CN105810806A - LED packaging structure having uniform colour temperature and good heat dissipation - Google Patents
LED packaging structure having uniform colour temperature and good heat dissipation Download PDFInfo
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- CN105810806A CN105810806A CN201610261657.2A CN201610261657A CN105810806A CN 105810806 A CN105810806 A CN 105810806A CN 201610261657 A CN201610261657 A CN 201610261657A CN 105810806 A CN105810806 A CN 105810806A
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- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 49
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 17
- 230000002708 enhancing effect Effects 0.000 claims abstract description 4
- 239000000843 powder Substances 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 32
- 238000009434 installation Methods 0.000 claims description 11
- 239000011241 protective layer Substances 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8582—Means for heat extraction or cooling characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
Landscapes
- Led Device Packages (AREA)
Abstract
Description
技术领域 technical field
本发明涉及一种LED封装结构，特别是一种色温均匀散热性良好的LED封装结构。 The invention relates to an LED packaging structure, in particular to an LED packaging structure with uniform color temperature and good heat dissipation.
背景技术 Background technique
传统LED灯的基本结构是一块电致发光的半导体材料芯片，用银胶或白胶固化到支架上，然后用银线或金线连接芯片和电路板，然后四周用环氧树脂密封，起到保护内部芯线的作用，最后安装外壳，所以LED灯的抗震性能好。运用领域涉及到手机、台灯、家电等日常家电和机械生产方面。但是传统LED封装结构普遍存在色温不均匀和散热性不好的问题。 The basic structure of traditional LED lights is an electroluminescent semiconductor material chip, which is cured on the bracket with silver glue or white glue, and then connected to the chip and the circuit board with silver or gold wires, and then sealed with epoxy resin around it to play a role. The role of protecting the inner core wire, and finally install the shell, so the shock resistance of the LED lamp is good. The field of application involves mobile phones, table lamps, home appliances and other daily household appliances and machinery production. However, the traditional LED packaging structure generally has the problems of uneven color temperature and poor heat dissipation.
发明内容 Contents of the invention
为解决上述问题，本发明的目的在于提供一种色温均匀散热性良好的LED封装结构。 In order to solve the above problems, the object of the present invention is to provide an LED packaging structure with uniform color temperature and good heat dissipation.
本发明解决其问题所采用的技术方案是：一种色温均匀散热性良好的LED封装结构，包括LED芯片，设置有用于增强散热性的散热通道、用于透射较强光线的透光层和用于透射较弱光线的透光部，所述透光层和透光部内均填充有荧光粉，所述透光部的厚度大于透光层的厚度。 The technical solution adopted by the present invention to solve the problem is: an LED packaging structure with uniform color temperature and good heat dissipation, including an LED chip, provided with a heat dissipation channel for enhancing heat dissipation, a light-transmitting layer for transmitting strong light, and an LED chip. In the light-transmitting part that transmits relatively weak light, both the light-transmitting layer and the light-transmitting part are filled with fluorescent powder, and the thickness of the light-transmitting part is greater than that of the light-transmitting layer.
进一步，所述散热通道包括微散热通道，所述微散热通道设置有两处且分别对称地设置于散热通道的两侧。本发明设置的微散热通道，可以进一步加强本发明的散热能力；本发明将微散热通道对称地设置于散热通道的两侧，可以使得本发明散热均匀，有效避免了封装结构各个部分的温差过高。 Further, the heat dissipation channels include micro heat dissipation channels, and the micro heat dissipation channels are arranged in two places and symmetrically arranged on both sides of the heat dissipation channels. The micro heat dissipation channel provided by the present invention can further enhance the heat dissipation capability of the present invention; the present invention arranges the micro heat dissipation channel symmetrically on both sides of the heat dissipation channel, which can make the heat dissipation of the present invention even, and effectively avoid excessive temperature difference of each part of the package structure. high.
进一步，设置有安装内腔，所述LED芯片设置于安装内腔中。本发明将LED芯片设置于安装内腔中，有利于LED芯片的保护，延长产品的使用寿命。 Further, an installation cavity is provided, and the LED chip is arranged in the installation cavity. The invention arranges the LED chip in the installation cavity, which is beneficial to the protection of the LED chip and prolongs the service life of the product.
