CN105810646A - Composite type high-power electronic chip radiator with multiple heat pipes - Google Patents

Abstract

A multi-heat pipe composite high-power electronic chip radiator belongs to the technical field of electronic product auxiliary equipment, including an annular steam cavity base, a gravity heat pipe, heat-driven pulsating flow heat pipe fins, fastening handles, tie hoops, and a cooling fan , enclosure brackets and fastening bolts; the gravity heat pipe is vertically installed on the base of the annular steam chamber, and its internal cavity is connected with the inner ring cavity of the base of the annular steam chamber and is sealed; several heat-driven pulsating flow heat pipe fins The staggered clamping is fixed in the multi-layered flower-shaped card slot on the outer side of the upper shell of the gravity heat pipe, and is tightly fixed to the outer wall of the gravity heat pipe through the fastening handle and the tie hoop. The invention realizes the rational distribution, efficient transportation and release of the heat produced by the high-power electronic chip in the three-dimensional heat dissipation space, and the heat dissipation power is large and the efficiency is high.

Description

A multi-heat pipe composite high-power electronic chip radiator

technical field

The invention belongs to the technical field of auxiliary equipment for electronic products, and relates to an electronic heat dissipation device, in particular to a multi-heat pipe composite high-power electronic device with high efficiency and high power heat dissipation for solving the heat dissipation problem of an independent high heat flux density electronic chip. Chip heatsink.

Background technique

The heat dissipation level of electronic chips and components is directly related to the reliability of electronic equipment, especially for independent high heat flux electronic chips with high thermal load sensitivity (such as CPU, GPU, LED), the accumulation of heat at the chip will Significantly reduce its working stability and service life. In particular, the three major development trends of high performance, miniaturization and integration of electronic components will make the heat dissipation problem more prominent, and the traditional heat dissipation method of extending the heat exchange surface of fins and forced air convection has been unable to meet the functional requirements. The heat dissipation requirements of the increasingly high heat flux density electronic chips. Therefore, in order to ensure the stable and efficient operation of high-power electronic chips, it is urgent to develop high heat flux density and high-efficiency electronic chip cooling technologies.

In recent years, the proposal and development of various new heat dissipation/cooling technologies such as heat pipe heat dissipation, thermoelectric cooling, jet/immersion direct cooling, and active microchannel liquid circulation cooling have provided an opportunity to solve the heat dissipation problems of the above-mentioned high heat flux electronic chips. . Among them, the heat pipe heat dissipation technology has been widely used in the field of heat dissipation of high heat flux electronic components due to its performance advantages such as good isothermal property, strong heat dissipation capacity, convenient processing and layout, and excellent reliability. At present, the conventional heat pipe heat dissipation technology often uses high thermal conductivity heat exchange elements such as capillary heat pipes, gravity heat pipes, and loop heat pipes to efficiently export the heat generated by electronic chips to the large-area ribbed heat exchange surface that cooperates with it, and then dissipates heat through forced convection heat exchange. release. However, although various types of heat pipes based on traditional designs have mature processing technology and low production costs, there are still a series of heat transfer limits in the operation process, such as carrying limit, capillary limit, etc., resulting in that the limit heat dissipation still needs to be improved. In addition, the extended surface of traditional fins with high thermal conductivity metal as the base material is limited in its heat dissipation performance due to the influence of rib efficiency.

Contents of the invention

The object of the present invention is to address the deficiencies of the above-mentioned prior art, and provide a multi-heat pipe composite high-power electronic chip radiator with large heat dissipation power, good heat dissipation performance, novel and compact structure, and convenient installation and maintenance. The heat dissipation limit of heat dissipation technology, and significantly improve the problem that the heat transfer performance of the extended surface of traditional high heat rate metal fins is limited by the efficiency of the fins.

The technical solution of the present invention is: a multi-heat pipe composite high-power electronic chip radiator, including an annular steam chamber base, a gravity heat pipe, heat-driven pulsating flow heat pipe fins, fastening handles, tie hoops, cooling fans, Enclosing bracket and fastening bolts; it is characterized in that: the gravity heat pipe is vertically installed on the base of the annular steam chamber, and its internal cavity communicates with the inner ring cavity of the base of the annular steam chamber and is sealed and connected; Several heat-driven pulsating flow heat pipe fins are interlaced and fixed in the multi-layer flower-shaped slots on the outer side of the upper shell of the gravity heat pipe, and the clamps are matched with the outer wall of the gravity heat pipe through the fastening gripper Closely fixed; the heat dissipation fan is horizontally supported above the gravity heat pipe through the enclosure bracket, and is fastened in series with the fastening bolts.

