CN105603248A - Foam graphene skeleton reinforced copper-base composite material and preparation method thereof - Google Patents
Foam graphene skeleton reinforced copper-base composite material and preparation method thereof Download PDFInfo
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 262
- 239000006260 foam Substances 0.000 title claims abstract description 98
- 239000002131 composite material Substances 0.000 title claims abstract description 88
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 157
- 239000010949 copper Substances 0.000 claims abstract description 72
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 71
- 239000010432 diamond Substances 0.000 claims abstract description 71
- 239000000758 substrate Substances 0.000 claims abstract description 71
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 68
- 229910052802 copper Inorganic materials 0.000 claims abstract description 68
- 239000011159 matrix material Substances 0.000 claims abstract description 52
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 40
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 40
- 230000002787 reinforcement Effects 0.000 claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 19
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 18
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 12
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000919 ceramic Substances 0.000 claims abstract description 8
- 238000009826 distribution Methods 0.000 claims abstract description 6
- 238000000151 deposition Methods 0.000 claims description 41
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 38
- 230000008021 deposition Effects 0.000 claims description 38
- 239000002245 particle Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 24
- 238000005229 chemical vapour deposition Methods 0.000 claims description 21
- 239000000956 alloy Substances 0.000 claims description 19
- 229910052759 nickel Inorganic materials 0.000 claims description 19
- 229910045601 alloy Inorganic materials 0.000 claims description 18
- 239000011651 chromium Substances 0.000 claims description 18
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 17
- 239000010936 titanium Substances 0.000 claims description 17
- 229910052719 titanium Inorganic materials 0.000 claims description 17
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 14
- 229910052804 chromium Inorganic materials 0.000 claims description 14
- 238000005516 engineering process Methods 0.000 claims description 14
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 14
- 230000003014 reinforcing effect Effects 0.000 claims description 13
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 13
- 229910052721 tungsten Inorganic materials 0.000 claims description 13
- 239000010937 tungsten Substances 0.000 claims description 13
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 11
- 238000011065 in-situ storage Methods 0.000 claims description 11
- 239000011733 molybdenum Substances 0.000 claims description 11
- 229910052750 molybdenum Inorganic materials 0.000 claims description 11
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- 238000005728 strengthening Methods 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 claims description 9
- 239000011148 porous material Substances 0.000 claims description 9
- 238000005240 physical vapour deposition Methods 0.000 claims description 7
- 238000005137 deposition process Methods 0.000 claims description 6
- 238000007772 electroless plating Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 6
- 229910039444 MoC Inorganic materials 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 5
- 238000001704 evaporation Methods 0.000 claims description 5
- 230000008020 evaporation Effects 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 238000009715 pressure infiltration Methods 0.000 claims description 5
- 230000003197 catalytic effect Effects 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 239000004005 microsphere Substances 0.000 claims description 4
- QIJNJJZPYXGIQM-UHFFFAOYSA-N 1lambda4,2lambda4-dimolybdacyclopropa-1,2,3-triene Chemical compound [Mo]=C=[Mo] QIJNJJZPYXGIQM-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 238000009835 boiling Methods 0.000 claims description 3
- UFGZSIPAQKLCGR-UHFFFAOYSA-N chromium carbide Chemical compound [Cr]#C[Cr]C#[Cr] UFGZSIPAQKLCGR-UHFFFAOYSA-N 0.000 claims description 3
- 239000006262 metallic foam Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910003470 tongbaite Inorganic materials 0.000 claims description 3
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims description 2
- 239000000178 monomer Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000000725 suspension Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
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- 235000008446 instant noodles Nutrition 0.000 claims 1
