CN105916303A - PCB and method for producing same - Google Patents
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- CN105916303A CN105916303A CN201610327638.5A CN201610327638A CN105916303A CN 105916303 A CN105916303 A CN 105916303A CN 201610327638 A CN201610327638 A CN 201610327638A CN 105916303 A CN105916303 A CN 105916303A
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Abstract
本发明提供了一种生成PCB板的方法及一种PCB板,该方法,包括:预先确定待生成PCB板的信号线中的信号的信号质量要求;确定所述待生成PCB板中的设置有信号线的信号层中的信号线的线参数;确定所述信号层与所述待生成PCB板的参考平面之间的介质的介质参数;确定所述信号线中的信号的信号参数;根据所述线参数、所述介质参数和所述信号参数,确定满足所述信号质量要求的所述信号层与所述参考平面之间的介质的优化厚度;根据所述优化厚度生成所述待生成PCB板。本发明提供了一种生成PCB板的方法及一种PCB板,能够降低PCB板的成本。
The present invention provides a method for generating a PCB board and a PCB board. The method includes: predetermining the signal quality requirements of the signal in the signal line of the PCB board to be generated; determining that the settings in the PCB board to be generated are The line parameter of the signal line in the signal layer of the signal line; Determine the medium parameter of the medium between the signal layer and the reference plane of the PCB board to be generated; Determine the signal parameter of the signal in the signal line; According to the The line parameters, the medium parameters, and the signal parameters, determine the optimal thickness of the medium between the signal layer and the reference plane that meets the signal quality requirements; generate the PCB to be generated according to the optimized thickness plate. The invention provides a method for generating a PCB board and a PCB board, which can reduce the cost of the PCB board.
Description
技术领域technical field
本发明涉及电子技术领域,特别涉及一种生成PCB(Printed CircuitBoard,印制电路板)板的方法及一种PCB板。The invention relates to the field of electronic technology, in particular to a method for producing a PCB (Printed Circuit Board, printed circuit board) board and a PCB board.
背景技术Background technique
伴随着云计算时代的到来,服务器的发展迅速崛起,在服务器主板设计中,信号速率越来越高,高速信号对信号完整性的需求也在不断提升。在PCB板的高速线设计中,高速信号线长线宽线距、信号线到参考平面间介质厚度、板材的电性能参数、铜箔的粗糙度等都会影响信号的损耗。如何合理利用这些因素,使得信号质量满足设计要求,成为研发工程师一直致力优化的方向。With the advent of the era of cloud computing, the development of servers has risen rapidly. In the design of server motherboards, the signal rate is getting higher and higher, and the demand for signal integrity of high-speed signals is also increasing. In the high-speed line design of the PCB board, the long line width and line spacing of the high-speed signal line, the dielectric thickness between the signal line and the reference plane, the electrical performance parameters of the board, and the roughness of the copper foil will all affect the signal loss. How to make reasonable use of these factors to make the signal quality meet the design requirements has become the direction that R&D engineers have been working on to optimize.
在现有的PCB板的设计中,为了满足对信号质量的要求,通常会通过更换PCB板的板材,采用性能更好的板材来实现对信号质量的要求。In the current design of the PCB board, in order to meet the requirements for signal quality, the board material of the PCB board is usually replaced and a board material with better performance is used to meet the requirements for signal quality.
通过上述描述可见,现有的技术方案中,通过使用性能更好的板材来满足对信号质量的要求,这样会使得PCB板的成本大幅提升。It can be seen from the above description that in the existing technical solutions, the requirements for signal quality are met by using boards with better performance, which will greatly increase the cost of the PCB board.
发明内容Contents of the invention
本发明实施例提供了一种生成PCB板的方法及一种PCB板,能够降低PCB板的成本。Embodiments of the present invention provide a method for generating a PCB board and a PCB board, which can reduce the cost of the PCB board.
