CN105817607A - Method for raising combination intensity of liquid and solid compound interface of aluminum/copper double metal - Google Patents
Method for raising combination intensity of liquid and solid compound interface of aluminum/copper double metal Download PDFInfo
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- 239000007787 solid Substances 0.000 title claims abstract description 49
- 239000010949 copper Substances 0.000 title claims abstract description 47
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 26
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 title abstract description 6
- 239000002184 metal Substances 0.000 title abstract description 6
- 239000007788 liquid Substances 0.000 title abstract 7
- 150000001875 compounds Chemical class 0.000 title abstract 4
- 239000002131 composite material Substances 0.000 claims abstract description 48
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 44
- 239000000956 alloy Substances 0.000 claims abstract description 44
- 239000011159 matrix material Substances 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims abstract description 3
- 239000010453 quartz Substances 0.000 claims description 42
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 42
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 15
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000011259 mixed solution Substances 0.000 claims description 4
- 239000004115 Sodium Silicate Substances 0.000 claims description 3
- 239000003513 alkali Substances 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 238000013329 compounding Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 235000021110 pickles Nutrition 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 238000001816 cooling Methods 0.000 abstract description 2
- 238000007792 addition Methods 0.000 description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 229910000765 intermetallic Inorganic materials 0.000 description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005266 casting Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910018182 Al—Cu Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 210000001787 dendrite Anatomy 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000001488 sodium phosphate Substances 0.000 description 2
- 229910000162 sodium phosphate Inorganic materials 0.000 description 2
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005058 metal casting Methods 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D19/00—Casting in, on, or around objects which form part of the product
- B22D19/16—Casting in, on, or around objects which form part of the product for making compound objects cast of two or more different metals, e.g. for making rolls for rolling mills
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Abstract
Description
技术领域technical field
本发明属于有色金属铸造方法技术领域，具体涉及提高铝铜双金属液固复合界面结合强度的方法。The invention belongs to the technical field of nonferrous metal casting methods, and in particular relates to a method for improving the bonding strength of an aluminum-copper bimetallic liquid-solid composite interface.
背景技术Background technique
据英国《材料科学技术》(2013年第29卷第2期、190-196页)介绍，在利用液固复合铸造的方法制备铝铜双金属复合材料过程中，铜表面的氧化物层阻碍了铝铜间原子的相互扩散，致使铝铜间无法实现连续完整的冶金结合，同时在复合界面处易产生脆性金属间化合物，降低了界面结合强度，由于铝、铜的线膨胀系数不同，在冷却过程中铝铜复合界面将产生很大的应力，当界面结合强度较低时会致使铝铜复合界面开裂，大大降低了接头的综合性能。According to the British "Materials Science and Technology" (2013, Vol. 29, No. 2, pp. 190-196), in the process of preparing aluminum-copper bimetallic composite materials by liquid-solid composite casting, the oxide layer on the copper surface hinders The interdiffusion of atoms between aluminum and copper makes it impossible to achieve continuous and complete metallurgical bonding between aluminum and copper. At the same time, brittle intermetallic compounds are easily produced at the composite interface, which reduces the interface bonding strength. Due to the different linear expansion coefficients of aluminum and copper, when cooling During the process, the aluminum-copper composite interface will generate a lot of stress. When the interface bonding strength is low, it will cause the aluminum-copper composite interface to crack, which greatly reduces the overall performance of the joint.
发明内容Contents of the invention
本发明的目的是提出一种提高铝铜双金属液固复合界面结合强度的方法，以克服现有铝铜双金属液固复合界面强度低、脆性大的缺点，获得界面组织性能优化的铝铜双金属复合材料。The purpose of the present invention is to propose a method for improving the bonding strength of the aluminum-copper bimetallic liquid-solid composite interface, to overcome the shortcomings of the existing aluminum-copper bimetallic liquid-solid composite interface, such as low strength and high brittleness, and to obtain aluminum-copper with optimized interface structure and performance bimetallic composites.