进一步，设置有用于增加LED芯片的光线利用率的反射层，所述反射层设置于安装内腔的下方。一般LED芯片的光线都是向四周射出，而向LED芯片的安装底面射出的光线却无法得到有效的利用，因此本发明在LED芯片的下方设置有反射层，这样可以有效提高LED芯片的光线利用率。 Further, a reflective layer for increasing the light utilization rate of the LED chip is provided, and the reflective layer is arranged below the installation cavity. Generally, the light of the LED chip is emitted to the surroundings, but the light emitted to the bottom surface of the LED chip cannot be effectively utilized. Therefore, the present invention is provided with a reflective layer under the LED chip, which can effectively improve the light utilization of the LED chip. Rate.
进一步，设置有用于保护反射层的保护层，所述反射层设置于保护层的内部。本发明设置有保护层，并且将反射层设置于保护层之内，这样可以有效防止反射层的银被硫化，提高反射层的使用寿命。 Further, a protective layer for protecting the reflective layer is provided, and the reflective layer is disposed inside the protective layer. The invention is provided with a protective layer, and the reflective layer is arranged in the protective layer, which can effectively prevent the silver of the reflective layer from being vulcanized and improve the service life of the reflective layer.
进一步，所述透光层从上到下的厚度逐渐加厚。由于LED芯片两侧的光线较弱，这样设计可以使得较弱的光线通过较厚的荧光粉，从而使得光线的色温更加均匀。 Further, the thickness of the transparent layer gradually increases from top to bottom. Since the light on both sides of the LED chip is weak, this design can make the weaker light pass through the thicker phosphor, so that the color temperature of the light is more uniform.
本发明的有益效果是：本发明采用的一种色温均匀散热性良好的LED封装结构，本发明通过设置散热通道大大加强了LED封装结构的散热能力；本发明将较强光线通过厚度较薄的透光层透射出去，而将较弱光线通过厚度较厚的透光部透射出去，使得LED芯片的透射光的色温整体看起来比较均匀。 The beneficial effects of the present invention are: the present invention adopts an LED package structure with uniform color temperature and good heat dissipation, and the present invention greatly enhances the heat dissipation capability of the LED package structure by setting heat dissipation channels; The light-transmitting layer transmits out, and transmits the weaker light through the thicker light-transmitting part, so that the color temperature of the transmitted light of the LED chip looks relatively uniform as a whole.
附图说明 Description of drawings
下面结合附图和实例对本发明作进一步说明。 The present invention will be further described below in conjunction with accompanying drawing and example.
图1是本发明的结构图。 Fig. 1 is a structural diagram of the present invention.
具体实施方式 detailed description
图1是本发明的结构图,如图1所示，一种色温均匀散热性良好的LED封装结构，包括LED芯片1，设置有用于增强散热性的散热通道2、用于透射较强光线的透光层3和用于透射较弱光线的透光部4，所述透光层3和透光部4内均填充有荧光粉，所述透光部4的厚度大于透光层3的厚度。本发明的散热通道2包括微散热通道5，所述微散热通道5设置有两处且分别对称地设置于散热通道2的两侧。本发明设置的微散热通道5，可以进一步加强本发明的散热能力；本发明将微散热通道5对称地设置于散热通道2的两侧，可以使得本发明散热均匀，有效避免了封装结构各个部分的温差过高。 Fig. 1 is a structural diagram of the present invention, as shown in Fig. 1, an LED packaging structure with uniform color temperature and good heat dissipation, including an LED chip 1, is provided with a heat dissipation channel 2 for enhancing heat dissipation, and a channel for transmitting strong light The light-transmitting layer 3 and the light-transmitting portion 4 for transmitting weaker light, both of the light-transmitting layer 3 and the light-transmitting portion 4 are filled with fluorescent powder, and the thickness of the light-transmitting portion 4 is greater than the thickness of the light-transmitting layer 3 . The heat dissipation channel 2 of the present invention includes micro heat dissipation channels 5 , and the micro heat dissipation channels 5 are arranged in two places and symmetrically arranged on both sides of the heat dissipation channel 2 . The micro heat dissipation channel 5 provided in the present invention can further enhance the heat dissipation capacity of the present invention; the present invention arranges the micro heat dissipation channel 5 symmetrically on both sides of the heat dissipation channel 2, which can make the heat dissipation of the present invention even and effectively avoid the heat dissipation of each part of the packaging structure. The temperature difference is too high.
