CN105813447A - Installation system, installation device, and installation method - Google Patents

Abstract

Whether there is identification information on the substrate or not, the recognition operation of various marks in the mounting device is shortened and the production cycle is improved. In a mounting system (1) in which components are mounted on boards (W) sequentially conveyed from the solder printing inspection device by using the mounting device on a mounting line in which a mounting device (20) is arranged downstream of the solder printing inspection device (10), the The solder printing inspection device is provided with an identification unit (11) for identifying a mark attached to a substrate, and a storage unit (12) for storing the order in which the substrate is conveyed in association with marking information representing the identification result of the identification unit. ), a counter (22) that counts each time a substrate is carried in is provided in the mounting device that carries in the substrate first, and a reader that reads the mark information associated with the order of the substrate represented by the count value from the solder printing inspection device. A pick-up unit (24), and a mounting unit (25) for mounting a component on a substrate based on the marking information.

Description

Installation system, installation device and installation method

technical field

The present invention relates to a mounting system, a mounting device, and a mounting method for mounting components on a substrate.

Background technique

There is known a mounting system in which a substrate is conveyed by a mounting line provided with a plurality of mounting devices, and components are mounted on the substrate in stages. In the mounting system described above, in order to correct the position of components and detect defective parts, each mounting device performs a recognition operation of various marks such as area marks and defective board marks attached to the board. Conventionally, as this type of mounting system, a technique is known in which the recognition of marks in each device is shortened by transmitting the mark information of various marks recognized in the head device of the mounting line to each downstream device. operation to increase the tact (for example, refer to Patent Document 1).

In the mounting system described in Patent Document 1, the initial mounting device reads the barcode attached to the board, and associates various marks such as an area mark and a bad board mark with the identification information of the board indicated by the barcode. Tag information. Following the conveyance of the substrate from the initial mounting device to the subsequent mounting device, the marking information of various marks associated with the identification information of the substrate is transmitted to the subsequent mounting device. In the subsequent mounting device, the substrate to be mounted can be identified based on the identification information, and the component mounting process can be performed using the tag information associated with the substrate.

Patent Document 1: Japanese Patent No. 4076287

However, in the mounting system described in Patent Document 1, the recognition operation of various marks in the subsequent mounting device can be shortened and the production cycle can be improved. The device recognizes the substrate. Therefore, when there is no substrate with identification information such as a barcode due to the space problem of the substrate, in the initial mounting device, it is impossible to associate the marking information with the substrate and transmit it to the subsequent mounting device. It is not possible to determine substrates with various markers associated with them. Therefore, it is necessary to perform the recognition operation of various marks in each mounting device for the substrate without a barcode, and the recognition operation of various marks cannot be shortened.

Contents of the invention

The present invention is made in view of the above-mentioned circumstances, and its object is to provide a mounting system, a mounting device, and a program used in the mounting system, which can shorten the number of various tasks in the mounting device regardless of whether there is identification information on the board or not. The recognition action of the mark improves the production cycle.

In the mounting system of the present invention, the mounting line of the mounting device is arranged downstream of the processing device, and the mounting device is used to mount components on the substrates sequentially transported from the processing device. The mounting system is characterized in that the processing device In the present invention, there is provided: a recognition unit that recognizes the marks attached to the substrates; and a storage unit that stores the order in which the substrates are transported in association with the mark information representing the recognition results of the recognition parts, in The mounting device that carries in the substrate first from the processing device is provided with: a counter that counts each time the substrate is carried in; The mark information associated with the order of the boards indicated by the count value of the counter; and a mounting section that mounts the component on the board based on the mark information.

The program of the present invention is to use the mounting device on a mounting line in which the mounting device is arranged downstream of the processing device to mount components on the substrates sequentially transported from the processing device. The mounting method is characterized in that the processing device The following steps are performed: a step of recognizing the mark attached to the substrate; and a step of storing the order in which the substrate is transported in association with the mark information indicating the result of the recognition, so that the substrate is carried in first from the processing apparatus. The mounting device of the board performs the steps of: counting each time the board is carried in; and reading the mark associated with the order of the boards indicated by the count value from the processing device information; and mounting the component to the substrate based on the marking information.

According to these configurations, the marking information and the order in which the substrates are transported are stored in association with each other in the processing apparatus. In addition, the mounting device counts each time a board is carried in, and the order of the boards carried into the mounting device is determined based on the count value. In the mounting device, which tag information in the processing device is associated with the carried-in substrate is identified, and the tag information corresponding to the carried-in substrate is read. Therefore, even if there is no identification information such as a barcode, the mounting device can recognize the mark on the board to properly mount components on the board, and the recognition operation of various marks in the mounting device can be shortened to improve the tact.

