CN105801171A - Preparation method for diamond with controllable surface coating thickness, and product prepared by using the same - Google Patents
Preparation method for diamond with controllable surface coating thickness, and product prepared by using the same Download PDFInfo
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Abstract
本发明涉及一种制备表面镀层厚度受控的金刚石的方法,所述方法包括如下步骤:(1)提供一表面镀层的金刚石D,其中,所述表面镀层的金刚石D包括金刚石和结合于所述金刚石表面的表面镀层C;(2)将所述表面镀层的金刚石D进行高温处理使得所述镀层出现微裂纹或微损伤;(3)将经步骤(2)高温处理的所述表面镀层的金刚石进行脱落处理,制得表面镀层厚度减薄的金刚石。本发明还公开了使用所述方法制备的产品。所述方法处理设备简单,制备工艺简单、快速。The present invention relates to a method for preparing a diamond with a controlled thickness of the surface coating, the method comprising the following steps: (1) providing a diamond D with a surface coating, wherein the diamond D of the surface coating includes diamond and bonded to the The surface coating C on the diamond surface; (2) carrying out high-temperature treatment to the diamond D of the surface coating so that microcracks or micro-damages occur in the coating; (3) the diamond D of the surface coating processed through step (2) Exfoliation treatment is carried out to obtain a diamond with a thinned surface coating. The invention also discloses the products prepared by the method. The method has simple processing equipment and simple and rapid preparation process.
Description
技术领域technical field
本发明涉及金刚石复合材料领域,具体地涉及一种控制金刚石表面镀层厚度的方法及使用该方法制得的产品。The invention relates to the field of diamond composite materials, in particular to a method for controlling the thickness of a diamond surface coating and a product obtained by using the method.
背景技术Background technique
目前,金刚石工具应用于机械工具市场以及导热复合材料市场的过程中,由于金刚石与金属或硬质合金基体之间的结合强度低,因此往往需要在金刚石表面镀覆化合物层或合金层,在这个过程中,镀层厚度的控制在一些高端应用场合显得尤为重要。At present, when diamond tools are used in the mechanical tool market and the heat-conducting composite material market, due to the low bonding strength between diamond and metal or hard alloy substrates, it is often necessary to coat the diamond surface with a compound layer or alloy layer. In this In the process, the control of coating thickness is particularly important in some high-end applications.
如在金刚石-金属导热复合材料制备过程中,为提高金刚石与金属之间的结合强度,往往在金刚石与金属之间引入强碳化物元素层。现有较优异的工艺是在金刚石粉体表面镀层,但镀层厚度高会导致金刚石与金属之间的界面热阻较大,影响复合材料的热导率,因此需要对金刚石粉体表面镀层厚度进行控制。For example, in the preparation process of diamond-metal heat-conducting composite materials, in order to improve the bonding strength between diamond and metal, a strong carbide element layer is often introduced between diamond and metal. The existing relatively excellent process is to coat the surface of diamond powder, but the high thickness of the coating will lead to a large interface thermal resistance between the diamond and the metal, which will affect the thermal conductivity of the composite material. control.
如在金刚石粉体表面镀层后制备金刚石砂轮的过程中,也需要对金刚石表面镀层厚度进行控制。过厚的金刚石表面镀层由于外界影响会导致与金刚石或基体间的结合强度下降,且过厚的金刚石表面镀层会影响后续的电镀等工艺因素。因此,金刚石粉体表面镀层厚度的控制成为精密工具制备的一大制约因素。For example, in the process of preparing the diamond grinding wheel after the surface coating of the diamond powder, it is also necessary to control the thickness of the diamond surface coating. Too thick diamond surface coating will reduce the bonding strength with diamond or substrate due to external influences, and too thick diamond surface coating will affect subsequent process factors such as electroplating. Therefore, the control of the coating thickness on the surface of diamond powder has become a major constraint factor in the preparation of precision tools.
现有技术往往通过对金刚石表面镀层过程中工艺的改进来控制金刚石表面镀层的厚度,这种技术手段往往需要花费大量的时间以及成本才能满足要求。In the existing technology, the thickness of the diamond surface coating is often controlled by improving the process of the diamond surface coating process. This technical means often takes a lot of time and cost to meet the requirements.
综上所述,目前在上述两个领域迫切需要开发一种工艺简单、成本降低的金刚石表面镀层厚度控制方法。To sum up, there is an urgent need to develop a method for controlling the thickness of the diamond surface coating with simple process and low cost in the above two fields.
发明内容Contents of the invention
本发明的目的在于提供一种处理设备简单,制备工艺简单、快速的金刚石表面镀层厚度控制方法。The object of the present invention is to provide a method for controlling the thickness of the diamond surface coating with simple processing equipment and simple and rapid preparation process.