第一方面,本发明实施例提供了一种生成PCB板的方法,包括:In the first aspect, the embodiment of the present invention provides a method for generating a PCB, including:
S0:预先确定待生成PCB板的信号线中的信号的信号质量要求;S0: Predetermine the signal quality requirements of the signal in the signal line of the PCB board to be generated;
S1:确定所述待生成PCB板中的设置有信号线的信号层中的信号线的线参数;S1: Determine the line parameters of the signal lines in the signal layer provided with signal lines in the PCB board to be generated;
S2:确定所述信号层与所述待生成PCB板的参考平面之间的介质的介质参数;S2: Determine the medium parameters of the medium between the signal layer and the reference plane of the PCB board to be generated;
S3:确定所述信号线中的信号的信号参数;S3: Determine signal parameters of the signal in the signal line;
S4:根据所述线参数、所述介质参数和所述信号参数,确定满足所述信号质量要求的所述信号层与所述参考平面之间的介质的优化厚度;S4: Determine an optimal thickness of the medium between the signal layer and the reference plane that meets the signal quality requirement according to the line parameter, the medium parameter, and the signal parameter;
S5:根据所述优化厚度生成所述待生成PCB板。S5: Generate the PCB board to be generated according to the optimized thickness.
进一步地,所述信号质量的要求包括:眼图的要求;Further, the signal quality requirements include: eye diagram requirements;
所述S4,包括:The S4, including:
根据所述线参数、所述介质参数和所述信号参数,对所述待生成PCB板进行仿真,调整所述信号层与所述参考平面之间的介质的厚度,生成每个厚度对应的眼图;According to the line parameter, the medium parameter and the signal parameter, simulate the PCB board to be generated, adjust the thickness of the medium between the signal layer and the reference plane, and generate an eye corresponding to each thickness picture;
根据生成的眼图,确定满足所述眼图的要求的优化厚度。Based on the generated eye diagram, an optimal thickness that satisfies the requirements of the eye diagram is determined.
进一步地,所述信号参数包括:所述信号为SAS(Serial Attached SCSI)信号;Further, the signal parameters include: the signal is a SAS (Serial Attached SCSI) signal;
所述眼图的要求包括:眼图的高度大于等于75mV,且眼图的宽度大于等于25pS。The requirements of the eye diagram include: the height of the eye diagram is greater than or equal to 75mV, and the width of the eye diagram is greater than or equal to 25pS.
进一步地,所述对所述待生成PCB板进行仿真,包括:Further, the simulation of the PCB board to be generated includes:
利用先进设计系统ADS对所述待生成PCB板进行仿真。The PCB board to be generated is simulated by using the advanced design system ADS.
进一步地,所述线参数包括:所述信号线的长度,和/或,信号线的阻抗。Further, the line parameters include: the length of the signal line, and/or, the impedance of the signal line.
进一步地,所述介质参数包括:所述介质的介电常数。Further, the medium parameter includes: a dielectric constant of the medium.
进一步地,所述信号参数包括:所述信号的类型。Further, the signal parameter includes: the type of the signal.
进一步地,所述S5,包括:Further, said S5 includes:
将所述优化厚度导入到所述待生成PCB板的layout设计和PCB制作中。Import the optimized thickness into the layout design and PCB production of the PCB board to be generated.
进一步地,所述S0,包括:Further, said S0 includes:
确定在所述待生成PCB板的信号线中的信号的信号类型;Determine the signal type of the signal in the signal line of the PCB board to be generated;
确定所述信号类型对应的需要满足的眼图的要求。Determine the eye diagram requirements that need to be met corresponding to the signal type.
第二方面,本发明实施例提供了一种PCB板,包括:In a second aspect, an embodiment of the present invention provides a PCB board, including:
根据第一方面中任一所述的方法生成的PCB板。A PCB board generated according to any one of the methods described in the first aspect.