In the above mounting system, the mounting device is an initial mounting device that first loads the substrate, and a subsequent mounting device downstream of the initial mounting device, and the counter is not provided in the subsequent mounting device , the reading part and the mounting part are provided, and a transfer part is provided in the initial mounting device and the subsequent mounting device, and the transfer part follows the conveyance of the substrate and converts the count value of the counter to Transfer to the next downstream installation. According to this configuration, since the count value is transmitted following the conveyance of the substrate from the initial mounting device to the subsequent mounting device, the marking information is read from the processing device in each mounting device based on the count value. Thereby, the recognition operation|movement of various marks in each mounting apparatus can be shortened, and a tact can be improved.

In the mounting system described above, the initial mounting device and the subsequent mounting device are provided with: a sensor that detects the loading of the substrate; and a buffer that detects the loading of the substrate by the sensor The count value at the time of board loading is overwritten, the buffer of the first mounting device is overwritten by the count value of the counter, and the buffer of the subsequent mounting device is overwritten by the count value of the preceding upstream mounting device. , when the buffer is written with a count value, the reading unit of the first mounting device and the subsequent mounting device reads from the processing device the information corresponding to the substrate indicated by the count value. Sequence associated tag information. According to this configuration, it is possible to transfer the count value following the conveyance of the substrate with a simple configuration, and to share marking information among a plurality of mounting apparatuses.

In the mounting system described above, the initial mounting device and the subsequent mounting device are provided with: a sensor that detects the loading/unloading of the substrate; and a loading buffer that is detected by the sensor. The count value at the time of carrying-in of the board is overwritten; and the carry-out buffer is overwritten when the count value is detected at the time of carrying-out of the board by the sensor, the carrying-in buffer of the initial mounting device is controlled by the The count value of the counter is overwritten, the said unloading buffer of the initial mounting device is covered by the count value of the loading buffer of this device, and the loading buffer of the subsequent mounting device is covered by the previous upstream mounting device The count value of the carry-out buffer is overwritten, the carry-out buffer of the subsequent mounting device is covered by the count value of the carry-in buffer of the device, and when the carry-in buffer is covered by the count value, the The reading unit of the first mounting device and the subsequent mounting device reads, from the processing device, tag information associated with an order of the boards indicated by a count value. According to this configuration, even if the arrival timing of each substrate to each mounting device is shifted back and forth when a plurality of substrates are continuously conveyed, the counter value can be transmitted following the conveyance of the substrate, and the tag information can be shared among the plurality of mounting devices.

In the above mounting system, the substrate is an aggregate substrate composed of a plurality of unit substrates, and the mark is a bad board mark indicating that each of the unit substrates is defective. According to this configuration, the mounting apparatus can perform mounting processing while ignoring the defective unit substrates with the defective board marks.

In the mounting system described above, the processing device is a solder printing inspection device that inspects a printed state of the solder. According to this configuration, since the mark attached to the substrate is recognized by the solder printing inspection device, a dedicated device for recognizing the mark is unnecessary, and the system configuration can be simplified.

In the mounting device of the present invention, in a mounting line for mounting components onto substrates sequentially transported from a processing device, the substrate is conveyed first from the processing device, and the mounting device is characterized in that it includes a counter for The processing device counts when the substrate is carried in, and the processing device stores the order in which the substrates are transported in association with the mark information that identifies the mark attached to the substrate and indicates the recognition result; the reading unit, It reads, from the processing device, marking information associated with an order in which the boards are carried in, indicated by a count value of the counter; and a mounting section mounts the components on the board based on the marking information.

According to this configuration, the mounting device counts each time a board is carried in, and the order of the boards carried into the mounting device is determined based on the count value. In the processing device, the tag information and the order in which the substrates are conveyed are stored in association with each other. Therefore, in the mounting device, it is determined which tag information in the processing device the carried-in substrate is associated with, and the information corresponding to the carried-in substrate is read. Tag information. Therefore, even on a substrate without identification information such as a barcode, the mark on the substrate can be recognized and components can be appropriately mounted on the substrate, and the recognition operation of various marks can be shortened to improve the tact.

The effect of the invention

According to the present invention, the order of the substrates conveyed by the processing apparatus is determined based on the count value by counting each time a substrate is carried in by the mounting apparatus to which the substrate is conveyed first. Thereby, the marking information associated with the order of the boards can be read from the processing device based on the count value, regardless of whether there is identification information on the boards, the recognition operation of various marks in the mounting device can be shortened and the production cycle can be improved.

Description of drawings

FIG. 1 is a schematic diagram of a mounting system according to the present embodiment.

FIG. 2 is a schematic plan view of a substrate according to this embodiment.

FIG. 3 is an explanatory diagram of processing operations of each mounting device according to the present embodiment.

FIG. 4 is a functional block diagram of the mounting system according to the present embodiment.

FIG. 5 is a sequence diagram showing the operation of the mounting system according to the present embodiment.

FIG. 6 is an explanatory diagram of a method of transmitting a counter value according to the present embodiment.

FIG. 7 is an explanatory diagram of a method of transmitting a counter value according to a modification.