在本发明的第一方面,提供了一种制备表面镀层厚度受控的金刚石的方法,包括如下步骤:In a first aspect of the present invention, a method for preparing a diamond with a controlled surface coating thickness is provided, comprising the steps of:
(1)提供一表面镀层的金刚石D,其中,所述表面镀层的金刚石D包括金刚石和结合于所述金刚石表面的表面镀层C;所述表面镀层C包括第一镀层C1和第二镀层C2;所述第一镀层C1位于所述金刚石和所述第二镀层C2之间;(1) provide the diamond D of a surface coating, wherein, the diamond D of the surface coating comprises diamond and is bonded to the surface coating C of the described diamond surface; The surface coating C comprises the first coating C1 and the second coating C2; The first coating C1 is located between the diamond and the second coating C2;
所述第一镀层C1为碳化物层,选自下组:碳化钨、碳化铬、碳化钼、碳化钛、或其组合;The first coating layer C1 is a carbide layer selected from the group consisting of tungsten carbide, chromium carbide, molybdenum carbide, titanium carbide, or combinations thereof;
所述第二镀层C2为碳化物元素层或其合金层,选自下组:钨、铬、钼、钛、或其组合;The second coating C2 is a carbide element layer or an alloy layer thereof, selected from the group consisting of tungsten, chromium, molybdenum, titanium, or a combination thereof;
所述第一镀层C1的厚度为c1,所述第二镀层C2的厚度为c2;The thickness of the first coating layer C1 is c1, and the thickness of the second coating layer C2 is c2;
(2)将所述表面镀层的金刚石D进行高温处理,使得所述第二镀层C2部分出现裂纹;(2) Carrying out high-temperature treatment to the diamond D of the surface coating, so that cracks appear in the second coating C2;
(3)将经步骤(2)高温处理的所述表面镀层的金刚石进行脱落处理,脱落所述第二镀层C2至目标厚度c2’,制得表面镀层厚度减薄的金刚石D’,其中0≤c2’<c2。(3) Carrying out the diamond of the described surface coating of step (2) high-temperature treatment, falling off the second coating C2 to the target thickness c2', and obtaining a diamond D' with a reduced thickness of the surface coating, wherein 0≤ c2'<c2.
在另一优选例中,所述第二镀层部分或全部脱落。In another preferred example, the second plating layer is partially or completely peeled off.
在另一优选例中,所述高温处理包括如下步骤:将所述表面镀层的金刚石D置于处理温度为200~1500℃且处理气氛为非氧化性气氛的反应炉中。In another preferred example, the high-temperature treatment includes the following steps: placing the surface-coated diamond D in a reaction furnace with a treatment temperature of 200-1500° C. and a non-oxidizing atmosphere.
在另一优选例中,所述处理温度较佳地为300~1000℃,更佳地为650~850℃。In another preferred example, the treatment temperature is preferably 300-1000°C, more preferably 650-850°C.
在另一优选例中,所述表面镀层的金刚石D在室温下放入反应炉中后,加热反应炉到处理温度。In another preferred example, after the diamond D coated on the surface is placed in the reaction furnace at room temperature, the reaction furnace is heated to the processing temperature.
在另一优选例中,所述加热速率为5~100℃/分钟,较佳地为5~50℃/分钟,更佳地为5~20℃/分钟。In another preferred example, the heating rate is 5-100°C/min, preferably 5-50°C/min, more preferably 5-20°C/min.
在另一优选例中,所述表面镀层的金刚石D在处理温度下进行保温。In another preferred example, the diamond D on the surface coating is kept at the treatment temperature.
在另一优选例中,所述保温时间为1~200分钟,较佳地为1~120分钟,更佳地为5~120分钟。In another preferred example, the holding time is 1-200 minutes, preferably 1-120 minutes, more preferably 5-120 minutes.
在另一优选例中,所述表面镀层的金刚石D在保温处理后进行降温。In another preferred example, the surface-coated diamond D is cooled after heat preservation treatment.
在另一优选例中,所述降温速率为5~100℃/分钟,较佳地为5~50℃/分钟,更佳地为5~20℃/分钟。In another preferred example, the cooling rate is 5-100°C/min, preferably 5-50°C/min, more preferably 5-20°C/min.
在另一优选例中,所述反应炉在到达保温时间后自然降温。In another preferred example, the reaction furnace cools down naturally after reaching the holding time.
在另一优选例中,所述表面镀层C完全包覆所述金刚石。In another preferred example, the surface coating C completely covers the diamond.
在另一优选例中,所述非氧化性气氛选自下组:真空、惰性气体、还原气体、或其组合。In another preferred embodiment, the non-oxidizing atmosphere is selected from the group consisting of vacuum, inert gas, reducing gas, or a combination thereof.
在另一优选例中,所述真空的真空度为10-4Pa~106Pa。In another preferred example, the degree of vacuum is 10 −4 Pa˜10 6 Pa.
在另一优选例中,所述惰性气体选自下组:氦气、氩气、或其组合。In another preferred embodiment, the inert gas is selected from the group consisting of helium, argon, or a combination thereof.
在另一优选例中,所述还原气体选自:氢气、氨气、或其组合。In another preferred embodiment, the reducing gas is selected from hydrogen, ammonia, or a combination thereof.
在另一优选例中,所述非氧化性气氛为在真空下通入还原气体,优选地,所述还原气体为氢气。In another preferred example, the non-oxidizing atmosphere is a reducing gas under vacuum, preferably, the reducing gas is hydrogen.
在另一优选例中,所述反应炉为真空碳管炉。In another preferred example, the reaction furnace is a vacuum carbon tube furnace.
在另一优选例中,所述脱落处理选自下组:超声处理、球磨处理、振动、或其组合。In another preferred embodiment, the exfoliation treatment is selected from the group consisting of ultrasonic treatment, ball milling treatment, vibration, or a combination thereof.
在另一优选例中,所述脱落处理的介质选自下组:水、乙醇。In another preferred example, the medium for the exfoliation treatment is selected from the group consisting of water and ethanol.
在另一优选例中,所述脱落处理的时间为1~100分钟,较佳地为1~50分钟,更佳地为1~20分钟。In another preferred example, the time for the exfoliation treatment is 1-100 minutes, preferably 1-50 minutes, more preferably 1-20 minutes.