在本发明实施例中,根据确定出的待生成PCB板的信号线的线参数、介质参数和信号参数,确定满足信号质量要求的信号层与参考平面之间的介质的优化厚度,通过调整待生成PCB板的介质的厚度来提高信号质量,无需使用性能更好的板材也能使得PCB板能够满足信号质量要求,降低了PCB板的成本。In the embodiment of the present invention, according to the determined line parameters, medium parameters and signal parameters of the signal lines of the PCB board to be generated, the optimal thickness of the medium between the signal layer and the reference plane that meets the signal quality requirements is determined, and by adjusting the The thickness of the medium that generates the PCB board is used to improve the signal quality, and the PCB board can meet the signal quality requirements without using a board with better performance, thereby reducing the cost of the PCB board.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are For some embodiments of the present invention, those skilled in the art can also obtain other drawings based on these drawings without creative work.
图1是本发明一实施例提供的一种生成PCB板的方法的流程图;Fig. 1 is a flow chart of a method for generating a PCB board provided by an embodiment of the present invention;
图2是本发明一实施例提供的另一种生成PCB板的方法的流程图。Fig. 2 is a flowchart of another method for generating a PCB provided by an embodiment of the present invention.
具体实施方式detailed description
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例,基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例,都属于本发明保护的范围。In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection of the present invention. scope.
如图1所示,本发明实施例提供了一种生成PCB板的方法,该方法可以包括以下步骤:As shown in Figure 1, an embodiment of the present invention provides a method for generating a PCB, which may include the following steps:
S0:预先确定待生成PCB板的信号线中的信号的信号质量要求;S0: Predetermine the signal quality requirements of the signal in the signal line of the PCB board to be generated;
S1:确定所述待生成PCB板中的设置有信号线的信号层中的信号线的线参数;S1: Determine the line parameters of the signal lines in the signal layer provided with signal lines in the PCB board to be generated;
S2:确定所述信号层与所述待生成PCB板的参考平面之间的介质的介质参数;S2: Determine the medium parameters of the medium between the signal layer and the reference plane of the PCB board to be generated;
S3:确定所述信号线中的信号的信号参数;S3: Determine signal parameters of the signal in the signal line;
S4:根据所述线参数、所述介质参数和所述信号参数,确定满足所述信号质量要求的所述信号层与所述参考平面之间的介质的优化厚度;S4: Determine an optimal thickness of the medium between the signal layer and the reference plane that meets the signal quality requirement according to the line parameter, the medium parameter, and the signal parameter;
S5:根据所述优化厚度生成所述待生成PCB板。S5: Generate the PCB board to be generated according to the optimized thickness.
在本发明实施例中,根据确定出的待生成PCB板的信号线的线参数、介质参数和信号参数,确定满足信号质量要求的信号层与参考平面之间的介质的优化厚度,通过调整待生成PCB板的介质的厚度来提高信号质量,无需使用性能更好的板材也能使得PCB板能够满足信号质量要求,降低了PCB板的成本。In the embodiment of the present invention, according to the determined line parameters, medium parameters and signal parameters of the signal lines of the PCB board to be generated, the optimal thickness of the medium between the signal layer and the reference plane that meets the signal quality requirements is determined, and by adjusting the The thickness of the medium that generates the PCB board is used to improve the signal quality, and the PCB board can meet the signal quality requirements without using a board with better performance, thereby reducing the cost of the PCB board.
在本发明一实施例中,所述信号质量的要求包括:眼图的要求;In an embodiment of the present invention, the signal quality requirements include: eye diagram requirements;
所述S4,包括:The S4, including:
根据所述线参数、所述介质参数和所述信号参数,对所述待生成PCB板进行仿真,调整所述信号层与所述参考平面之间的介质的厚度,生成每个厚度对应的眼图;According to the line parameter, the medium parameter and the signal parameter, simulate the PCB board to be generated, adjust the thickness of the medium between the signal layer and the reference plane, and generate an eye corresponding to each thickness picture;
根据生成的眼图,确定满足所述眼图的要求的优化厚度。Based on the generated eye diagram, an optimal thickness that satisfies the requirements of the eye diagram is determined.