Explanation of labels

1 Install the system

10 Solder print inspection device (processing device)

11 Identification Department

12 storage department

20 installation device (initial installation device, follow-up installation device)

21 sensors

22 counters

23 buffers

24 reading department

25 Installation Department

26 Department of Transmission

M2 Part Fiducial Mark (Mark)

M3 bad board mark (mark)

W substrate

Wa unit substrate

detailed description

Next, the mounting system according to this embodiment will be described with reference to the drawings. FIG. 1 is a schematic diagram of a mounting system according to the present embodiment. FIG. 2 is a schematic plan view of a substrate according to this embodiment. FIG. 3 is an explanatory diagram of processing operations of each mounting device according to the present embodiment. In addition, in this embodiment, an example in which a mounting line is constituted by a solder print inspection device and a plurality of mounting devices is described, but the mounting system according to this embodiment is merely an example and can be changed as appropriate. In addition, precision components are indicated by dotted lines in FIG. 2 .

As shown in FIG. 1 , the mounting system 1 according to the present embodiment uses a mounting line in which a plurality of mounting devices 20 are arranged downstream of the solder printing inspection device 10 , and components are transferred from the solder printing inspection device 10 to the solder printing inspection device 10 by each mounting device 20 . The sequentially conveyed substrates W are mounted. The solder printing inspection device 10 is a device for inspecting the printed state of solder printed on the substrate W, and inspects whether it is good or bad based on positional deviation and appearance of the solder by image processing or the like. The plurality of mounting devices 20 forms a conveyance path of the substrate W together with the solder printing inspection device 10 , and mounts various electronic components in stages on the substrate W sequentially conveyed from the solder printing inspection device 10 .

As shown in FIG. 2 , the substrate W is a collective substrate composed of a plurality of unit substrates Wa, and substrate reference marks (BOC marks, reference marks) serving as a position reference of the substrate W are attached near corners of diagonal corners of each unit substrate Wa. ) M1, and a part reference mark (area mark) M2 is attached near precision parts P such as ICs requiring precise mounting. In addition, each unit substrate Wa is provided with a defective board mark M3 indicating that the unit substrate Wa is defective. In addition, in the present embodiment, the collective substrate was exemplified as the substrate W, but it may be a single substrate with the above-mentioned various marks attached thereto.

In each mounting device 20 , by recognizing the substrate reference mark M1 , the positional deviation due to the skew of the substrate W or the like is corrected. In addition, in each mounting device 20, by recognizing the component reference mark M2, the local positional deviation of the precision component P is corrected. Then, in each mounting device 20 , by recognizing the bad board mark M3, the unit substrate Wa of poor quality with which the bad board mark M3 is attached is ignored, and the mounting process is performed. The solder print inspection apparatus 10 and the plurality of mounting apparatuses 20 are connected by wire with a LAN cable or the like via the hub 30 , and the timing of loading/unloading the substrate W between adjacent apparatuses is adjusted.

As shown in FIG. 3 , in each mounting device 20 , a loading operation of loading the substrate W, a recognition operation of recognizing various marks, a mounting operation of mounting components on the substrate W, and an unloading operation of unloading the substrate W are performed. In recent years, it is required to shorten the recognition operation of various marks in each mounting device 20 and improve the tact. The recognition results of the component reference mark M2 and the defective board mark M3 among various marks are common information among the mounting devices 20 , so there is no problem even if they are shared among the mounting devices 20 . Therefore, it is conceivable that the marking information indicating the recognition results of the component reference mark M2 and the defective board mark M3 is transmitted from the solder printing inspection device 10 to each mounting device 20 .

In addition, identification information such as a barcode is generally attached to the substrate, but when the substrate is small or the number of components mounted is small, the identification information may not be attached to the substrate W. In this case, the marking information cannot be associated with the substrate W in each mounting apparatus 20, and the mounting processing based on the marking information cannot be performed. Specifically, even if only the marking information is transmitted from the upstream solder printing inspection device 10 to the mounting device 20 , the mounting device 20 cannot specify which substrate W the marking information is for. Also, if the information amount of the tag information increases, it is necessary to increase the existing memory for transmission.

Therefore, in this embodiment, in the mounting device (initial mounting device) 20 where the substrate W is conveyed from the solder printing inspection device 10 first, counting is performed every time the substrate W is carried in, and the count value is sent to the downstream. The mounting device (subsequent mounting device) 20 performs the transfer. Therefore, even if there is no identification information attached to the substrate W, the substrate W loaded into each mounting device 20 can be identified based on the count value. In addition, in the solder printing inspection device 10, the marking information is stored in association with the order in which the boards W are transported, and each mounting device 20 reads the marking information from the solder printing inspection device 10 based on the count value, so there is no need to newly increase the memory for transport. .

Next, referring to FIG. 4 , the mounting system according to this embodiment will be described in detail. FIG. 4 is a functional block diagram of the mounting system according to the present embodiment. In addition, the functional block diagram of the installation system shown in FIG. 4 is simplified for explaining the present invention.