- 230000003313 weakening effect Effects 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 15
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical group C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 12
- 238000013329 compounding Methods 0.000 description 9
- 230000007704 transition Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 6
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- 238000005266 casting Methods 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 230000009471 action Effects 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 238000011056 performance test Methods 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000011156 metal matrix composite Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910001080 W alloy Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000004050 hot filament vapor deposition Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000002893 slag Substances 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 241000282326 Felis catus Species 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 239000011825 aerospace material Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- WCCJDBZJUYKDBF-UHFFFAOYSA-N copper silicon Chemical compound [Si].[Cu] WCCJDBZJUYKDBF-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000013354 porous framework Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1005—Pretreatment of the non-metallic additives
- C22C1/101—Pretreatment of the non-metallic additives by coating
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
- C22C2026/002—Carbon nanotubes
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
一种泡沫石墨烯骨架增强铜基复合材料及制备方法,所述复合材料由泡沫衬底、石墨烯强化层、基体材料组成,泡沫衬底为泡沫金属或泡沫陶瓷或泡沫碳。石墨烯强化层为石墨烯膜或石墨烯与金刚石、碳纳米管的复合。基体材料为铜及铜合金。本发明制得的复合材料因石墨烯与铝在三维空间内保持连续分布,形成了网络互穿结构,从而弱化了复合界面对材料热学和电学性能的显著影响,既能不降低金属基体在复合材料中的良好塑韧性,又能使增强相成为一个整体,最大限度地发挥增强体的导热和导电效率,使复合材料的热导率、导电率及机械强度相比较传统复合材料有极大提高,是一种很有潜力的新型多功能复合材料。
A foamed graphene skeleton reinforced copper-based composite material and a preparation method thereof, the composite material is composed of a foam substrate, a graphene reinforced layer, and a matrix material, and the foam substrate is foamed metal, foamed ceramics or foamed carbon. The graphene reinforced layer is a composite of graphene film or graphene, diamond and carbon nanotubes. The base material is copper and copper alloy. The composite material prepared by the present invention maintains a continuous distribution of graphene and aluminum in a three-dimensional space, forming a network interpenetrating structure, thereby weakening the significant impact of the composite interface on the thermal and electrical properties of the material, and not reducing the metal matrix in the composite material. The good plasticity and toughness in the material can also make the reinforced phase a whole, maximize the thermal conductivity and electrical conductivity of the reinforcement, and greatly improve the thermal conductivity, electrical conductivity and mechanical strength of the composite material compared with traditional composite materials. , is a new type of multifunctional composite material with great potential.
Description
技术领域technical field
本发明公开了一种泡沫石墨烯骨架增强铜基复合材料及制备方法,属于复合材料制备技术领域。The invention discloses a foamed graphene skeleton-reinforced copper-based composite material and a preparation method thereof, belonging to the technical field of composite material preparation.
背景技术Background technique
石墨烯(Graphene)是从石墨材料中剥离出来、由碳原子组成的只有一层原子厚度的二维晶体。2004年,英国曼彻斯特大学物理学家安德烈·盖姆和康斯坦丁·诺沃肖洛夫,成功从石墨中分离出石墨烯,证实它可以单独存在,两人也因此共同获得2010年诺贝尔物理学奖。石墨烯既是最薄的材料,也是最强韧的材料,断裂强度比最好的钢材还要高200倍。同时它又有很好的弹性,拉伸幅度能达到自身尺寸的20%。它是目前自然界最薄、强度最高的材料,如果用一块面积1平方米的石墨烯做成吊床,本身重量不足1毫克便可以承受一只一千克的猫。作为目前发现的最薄、强度最大、导电导热性能最强的一种新型纳米材料,石墨烯被称为“黑金”,是“新材料之王”,科学家甚至预言石墨烯将“彻底改变21世纪”。Graphene is a two-dimensional crystal that is exfoliated from graphite material and composed of carbon atoms with only one layer of atomic thickness. In 2004, Andre Geim and Konstantin Novoselov, physicists at the University of Manchester, successfully separated graphene from graphite and confirmed that it can exist alone. Bell Prize in Physics. Graphene is both the thinnest material and the strongest, with a breaking strength 200 times stronger than the best steel. At the same time, it has good elasticity, and the stretching range can reach 20% of its own size. It is currently the thinnest and strongest material in nature. If a piece of graphene with an area of 1 square meter is used to make a hammock, it can bear a cat weighing one kilogram with a weight of less than one milligram. As a new type of nanomaterial with the thinnest, highest strength, and strongest electrical and thermal conductivity found so far, graphene is called "black gold" and is the "king of new materials". Scientists even predict that graphene will "completely change the 21st century." ".