在本发明实施例中,通过对眼图的要求来实现对信号的信号质量要求。具体地,可以通过对眼图的高度和宽度的要求来实现。在本发明实施例中,通过确定出的线参数、介质参数和信号参数,对待生成PCB板进行仿真,通过调整信号层与参考平面之间的介质的厚度来调整信号线上的信号的质量,直到得到满足眼图的要求的厚度。In the embodiment of the present invention, the signal quality requirement for the signal is realized through the requirement for the eye diagram. Specifically, it can be realized through requirements on the height and width of the eye diagram. In the embodiment of the present invention, the PCB board to be generated is simulated through the determined line parameters, medium parameters and signal parameters, and the quality of the signal on the signal line is adjusted by adjusting the thickness of the medium between the signal layer and the reference plane. Until the thickness that meets the requirements of the eye diagram is obtained.
一般来说,信号线上的信号类型不同,眼图的要求也不同。在一种实施例中,所述信号参数包括:所述信号为SAS信号;Generally speaking, the signal types on the signal line are different, and the requirements of the eye diagram are also different. In an embodiment, the signal parameters include: the signal is a SAS signal;
所述眼图的要求包括:眼图的高度大于等于75mV,且眼图的宽度大于等于25pS。The requirements of the eye diagram include: the height of the eye diagram is greater than or equal to 75mV, and the width of the eye diagram is greater than or equal to 25pS.
在本发明一实施例中,所述对所述待生成PCB板进行仿真,包括:In an embodiment of the present invention, the simulation of the PCB board to be generated includes:
利用ADS对所述待生成PCB板进行仿真。Use ADS to simulate the PCB board to be generated.
在本发明实施例中,ADS可以是Angilen ADS软件。具体可以通过Angilen ADS软件对待生成PCB板进行有源仿真。In the embodiment of the present invention, the ADS may be Angelen ADS software. Specifically, the active simulation of the PCB board to be generated can be carried out through the Angilen ADS software.
在本发明一实施例中,所述线参数包括:所述信号线的长度,和/或,信号线的阻抗。In an embodiment of the present invention, the line parameters include: the length of the signal line, and/or, the impedance of the signal line.
在本发明一实施例中,所述介质参数包括:所述介质的介电常数。其中,介质可以包括:有玻璃布增强的材料、无玻璃布增强的材料。In an embodiment of the present invention, the medium parameter includes: a dielectric constant of the medium. Wherein, the medium may include: materials reinforced with glass cloth, materials without glass cloth reinforcement.
在本发明一实施例中,所述信号参数包括:所述信号的类型。举例来说,信号为SAS信号。In an embodiment of the present invention, the signal parameter includes: the type of the signal. For example, the signal is a SAS signal.
在本发明一实施例中,所述S5,包括:In an embodiment of the present invention, said S5 includes:
将所述优化厚度导入到所述待生成PCB板的layout设计和PCB制作中。Import the optimized thickness into the layout design and PCB production of the PCB board to be generated.
具体地,将优化厚度作为待生成PCB板的信号层与参考平面之间的介质的厚度,导入到待生成PCB板的layout设计和PCB制作中。Specifically, the optimized thickness is used as the thickness of the medium between the signal layer of the PCB to be generated and the reference plane, and is imported into the layout design and PCB production of the PCB to be generated.
PCB板的信号线中的信号一般是不变的,在本发明一实施例中,所述S0,包括:The signal in the signal line of the PCB board is generally constant, and in an embodiment of the present invention, the S0 includes:
确定在所述待生成PCB板的信号线中的信号的信号类型;Determine the signal type of the signal in the signal line of the PCB board to be generated;
确定所述信号类型对应的需要满足的眼图的要求。Determine the eye diagram requirements that need to be met corresponding to the signal type.