在另一优选例中,所述脱落处理前还包括如下步骤:将步骤(2)所得经高温处理的表面镀层的金刚石D分别过30~300目筛处理。In another preferred example, the following step is further included before the exfoliation treatment: passing the high-temperature-treated surface-coated diamond D obtained in step (2) through 30-300 mesh sieves respectively.
在另一优选例中,所述网筛目数依次为:30目、60目、80目、100目、150目、300目。In another preferred example, the mesh numbers of the mesh screen are: 30 mesh, 60 mesh, 80 mesh, 100 mesh, 150 mesh, and 300 mesh.
在另一优选例中,所述高温处理和脱落处理循环进行,直至所述第二镀层C2厚度达到目标厚度c2’。In another preferred example, the high temperature treatment and the peeling treatment are performed in cycles until the thickness of the second coating layer C2 reaches the target thickness c2'.
在另一优选例中,所述循环的循环次数为1~50次In another preferred example, the number of cycles of the cycle is 1 to 50 times
在另一优选例中,在所述高温处理之前进行所述脱落处理。In another preferred example, the exfoliation treatment is performed before the high temperature treatment.
在另一优选例中,经所述方法处理后,表面镀层的厚度减薄程度(c2’/c2)为1-95%,较佳地为10-70%,更佳地为10-50%。In another preferred example, after being treated by the method, the thickness reduction (c2'/c2) of the surface coating is 1-95%, preferably 10-70%, more preferably 10-50% .
在本发明的第二方面,提供了一种使用本发明第一方面所述方法制备的产品,所述产品包括金刚石和结合于所述金刚石表面的表面镀层C’,其中,所述表面镀层C’包括第一镀层C1’和第二镀层C2’;所述第一镀层C1’位于所述金刚石和所述第二镀层C2’之间;In the second aspect of the present invention, there is provided a product prepared using the method described in the first aspect of the present invention, the product includes diamond and a surface coating C' bonded to the diamond surface, wherein the surface coating C 'comprising a first coating C1' and a second coating C2'; the first coating C1' is located between the diamond and the second coating C2';
所述第一镀层C1’为碳化物层,选自下组:碳化钨、碳化铬、碳化钼、碳化钛、或其组合;The first coating C1' is a carbide layer selected from the group consisting of tungsten carbide, chromium carbide, molybdenum carbide, titanium carbide, or a combination thereof;
所述第二镀层C2’为碳化物元素层或其合金层,选自下组:钨、铬、钼、钛、或其组合;The second coating C2' is a carbide element layer or an alloy layer thereof, selected from the group consisting of tungsten, chromium, molybdenum, titanium, or a combination thereof;
所述第一镀层C1’的厚度为c1’,所述第二镀层C2’的厚度为c2’,所述表面镀层C’的厚度为c’。The thickness of the first coating C1' is c1', the thickness of the second coating C2' is c2', and the thickness of the surface coating C' is c'.
在另一优选例中,所述金刚石和所述第一镀层C1’通过化学键合结合。In another preferred example, the diamond and the first coating C1' are combined by chemical bonding.
在另一优选例中,所述表面镀层C’完全包覆所述金刚石。In another preferred example, the surface coating C' completely covers the diamond.
在另一优选例中,所述金刚石的形状为粉状、块状、片状或膜状。In another preferred example, the shape of the diamond is powder, block, sheet or film.
在另一优选例中,所述金刚石为天然的或为经高温、高压或化学气相沉积生成的。In another preferred embodiment, the diamond is natural or produced through high temperature, high pressure or chemical vapor deposition.
在另一优选例中,所述金刚石的粒径为10~1000μm,较佳地为100-500μm,更佳地为100~300μm。In another preferred example, the particle size of the diamond is 10-1000 μm, preferably 100-500 μm, more preferably 100-300 μm.
在另一优选例中,c2’为0~10000nm。In another preferred example, c2' is 0 to 10000 nm.
在另一优选例中,c2’较佳地为0~1000nm,更佳地为0~10nm。In another preferred example, c2' is preferably 0-1000 nm, more preferably 0-10 nm.
在另一优选例中,c’为10-10000nm,较佳地为10~300nm,更佳地为10~100nm。In another preferred example, c' is 10-10000 nm, preferably 10-300 nm, more preferably 10-100 nm.
在另一优选例中,所述产品的目数为30-300目,较佳地为50-100目。In another preferred example, the mesh size of the product is 30-300 mesh, preferably 50-100 mesh.
在另一优选例中,所述产品与金属铝复合后,所得复合材料的热导率为420~460W/m·K。In another preferred example, after the product is composited with metal aluminum, the thermal conductivity of the obtained composite material is 420-460 W/m·K.
在本发明的第三方面,提供了一种制品,包含本发明第二方面所述的产品或由本发明第二方面所述的产品制成。In a third aspect of the present invention there is provided an article comprising or made from the product of the second aspect of the present invention.
在本发明的第四方面,提供了一种本发明第二方面所述的产品的用途,所述产品用于制备机械制品、复合材料、和/或电子元器件。In the fourth aspect of the present invention, a use of the product described in the second aspect of the present invention is provided, the product is used for preparing mechanical products, composite materials, and/or electronic components.
在另一优选例中,所述机械制品包括:刀具、磨具、锉刀、砂轮、锯片、钻头等。In another preferred example, the mechanical products include: knives, grinding tools, files, grinding wheels, saw blades, drill bits and the like.