本发明提高铝铜双金属液固复合界面结合强度的方法，包括：The method for improving the bonding strength of the aluminum-copper bimetallic liquid-solid composite interface of the present invention comprises:
将纯度不低于99.9％的铜块，经打磨、清洗后，放入含8-12g/L氢氧化钠、25-30g/L碳酸钠、50-60g/L磷酸钠和8-12g/L硅酸钠的混合液中50-60℃碱洗15-20分钟后，用酒精冲洗并烘干，再放入体积百分浓度为10-15％的硫酸中酸洗30-40秒后，用酒精冲洗并烘干，获得经过预处理的铜基体；其特征在于：按质量比1:0.03～0.15取A390铝合金和Al-P中间合金两种固体颗粒组成混合合金，其中P在Al-P中间合金中的质量分数为3％，使P在这混合合金中的质量分数为0.1～0.4％；采用真空液固复合装置将混合合金与经过预处理的铜基体进行铝铜双金属液固复合：After grinding and cleaning copper blocks with a purity of not less than 99.9%, put them into Wash with alkali at 50-60°C for 15-20 minutes in the mixed solution of sodium silicate, rinse and dry with alcohol, then pickle in sulfuric acid with a concentration of 10-15% by volume for 30-40 seconds, then use Rinse with alcohol and dry to obtain a pretreated copper matrix; it is characterized in that: two solid particles of A390 aluminum alloy and Al-P intermediate alloy are used in a mass ratio of 1:0.03-0.15 to form a mixed alloy, wherein P is in Al-P The mass fraction in the master alloy is 3%, so that the mass fraction of P in the mixed alloy is 0.1-0.4%; the mixed alloy and the pretreated copper matrix are subjected to aluminum-copper bimetallic liquid-solid compounding by using a vacuum liquid-solid composite device :
所述真空液固复合装置的炉腔中安置有石英管B，石英管B内的托盘C通过与其相连接的磁力推杆A控制托盘C在石英管B内水平移动，通过环绕配置在石英管B外的电阻炉F将石英管注射器D内的混合合金加热融化以及预热托盘C上的铜基体，石英管注射器D内部的注射杆与磁力推杆E相连，通过磁力推杆E推动石英管注射器D内部的注射杆将加热融化后的混合合金挤出；A quartz tube B is placed in the furnace cavity of the vacuum liquid-solid composite device, and the tray C in the quartz tube B controls the horizontal movement of the tray C in the quartz tube B through the magnetic push rod A connected to it. The resistance furnace F outside B heats and melts the mixed alloy in the quartz tube injector D and preheats the copper substrate on the tray C. The injection rod inside the quartz tube injector D is connected with the magnetic push rod E, and the quartz tube is pushed by the magnetic push rod E The injection rod inside the syringe D extrudes the heated and melted mixed alloy;
将石英管B两端的可拆卸真空密封阀门G和H拆下，并将石英管B由电阻炉F的炉腔中取出，将铜基体放在托盘C上，并通过磁力推杆A水平拉离电阻炉F的加热区，将混合合金置于石英管注射器D内，随后将石英管B装入炉腔，将石英管B两端的真空密封阀门G、H密封并抽真空至10-3～10-4Pa，再充入氩气至0.01～0.02Mpa，控制电阻炉F加热混合合金至形成熔融铝液，然后通过磁力推杆A将装有铜基体的托盘C水平移动至石英管注射器D顶端正下方的位置预热，再通过磁力推杆E推挤石英管注射器D中的注射杆，将1～2g的熔融铝液均匀滴落在铜基体上，最后冷却至室温，即获得铝铜双金属液固复合材料。Remove the detachable vacuum-sealed valves G and H at both ends of the quartz tube B, and take the quartz tube B out of the furnace cavity of the resistance furnace F, put the copper substrate on the tray C, and pull it away horizontally through the magnetic push rod A In the heating zone of the resistance furnace F, put the mixed alloy in the quartz tube injector D, then put the quartz tube B into the furnace cavity, seal the vacuum sealing valves G and H at both ends of the quartz tube B and evacuate to 10 -3 ~10 -4 Pa, then fill with argon gas to 0.01-0.02Mpa, control the resistance furnace F to heat the mixed alloy to form molten aluminum, and then move the tray C with the copper substrate horizontally to the top of the quartz tube injector D through the magnetic push rod A Preheat the position directly below, and then push the injection rod in the quartz tube syringe D through the magnetic push rod E, drop 1~2g of molten aluminum evenly on the copper substrate, and finally cool to room temperature to obtain the aluminum-copper double Metal-liquid-solid composites.