在本发明实施例中,因此,可以根据待生成PCB板的设计要求、需要完成的功能等确定出信号线中信号的信号类型,根据信号类型来确定眼图的要求。当信号线中可能传输多种信号时,该眼图的要求为满足所有类型的信号的眼图的要求。举例来说,信号A的眼图的要求为:眼图的高度大于等于75mV,且眼图的宽度大于等于25pS;信号B的眼图的要求为:眼图的高度大于等于80mV,且眼图的宽度大于等于20pS。那么,该眼图的要求为:眼图的高度大于等于80mV,且眼图的宽度大于等于25pS。In the embodiment of the present invention, therefore, the signal type of the signal in the signal line can be determined according to the design requirements of the PCB board to be generated, the functions to be completed, etc., and the requirements of the eye diagram can be determined according to the signal type. When multiple signals may be transmitted in the signal line, the requirement of the eye diagram is to meet the requirements of the eye diagram of all types of signals. For example, the requirements of the eye diagram of signal A are: the height of the eye diagram is greater than or equal to 75mV, and the width of the eye diagram is greater than or equal to 25pS; the requirements of the eye diagram of signal B are: the height of the eye diagram is greater than or equal to 80mV, and the eye diagram The width is greater than or equal to 20pS. Then, the requirements of the eye diagram are: the height of the eye diagram is greater than or equal to 80mV, and the width of the eye diagram is greater than or equal to 25pS.
另外,每种信号所对应的眼图的要求可以由spec协议规范来确定。In addition, the requirements of the eye diagram corresponding to each signal can be determined by the spec protocol specification.
如图2所示,本发明实施例提供的一种生成PCB板的方法,该方法包括:As shown in Figure 2, a method for generating a PCB board provided by an embodiment of the present invention, the method includes:
步骤201:确定在待生成PCB板的信号线中的信号的信号类型。Step 201: Determine the signal type of the signal in the signal line of the PCB board to be generated.
举例来说,信号类型为SAS信号类型。For example, the signal type is a SAS signal type.
步骤202:确定所述信号类型对应的需要满足的眼图的要求。Step 202: Determine the eye diagram requirements corresponding to the signal type that need to be met.
针对SAS信号,通过spec协议规范可以确定出眼图的要求为:眼图的高度大于等于75mV,且眼图的宽度大于等于25pS。For SAS signals, the requirements for the eye diagram can be determined through the spec protocol specification: the height of the eye diagram is greater than or equal to 75mV, and the width of the eye diagram is greater than or equal to 25pS.
步骤203:确定待生成PCB板中的设置有信号线的信号层中的信号线的线参数。Step 203: Determine the line parameters of the signal lines in the signal layer on which the signal lines are arranged in the PCB board to be generated.
其中,线参数可以是信号线的长度、信号线的阻抗。举例来说,信号线的阻抗为100ohm。这里的信号线可以是差分走线。Wherein, the line parameter may be the length of the signal line and the impedance of the signal line. For example, the impedance of the signal line is 100ohm. The signal lines here may be differential traces.
步骤204:确定信号层与待生成PCB板的参考平面之间的介质的介质参数。Step 204: Determine the medium parameters of the medium between the signal layer and the reference plane of the PCB board to be generated.
该介质参数可以是该介质的介电常数。The medium parameter may be the dielectric constant of the medium.
步骤205:确定信号线中的信号的信号参数。Step 205: Determine signal parameters of the signal in the signal line.
该信号参数可以是信号的类型,例如:确定出该信号为SAS信号。该信号参数还可以包括:信号的频率。The signal parameter may be a signal type, for example, it is determined that the signal is a SAS signal. The signal parameter may also include: the frequency of the signal.
