471U (en) * | 2010-11-03 | 2011-06-08 | 上海祯显电子科技有限公司 | Antenna-embedded minisize radio frequency electronic label module |
| JP2013043037A (en) * | 2011-08-26 | 2013-03-04 | Sato Knowledge & Intellectual Property Institute | Rfid tag for laundry |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160907 |
|
| RJ01 | Rejection of invention patent application after publication |