在另一优选例中,所述复合材料包括:散热基板、散热片等。In another preferred example, the composite material includes: a heat dissipation substrate, a heat dissipation sheet, and the like.
应理解,在本发明范围内中,本发明的上述各技术特征和在下文(如实施例)中具体描述的各技术特征之间都可以互相组合,从而构成新的或优选的技术方案。限于篇幅,在此不再一一累述。It should be understood that within the scope of the present invention, the above-mentioned technical features of the present invention and the technical features specifically described in the following (such as embodiments) can be combined with each other to form new or preferred technical solutions. Due to space limitations, we will not repeat them here.
附图说明Description of drawings
图1是本发明表面镀层的金刚石处理过程示意图,其中,A为金刚石-碳化物-金属镀层复合体表面形貌示意图;B为复合体经所述方法处理后表面镀层破裂形貌示意图;C为复合体整体结构皲裂立体示意图。Fig. 1 is the diamond treatment process schematic diagram of surface coating of the present invention, and wherein, A is the diamond-carbide-metal coating composite surface topography schematic diagram; B is the composite surface coating rupture topography schematic diagram after the method is processed; C is The three-dimensional schematic diagram of the chapped overall structure of the complex.
图2是本发明实施例1和2所得产物的SEM图像,其中A、B分别为复合体D300×,10000×倍扫描电镜照片;C、D分别为复合体D’经所述方法处理后250×,13000×倍扫描电镜照片。Fig. 2 is the SEM image of the product obtained in Examples 1 and 2 of the present invention, wherein A and B are respectively complex D 300 ×, 10000 × magnification scanning electron micrographs; ×, 13000× magnification scanning electron microscope photo.
具体实施方式detailed description
本发明人经过长期而深入的研究,意外地发现通过在高温下氧化处理表面镀层的金刚石后再对其进行脱落处理可以有效地控制金刚石表面镀层的厚度,从而达到简化工艺和降低成本的效果。基于上述发现,发明人完成了本发明。After long-term and in-depth research, the inventor unexpectedly found that the thickness of the diamond surface coating can be effectively controlled by oxidizing the diamond on the surface of the coating at high temperature and then peeling it off, thereby achieving the effect of simplifying the process and reducing the cost. Based on the above findings, the inventors have accomplished the present invention.
术语the term
如本文所用,术语“本发明表面镀层的金刚石”、“表面镀层的金刚石”、“金刚石-碳化物-金属镀层复合体”和“复合体”可互换使用,均指由金刚石和表面镀层组成,其中,所述表面镀层包括碳化物层和碳化物元素层或其合金层;所述碳化物层结合于所述金刚石表面;所述碳化物元素层或其合金层结合于所述碳化物层。As used herein, the terms "coated diamond of the present invention", "coated diamond", "diamond-carbide-metal-coated composite" and "composite" are used interchangeably and refer to diamonds and coated diamonds. , wherein, the surface coating comprises a carbide layer and a carbide element layer or its alloy layer; the carbide layer is bonded to the diamond surface; the carbide element layer or its alloy layer is bonded to the carbide layer .
方法method
本发明所述制备表面镀层厚度受控的金刚石的方法,包括如下步骤:The method for preparing the diamond with controlled surface coating thickness of the present invention comprises the following steps:
(1)提供一表面镀层的金刚石D,其中,所述表面镀层的金刚石D包括金刚石和结合于所述金刚石表面的表面镀层C;所述表面镀层C包括第一镀层C1和第二镀层C2;所述第一镀层C1位于所述金刚石和所述第二镀层C2之间;(1) provide the diamond D of a surface coating, wherein, the diamond D of the surface coating comprises diamond and is bonded to the surface coating C of the described diamond surface; The surface coating C comprises the first coating C1 and the second coating C2; The first coating C1 is located between the diamond and the second coating C2;
所述第一镀层C1为碳化物层,选自下组:碳化钨、碳化铬、碳化钼、碳化钛、或其组合;The first coating layer C1 is a carbide layer selected from the group consisting of tungsten carbide, chromium carbide, molybdenum carbide, titanium carbide, or combinations thereof;
所述第二镀层C2为碳化物元素层或其合金层,选自下组:钨、铬、钼、钛、或其组合;The second coating C2 is a carbide element layer or an alloy layer thereof, selected from the group consisting of tungsten, chromium, molybdenum, titanium, or a combination thereof;
所述第一镀层C1的厚度为c1,所述第二镀层C2的厚度为c2;The thickness of the first coating layer C1 is c1, and the thickness of the second coating layer C2 is c2;
(2)将所述表面镀层的金刚石D进行高温处理,使得所述第二镀层C2部分出现裂纹;(2) Carrying out high-temperature treatment to the diamond D of the surface coating, so that cracks appear in the second coating C2;
(3)将经步骤(2)高温处理的所述表面镀层的金刚石进行脱落处理,脱落所述第二镀层C2至目标厚度c2’,制得表面镀层厚度减薄的金刚石D’,其中0≤c2’<c2。(3) Carrying out the diamond of the described surface coating of step (2) high-temperature treatment, falling off the second coating C2 to the target thickness c2', and obtaining a diamond D' with a reduced thickness of the surface coating, wherein 0≤ c2'<c2.
具体地,所述高温处理包括如下步骤:将所述表面镀层的金刚石D置于处理温度为200~1500℃且处理气氛为非氧化性气氛的反应炉中。Specifically, the high-temperature treatment includes the following steps: placing the surface-coated diamond D in a reaction furnace with a treatment temperature of 200-1500° C. and a non-oxidizing atmosphere.