2014年05月08日,中航工业航材院的一组年轻科研人员在国际石墨烯研究领域首创“烯合金”材料,这一具有里程碑意义的重大自主创新,不但发明了一类具有优异性能的新型高端合金材料,也使我国成为石墨烯这一材料科学前沿基础和应用研究的领跑者。烯合金的研制成功,宣告一代新型具有特殊优异性能的系列材料横空出世,填补了世界材料科学领域的空白,进而将这门学科推向全新的领域。On May 8, 2014, a group of young researchers from AVIC Aerospace Materials Institute created the "graphene alloy" material for the first time in the international graphene research field. The new high-end alloy material also makes my country a leader in basic and applied research on the frontier of graphene, a material science. The successful development of ene alloys announced the emergence of a new series of materials with special and excellent properties, filling the gaps in the field of materials science in the world, and pushing this subject to a new field.
石墨烯是目前热导率(最高可达5300W/mK)最高的人造材料,而且热膨胀系数和密度极低,将石墨烯作为增强相与高导热金属复合,在保证拥有理想热膨胀系数和低密度的同时,可获得更为优异的导热性能。由于Cu具有比Al更高的热导率和导电率,同时热膨胀系数比Al低,将Cu作为基体金属来制备石墨烯粉增强金属基复合材料,可实现复合材料热物理性能的进一步提升。同时,Cu的熔点高,也使Cu/金刚石复合材料具有更广的使用范围。因此,将石墨烯与铜复合使其兼具高热导、高导电、低热膨胀和耐高温等优异的综合性能,现已成为新一代电子封装材料的研究热点。Graphene is currently the man-made material with the highest thermal conductivity (up to 5300W/mK), and its thermal expansion coefficient and density are extremely low. Graphene is used as a reinforcing phase and combined with a high thermal conductivity metal to ensure an ideal thermal expansion coefficient and low density. At the same time, more excellent thermal conductivity can be obtained. Since Cu has higher thermal conductivity and electrical conductivity than Al, and the thermal expansion coefficient is lower than Al, using Cu as the matrix metal to prepare graphene powder-reinforced metal matrix composites can further improve the thermophysical properties of the composites. At the same time, Cu has a high melting point, which also makes Cu/diamond composite materials have a wider range of applications. Therefore, combining graphene with copper to have excellent comprehensive properties such as high thermal conductivity, high electrical conductivity, low thermal expansion, and high temperature resistance has become a research hotspot for a new generation of electronic packaging materials.
然而,就传统的石墨烯粉增强金属基复合材料而言,此种复合结构中的石墨烯粉末(热导率5300W/mK)犹如一座座由金属铝(热导率237W/mK)连接的导热孤岛,既增加了两相界面数量,又难产生协同作用,使石墨烯优异的导热性能难以充分发挥。本发明的创新思路是在复合材料中构建连续的石墨烯网络骨架,变高导热孤岛为高导热通道。然而,对于传统的颗粒增强型复合材料,网络互穿结构的制备难度很大。However, as far as the traditional graphene powder-reinforced metal matrix composite is concerned, the graphene powder (thermal conductivity 5300W/mK) in this composite structure is like a heat-conducting grid connected by metal aluminum (thermal conductivity 237W/mK). Islands not only increase the number of two-phase interfaces, but also make it difficult to produce synergy, making it difficult to fully exert the excellent thermal conductivity of graphene. The innovative idea of the present invention is to build a continuous graphene network skeleton in the composite material, and transform the high thermal conductivity island into a high thermal conductivity channel. However, for traditional particle-reinforced composites, the preparation of interpenetrating network structures is very difficult.
中国发明专利CN105112754A提出了一种三维网络金刚石骨架增强金属基复合材料及制备方法,其中金属三维网络骨架衬底采用机械加工方法制备或采用金属线编织而成。然而,传统的机械加工方法属于多维加工,加工工序多,成本较高。此外,机械加工受制于传统机械加工手段和设备的束缚,对三维多孔骨架内部孔径、联通性的精细控制难度较大。采用金属线编织的方法,存在三维孔隙间含有缝隙,且工艺流程复杂等问题。Chinese invention patent CN105112754A proposes a three-dimensional network diamond framework reinforced metal matrix composite material and its preparation method, wherein the metal three-dimensional network framework substrate is prepared by mechanical processing or braided by metal wires. However, the traditional mechanical processing method belongs to multi-dimensional processing, with many processing steps and high cost. In addition, mechanical processing is restricted by traditional mechanical processing methods and equipment, and it is difficult to finely control the internal pore size and connectivity of the three-dimensional porous framework. The method of weaving metal wires has problems such as gaps in the three-dimensional pores and complicated technological process.