As shown in FIG. 4 , in the solder printing inspection device 10 , in addition to a functional module (not shown) that inspects the printed state of the solder, a component reference mark M2 and a defective board mark M3 attached to the substrate W are provided. (Refer to FIG. 2 ) An identification unit 11 that performs identification, and a storage unit 12 that stores the order in which substrates W are transported in association with flag information indicating identification results. The recognition unit 11 performs imaging processing, image processing, and the like on various marks to recognize mark information. The mark information of the component reference mark M2 and the defective board mark M3 is output as a file to the specific folder 13 of the storage unit 12 , and the file in the specific folder 13 is shared with a plurality of mounting devices 20 .

In addition, the substrate reference mark M1 is also recognized by the recognition unit 11 , but the mark information of the substrate reference mark M1 is not output as a file to the specific folder 13 . The reason for this is that the substrate reference mark M1 indicates the positional deviation of the substrate W, and needs to be recognized individually in each mounting device 20 . The mark information of the component reference mark M2 shows relative coordinates to the position coordinates of the board reference mark M1. The flag information of the defective board flag M3 shows data in which each unit substrate Wa is in one-to-one correspondence with the presence or absence of a quality defect. The mark information of the component reference mark M2 and the bad plate mark M3 can be stored in the same file, or can be stored in different files.

In addition, as the marking information in the specific folder 13 , the end of the file name is stored in the order in which the substrates W are conveyed. For example, the mark information of the substrate W conveyed from the solder printing inspection apparatus 10 first has the number "1" at the end of the file name, and the mark information of the board W conveyed second has the number "2" at the end of the file name. . Thereby, by including the order of conveyance in a file name, the board|substrate W conveyed from the solder print inspection apparatus 10 and marking information are associated. In addition, the order of delivery is not limited to numbers, and may also be represented by letters, Chinese characters and other characters.

The mounting device 20A into which the substrate W is first carried in from the solder printing inspection apparatus 10 is provided with: a sensor 21A that detects the carrying-in of the substrate W; a counter 22A that counts each time the substrate W is carried in; The buffer 23A is overwritten with a count value when the loading of the substrate W is detected. The sensor 21A detects the loading of the substrate W when the substrate W on the transport path passes through the entrance of the mounting device 20A. When the sensor 21A detects the loading of the substrate W, the count value of the counter 22A is incremented by 1, and the count value is output from the counter 22A and written in the buffer 23A.

In addition, in the mounting device 20A, a reading section 24A that reads, from the solder print inspection device 10, mark information associated with the order of the substrates W indicated by the count value; The substrate W mounts components. When the count value of buffer 23A is overwritten, reading unit 24A searches specific folder 13 of storage unit 12 of solder print inspection device 10 for the number at the end of the file name that matches the count value. Thereby, the file name of the mark information of the board|substrate W carried in to 20 A of mounting apparatuses is specified, and the mark information of the board|substrate W can be read from the solder printing inspection apparatus 10. FIG.

The mounting unit 25A corrects the positional deviation of the substrate W by recognizing the substrate reference mark M1 attached to the substrate W. In addition, the mounting unit 25A mounts the precision parts P (see FIG. 2 ) with high precision based on the marking information of the component reference mark M2 read from the specific folder 13, and based on the mark information of the bad board mark M3 read from the specific folder 13 information, the component mounting operation is performed while ignoring the defective unit substrate Wa with the defective board mark M3 attached thereto. As a result, the recognition operation corresponding to the component reference mark M2 and the defective board mark M3 in the mounting device 20A is omitted, the time required for the recognition operation is shortened, and the tact is improved.

Furthermore, the mounting device 20A is provided with a transfer unit 26A that transfers the count value of the counter 22 to the next mounting device 20B following the transfer of the substrate W. The transfer unit 26A transfers the count value covered in the buffer 23A to the mounting device 20B so that the count value follows the conveyance of the substrate W. In addition, since only the counter value is transferred in the transfer unit 26A, the use of the transfer memory can be minimized, and there is no need to increase the transfer memory. In addition, since the tag information read by the reading unit 24A is stored in a large-capacity memory for the main body, even if the tag information is large, the transfer memory is not affected.

The mounting device 20B downstream of the mounting device 20A differs from the mounting device 20A in that the counter 22A is not provided. The mounting device 20B is provided with a sensor 21B, a buffer 23B, a reading section 24B, a mounting section 25B, and a conveying section 26B. In the mounting apparatus 20B, when the sensor 21B detects the carrying-in of the substrate W, the buffer 23B is overwritten with the counter value of the preceding upstream mounting apparatus 20A. Subsequently, the marking information whose number at the end of the file name matches the count value is read from the specific folder 13 of the storage unit 12 of the solder printing inspection device 10 by the reading unit 24B, and the mounting operation is performed based on the marking information by the mounting unit 25B. .

The mounting device 20C downstream of the mounting device 20B and the mounting device 20C downstream of the mounting device 20C have the same configuration as the mounting device 20B, and description thereof will be omitted here. Thus, in the mounting system 1 according to the present embodiment, the counter value associated with the substrate W is transmitted between the plurality of mounting devices 20 as the substrate W is conveyed in the mounting device 20A. Therefore, in the downstream mounting devices 20B and 20C, the marking information corresponding to the substrate W can be read from the solder printing inspection device 10 based on the counter value, and the time for the identification operation is shortened in each mounting device 20 to improve production. the beat.