The base of the annular steam chamber is welded and processed by a base plate and a cover plate. The base plate is processed with an inner ring opening cavity and an outer ring opening cavity. The back of the inner ring opening cavity is processed with a heat-conducting contact surface of a high-power electronic chip. The top of the base of the annular steam chamber is provided with radial ribs, and the inner surface of the steam chamber is processed with three-dimensional micro ribs.

The shape of the three-dimensional micro-rib is one of cuboid, trapezoidal platform or triangular cone, the rib height is 0.1-0.2mm, and the rib density is 90-150/ ^cm2 ; the radial ribs on the top and lower inner walls of the steam chamber The spacing is 0.8-1.2mm, and the circumferential rib spacing is 0.6-1.0mm; the axial rib spacing on the inner wall around the steam chamber is 0.6-1.0mm, and the circumferential rib spacing is 0.8-1.2mm.

The gravity heat pipe is welded by the inner ring opening cavity of the base of the annular steam chamber, the shell, the inner insert of the evaporation section, the inner insert of the condensation section and the top cover. Place the intubation tube in the condensation section and the intubation tube in the evaporation section. The length of the intubation tube in the condensation section is 50% to 55% of the total height of the inner cavity of the gravity heat pipe, and the length of the intubation tube in the evaporation section is 30% of the total height of the inner cavity of the gravity heat pipe. ~35%.

The bottom end of the intubation pipe in the evaporation section is provided with a flow grid for the intubation pipe in the evaporation section, and a number of foam-limiting through holes are arranged in a staggered manner on the wall of the intubation pipe in the evaporation section. The hole spacing is 6-10mm, and the circumferential hole spacing is 4-8mm.

The intubation pipe in the condensation section is a smooth tube with uniform wall thickness, the top end of which is provided with a flow grid for the intubation pipe in the condensation section, and the other end is provided with a gradually expanding diversion section, and the height of the gradually expanding diversion section is 10 ~ 12mm, gradual expansion angle θ=45°～60°.

The internal and external pipe diameters of the inner pipe in the evaporating section and the inner pipe in the condensing section are uniform, and the optimal size range of the ring gap formed between the outer wall of each and the inner wall of the gravity heat pipe is 3-5 mm.

The heat-driven pulsating flow heat pipe fins are made by connecting capillary metal tubes end to end and repeatedly bending them into a petal shape, then evacuating and partially filling them with working fluid. The diameter of the inner ring of the petal-shaped heat-driven pulsating flow heat pipe fins is Match the minimum outer diameter of the outer wall of the gravity heat pipe.

The number of "petals" of the capillary metal tube is greater than or equal to 6, and its equivalent inner diameter is between 0.5-3.0 mm, and the wall thickness is 0.15-0.2 mm.

The flower-shaped slots are multi-layered, and each layer of slots holds a heat-driven pulsating flow heat pipe fin. The heat-driven pulsating flow heat pipe fins are fastened with positive fit; the flower-shaped card slot is axially processed with a chute that matches the shape of the inner ring pipeline of the heat-driven pulsating flow heat pipe fins, and the heat supply drives the pulsating flow heat pipe fins. The tab slides into the installation.