在一优选例中,所述处理温度较佳地为300~1000℃,更佳地为650~850℃。In a preferred example, the treatment temperature is preferably 300-1000°C, more preferably 650-850°C.
在一优选例中,所述表面镀层的金刚石D在室温下放入反应炉中后,加热反应炉到处理温度。In a preferred example, after the diamond D coated on the surface is put into the reaction furnace at room temperature, the reaction furnace is heated to the processing temperature.
在一优选例中,所述加热速率为5~100℃/分钟,较佳地为5~50℃/分钟,更佳地为5~20℃/分钟。In a preferred example, the heating rate is 5-100°C/min, preferably 5-50°C/min, more preferably 5-20°C/min.
在一优选例中,所述表面镀层的金刚石D在处理温度下进行保温。In a preferred example, the diamond D on the surface coating is kept at the treatment temperature.
在一优选例中,所述保温时间为1~200分钟,较佳地为1~120分钟,更佳地为5~120分钟。In a preferred example, the holding time is 1-200 minutes, preferably 1-120 minutes, more preferably 5-120 minutes.
在一优选例中,所述表面镀层的金刚石D在保温处理后进行降温。In a preferred example, the surface-coated diamond D is cooled after heat preservation treatment.
在一优选例中,所述降温速率为5~100℃/分钟,较佳地为5~50℃/分钟,更佳地为5~20℃/分钟。In a preferred example, the cooling rate is 5-100°C/min, preferably 5-50°C/min, more preferably 5-20°C/min.
在一优选例中,所述反应炉在到达保温时间后自然降温。In a preferred example, the reaction furnace cools down naturally after reaching the holding time.
在一优选例中,所述表面镀层C完全包覆所述金刚石。In a preferred example, the surface coating C completely covers the diamond.
代表性地,所述非氧化性气氛包括(但并不限于):真空、惰性气体、还原气体、或其组合。Typically, the non-oxidizing atmosphere includes (but is not limited to): vacuum, inert gas, reducing gas, or a combination thereof.
在一优选例中,所述真空的真空度为10-4Pa~106Pa。In a preferred example, the degree of vacuum is 10 −4 Pa˜10 6 Pa.
代表性地,所述惰性气体包括(但并不限于):氦气、氩气、或其组合。Typically, the inert gas includes (but is not limited to): helium, argon, or a combination thereof.
代表性地,所述还原气体包括(但并不限于):氢气、氨气、或其组合。Typically, the reducing gas includes (but is not limited to): hydrogen, ammonia, or a combination thereof.
在一优选例中,所述非氧化气氛为在真空下通入还原气体,优选地,所述还原气体为氢气。In a preferred example, the non-oxidizing atmosphere is a reducing gas under vacuum, preferably, the reducing gas is hydrogen.
在一优选例中,所述反应炉为真空碳管炉。In a preferred example, the reaction furnace is a vacuum carbon tube furnace.
具体地,所述脱落处理包括(但并不限于):超声处理、球磨处理、振动、或其组合。Specifically, the exfoliation treatment includes (but is not limited to): ultrasonic treatment, ball milling treatment, vibration, or a combination thereof.
代表性地,所述脱落处理的介质包括(但并不限于):水、乙醇。Typically, the medium for the exfoliation treatment includes (but is not limited to): water and ethanol.
在一优选例中,所述脱落处理的时间为1~100分钟,较佳地为1~50分钟,更佳地为1~20分钟。In a preferred example, the time for the exfoliation treatment is 1-100 minutes, preferably 1-50 minutes, more preferably 1-20 minutes.
在一优选例中,所述脱落处理前还包括如下步骤:将步骤(2)所得经高温处理的表面镀层的金刚石D分别过30~300目筛处理。In a preferred example, the following step is further included before the exfoliation treatment: passing the high-temperature-treated surface-coated diamond D obtained in step (2) through 30-300 mesh sieves for treatment.
在一优选例中,所述网筛目数依次为:30目、60目、80目、100目、150目、300目。In a preferred example, the mesh numbers of the mesh screen are: 30 mesh, 60 mesh, 80 mesh, 100 mesh, 150 mesh, and 300 mesh.
典型地,所述高温处理和脱落处理循环进行,直至所述第二镀层C2厚度达到目标厚度c2’。Typically, the high temperature treatment and the peeling treatment are performed in cycles until the thickness of the second coating layer C2 reaches the target thickness c2'.
在一优选例中,所述循环的循环次数为1~50次In a preferred example, the number of cycles of the cycle is 1 to 50 times
在一优选例中,在所述高温处理之前进行所述脱落处理。In a preferred example, the exfoliation treatment is performed before the high temperature treatment.
在一优选例中,经所述方法处理后,表面镀层的厚度减薄程度(c2’/c2)为1-95%,较佳地为10-70%,更佳地为10-50%。In a preferred example, after being treated by the method, the thickness reduction (c2'/c2) of the surface coating is 1-95%, preferably 10-70%, more preferably 10-50%.