Moreover, the control part (not shown) which collectively controls the operation|movement of various apparatuses is provided in the solder printing inspection apparatus 10 and each mounting apparatus 20A-20C. In addition, the control unit is composed of a processor, a memory, and the like that execute various processes of each unit. The memory is composed of one or more storage media such as ROM (ReadOnlyMemory) and RAM (RandomAccessMemory) depending on the application, and programs used in the installation system according to this embodiment are stored in the memory.

Next, as shown in FIG. 5, the operation of the installation system will be described. FIG. 5 is a sequence diagram showing the operation of the mounting system according to the present embodiment. In addition, although the sequence diagram shown in FIG. 5 shows an example of the operation|movement of a mounting system, it is not limited to this content.

First, the solder printing state of the first substrate W1 is inspected in the solder printing inspection device 10 (step S01 ). Then, various marks such as component reference marks M2 and defective board marks M3 (see FIG. 2 ) on the substrate W1 are recognized, and the recognition results are output as mark information to the specified folder 13 (step S02 ). In the specific folder 13 , mark information with the transfer order of the substrate W1 (“1” here) at the end of the file name is stored, and the transfer order of the substrate W1 is associated with the mark information and stored. Then, the board|substrate W1 is carried out from the solder printing inspection apparatus 10, and the board|substrate W1 is conveyed toward 20 A of mounting apparatuses which started (step S03).

Then, the first mounting device 20A detects and counts the loading of the board W1, writes the count value "1" into the buffer, and clamps the board W1 (step S04). Then, based on the counter value "1", the mark information stored as the file 1 is read from the specific folder 13 (step S05), and the installation operation is performed based on the mark information of the file 1 (step S06). In parallel with this, the printed state of the solder on the second substrate W2 is inspected in the solder printing inspection device 10 (step S07), and the identification results of various marks on the substrate W2 are sent to the specified folder 13 as mark information. File output (step S08).

When the component mounting on the substrate W1 is completed in the first mounting device 20A, the substrate W1 is unloaded from the first mounting device 20A, and the substrate W1 is conveyed toward the subsequent mounting device 20B (step S09 ). Then, the carrying-in of the substrate W1 is detected in the subsequent mounting device 20B, the count value "1" transferred from the first mounting device 20A is written into the buffer, and the substrate W1 is clamped (step S10 ). When the substrate W1 is carried out from the first mounting apparatus 20A, the substrate W2 is carried out from the solder print inspection apparatus 10, and the substrate W2 is conveyed toward the first mounting apparatus 20A instead of the substrate W1 (step S11).

Then, the first mounting device 20A detects and counts the carrying-in of the board W2, covers the buffer with the count value "2" transferred from the first mounting device 20A, and clamps the board W2 (step S12). Then, in the subsequent installation device 20B, the file 1 is read from the specific folder 13 based on the counter value "1" (step S13), and the installation operation is performed based on the tag information of the file 1 (step S14). Also in the first installation device 20A, the file 2 is read from the specific folder 13 based on the counter value "2" (step S15), and the installation operation is performed based on the tag information of the file 2 (step S16).

When the component mounting on the substrate W1 is completed in the subsequent mounting device 20B, the substrate W1 is unloaded from the subsequent mounting device 20B, and the substrate W1 is further conveyed toward the subsequent mounting device (step S17 ). When the substrate W1 is carried out from the subsequent mounting apparatus 20B, the substrate W2 is carried out from the first mounting apparatus 20A, and the substrate W2 is conveyed toward the subsequent mounting apparatus 20B instead of the substrate W1 (step S18 ). The subsequent mounting device 20B detects the loading of the substrate W2, covers the buffer with the count value "2" transmitted from the first mounting device 20A, and clamps the substrate W2 (step S19).

Subsequently, by repeating the above-described operation in each mounting device 20 , components are mounted on the substrate W in stages. Thereby, it is possible to transmit the count value between the plurality of mounting devices 20 following the conveyance of the substrate W, and to identify the substrate W to be mounted in each mounting device 20 . Thereby, in each mounting device 20 , the marking information corresponding to the board W can be read from the specific folder 13 of the solder printing inspection device 10 . Here, description of the third and subsequent substrates W is omitted, but the same operation is performed on the third and subsequent substrates W as well.

In addition, instead of the configuration according to the present embodiment, it is conceivable to transfer the marking information according to the conveyance of the substrate W, but only the substrate W is conveyed when the network is disconnected for some reason. In the above-mentioned case, there is a problem that the compatibility between the substrate W and the marking information cannot be obtained in each mounting device 20 . In this embodiment, after the substrate W is conveyed, each mounting device 20 reads the marking information from the solder printing inspection device 10, so there is no possibility that the compatibility between the substrate W and the marking information cannot be obtained after the substrate W is conveyed only. Such a glitch.