The beneficial effects of the present invention are: a multi-heat pipe composite high-power electronic chip radiator proposed by the present invention has novel and compact structure, clear working principle, convenient installation and maintenance, and uses the central gravity heat pipe as the heat transfer center of the radiator to realize High-efficiency heat transfer along the vertical direction of the heat generated by the high-power electronic chip at the bottom, and compared with the traditional hollow gravity heat pipe, the inner tube set in the tube helps the micro-layer evaporation and boiling bubbles during the boiling process of the working medium in the evaporation section The detachment weakens the countercurrent carry between the rising steam and the return condensate in the condensation section and promotes the condensation discharge, which in turn strengthens the boiling and condensation heat transfer in the corresponding working section respectively, and improves the carrying limit of the gravity heat pipe; the bottom annular steam chamber base The seat can quickly expand the heat generated by the high-power electronic chip to the horizontal direction, effectively alleviating the heat dissipation load in the vertical direction, and the three-dimensional micro-ribs processed on the inner wall surface greatly increase the nuclear state of the evaporation surface of the steam chamber The number of boiling vaporization cores enhances the capillary suction and drainage capacity of the condensation surface, thereby enhancing the boiling and condensation heat transfer in the steam chamber and improving its capillary limit; the heat-driven pulsating flow heat pipe fins are used as the extended heat dissipation surface, It effectively solves the problem that the heat transfer performance of the extended surface of traditional high heat rate metal fins is limited by the efficiency of the fins. The invention can rationally distribute the heat produced by the high-power electronic chip and efficiently expand it to the three-dimensional space expansion surface for dissipation, and has high heat dissipation power and high efficiency, thereby meeting the heat dissipation demand of the high heat flux density electronic chip with increasing power consumption.

Description of drawings

Fig. 1 is a schematic diagram of the three-dimensional structure of the present invention.

Fig. 2 is a schematic diagram of the overall assembly of the three-dimensional structure of the present invention.

Fig. 3 is a schematic view of the front view of the combination of the annular steam chamber base and the gravity heat pipe in the present invention.

Fig. 4 is a flow chart of making the base of the annular steam chamber in the present invention.

Fig. 5 is a flow chart of the fabrication of the combination of the gravity heat pipe and the annular steam chamber base in the present invention.

Fig. 6 is a schematic diagram of the intubation tube in the evaporation section in the present invention.

Fig. 7 is a schematic diagram of the intubation pipe in the condensation section in the present invention.

Fig. 8 is a schematic diagram of a gravity heat pipe shell in the present invention.

Fig. 9 is a schematic diagram of the top cover of the gravity heat pipe in the present invention.

Fig. 10 is a schematic diagram of heat-driven pulsating flow heat pipe fins in the present invention.

Fig. 11 is a schematic diagram of the assembly process of heat-driven pulsating flow heat pipe fins in the present invention.

In the figure: cooling fan 1, fastening bolt 2, enclosure bracket 3, heat-driven pulsating flow heat pipe fin 4, radial fin 5, annular steam chamber base 6, fastening handle 7, gravity heat pipe 8, Tie hoop 9, through hole 10, top cover 11, condensing section inner tube 12, shell 13, annular gap 14, evaporating section inner tube 15, steam chamber 16, heat conduction contact surface 17, cover plate 18, inner ring Open cavity 19, outer ring open cavity 20, base plate 21, three-dimensional micro-rib 22, prefabricated body 23, bubble-limiting through-hole 24, intubation pipe flow grid in the evaporation section 25, intubation pipe flow grid in the condensation section 26. Gradually expanding diversion section 27, flower-shaped card slot 28, chute 29, flange 30, trapezoidal three-dimensional micro-rib a, triangular-conical three-dimensional micro-rib b, cuboid three-dimensional micro-rib c.

detailed description

The present invention will be further described below in conjunction with accompanying drawing:

As shown in Figure 1-2, a multi-heat pipe composite high-power electronic chip radiator includes an annular steam cavity base 6, a gravity heat pipe 8, heat-driven pulsating flow heat pipe fins 4, a fastening handle 7, and a fastening handle. Hoop 9, cooling fan 1, enclosure bracket 3 and fastening bolt 2.