步骤206:根据线参数、介质参数和信号参数,利用ADS对待生成PCB板进行仿真,调整信号层与参考平面之间的介质的厚度,生成每个厚度对应的眼图。Step 206: According to the line parameters, medium parameters and signal parameters, use ADS to simulate the PCB board to be generated, adjust the thickness of the medium between the signal layer and the reference plane, and generate eye diagrams corresponding to each thickness.
在本发明实施例中,当线参数、介质参数、信号参数都确定后,通过调整信号层与参考平面之间的介质的厚度来调整仿真结果中眼图。当得到的眼图满足眼图的要求时,则确定该厚度为待生成PCB板的优化厚度,也就是,根据该优化厚度来制作待生成PCB板。在仿真过程中,在待生成PCB板的其他条件不变的情况下,调节信号层与参考平面之间的介质的厚度。例如:依次将信号层与参考平面之间的介质的厚度设置为4mil、5mil、6mil,当厚度为6mil,得到的眼图满足眼图的要求,具体地,当厚度为6mil,得到的眼图的高度为89mV,大于等于75mV,且宽度为27pS,大于等于25pS。6mil可以作为优化厚度。In the embodiment of the present invention, after the line parameters, medium parameters and signal parameters are determined, the eye diagram in the simulation result is adjusted by adjusting the thickness of the medium between the signal layer and the reference plane. When the obtained eye diagram meets the requirements of the eye diagram, it is determined that the thickness is the optimized thickness of the PCB to be generated, that is, the PCB to be generated is manufactured according to the optimized thickness. During the simulation process, under the condition that other conditions of the PCB board to be generated remain unchanged, the thickness of the medium between the signal layer and the reference plane is adjusted. For example: set the thickness of the medium between the signal layer and the reference plane to 4mil, 5mil, and 6mil in sequence. When the thickness is 6mil, the obtained eye diagram meets the requirements of the eye diagram. Specifically, when the thickness is 6mil, the obtained eye diagram The height is 89mV, greater than or equal to 75mV, and the width is 27pS, greater than or equal to 25pS. 6mil can be used as the optimal thickness.
步骤207:根据生成的眼图,确定满足眼图的要求的优化厚度。Step 207: According to the generated eye diagram, determine the optimal thickness that meets the requirements of the eye diagram.
一般来说,随着信号线到参考平面间介质的厚度的增加,插入损耗值随之降低,接收端信号眼图的高度和宽度也随之增大,信号质量得到明显提升。但是,为了减少成本,不会无限增大该厚度,只要满足眼图的要求即可。Generally speaking, as the thickness of the medium between the signal line and the reference plane increases, the insertion loss value decreases, the height and width of the signal eye diagram at the receiving end also increase, and the signal quality is significantly improved. However, in order to reduce costs, the thickness will not be increased indefinitely, as long as the requirements of the eye diagram are met.
步骤208:根据优化厚度生成待生成PCB板。Step 208: Generate the PCB board to be generated according to the optimized thickness.
具体地,将优化厚度导入到所述待生成PCB板的layout设计和PCB制作中。Specifically, the optimized thickness is imported into the layout design and PCB fabrication of the PCB board to be generated.
针对高速信号,在设计PCB板时,在信号线过长或者串扰较大,导致信号损耗严重,眼图结果未达到要求的情况,在本发明实施例中,可在叠层设计中,通过调节信号线所在的信号层到参考平面间的介质的厚度,来降低信号损耗,提高信号质量,同时避免采用优质板材带来的成本升高。For high-speed signals, when designing the PCB board, if the signal line is too long or the crosstalk is large, resulting in serious signal loss and the result of the eye diagram does not meet the requirements, in the embodiment of the present invention, in the stack design, by adjusting The thickness of the medium between the signal layer where the signal line is located and the reference plane is used to reduce signal loss, improve signal quality, and avoid the cost increase caused by the use of high-quality boards.