所述混合合金中P的质量分数优选0.2～0.4％。The mass fraction of P in the mixed alloy is preferably 0.2-0.4%.
由于本发明采取了在铝铜双金属液固复合过程中加入Al-P中间合金的方法，一方面，利用反应：2P+5CuO＝5Cu+P2O5在液固复合过程中去除铜表面的氧化物，使铝铜间良好的冶金结合得以形成，克服了现有铝铜液固复合铸造方法中铜经表面处理后被再次氧化的问题；另一方面，混合合金中P的质量分数为0.2～0.4％时，Al-P中间合金的加入提高了熔体的过冷度，增加了凝固形核的驱动力，从而控制了脆性金属间化合物的长大，克服了现有铝铜液固复合铸造方法中复合界面强度低、脆性大的缺点，且此方法不受工件形状、尺寸等影响，成本低、操作简单。Because the present invention has taken the method that adds Al-P intermediate alloy in the aluminum-copper double metal liquid-solid composite process, on the one hand, utilizes reaction: 2P+5CuO=5Cu+P 2 O 5 removes the copper surface in the liquid-solid composite process Oxide, so that a good metallurgical bond between aluminum and copper can be formed, which overcomes the problem that copper is re-oxidized after surface treatment in the existing aluminum-copper liquid-solid composite casting method; on the other hand, the mass fraction of P in the mixed alloy is 0.2 When ~0.4%, the addition of Al-P master alloy improves the undercooling of the melt and increases the driving force of solidification nucleation, thereby controlling the growth of brittle intermetallic compounds and overcoming the existing aluminum-copper liquid-solid composite The casting method has the disadvantages of low composite interface strength and high brittleness, and this method is not affected by the shape and size of the workpiece, and has low cost and simple operation.
附图说明Description of drawings
图1为真空液固复合实验装置的示意图；Fig. 1 is the schematic diagram of vacuum liquid-solid composite experimental device;
图2为未添加Al-P中间合金的铝铜双金属液固复合界面的显微组织照片。Figure 2 is a photo of the microstructure of the aluminum-copper bimetal liquid-solid composite interface without adding Al-P master alloy.
图3为P的添加量为0.1wt.％的铝铜双金属液固复合界面的显微组织照片。Figure 3 is a photo of the microstructure of the aluminum-copper bimetallic liquid-solid composite interface with the addition of 0.1wt.% of P.
图4为P的添加量为0.2wt.％的铝铜双金属液固复合界面的显微组织照片。Figure 4 is a photo of the microstructure of the aluminum-copper bimetallic liquid-solid composite interface with the addition of 0.2wt.% of P.
图5为P的添加量为0.4wt.％的铝铜双金属液固复合界面的显微组织照片。Figure 5 is a photo of the microstructure of the aluminum-copper bimetallic liquid-solid composite interface with the addition of 0.4wt.% of P.
图6为不同P添加量的铝铜双金属液固复合样品的剪切强度对比图。Figure 6 is a comparative diagram of the shear strength of Al-Cu bimetallic liquid-solid composite samples with different P additions.
具体实施方式detailed description
以下通过实施例并结合附图来对本发明的实施工艺和效果作进一步的阐述。The implementation process and effects of the present invention will be further described below through examples and in conjunction with the accompanying drawings.