Referring to FIG. 6 , the transmission method of the counter value will be described. FIG. 6 is an explanatory diagram of a method of transmitting a counter value according to the present embodiment. FIG. 7 is an explanatory diagram of a method of transmitting a counter value according to a modification. In addition, FIG. 6A shows the conveyance state of the substrate, and FIGS. 6B and 6C show the transition of the count value in the buffer.

As shown in FIG. 6A , sensors 21A- 21C for detecting carrying-in of the substrate W are provided in the mounting apparatuses 20A- 20C. In this figure, the initial loading of the substrate W1 is detected by the sensor 21B, and the subsequent loading of the substrate W2 is detected by the sensor 21A. Therefore, as shown in FIG. 6B , the count value "1" is written in the buffer of the mounting device 20B, and the count value "2" is written in the buffer of the mounting device 20A. When the substrate W1 is unloaded from the mounting device 20B in this state, the sensor 21B is switched from ON to OFF, and the substrate W1 is conveyed toward the mounting device 20C. Next, the substrate W2 is unloaded from the mounting device 20A, the sensor 21A is switched from ON to OFF, and the substrate W2 is conveyed toward the mounting device 20B.

When the substrate W1 arrives and is carried into the mounting device 20C, the sensor 21C is switched from OFF to ON, and the count value "1" is transmitted from the mounting device 20B to the mounting device 20C. Thereby, the count value "1" is written in the buffer of 20 C of mounting apparatuses. Then, when the substrate W2 arrives and is carried into the mounting device 20B, the sensor 21B is switched from OFF to ON, and the count value "2" is transmitted from the mounting device 20A to the mounting device 20B. Thus, the buffer of the mounting device 20B is overwritten with the count value "2". As described above, after the first substrate W1 reaches the remote mounting device 20 , control is performed so that the subsequent substrate W2 reaches the previous mounting device 20 , and the count value is transferred in accordance with the conveyance of the substrate W.

In addition, in the above-mentioned conveyance method, when the substrate W1 is delayed for some reason, the count value does not follow the conveyance of the substrate W. For example, as shown in the third row from the top in FIG. 6C , before the substrate W1 reaches the mounting device 20C from the mounting device 20B, the substrate W2 may reach the mounting device 20B from the mounting device 20A. When the substrate W2 arrives and is carried into the mounting device 20B, the sensor 21B is switched from OFF to ON, and the count value "2" is transmitted from the mounting device 20A to the mounting device 20B. Thus, before the substrate W1 reaches the mounting device 20C, the buffer of the mounting device 20B is covered with the count value "2".

Then, when the substrate W1 arrives and is carried into the mounting device 20C, the sensor 21C is switched from OFF to ON, and the count value is transmitted from the mounting device 20B to the mounting device 20C. In this case, since the buffer of the mounting device 20B is already covered with the count value "2" before the board W1 reaches the mounting device 20C, the count value "2" is transferred from the mounting device 20B to the mounting device 20C. Thereby, the buffer of 20 C of mounting apparatuses is covered with the count value "2" which does not correspond to board|substrate W1. In this case, in the mounting device 20C, a failure occurs in that the mounting operation is performed on the substrate W1 in accordance with the flag information associated with the count value "2".

Therefore, as shown in the modified example of FIG. 7, a carrying-in buffer and a carrying-out buffer may be provided in each mounting apparatus 20A-20C. The sensor 21 of the modified example detects not only the loading of the substrate W but also the carrying out of the substrate W by turning ON and OFF. The load-in buffers of the mounting devices 20A- 20C are overwritten when the sensor 21 is switched ON to detect the load-in of the substrate W, and the load-out buffers of the mounting devices 20A- 20C are detected to detect the substrate W when the sensor 21 is switched OFF. The count value is overwritten on move-out.

More specifically, the loading buffer of the mounting apparatus 20A is overwritten with the count value of the counter 22A (see FIG. 4 ), and the unloading buffer of the mounting apparatus 20A is overwritten with the count value of the loading buffer of the mounting apparatus. The carry-in buffer of the mounting device 20B is overwritten with the count value of the carry-out buffer of the previous upstream mounting device 20A, and the carry-out buffer of the mounting device 20B is overwritten with the count value of the carry-in buffer of the own device. When the substrate W1 is unloaded from the mounting device 20B in the state shown in FIG. 6A , the sensor 21B is switched from ON to OFF, and the count value "1" of the loading buffer is written to the loading buffer of the mounting device 20B. Subsequently, the substrate W1 is conveyed toward the mounting device 20C.

Next, the substrate W2 is carried out from the mounting device 20A, the sensor 21A is switched from ON to OFF, and the carry-out buffer of the mounting device 20A is covered with the count value "2" of the carry-in buffer. Subsequently, the substrate W2 is conveyed toward the mounting device 20B. Here, if the substrate W2 arrives from the mounting apparatus 20A and is carried into the mounting apparatus 20B before the substrate W1 arrives from the mounting apparatus 20B to the mounting apparatus 20C, the sensor 21B is switched from OFF to ON, and the load is transferred from the unloading buffer of the mounting apparatus 20A to the mounting apparatus 20B. The carry-in buffer of 20B transfers the count value "2". Thereby, the carry-in buffer of the mounting apparatus 20B is overwritten with the counter value "2".