发明内容Contents of the invention
本发明的目的在于克服现有技术不足而提供一种泡沫石墨烯骨架增强铜基复合材料及制备方法,本发明通过化学气相沉积技术复制泡沫金属的结构,使高导热材料以无缝连接的方式构成一个全连通的整体,与铝基形成网络互穿结构,使复合材料具有优异的连续导热能力、电荷传导能力和极低的密度。The purpose of the present invention is to overcome the deficiencies of the prior art and provide a foamed graphene skeleton reinforced copper-based composite material and a preparation method. The present invention replicates the structure of the foamed metal by chemical vapor deposition technology, so that the highly thermally conductive material can be seamlessly connected It forms a fully connected whole and forms a network interpenetrating structure with the aluminum matrix, so that the composite material has excellent continuous thermal conductivity, charge conductivity and extremely low density.
本发明泡沫石墨烯骨架增强铜基复合材料,所述复合材料包括增强体、基体材料,所述增强体包括泡沫骨架衬底、石墨烯强化层,所述泡沫骨架衬底表面设有石墨烯强化层;所述泡沫骨架衬底选自泡沫金属骨架、泡沫陶瓷骨架、泡沫碳骨架中的至少一种,所述基体材料选自铜及其合金。The foamed graphene skeleton reinforced copper-based composite material of the present invention, the composite material includes a reinforcement body and a matrix material, the reinforcement body includes a foam skeleton substrate and a graphene reinforced layer, and the surface of the foam skeleton substrate is provided with graphene reinforcement layer; the foam skeleton substrate is selected from at least one of foam metal skeleton, foam ceramic skeleton, and foam carbon skeleton, and the matrix material is selected from copper and its alloys.
本发明泡沫石墨烯骨架增强铜基复合材料,所述泡沫金属骨架选自泡沫镍、泡沫铜、泡沫钛、泡沫钴、泡沫钨、泡沫钼、泡沫铬、泡沫铁镍、泡沫铝中的一种;所述泡沫陶瓷骨架选自泡沫A12O3、泡沫ZrO2、泡沫SiC、泡沫Si3N4、泡沫BN、泡沫B4C、泡沫AlN、泡沫WC、泡沫Cr7C3中的一种。The foamed graphene skeleton reinforced copper-based composite material of the present invention, the foamed metal skeleton is selected from one of foamed nickel, foamed copper, foamed titanium, foamed cobalt, foamed tungsten, foamed molybdenum, foamed chromium, foamed iron nickel, foamed aluminum The ceramic foam skeleton is selected from foam A1 2 O 3 , foam ZrO 2 , foam SiC, foam Si 3 N 4 , foam BN, foam B 4 C, foam AlN, foam WC, foam Cr 7 C 3 .
本发明泡沫石墨烯骨架增强铜基复合材料,所述泡沫骨架衬底中,泡沫孔径为0.01-10mm,开孔率40-99.9%,泡沫孔洞均匀分布或随机分布;泡沫骨架为平面结构或三维立体结构。The foam graphene skeleton reinforced copper-based composite material of the present invention, in the foam skeleton substrate, the foam pore diameter is 0.01-10mm, the opening ratio is 40-99.9%, and the foam holes are evenly or randomly distributed; the foam skeleton is a planar structure or a three-dimensional structure three-dimensional structure.
本发明泡沫石墨烯骨架增强铜基复合材料,所述石墨烯强化层选自石墨烯膜、石墨烯墙、石墨烯包覆金刚石、碳纳米管包覆石墨烯中的一种。The graphene-foamed skeleton-reinforced copper-based composite material of the present invention, the graphene-enhanced layer is selected from one of graphene film, graphene wall, graphene-coated diamond, and carbon nanotube-coated graphene.