对比仿真结果表明,随着介质厚度的增大,信号损耗降低,眼图中眼高和眼宽也有明显的增大,信号质量有明显的提高。同时该方法简单易用,可操作性强,适用于所有板卡设计,易于在设计中实现。The comparative simulation results show that with the increase of the medium thickness, the signal loss decreases, the eye height and eye width in the eye diagram also increase obviously, and the signal quality improves obviously. At the same time, the method is simple and easy to use, has strong operability, is suitable for all board designs, and is easy to implement in the design.
本发明实施例提供了一种PCB板,包括:根据本发明实施例中任一所述的方法生成的PCB板。An embodiment of the present invention provides a PCB board, including: a PCB board generated according to any one of the methods described in the embodiments of the present invention.
举例来说,该PCB板的信号线中的信号为SAS信号,信号线的阻抗为100ohm,信号层与待生成PCB板的参考平面之间的介质的厚度为6mil。For example, the signal in the signal line of the PCB board is a SAS signal, the impedance of the signal line is 100 ohm, and the thickness of the medium between the signal layer and the reference plane of the PCB board to be generated is 6 mil.
本发明实施例至少具有如下有益效果:Embodiments of the present invention have at least the following beneficial effects:
1、在本发明实施例中,根据确定出的待生成PCB板的信号线的线参数、介质参数和信号参数,确定满足信号质量要求的信号层与参考平面之间的介质的优化厚度,通过调整待生成PCB板的介质的厚度来提高信号质量,无需使用性能更好的板材也能使得PCB板能够满足信号质量要求,降低了PCB板的成本。1. In the embodiment of the present invention, according to the determined line parameters, medium parameters and signal parameters of the signal lines of the PCB board to be generated, determine the optimal thickness of the medium between the signal layer and the reference plane that meets the signal quality requirements, and pass By adjusting the thickness of the medium of the PCB board to be generated to improve the signal quality, the PCB board can meet the signal quality requirements without using a board with better performance, and the cost of the PCB board is reduced.
2、在设计PCB板时,在信号线过长或者串扰较大,导致信号损耗严重,眼图结果未达到要求的情况,在本发明实施例中,在叠层设计中,通过调节信号线所在的信号层到参考平面间的介质的厚度,来降低信号损耗,提高信号质量,避免采用优质板材带来的成本升高。2. When designing the PCB board, if the signal line is too long or the crosstalk is large, resulting in serious signal loss and the result of the eye diagram does not meet the requirements, in the embodiment of the present invention, in the stack design, by adjusting the position of the signal line The thickness of the medium between the signal layer and the reference plane can reduce signal loss, improve signal quality, and avoid the cost increase caused by the use of high-quality plates.
需要说明的是,在本文中,诸如第一和第二之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来,而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同因素。It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is a relationship between these entities or operations. There is no such actual relationship or sequence. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or device. Without further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional same elements in the process, method, article or apparatus comprising said element.
本领域普通技术人员可以理解:实现上述方法实施例的全部或部分步骤可以通过程序指令相关的硬件来完成,前述的程序可以存储在计算机可读取的存储介质中,该程序在执行时,执行包括上述方法实施例的步骤;而前述的存储介质包括:ROM、RAM、磁碟或者光盘等各种可以存储程序代码的介质中。Those of ordinary skill in the art can understand that all or part of the steps for realizing the above-mentioned method embodiments can be completed by hardware related to program instructions, and the aforementioned programs can be stored in a computer-readable storage medium. When the program is executed, the It includes the steps of the above method embodiments; and the aforementioned storage medium includes: ROM, RAM, magnetic disk or optical disk and other various media that can store program codes.
最后需要说明的是:以上所述仅为本发明的较佳实施例,仅用于说明本发明的技术方案,并非用于限定本发明的保护范围。凡在本发明的精神和原则之内所做的任何修改、等同替换、改进等,均包含在本发明的保护范围内。Finally, it should be noted that: the above descriptions are only preferred embodiments of the present invention, and are only used to illustrate the technical solutions of the present invention, and are not used to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.
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