现以金刚石粉体表面镀铬及其化合物层为例,说明本发明的金刚石表面镀层厚度控制过程。首先将经过镀层处理后的金刚石粉体超声或球磨处理,使得金刚石表面的镀层受到外界各种力的作用,形成一定的微裂纹或微损伤。然后在一定的升温速率下,金刚石粉体加热到一定温度处理,保温一段时间,以一定的降温速率对金刚石粉体进行处理,由于金刚石与金刚石表面的镀层热膨胀系数不一样,在不同的温度下,金刚石表面的镀层上的微裂纹进一步扩展,进而产生更大的裂纹。最后粉体取出后进一步超声或在各种力作用下,金刚石粉体表面第二镀层会从金刚石粉体表面部分或全部脱落,从而控制金刚石粉体表面镀层厚度。Now take the diamond powder surface chromium plating and its compound layer as an example to illustrate the diamond surface coating thickness control process of the present invention. First, the coated diamond powder is ultrasonically or ball milled, so that the coating on the diamond surface is subjected to various external forces to form certain micro-cracks or micro-damages. Then, at a certain heating rate, the diamond powder is heated to a certain temperature for treatment, and kept for a period of time, and the diamond powder is treated at a certain cooling rate. Since the thermal expansion coefficient of the diamond and the diamond surface coating is different, at different temperatures , the microcracks on the coating on the diamond surface further expand, and then produce larger cracks. Finally, after the powder is taken out and further ultrasonicated or under the action of various forces, the second coating on the surface of the diamond powder will partly or completely fall off from the surface of the diamond powder, thereby controlling the thickness of the coating on the surface of the diamond powder.
本发明所述方法与金刚石粉体表面镀层过程中工艺控制因素基本无关,通常只与镀层中不同层之间热膨胀系数差异以及各层的性质有关。The method of the present invention is basically irrelevant to the process control factors in the coating process of the surface of the diamond powder, and usually only related to the difference in thermal expansion coefficient between different layers in the coating and the properties of each layer.
本发明的金刚石表面镀层的厚度得到控制。这种新型控制镀层厚度工艺极大简化了金刚石表面镀层过程中各种工艺参数的改进所耗费的大量的时间和成本,在机械、材料、电子等多方面具有很好的应用前景。The thickness of the diamond surface coating of the present invention is controlled. This new coating thickness control process greatly simplifies the time and cost spent on improving various process parameters in the diamond surface coating process, and has good application prospects in many aspects such as machinery, materials, and electronics.
产品product
本发明所述产品包括金刚石和结合于所述金刚石表面的表面镀层C’,其中,所述表面镀层C’包括第一镀层C1’和第二镀层C2’;所述第一镀层C1’位于所述金刚石和所述第二镀层C2’之间;The product of the present invention includes diamond and a surface coating C' bonded to the surface of the diamond, wherein the surface coating C' includes a first coating C1' and a second coating C2'; the first coating C1' is located at the between the diamond and the second coating C2';
所述第一镀层C1’为碳化物层,选自下组:碳化钨、碳化铬、碳化钼、碳化钛、或其组合;The first coating C1' is a carbide layer selected from the group consisting of tungsten carbide, chromium carbide, molybdenum carbide, titanium carbide, or a combination thereof;
所述第二镀层C2’为碳化物元素层或其合金层,选自下组:钨、铬、钼、钛、或其组合;The second coating C2' is a carbide element layer or an alloy layer thereof, selected from the group consisting of tungsten, chromium, molybdenum, titanium, or a combination thereof;
所述第一镀层C1’的厚度为c1’,所述第二镀层C2’的厚度为c2’,所述表面镀层C’的厚度为c’。The thickness of the first coating C1' is c1', the thickness of the second coating C2' is c2', and the thickness of the surface coating C' is c'.
在一优选例中,所述金刚石和所述第一镀层C1’通过化学键合结合。In a preferred example, the diamond and the first coating C1' are combined by chemical bonding.
在一优选例中,所述表面镀层C’完全包覆所述金刚石。In a preferred example, the surface coating C' completely covers the diamond.
本发明所述产品的表面镀层易受外界温度变化、超声或球磨等外界作用力影响导致表面龟裂、脱落,从而使得镀层厚度改变。The surface coating of the product described in the present invention is easily affected by external temperature changes, ultrasonic or ball milling and other external forces to cause surface cracks and peeling off, thereby changing the thickness of the coating.
在一优选例中,所述金刚石的形状为粉状、块状、片状或膜状。In a preferred example, the shape of the diamond is powder, block, sheet or film.
在一优选例中,所述金刚石为天然的或为经高温、高压或化学气相沉积生成的。In a preferred example, the diamond is natural or produced through high temperature, high pressure or chemical vapor deposition.
在一优选例中,所述金刚石的粒径为10~1000μm,较佳地为100~500μm,更佳地为100-400μm。In a preferred example, the particle size of the diamond is 10-1000 μm, preferably 100-500 μm, more preferably 100-400 μm.
在本发明所述产品中,c2’为0~10000nm。In the product of the present invention, c2' is 0-10000nm.
在一优选例中,c2’较佳地为0~1000nm,更佳地为0~10nm。In a preferred example, c2' is preferably 0-1000 nm, more preferably 0-10 nm.
在一优选例中,c’为10-10000nm,较佳地为10~300nm,更佳地为10~100nm。In a preferred example, c' is 10-10000 nm, preferably 10-300 nm, more preferably 10-100 nm.
在一优选例中,所述产品的目数为30-300目,较佳地为50-100目。In a preferred example, the mesh of the product is 30-300 mesh, preferably 50-100 mesh.
本发明所述产品与金属铝复合后,所得复合材料的热导率为420~460W/m·K。After the product described in the invention is combined with metal aluminum, the thermal conductivity of the obtained composite material is 420-460 W/m·K.
制品与用途Products and uses
本发明提供了一种制品,所述制品包含本发明所述产品或由本发明所述产品制成。The invention provides an article comprising or made from the product of the invention.
本发明所述产品用于制备机械制品、复合材料、电子元器件。The product of the invention is used for preparing mechanical products, composite materials and electronic components.