本发明泡沫石墨烯骨架增强铜基复合材料,石墨烯强化层中,石墨烯包覆金刚石是指在金刚石表面原位生长石墨烯,且石墨烯垂直于金刚石表面形成石墨烯墙;In the present invention, the foamed graphene skeleton strengthens the copper-based composite material, and in the graphene-reinforced layer, the graphene-coated diamond refers to the in-situ growth of graphene on the diamond surface, and the graphene is perpendicular to the diamond surface to form a graphene wall;
碳纳米管包覆石墨烯是指在石墨烯表面催化生长碳纳米管,且碳纳米管垂直于石墨烯表面形成碳纳米管林。Carbon nanotube-coated graphene refers to the catalytic growth of carbon nanotubes on the surface of graphene, and the carbon nanotubes are perpendicular to the surface of graphene to form carbon nanotube forests.
本发明泡沫石墨烯骨架增强铜基复合材料,基体材料中还添加有强化颗粒,强化颗粒选自高导热颗粒、超硬耐磨颗粒、导电颗粒中的至少一种;所述高导热颗粒选自金刚石粉、石墨烯、碳纳米管、石墨烯包覆金刚石微球、碳纳米管包覆金刚石微球、碳纳米管包覆石墨烯中的至少一种;超硬耐磨颗粒选自金刚石粉、SiC、TiC、TiN、AlN、Si3N4、Al2O3、BN、WC、MoC、Cr7C3中的至少一种;导电颗粒选自石墨、碳纳米管、石墨烯中的至少一种。The foamed graphene skeleton reinforced copper-based composite material of the present invention is also added with reinforcing particles in the matrix material, and the reinforcing particles are selected from at least one of high thermal conductivity particles, superhard wear-resistant particles, and conductive particles; the high thermal conductivity particles are selected from At least one of diamond powder, graphene, carbon nanotubes, graphene-coated diamond microspheres, carbon nanotube-coated diamond microspheres, and carbon nanotube-coated graphene; superhard wear-resistant particles are selected from diamond powder, At least one of SiC, TiC, TiN, AlN, Si 3 N 4 , Al 2 O 3 , BN, WC, MoC, Cr 7 C 3 ; conductive particles selected from at least one of graphite, carbon nanotubes, and graphene kind.
本发明泡沫石墨烯骨架增强铜基复合材料,复合材料中,各组分的体积百分含量为:基体材料40-99.9%,增强体0.01-60%,强化颗粒体积分数为0-30%。In the foamed graphene skeleton-reinforced copper-based composite material of the present invention, in the composite material, the volume percentage of each component is: 40-99.9% of the matrix material, 0.01-60% of the reinforcement body, and 0-30% of the reinforcing particle volume fraction.
本发明泡沫石墨烯骨架增强铜基复合材料,强化相中,石墨烯强化层体积分数为0.01-80%,泡沫骨架体积分数为0.1-20%。In the foamed graphene skeleton reinforced copper-based composite material of the present invention, in the strengthening phase, the volume fraction of the graphene strengthening layer is 0.01-80%, and the volume fraction of the foam skeleton is 0.1-20%.
本发明泡沫石墨烯骨架增强铜基复合材料,在基体中,增强体以单体增强或多体阵列增强,所述多体阵列增强是指增强体以层片状平行分布或以柱状平行分布于基体中。The foamed graphene skeleton reinforced copper-based composite material of the present invention, in the matrix, the reinforcing body is reinforced by a single body or a multi-body array. In the matrix.