本发明设置有安装内腔6，所述LED芯片1设置于安装内腔6中。本发明将LED芯片1设置于安装内腔6中，有利于LED芯片1的保护，延长产品的使用寿命。本发明设置有用于增加LED芯片1的光线利用率的反射层7，所述反射层7设置于安装内腔6的下方。一般LED芯片1的光线都是向四周射出，而向LED芯片1的安装底面射出的光线却无法得到有效的利用，因此本发明在LED芯片1的下方设置有反射层7，这样可以有效提高LED芯片1的光线利用率。本发明设置有用于保护反射层7的保护层8，所述反射层7设置于保护层8的内部。本发明设置有保护层8，并且将反射层7设置于保护层8之内，这样可以有效防止反射层7的银被硫化，提高反射层7的使用寿命。本发明的透光层3从上到下的厚度逐渐加厚。由于LED芯片1两侧的光线较弱，这样设计可以使得较弱的光线通过较厚的荧光粉，从而使得光线的色温更加均匀。 The present invention is provided with an installation cavity 6 , and the LED chip 1 is arranged in the installation cavity 6 . The present invention arranges the LED chip 1 in the installation cavity 6, which is beneficial to the protection of the LED chip 1 and prolongs the service life of the product. The present invention is provided with a reflective layer 7 for increasing the light utilization rate of the LED chip 1 , and the reflective layer 7 is arranged below the installation cavity 6 . Generally, the light of the LED chip 1 is emitted to the surroundings, but the light emitted to the bottom surface of the LED chip 1 cannot be effectively utilized. Therefore, the present invention is provided with a reflective layer 7 under the LED chip 1, which can effectively improve the LED performance. The light utilization rate of chip 1. The present invention is provided with a protective layer 8 for protecting the reflective layer 7 disposed inside the protective layer 8 . The present invention is provided with a protective layer 8, and the reflective layer 7 is arranged in the protective layer 8, which can effectively prevent the silver of the reflective layer 7 from being vulcanized and improve the service life of the reflective layer 7. The thickness of the transparent layer 3 of the present invention increases gradually from top to bottom. Since the light on both sides of the LED chip 1 is weak, this design can allow the weaker light to pass through the thicker phosphor, thereby making the color temperature of the light more uniform.
以上所述，只是本发明的较佳实施例而已，本发明并不局限于上述实施方式，只要其以相同的手段达到本发明的技术效果，都应属于本发明的保护范围。 The above descriptions are only preferred embodiments of the present invention, and the present invention is not limited to the above-mentioned embodiments, as long as they achieve the technical effects of the present invention by the same means, they should all belong to the protection scope of the present invention.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610261657.2A CN105810806A (en) | 2016-04-22 | 2016-04-22 | LED packaging structure having uniform colour temperature and good heat dissipation |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610261657.2A CN105810806A (en) | 2016-04-22 | 2016-04-22 | LED packaging structure having uniform colour temperature and good heat dissipation |
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| CN105810806A true CN105810806A (en) | 2016-07-27 |
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| CN201610261657.2A Pending CN105810806A (en) | 2016-04-22 | 2016-04-22 | LED packaging structure having uniform colour temperature and good heat dissipation |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106932855A (en) * | 2017-02-08 | 2017-07-07 | 江门吉华光电精密有限公司 | RGBW colour mixture light-guiding pillars |
| CN106952997A (en) * | 2017-02-08 | 2017-07-14 | 江门吉华光电精密有限公司 | The total internal reflection lens of even light mixing |
| CN107461676A (en) * | 2017-07-26 | 2017-12-12 | 江门吉华光电精密有限公司 | A kind of good LED down lamp of thermal diffusivity |
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| CN107461676A (en) * | 2017-07-26 | 2017-12-12 | 江门吉华光电精密有限公司 | A kind of good LED down lamp of thermal diffusivity |
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Application publication date: 20160727 |