代表性地,所述机械制品包括(但并不限于):刀具、磨具、锉刀、砂轮、锯片、钻头等。Typically, the mechanical products include (but are not limited to): knives, grinding tools, files, grinding wheels, saw blades, drill bits and the like.
代表性地,所述复合材料包括(但并不限于):散热基板、散热片等。Typically, the composite material includes (but not limited to): a heat dissipation substrate, a heat dissipation sheet, and the like.
与现有技术相比,本发明具有以下主要优点:Compared with the prior art, the present invention has the following main advantages:
(1)使用本发明方法可快速、有效控制表面镀层的厚度;(1) using the inventive method can quickly and effectively control the thickness of the surface coating;
(2)使用本发明方法可极大地简化制备工艺、降低制备成本;(2) Using the method of the present invention can greatly simplify the preparation process and reduce the preparation cost;
(3)使用本发明方法处理设备简单;(3) use the inventive method processing equipment to be simple;
(4)使用本发明方法所制得的金刚石的表面镀层厚度均匀;(4) the surface coating thickness of the prepared diamond using the inventive method is even;
本发明提到的上述特征,或实施例提到的特征可以任意组合。本案说明书所揭示的所有特征可与任何组合物形式并用,说明书中所揭示的各个特征,可以任何被提供相同、均等或相似目的的替代性特征取代。因此除有特别说明,所揭示的特征仅为均等或相似特征的一般性例子。The above-mentioned features mentioned in the present invention, or the features mentioned in the embodiments can be combined arbitrarily. All the features disclosed in the specification of this case can be used in combination with any combination, and each feature disclosed in the specification can be replaced by any alternative feature that provides the same, equivalent or similar purpose. Therefore, unless otherwise specified, the disclosed features are only general examples of equivalent or similar features.
下面结合具体实施例,进一步阐述本发明。应理解,这些实施例仅用于说明本发明而不用于限制本发明的范围。下列实施例中未注明具体条件的实验方法,通常按照常规条件或按照制造厂商所建议的条件。除非另外说明,否则百分比和份数按重量计算。Below in conjunction with specific embodiment, further illustrate the present invention. It should be understood that these examples are only used to illustrate the present invention and are not intended to limit the scope of the present invention. For the experimental methods without specific conditions indicated in the following examples, usually follow the conventional conditions or the conditions suggested by the manufacturer. Percentages and parts are by weight unless otherwise indicated.
除非另行定义,文中所使用的所有专业与科学用语与本领域熟练人员所熟悉的意义相同。此外,任何与所记载内容相似或均等的方法及材料皆可应用于本发明方法中。文中所述的较佳实施方法与材料仅作示范之用。Unless otherwise defined, all professional and scientific terms used herein have the same meanings as commonly understood by those skilled in the art. In addition, any methods and materials similar or equivalent to those described can be applied to the method of the present invention. The preferred implementation methods and materials described herein are for demonstration purposes only.
实施例1Example 1
制备表面镀铬层的金刚石复合体DPreparation of diamond composite D with chrome-plated layer on the surface
将10g平均粒径为100μm左右的金刚石颗粒与高纯铬粉和少量聚乙二醇(分子量为2000)混合均匀制成混合物,按混合物总重量计算,铬粉占10wt%,聚乙二醇占5wt%。将混合物放在搅拌机中搅拌混合均匀制备成浆料。放入真空碳管炉中,抽真空至真空度约为10-2Pa,然后通入氢气,气压力为1Pa–120kPa,加热速率为10℃/min升温至700℃,保温60min,然后随炉冷却至室温。Mix 10g of diamond particles with an average particle size of about 100 μm with high-purity chromium powder and a small amount of polyethylene glycol (molecular weight: 2000) to make a mixture. Calculated by the total weight of the mixture, chromium powder accounts for 10 wt%, and polyethylene glycol accounts for 10% by weight. 5wt%. Put the mixture in a blender and stir to mix evenly to prepare a slurry. Put it into a vacuum carbon tube furnace, evacuate to a vacuum of about 10 -2 Pa, then pass in hydrogen, the gas pressure is 1Pa–120kPa, and the heating rate is 10°C/min. Cool to room temperature.
将高温处理过的混合物取出,分别过30目、60目、80目、100目、150目、300目筛,然后将所得金刚石颗粒超声水洗除杂,去除过剩的铬粉,获得金刚石-碳化铬-铬镀层复合体D,称量粉体质量为10.546g。Take out the high-temperature treated mixture, pass through 30 mesh, 60 mesh, 80 mesh, 100 mesh, 150 mesh, and 300 mesh respectively, and then ultrasonically wash the obtained diamond particles to remove impurities, remove excess chromium powder, and obtain diamond-chromium carbide - Chromium-coated complex D, the weight of the weighed powder is 10.546g.
实施例2Example 2
制备表面镀铬层的金刚石复合体D’Preparation of diamond composite D' with chrome-plated layer on the surface
将实施例1所制得的10.546g100目表面镀铬层的金刚石全部再次放入真空碳管炉中,抽真空至真空度约为10-2Pa,然后通入氢气,气压力为1Pa–120kPa,加热速率为10℃/min升温至750℃,保温60min,然后随炉冷却至室温。Put 10.546g of 100-mesh chrome-plated diamonds prepared in Example 1 into the vacuum carbon tube furnace again, evacuate to a vacuum degree of about 10-2 Pa, and then inject hydrogen gas with a pressure of 1Pa-120kPa. The heating rate is 10°C/min and the temperature is raised to 750°C, kept for 60 minutes, and then cooled to room temperature with the furnace.