实施例1：Example 1:
本实施例中采用的铜基体是将T2纯铜样品切割加工成尺寸为20mm×15mm×4mm的铜块，通过机械打磨去除表面的污垢，随后在丙酮中超声清洗15分钟并干燥，再将其放入55℃的含10g/L氢氧化钠、25g/L碳酸钠、55g/L磷酸钠和10g/L硅酸钠的混合溶液中碱洗15分钟，经过酒精冲洗并烘干后，再放入体积百分浓度为10％的硫酸中酸洗30秒，随后用酒精冲洗并烘干，获得经过预处理的铜基体。上述预处理铜基体也可在混合溶液温度50-60℃，氢氧化钠浓度在8-12g/L，碳酸钠浓度在25-30g/L范围内，磷酸钠浓度在50-60g/L，硅酸钠浓度在8-12g/L，硫酸体积百分浓度在10-15％进行；所述碱洗15-20分钟，酸洗30-40秒，都能满足预处理的实验效果。The copper substrate used in this example is to cut the T2 pure copper sample into a copper block with a size of 20mm×15mm×4mm, remove the dirt on the surface by mechanical grinding, and then ultrasonically clean it in acetone for 15 minutes and dry it. Put it into a mixed solution containing 10g/L sodium hydroxide, 25g/L sodium carbonate, 55g/L sodium phosphate and 10g/L sodium silicate at 55°C for alkaline washing for 15 minutes, rinse with alcohol and dry, then put pickling in sulfuric acid with a concentration of 10% by volume for 30 seconds, followed by rinsing with alcohol and drying to obtain a pretreated copper matrix. The above-mentioned pretreated copper substrate can also be prepared at a mixed solution temperature of 50-60°C, a sodium hydroxide concentration of 8-12g/L, a sodium carbonate concentration of 25-30g/L, a sodium phosphate concentration of 50-60g/L, and silicon The concentration of sodium acid is 8-12g/L, and the concentration of sulfuric acid is 10-15% by volume; the alkali washing for 15-20 minutes and the acid washing for 30-40 seconds can both meet the experimental effect of pretreatment.
分别按质量比为1:0.03、1:0.07、1:0.15称量A390铝合金和Al-P中间合金，混合获得P的添加量(占混合合金总质量的百分比)分别为0.1wt.％、0.2wt.％和0.4wt.％的三种混合合金，为确保有足够量的混合合金与铜基体进行液固复合，称量的混合合金的质量为2.5g；另称量2.5gA390铝合金用于做对比试验；下面分别对A390铝合金和混合合金进行铝铜双金属液固复合实验。Weigh the A390 aluminum alloy and the Al-P master alloy according to the mass ratio of 1:0.03, 1:0.07, and 1:0.15, respectively, and mix to obtain the addition amount of P (the percentage of the total mass of the mixed alloy) to be 0.1wt.%, 0.2wt.% and 0.4wt.% of the three mixed alloys, in order to ensure that there is a sufficient amount of mixed alloys and copper matrix for liquid-solid compounding, the weight of the mixed alloys weighed is 2.5g; another 2.5g of A390 aluminum alloy is used for weighing In order to do a comparative test; the following is the aluminum-copper bimetallic liquid-solid composite experiment on the A390 aluminum alloy and the mixed alloy.
本发明方法中采用真空液固复合实验装置来进行混合合金与铜之间的铝铜双金属液固复合工艺过程。图1给出了真空液固复合实验装置的示意图。该真空液固复合实验装置主要由磁力推杆A、石英管B、托盘C、石英管注射器D、磁力推杆E、电阻炉F以及真空密封阀门G、H构成；石英管B(外径55mm、内径50mm、长570mm)的两端由可拆卸的真空密封阀门G、H密封，托盘C与磁力推杆A相连，并可通过磁力推杆A控制托盘C在石英管B内水平移动，通过电阻炉F(长365mm、宽325mm、高325mm)可将石英管注射器D(内径6-8mm、长290mm)内的混合合金加热融化以及预热托盘C上的铜基体，石英管注射器D内部的注射杆与磁力推杆E相连，通过磁力推杆E推动石英管注射器D内部的注射杆将加热融化后的混合合金挤出。In the method of the invention, a vacuum liquid-solid composite experimental device is used to carry out the aluminum-copper bimetallic liquid-solid composite process between the mixed alloy and copper. Figure 1 shows a schematic diagram of the vacuum liquid-solid composite experimental device. The vacuum liquid-solid composite experimental device is mainly composed of a magnetic push rod A, a quartz tube B, a tray C, a quartz tube syringe D, a magnetic push rod E, a resistance furnace F, and vacuum-sealed valves G and H; the quartz tube B (outer diameter 55mm , inner diameter 50mm, length 570mm) are sealed by detachable vacuum sealing valves G and H, the tray C is connected with the magnetic push rod A, and the tray C can be controlled to move horizontally in the quartz tube B through the magnetic push rod A, through Resistance furnace F (length 365mm, width 325mm, height 325mm) can heat and melt the mixed alloy in the quartz tube syringe D (inner diameter 6-8mm, length 290mm) and preheat the copper substrate on the tray C, and the inside of the quartz tube syringe D The injection rod is connected with the magnetic push rod E, and the injection rod inside the quartz tube syringe D is pushed through the magnetic push rod E to extrude the heated and melted mixed alloy.