As shown in Figure 3-4, a multi-heat pipe composite high-power electronic chip radiator, the annular steam chamber base 6 is welded and processed by the base plate 21 and the cover plate 18, and the materials of each component are high thermal conductivity metal or Alloys, such as copper (alloy), aluminum (alloy), nickel (alloy), etc. The substrate 21 is processed with an inner ring opening cavity 19 and an outer ring opening cavity 20, and the back of the inner ring opening cavity 19 is processed with a high-power electronic chip heat-conducting contact surface 17; the cover plate 18 passes through the outer wall surface of the inner ring opening cavity 19 After the outer ring opening cavity 20 is sealed, the annular steam chamber base 6 is formed; the radial fins 5 are vertically welded on the top surface of the cover plate 18 in the radial direction, so as to increase the effective heat dissipation area, and its thickness, height and distribution density can be adjusted. Flexible adjustment according to the heat dissipation load; four through holes 10 are symmetrically opened on the outer edge of the annular steam chamber base 6 for fastening bolts 2 to pass through and fix. The top, bottom and surroundings of the inner wall of the steam chamber 16 inside the annular steam chamber base 6 are all plowed with cluster cutters to form three-dimensional micro-ribs 22. Or cuboid-shaped three-dimensional micro-rib c, the rib height is 0.1-0.2mm, and the rib density is 90-150/cm ² ; the radial rib spacing on the top and lower inner wall of the steam chamber 16 is 0.8-1.2mm, and the circumferential rib spacing 0.6-1.0mm; the axial rib spacing on the inner wall around the steam chamber 16 is 0.6-1.0mm, and the circumferential rib spacing is 0.8-1.2mm; the three-dimensional micro-ribs 22 effectively improve the nucleate boiling vaporization of the evaporation surface of the steam chamber 16 The number of cores and the capillary suction drainage capacity of the condensing surface increase the capillary limit of the steam chamber 16 and enhance boiling and condensation heat transfer. Before use, the steam chamber 16 needs to be evacuated and filled with working fluid. Since the heat dissipation load of the annular steam chamber base 6 is smaller than the heat dissipation load perpendicular to the direction of the high-power electronic chip, a liquid with a lower boiling point is selected as the working medium, such as F87 fluorinated fluid, R123, etc., the fluid filling rate of the working fluid is 30% to 50%.

As shown in Figure 3 and Figure 5, a multi-heat pipe composite high-power electronic chip radiator, the gravity heat pipe 8 is composed of the inner ring opening cavity 19 of the annular steam chamber base 6, the shell 13, and the inner insert pipe 15 of the evaporation section , the intubation pipe 12 of the condensing section and the top cover 11 are combined and welded, and the materials of each component are consistent with the base 6 of the annular steam chamber. The length of the intubation tube 15 in the evaporating section is 30% to 35% of the total height of the inner cavity of the gravity heat pipe 8, and the wall thickness is 1 to 2 mm. The bottom end of the evaporating section is processed with a flow grid 25 for the intubation tube, and the rest of the wall is staggered. A number of foam-limiting through-holes 24 are provided; the height of the intubation flow grid 25 in the evaporation section is 10-12mm, and the flow-through area accounts for more than 70% of the circular area at the same height; the diameter of the bubble-limiting through-holes 24 is 2-3mm. The vertical hole spacing is 6-10 mm, and the circumferential hole spacing is 4-8 mm. The specific value can be set according to the height and diameter of the intubation tube 15 in the evaporation section. The intubation tube 12 in the condensation section is a smooth tube with uniform wall thickness, and the length is 50% to 55% of the total height of the inner cavity of the gravity heat pipe 8. The top end of the intubation tube in the condensation section is provided with a flow grid 26, and the other end is processed with a gradually expanding Shape diversion section 27, the height