将高温处理过样品取出,分别过30目、60目、80目、100目、150目、300目筛,然后超声水洗除杂,去除金刚石粉体表面掉落物质,即可获得金刚石表面镀层减薄的金刚石复合体D’,称量粉体质量为10.361g。Take out the high-temperature treated samples, pass through 30 mesh, 60 mesh, 80 mesh, 100 mesh, 150 mesh, and 300 mesh sieves respectively, and then ultrasonically wash to remove impurities and remove the falling substances on the surface of the diamond powder, and then the diamond surface coating can be obtained. Thin diamond composite D', weighing powder mass is 10.361g.
结果result
对所得产物进行表面形貌等检测。The surface morphology of the obtained product was detected.
经1次高温处理和脱落处理后表面镀铬层的金刚石的质量从10.546g减少为10.361g,这表明经本发明所述方法处理后,金刚石的粒径得到减小,即金刚石表面镀层厚度得到减薄。After 1 high-temperature treatment and peeling treatment, the quality of the diamond on the chrome-plated layer on the surface is reduced from 10.546g to 10.361g, which shows that after the method of the present invention is processed, the particle size of the diamond is reduced, that is, the thickness of the diamond surface coating is reduced. Thin.
从图2中可以看出,经本发明所述方法处理后,未脱落的表面镀层中存在部分微裂纹,这些微裂纹的存在为其与其他金属的结合提供了着力部位,利于提高其与其他金属的结合强度。As can be seen from Fig. 2, after being processed by the method of the present invention, there are some microcracks in the surface coating that does not come off, and the existence of these microcracks provides a force site for its combination with other metals, which is conducive to improving its connection with other metals. The bond strength of the metal.
此外,上述微裂纹也可根据实际需要,通过与本发明同日提交的发明名称为“一种制备表面镀层厚度减薄的金刚石的方法”的发明专利申请中提及的清洗处理步骤去除。In addition, the above-mentioned microcracks can also be removed according to actual needs through the cleaning treatment steps mentioned in the invention patent application titled "A Method for Preparing Diamond with a Reduced Surface Coating Thickness" filed on the same day as the present invention.
实施例3Example 3
实施例1所得复合体D与金属铝所制备的复合材料1The composite material 1 prepared by the composite body D obtained in embodiment 1 and metal aluminum
将实施例1所得复合体D与金属铝粉混合,在650℃真空热压60min,获得复合材料1。The composite D obtained in Example 1 was mixed with metal aluminum powder, and vacuum hot-pressed at 650° C. for 60 minutes to obtain composite material 1 .
结果result
对所得复合材料1进行热导率测试,测试得复合材料1的热导率为396W/m·K。The thermal conductivity test of the obtained composite material 1 was carried out, and the thermal conductivity of the composite material 1 was tested to be 396 W/m·K.
实施例4Example 4
实施例2所得复合体D’与金属铝所制备的复合材料2Composite material 2 prepared by embodiment 2 gained composite body D ' and metal aluminum
将实施例2所得复合体D’与金属铝粉混合,在650℃真空热压60min,获得复合材料2。The composite D' obtained in Example 2 was mixed with metal aluminum powder, and vacuum hot-pressed at 650°C for 60 minutes to obtain composite material 2.
结果result
测试得复合材料2的热导率为435W/m·K。The thermal conductivity of composite material 2 was tested to be 435W/m·K.
对比实施例3和4可知,经本发明所述方法处理后,复合材料的热导率得到显著提高,提升率高达9.8%。Comparing Examples 3 and 4, it can be seen that after being treated by the method of the present invention, the thermal conductivity of the composite material is significantly improved, and the improvement rate is as high as 9.8%.
在本发明提及的所有文献都在本申请中引用作为参考,就如同每一篇文献被单独引用作为参考那样。此外应理解,在阅读了本发明的上述讲授内容之后,本领域技术人员可以对本发明作各种改动或修改,这些等价形式同样落于本申请所附权利要求书所限定的范围。All documents mentioned in this application are incorporated by reference in this application as if each were individually incorporated by reference. In addition, it should be understood that after reading the above teaching content of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of the present application.
Claims (10)
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| CN201410854411.7A CN105801171B (en) | 2014-12-31 | 2014-12-31 | Product made from the method and use this method of a kind of diamond for preparing overlay coating controlled thickness |
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| CN201410854411.7A CN105801171B (en) | 2014-12-31 | 2014-12-31 | Product made from the method and use this method of a kind of diamond for preparing overlay coating controlled thickness |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100206941A1 (en) * | 2007-05-22 | 2010-08-19 | David Patrick Egan | Coated diamond |
| CN104045081A (en) * | 2013-03-11 | 2014-09-17 | 中国科学院宁波材料技术与工程研究所 | Diamond composite and preparation method thereof |
| CN104162664A (en) * | 2013-05-16 | 2014-11-26 | 中国科学院宁波材料技术与工程研究所 | Diamond complex and preparation method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100206941A1 (en) * | 2007-05-22 | 2010-08-19 | David Patrick Egan | Coated diamond |
| CN104045081A (en) * | 2013-03-11 | 2014-09-17 | 中国科学院宁波材料技术与工程研究所 | Diamond composite and preparation method thereof |
| CN104162664A (en) * | 2013-05-16 | 2014-11-26 | 中国科学院宁波材料技术与工程研究所 | Diamond complex and preparation method thereof |
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