进行铝铜双金属液固复合实验时，先将真空密封阀门G、H由石英管B的两端拆下，并将石英管B由电阻炉F的炉腔中取出，将铜基体放在托盘C上，并通过磁力推杆A水平拉离电阻炉F的加热区，将混合合金置于石英管注射器D内，随后将石英管B装入炉腔，将石英管B两端的真空密封阀门G、H密封并对管腔内进行抽真空，时间不少于15分钟，使真空度达到10-3～10-4Pa，之后再充入氩气至0.01～0.02Mpa。随后根据石英管注射器D顶端的位置，通过磁力推杆A调节装有铜基体的托盘C位置，保证熔融铝液能够准确无误的滴落在铜基体表面。托盘C位置调准后，将其拉离中间的加热区。When carrying out the aluminum-copper bimetal liquid-solid composite experiment, first remove the vacuum-sealed valves G and H from both ends of the quartz tube B, and take the quartz tube B out of the furnace cavity of the resistance furnace F, and put the copper substrate on the tray C, and horizontally pull away from the heating zone of the resistance furnace F through the magnetic push rod A, place the mixed alloy in the quartz tube injector D, then put the quartz tube B into the furnace cavity, and seal the vacuum seal valve G at both ends of the quartz tube B , H sealing and vacuuming the lumen for not less than 15 minutes to make the vacuum degree reach 10 -3 ~ 10 -4 Pa, and then fill with argon gas to 0.01 ~ 0.02Mpa. Then, according to the position of the top of the quartz tube syringe D, the position of the tray C equipped with the copper substrate is adjusted through the magnetic push rod A to ensure that the molten aluminum can drip on the surface of the copper substrate accurately. Once tray C is in position, pull it away from the central heating zone.
按预定的温度及保温时间设置好电阻炉F的加热程序，加热混合合金至800℃形成熔融铝液；通过磁力推杆A移动托盘C将铜基体移至石英管注射器D顶端正下方位置，预热到设定温度650℃(预热1.5min时即可达到该温度)后，通过磁力推杆E推挤石英管注射器D中的注射杆，将1～2g熔融铝液滴落在铜基体上(本实施例中所滴熔融铝液为1.5g)，随即关闭电阻炉加热程序，将该铝铜双金属复合样品移至炉口处冷却至室温，获得铝铜双金属液固复合材料。Set the heating program of the resistance furnace F according to the predetermined temperature and holding time, heat the mixed alloy to 800°C to form molten aluminum; move the tray C through the magnetic push rod A to move the copper matrix to the position directly below the top of the quartz tube syringe D, pre-set After heating to the set temperature of 650°C (the temperature can be reached after 1.5 minutes of preheating), push the injection rod in the quartz tube syringe D through the magnetic push rod E, and drop 1 to 2 g of molten aluminum onto the copper substrate (1.5 g of molten aluminum was dropped in this embodiment), and then the resistance furnace heating program was turned off, and the aluminum-copper bimetallic composite sample was moved to the furnace mouth and cooled to room temperature to obtain the aluminum-copper bimetallic liquid-solid composite material.
本发明在铝铜液固复合过程中添加Al-P中间合金，一方面去除铜表面的氧化物层，促使铝铜间形成良好的冶金结合，另一方面控制脆性金属间化合物的长大，从而提高界面结合强度，增强铝铜双金属接头的综合性能。The present invention adds Al-P master alloy in the aluminum-copper liquid-solid composite process, on the one hand, removes the oxide layer on the copper surface, promotes the formation of a good metallurgical bond between aluminum and copper, and on the other hand controls the growth of brittle intermetallic compounds, thereby Improve the interface bonding strength and enhance the comprehensive performance of aluminum-copper bimetallic joints.