of the diverging section is 10-12mm, the diverging angle θ=45°-60°, the intubation pipe 12 in the condensing section, the internal and external diameter of the non-expanding section and the flow grid of the intubating pipe in the condensing section 26 The dimensions are respectively consistent with the corresponding dimensions of the intubation pipe 15 in the evaporating section. The shell 13 is a hollow tubular structure with an inner diameter consistent with the inner diameter of the inner ring opening cavity 19 of the base of the annular steam chamber. A welding plane with the same ring size, and the outer wall is processed with a flower-shaped slot 28 installed with heat-supply-driven pulsating flow heat pipe fins 4; The heat pipe fin 4, the inner size of the card slot matches the inner ring pipeline of the heat-driven pulsating flow heat pipe fin 4 and adopts interference fit to fasten the heat-driven pulsating flow heat pipe fin 4; flower-shaped card slot 28 shafts A chute 29 matching the shape of the inner ring pipeline of the heat-driven pulsating flow heat pipe fin 4 is processed upward, and the heat supply drives the pulsating flow heat pipe fin 4 to slide into and install. The top cover 11 is a circular cover with the same diameter as the outer wall of the shell 13, with a thickness of 3-4mm. The bottom is provided with a positioning flange 30 matching the radial direction of the shell 13 to facilitate positioning welding with the shell 13. As shown in Figure 5, before the combined welding, the parts and welding contact surfaces are processed flat and cleaned, and then the inner insert pipe 15 of the evaporating section passes through the grid pins of the inner insert pipe flow grid 25 of the evaporating section and the annular steam The inner surface of the bottom inner surface of the inner ring opening cavity 19 of the base of the cavity is connected by coaxial vertical butt welding, and the housing 13 is inserted through the inner tube 15 of the evaporation section and welded through the inner ring opening cavity 19 of the base of the annular steam cavity; The intubation pipe 12 in the condensation section is welded coaxially and vertically to the lower surface of the top cover 11 through the grid pins of the intubation grid 26 in the condensation section to obtain the prefabricated body 23; finally, the prefabricated body 23 is coaxially inserted into the shell from the top The body 13 is sealed with the positioning flange 30 on the top cover 11 and the top of the housing 13 by positioning welding to form a closed cavity of the gravity heat pipe 8 . Check the seal of the gravity heat pipe 8, and then vacuumize and fill 25% to 30% of the working fluid. Since the gravity heat pipe 8 bears the main heat dissipation load of the high-power electronic chip, it is selected on the basis of considering the compatibility of the material of the pipe body. Liquid substances with high latent heat of vaporization are used as working fluids, such as water, methanol, etc. In this way, an annular gap 14 is formed between the outer wall of the inner tube 15 of the evaporation section, the outer wall of the inner tube 12 of the condensation section, and the inner wall of the gravity heat pipe 8, and the optimal size range of the annular gap is 3 to 5 mm; The growth of this segment of boiling bubbles in the annular space 14 is increased, the heating area of the bubbles by the liquid microlayer at the bottom of the bubbles is increased and the evaporation time of the microlayers is prolonged, and the bubble-limiting through hole 24 is helpful for the detachment of boiling bubbles , so that the boiling heat transfer in the evaporation section is strengthened; the intubation pipe 12 in the condensation section can guide the rising steam through the intubation flow grid 26 in the condensation section and return to the condensation heat release in the annulus of the condensation section, thus weakening the rising steam and backflow The countercurrent between the condensate carries and promotes the drainage of the condensate, which increases the carrying limit of the gravity heat pipe 8 and the condensation heat exchange intensity of the condensation section.