Then, when the substrate W1 arrives and is carried into the mounting device 20C, the sensor 21C is switched from OFF to ON, and the count value "1" is transferred from the carry-out buffer of the mounting device 20B to the carry-in buffer of the mounting device 20C. Thereby, the counter value "1" corresponding to the board|substrate W1 is written in the carry-in buffer of 20 C of mounting apparatuses. Thus, in the counter value transfer method according to the modified example, even if the arrival timing of each substrate W to each mounting device 20 deviates back and forth, the count value can be transferred in accordance with the conveyance of the substrate W so that The substrate W corresponds to the count value.

As described above, in the mounting system 1 according to the present embodiment, the marking information and the order in which the substrates W are conveyed are stored in association with each other in the solder print inspection device 10 . In addition, in the mounting apparatus 20A, a count is performed every time a substrate W is carried in, and the order of the substrates W carried into the mounting apparatus 20A is determined based on the count value. In addition, since the count value is transmitted following the conveyance of the substrate W from the mounting device 20A to the subsequent mounting devices 20B and 20C, the marking information is read from the solder printing inspection device 10 in each mounting device 20 based on the count value. Therefore, even if it is a substrate W without identification information such as a barcode, the mounting device 20 can recognize the marks on the substrate W and properly mount components on the substrate, and the recognition operation of various marks in the mounting device 20 can be shortened and improved. Production beats.

In addition, this invention is not limited to the said embodiment, It can change variously and can implement. In the above-described embodiment, the size, shape, and the like shown in the drawings are not limited thereto, and can be appropriately changed within the range in which the effects of the present invention are exhibited. In addition, unless it deviates from the scope of the objective of this invention, it can change suitably and implement.

For example, in this embodiment, the mounting line in which the several mounting apparatuses 20 are arranged in the downstream of the solder printing inspection apparatus 10 was illustrated and demonstrated, However, It is not limited to this mounting line. It is only necessary for the installation line to have at least one installation device 20 arranged downstream of the processing device, for example, one installation device 20 may be used.

In addition, in this embodiment, although the solder printing inspection apparatus 10 was illustrated and demonstrated as a processing apparatus, the processing apparatus is not limited to the solder printing inspection apparatus 10. FIG. The processing device may be disposed at the beginning of the mounting line, and may be, for example, an adhesive application device for applying an adhesive to the substrate W, or a mounting device similar to the subsequent mounting device 20 . In this case, the identification unit 11 and the storage unit 12 are provided in the adhesive application device or the mounting device.

In addition, in the present embodiment, the solder printing inspection device 10 and the plurality of mounting devices 20 are configured to be wired by LAN, but the configuration is not limited to this configuration. The solder print inspection device 10 and the plurality of mounting devices 20 may also be wirelessly connected.

In addition, in this embodiment, although the structure which recognized the marking information of the component reference mark M2 and the defective board mark M3 was demonstrated, it is not limited to this structure. The mark information may be information indicating the recognition result of marks on the substrate W, and may be, for example, any mark information among the component reference mark M2 and the failure mark M3 , or other mark information.

In addition, in this embodiment, although the structure which does not attach identification information, such as a barcode, to the board|substrate W was demonstrated, it is not limited to this structure. Identification information such as a barcode may be attached to the substrate W.

In addition, in this embodiment, the substrate W is not limited to a printed circuit board, and may be a flexible substrate placed on a jig substrate.

In addition, in this embodiment, although the structure which arrange|positions the initial mounting board|substrate W at the 1st position downstream of the solder print inspection apparatus 10 is comprised, it is not limited to this structure. Another device may be provided between the solder printing inspection device 10 and the mounting device 20 .

In addition, in the present embodiment, the counter 22 is configured to increment numbers one by one, but it is not limited to this configuration. The counter 22 only needs to count each time the substrate W is carried in, and may have a structure in which character strings such as letters and Chinese characters are incremented.

In addition, in the present embodiment, the mark information is associated with the substrate W by adding a number indicating the order in which the substrates are transported at the end of the file name, but the configuration is not limited to this configuration. The mark information may be associated with the order of the substrates W indicated by the count value of the counter 22 . For example, a number may be added to the head of the file name, or characters indicating the transfer order, such as letters and Chinese characters, may be added instead of the number.

In addition, in this embodiment, although the structure which provided the transmission part 26 independently from the sensor 21 was set, it is not limited to this structure. The transmission unit 26 may also be attached to the sensor 21 . In addition, the sensor 21 may be provided with the buffer concerning this embodiment, and the carrying-in buffer and carrying-out buffer concerning a modification.