保持上述铝铜液固复合过程中的其它实验条件不变，而把2.5g混合合金替换为2.5gA390铝合金进行对比试验。图2为未添加Al-P中间合金的铝铜双金属液固复合界面的显微组织照片。The other experimental conditions in the above-mentioned aluminum-copper liquid-solid composite process were kept unchanged, and 2.5g of the mixed alloy was replaced by 2.5g of A390 aluminum alloy for comparative experiments. Figure 2 is a photo of the microstructure of the aluminum-copper bimetal liquid-solid composite interface without adding Al-P master alloy.
图3、图4、图5分别为P的添加量为0.1wt.％、0.2wt.％和0.4wt.％的铝铜双金属液固复合界面的显微组织照片。Figure 3, Figure 4, and Figure 5 are microstructure photos of the aluminum-copper bimetal liquid-solid composite interface with P additions of 0.1wt.%, 0.2wt.%, and 0.4wt.%, respectively.
图6为不同P添加量的铝铜双金属液固复合样品的剪切强度对比图。Figure 6 is a comparative diagram of the shear strength of Al-Cu bimetallic liquid-solid composite samples with different P additions.
图2中，界面下方浅色区域为铜基体，界面处黑色区域为孔洞，界面上方灰黑相间的区域为共晶组织Al2Cu+a-Al，黑色区域为a-Al枝晶。图3、图4、图5中，界面上方浅色块状区域为液固复合过程中产生的脆性金属间化合物Al2Cu，灰黑相间的区域为共晶组织Al2Cu+a-Al，黑色区域为a-Al枝晶。通过对比图2、图3、图4、图5可以看出，在未添加Al-P中间合金的情况下，铝铜接头未能形成良好的冶金结合，在界面处出现了较明显的孔洞；在添加了Al-P中间合金后，铝铜接头形成了连续完整的复合界面，且随着P加入量的提高，脆性金属间化合物的厚度由P添加量为0.1wt.％时的1500μm降低到P添加量分别为0.2wt.％和0.4wt.％时的900μm和200μm。相应地，如图6所示，铝铜双金属液固复合材料接头强度也由最初没有添加P时的26.28Mpa提高到P添加量分别为0.1wt.％、0.2wt.％和0.4wt.％时的32.75Mpa、70.11Mpa和96.36Mpa。In Figure 2, the light-colored area below the interface is the copper matrix, the black area at the interface is the hole, the gray-black area above the interface is the eutectic Al 2 Cu+a-Al, and the black area is the a-Al dendrite. In Figure 3, Figure 4, and Figure 5, the light-colored blocky area above the interface is the brittle intermetallic compound Al 2 Cu produced during the liquid-solid composite process, and the gray-black area is the eutectic structure Al 2 Cu+a-Al, The black areas are a-Al dendrites. By comparing Figure 2, Figure 3, Figure 4, and Figure 5, it can be seen that without the addition of Al-P master alloy, the aluminum-copper joint failed to form a good metallurgical bond, and obvious holes appeared at the interface; After adding the Al-P master alloy, the aluminum-copper joint formed a continuous and complete composite interface, and with the increase of the P addition, the thickness of the brittle intermetallic compound decreased from 1500 μm when the P addition was 0.1wt.%. The P addition amounts are 900 μm and 200 μm at 0.2wt.% and 0.4wt.%, respectively. Correspondingly, as shown in Figure 6, the joint strength of aluminum-copper bimetallic liquid-solid composites also increased from 26.28Mpa when P was not added initially to the addition of P at 0.1wt.%, 0.2wt.% and 0.4wt.%. 32.75Mpa, 70.11Mpa and 96.36Mpa.
上面结合附图对本发明进行了示例性描述，可见采用本发明方法可以有效地去除铜表面的氧化物，并控制脆性金属间化合物的生长，从而提高铝铜双金属液固复合界面结合强度，且采用本发明方法不受工件形状、尺寸等影响，成本低、操作简单。The present invention has been exemplarily described above in conjunction with the accompanying drawings. It can be seen that the oxides on the copper surface can be effectively removed by the method of the present invention, and the growth of brittle intermetallic compounds can be controlled, thereby improving the bonding strength of the aluminum-copper bimetallic liquid-solid composite interface, and The method of the invention is not affected by the shape and size of workpieces, and has low cost and simple operation.
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