As shown in Figure 10, a multi-heat pipe composite high-power electronic chip radiator, heat-driven pulsating flow heat pipe fins 4 are connected end to end through capillary metal tubes and repeatedly bent into a petal shape, then evacuated and partially filled The equivalent inner diameter of the capillary metal tube is 0.5-3.0mm, the wall thickness is 0.15-0.2mm, and the liquid filling rate of the working medium is 50%-60%; petal-shaped heat-driven pulsating flow heat pipe fins 4 The diameter of the ring matches the minimum outer diameter of the outer wall of the gravity heat pipe 8, and the diameter of the outer ring should be within the diameter range of the circular arc where the through hole 10 on the outer edge of the base of the annular steam chamber is located, so as to facilitate the installation of the enclosure bracket 3; the petal-shaped The number of "petals" of heat-driven pulsating flow heat pipe fins 4 is greater than or equal to 6, so that enough channel elbows can provide sufficient surface tension in the tube and unbalanced thermal driving force between the tubes, thereby overcoming the impact of gravity on the thermal drive. The influence of the working performance of the pulsating flow heat pipe fin 4 makes it work efficiently in a horizontal state.

As shown in Figure 2 and Figure 11, a multi-heat pipe composite high-power electronic chip radiator, when assembling, the outer wall of the inner ring pipeline of the flower-shaped card slot 28 and the heat-driven pulsating flow heat pipe fin 4 are all painted Thermally conductive silicone grease to reduce contact thermal resistance; insert multiple heat-driven pulsating flow heat pipe fins 4 from top to bottom into the chute 29 of the flower-shaped card slot 28, and rotate into the card teeth for positioning after reaching their respective installation positions A multi-layer fin group is solidly formed, wherein, the pipe section that is inserted into the outer wall of the gravity heat pipe 8 by means of the flower-shaped slot 28 is the evaporation section, and the remaining pipe sections are the condensation section; the fins in the multi-layer fin group are arranged staggered along the axial direction, so that Make the pipelines in the condensation section of each layer form a turbulent flow with each other during work, and strengthen the forced convection heat dissipation outside the heat-driven pulsating flow heat pipe fins 4; the number of heat-driven pulsating flow heat pipe fins 4 and the axial distribution density can be adjusted Flexible adjustment according to the heat dissipation load; then, the evaporating section of the heat-driven pulsating flow heat pipe fin 4 is clamped and fixed on the flower-shaped card slot 28 through the fastening grip 7 from top to bottom through the staggered fin gap, and The tie hoops 9 that cooperate with each other at the bottom further constrain and fix the fastening handle 7 . Finally, the cooling fan is supported above the combination of the gravity heat pipe 8 and the heat-driven pulsating flow heat pipe fin 4 through the enclosure bracket 3, and the four corners of the cooling fan and the four legs of the enclosure bracket are processed with ring-shaped The bolt through holes corresponding to the through holes 10 on the outer edge of the steam chamber base, so that the cooling fan 1, the enclosure bracket 3 and the annular steam chamber base 6 can be connected in series with the fastening bolts 2 and connected with the corresponding fixing screw holes on the main board Tighten it, and fasten the heat conduction contact surface 17 on the back side of the inner ring opening cavity on the high-power electronic chip. The type of working medium filled in the heat-driven pulsating flow heat pipe fin 4 can be selected according to the metal compatibility of the pipe wall and the principle of energy cascade utilization. On the side near the bottom of the high-power electronic chip, the heat-driven pulsating flow heat pipe fin 4 has a higher temperature and heat dissipation load in the evaporation section, and the working fluid with a boiling point can be selected, such as acetone, FC-72 fluorinated liquid, etc.; on the side far away from the bottom of the electronic chip In the end section of heat dissipation, the heat-driven pulsating flow heat pipe fin 4 has a lower temperature and heat dissipation load in the evaporation section, and a working fluid with a lower boiling point can be selected, such as F87 fluorinated liquid, R123, etc. Heat-driven pulsating flow heat pipe fins 4 rely on heat-driven gas-liquid two-phase pulsating phase change latent heat transfer and sensible heat transport in the tube. The equivalent thermal conductivity is hundreds of times that of pure copper with equal cross-section, which significantly improves the traditional high-heat The heat transfer performance of the high-rate metal fins is limited due to the influence of the rib efficiency. At the same time, the heat-driven pulsating flow heat pipe fin 4 selects the heat pipe working fluid with the corresponding boiling point according to the heat dissipation load along the height direction of the gravity heat pipe 6. The cascade utilization of energy can be effectively realized.

Claims (10)

1. the combined type high power electronic chip radiator of heat pipe more than, including annular steam cavity pedestal (6), gravity assisted heat pipe (8), thermal drivers pulsating flow heat pipe type fin (4), fastening handgrip (7), pricks and binds round (9), radiator fan (1), goes along with sb. to guard him support (3) and fasten bolt (2)；It is characterized in that: described gravity assisted heat pipe (8) is installed vertically on described annular steam cavity pedestal (6), its internal cavity and described annular steam cavity pedestal (6) internal ring cavity are mutually communicated and are tightly connected；In staggered multilamellar flower-shape draw-in groove (28) fixed outside described gravity assisted heat pipe (8) upper body of some described thermal drivers pulsating flow heat pipe type fin (4), and described hoop (9) of pricking is coordinated to be close to fixing with described gravity assisted heat pipe (8) outer wall by described fastening handgrip (7)；Described radiator fan (1) goes along with sb. to guard him support (3) horizontal support in described gravity assisted heat pipe (8) top described in passing through, and utilizes the concatenation fastening of described fastening bolt (2).

2. one many heat pipes combined type high power electronic chip radiator according to claim 1, it is characterized in that: described annular steam cavity pedestal (6) is processed by substrate (21) and cover plate (18) Combination Welding, the upper processing of substrate (21) has internal ring open cavity (19) and outer ring opening cavity (20), the processing of internal ring open cavity (19) back side has high power electronic chip thermal conductive contact face (17), annular steam cavity pedestal (6) top is provided with radial fin (5), the processing of vapor chamber (16) inner surface has three-dimensional micro-rib (22).