In addition, in this embodiment, various marks such as the component reference mark M2 and the defective board mark M3 on the substrate W1 are recognized, and the recognition result is output as a file to the specified folder 13 as mark information. On this basis, it can be set to identify the substrate reference mark M1, and how much the part reference mark M2 is separated from the substrate reference mark M1 in the X direction and the Y direction, that is, the distance is used as data to a specific folder 13 outputs.

Also, in this embodiment, it is composed of a processing device, an initial mounting device, and a subsequent mounting device. The initial mounting device is provided with a counter, a sensor, and a buffer, and the subsequent mounting device is provided with a buffer and a sensor. Alternatively, counters may be provided in both the initial installation device and the subsequent installation device, and the tag information represented by the count value may be read.

Industrial Applicability

As shown in the above description, the present invention has the following effects, that is, regardless of whether there is identification information on the substrate, the recognition operation of various marks in the mounting device can be shortened and the production cycle can be improved. It is effective in a mounting system, a mounting device, and a program used in a mounting system in which components are mounted on a substrate after solder printing inspection.

Claims (8)

1. A mounting system, which uses a mounting line in which mounting devices are arranged downstream of a processing device, and uses the mounting device to mount components to substrates sequentially transported from the processing device, The mounting system is characterized in that, The processing apparatus is provided with: a recognition unit that recognizes marks attached to the substrates; and a storage unit that correlates the order in which the substrates are conveyed with mark information indicating a recognition result by the recognition unit. joint storage, The mounting device that first carries in the substrate from the processing device is provided with a counter that counts each time the substrate is carried in, and a reading unit that reads and reads the board from the processing device the mark information associated with the order of the boards indicated by the count value of the counter; and a mounting section that mounts the component on the board based on the mark information. 2. The mounting system of claim 1, wherein: The mounting device is an initial mounting device that first loads the substrate, and a subsequent mounting device downstream of the initial mounting device, The counter is not provided in the subsequent mounting device, and the reading part and the mounting part are provided, The first mounting device and the subsequent mounting device are provided with a transfer unit that transfers the count value of the counter to a next downstream mounting device following the conveyance of the substrate. 3. The mounting system of claim 2, wherein: The initial mounting device and the subsequent mounting device are provided with: a sensor that detects the loading of the board; and a buffer that the counter detects when the sensor detects the loading of the board. The count value of is overwritten, said buffer of said initial mounting device is overwritten by the count value of said counter, said buffer of said subsequent mounting device is covered by the count value of a preceding upstream mounting device, When the count value is written in the buffer, the reading unit of the first mounting device and the subsequent mounting device reads from the processing device the value indicated by the written count value. The order of the substrates is associated with the tag information. 4. The mounting system of claim 2, wherein: The first mounting device and the subsequent mounting device are provided with: a sensor for detecting loading/unloading of the substrate; and a loading buffer for counting when the sensor detects the loading of the substrate. a value is overwritten; and an unloading buffer whose count value is overwritten when the unloading of the substrate is detected by the sensor, The loading buffer of the initial installation device is covered by the count value of the counter, and the output buffer of the initial installation device is covered by the count value of the loading buffer of the initial installation device, The carry-in buffer of the subsequent mounting device is overwritten with the count value of the carry-out buffer of the previous upstream mounting device, and the carry-out buffer of the subsequent mounting device is overwritten with the count value of the carry-in buffer of the subsequent mounting device. count value override, The reading unit of the first mounting device and the subsequent mounting device, when the carry-in buffers of the initial mounting device and the subsequent mounting device are overwritten with a count value, reads from the processing The device reads the marking information associated with the order of the substrates represented by the count value. 5. Mounting system according to any one of claims 1 to 4, characterized in that, The substrate is an aggregate substrate composed of a plurality of unit substrates, The mark is a bad board mark indicating that the quality of each of the unit substrates is poor. 6. Mounting system according to any one of claims 1 to 4, characterized in that, The processing device is a solder printing inspection device that inspects a printed state of solder. 7. A mounting device in which a substrate is conveyed first from the processing device in a mounting line for mounting components on substrates sequentially conveyed from the processing device, The installation device is characterized in that it has: a counter that counts each time the substrate is carried in from the processing device, and the processing device correlates the order in which the substrates are conveyed with mark information that recognizes a mark attached to the substrate and indicates a recognition result joint storage; a reading section that reads, from the processing device, the mark information associated with the order in which the substrates are carried in indicated by the count value of the counter; and and a mounting section that mounts the component on the substrate based on the marking information. 8. A mounting method comprising mounting components on substrates sequentially conveyed from the processing device by using a mounting line in which mounting devices are arranged downstream of the processing device, This installation method is characterized in that, causing the processing device to execute the steps of: recognizing marks attached to the substrates; and storing the order in which the substrates are conveyed in association with mark information representing the recognition results, The mounting device carrying the substrate first from the processing device performs the following steps: counting each time the substrate is carried in; reading the processing device from the processing device the step of the marking information associated with the order of the substrate; and the step of mounting the component on the substrate based on the marking information.