3. one many heat pipes combined type high power electronic chip radiator according to claim 2, it is characterized in that: the micro-rib of described three-dimensional (22) is the one in the three-dimensional micro-rib (a) of bucking ladder shape, the three-dimensional micro-rib (b) of triangular pyramidal or the cuboid micro-rib (c) of three-dimensional, rib height is 0.1～0.2mm, and rib density is 90～150/cm²；Vapor chamber (16) top is 0.8～1.2mm with the radial rib spacing in lower inner wall, and circumferential rib spacing is 0.6～1.0mm；Axial rib spacing on vapor chamber (16) surrounding inwall is 0.6～1.0mm, and circumferential rib spacing is 0.8～1.2mm.

4. one many heat pipes combined type high power electronic chip radiator according to claim 1, it is characterized in that: described gravity assisted heat pipe (8) is by annular steam cavity pedestal internal ring open cavity (19), housing (13), evaporator section interpolation pipe (15), condensation segment interpolation pipe (12) and top closure (11) Combination Welding process, the condensation segment interpolation pipe (12) with gravity assisted heat pipe (8) coaxial placement and evaporator section interpolation pipe (15) it is provided with in gravity assisted heat pipe (8), condensation segment interpolation pipe (12) length is the 50%～55% of gravity heat pipe inner chamber total height, evaporator section interpolation pipe (15) length is the 30%～35% of gravity heat pipe inner chamber total height.

5. one many heat pipes combined type high power electronic chip radiator according to claim 4, it is characterized in that: described evaporator section interpolation pipe (15) bottom is provided with the through-flow grid of evaporator section interpolation pipe (25), on evaporator section interpolation pipe (15) wall, stagger arrangement offers some limits bubble through hole (24), the aperture of limit bubble through hole (24) is 2～3mm, longitudinal hole spacing is 6～10mm, and circumference pitch of holes is 4～8mm.

6. one many heat pipes combined type high power electronic chip radiator according to claim 4, it is characterized in that: the plain tube that described condensation segment interpolation pipe (12) is uniform wall thickness, its top is provided with the through-flow grid of condensation segment interpolation pipe (26), the other end is provided with gradually expanded form diversion section (27), gradually expanded form diversion section (27) is highly 10～12mm, θ=45 °～60 °, flaring angle.

7. one many heat pipes combined type high power electronic chip radiator according to claim 4, it is characterized in that: inside and outside described evaporator section interpolation pipe (15) and condensation segment interpolation pipe (12), caliber is unified, and the optimum size scope each forming annular space between outer wall and gravity assisted heat pipe inwall is 3～5mm.

8. one many heat pipes combined type high power electronic chip radiator according to claim 1, it is characterized in that: described thermal drivers pulsating flow heat pipe type fin (4) is end to end by capillary metal tube and is repeatedly bent into petal rear evacuation the filled working medium of part and makes, and the minimum outer diameter of petal thermal drivers pulsating flow heat pipe type fin (4) annular diameters and gravity assisted heat pipe (8) outside wall surface matches.

9. one many heat pipes combined type high power electronic chip radiator according to claim 1, it is characterised in that: " petal " number of described capillary metal tube is be more than or equal to 6, and its internal equivalent diameter is between 0.5～3.0mm, and wall thickness is 0.15～0.2mm.

10. one many heat pipes combined type high power electronic chip radiator according to claim 1, it is characterized in that: described flower-shape draw-in groove (28) is multiple structure, every layer of draw-in groove fixes thermal drivers pulsating flow heat pipe type fin (4), and its draw-in groove inside dimension and thermal drivers pulsating flow heat pipe type fin (4) internal ring pipeline match and adopt interference fit to be fixed by thermal drivers pulsating flow heat pipe type fin (4)；Flower-shape draw-in groove (28) is axially processed the chute (29) matched with thermal drivers pulsating flow heat pipe type fin (4) internal ring pipeline profile, slips into installation for thermal drivers pulsating flow heat pipe type fin (4).