一种泡沫石墨烯骨架增强铜基复合材料的制备方法,包括下述步骤:A preparation method for a foamed graphene skeleton reinforced copper-based composite material, comprising the steps of:
第一步:增强体的制备Step 1: Preparation of Reinforcement Body
将泡沫骨架衬底清洗、烘干后,采用化学气相沉积在泡沫骨架表面原位生长石墨烯膜,得到增强体;沉积参数为:After the foam skeleton substrate is cleaned and dried, a graphene film is grown in situ on the surface of the foam skeleton by chemical vapor deposition to obtain a reinforcement; the deposition parameters are:
沉积石墨烯膜:含碳气体占炉内全部气体质量流量百分比为0.5-80.0%;生长温度为400-1200℃,生长气压为5-105Pa;Deposition of graphene film: the carbon-containing gas accounts for 0.5-80.0% of the total gas mass flow rate in the furnace; the growth temperature is 400-1200°C, and the growth pressure is 5-10 5 Pa;
或or
将泡沫骨架衬底清洗、烘干后,采用化学气相沉积在泡沫骨架表面原位生长石墨烯墙、石墨烯包覆金刚石、碳纳米管包覆石墨烯,沉积过程中在泡沫骨架衬底上施加等离子辅助生长,并通过在衬底底部添加磁场把等离子体约束在泡沫骨架近表面,强化等离子对泡沫骨架表面的轰击,使石墨烯垂直于泡沫骨架表面生长,形成石墨烯墙,得到增强体;沉积工艺为:After the foam skeleton substrate is cleaned and dried, the graphene wall, graphene-coated diamond, and carbon nanotube-coated graphene are grown on the surface of the foam skeleton by chemical vapor deposition. Plasma-assisted growth, and by adding a magnetic field at the bottom of the substrate to confine the plasma near the surface of the foam skeleton, strengthen the bombardment of the plasma on the surface of the foam skeleton, make graphene grow perpendicular to the surface of the foam skeleton, form a graphene wall, and obtain a reinforcement; The deposition process is:
沉积石墨烯墙:含碳气体占炉内全部气体质量流量百分比为0.5-80%;生长温度为400-1200℃,生长气压为5-105Pa;等离子电流密度为0-50mA/cm2;沉积区域中磁场强度为100高斯至30特斯拉;Deposited graphene wall: the carbon-containing gas accounts for 0.5-80% of the total gas mass flow rate in the furnace; the growth temperature is 400-1200°C, the growth pressure is 5-10 5 Pa; the plasma current density is 0-50mA/cm 2 ; The magnetic field strength in the deposition area is 100 Gauss to 30 Tesla;
沉积石墨烯包覆金刚石:首先,采用化学气相沉积技术在衬底表面沉积金刚石,沉积参数为:含碳气体质量流量百分比为0.5-10%;生长温度为600-1000℃,生长气压为103-104Pa;然后,再在金刚石表面沉积石墨烯墙,石墨烯垂直于金刚石表面生长,形成石墨烯墙,沉积参数为:含碳气体占炉内全部气体质量流量百分比为0.5-80%;生长温度为400-1200℃,生长气压为5-105Pa;等离子电流密度为0-50mA/cm2;沉积区域中磁场强度为100高斯至30特斯拉;Deposition of graphene-coated diamond: first, diamond is deposited on the surface of the substrate by chemical vapor deposition technology, and the deposition parameters are: the mass flow rate of carbon-containing gas is 0.5-10%; the growth temperature is 600-1000°C, and the growth pressure is 10 3 -10 4 Pa; Then, deposit a graphene wall on the diamond surface, and graphene grows perpendicular to the diamond surface to form a graphene wall. The deposition parameters are: carbon-containing gas accounts for 0.5-80% of the total gas mass flow rate in the furnace; The growth temperature is 400-1200°C, the growth pressure is 5-10 5 Pa; the plasma current density is 0-50mA/cm 2 ; the magnetic field strength in the deposition area is 100 Gauss to 30 Tesla;
沉积碳纳米管包覆石墨烯:首先,采用化学气相沉积技术在衬底表面沉积石墨烯膜,沉积参数为:含碳气体占炉内全部气体质量流量百分比为0.5-80%;生长温度为400-1200℃,生长气压为5-105Pa;然后,在石墨烯墙表面沉积碳纳米管林,沉积参数为:含碳气体质量流量百分比为5-50%;生长温度为400-1300℃,生长气压为103-105Pa;等离子电流密度为0-30mA/cm2;沉积区域中磁场强度为100高斯至30特斯拉;Deposition of carbon nanotube-coated graphene: First, the graphene film is deposited on the surface of the substrate by chemical vapor deposition technology. The deposition parameters are: carbon-containing gas accounts for 0.5-80% of the total gas mass flow rate in the furnace; -1200°C, the growth pressure is 5-10 5 Pa; then, carbon nanotube forests are deposited on the surface of the graphene wall, and the deposition parameters are: the mass flow percentage of carbon-containing gas is 5-50%; the growth temperature is 400-1300°C, The growth pressure is 10 3 -10 5 Pa; the plasma current density is 0-30mA/cm 2 ; the magnetic field strength in the deposition area is 100 Gauss to 30 Tesla;
第二步:采用压力熔渗技术将具有石墨烯强化层的增强体与铜基体复合。Step 2: Composite the reinforcing body with the graphene strengthening layer and the copper matrix by pressure infiltration technology.
一种泡沫石墨烯骨架增强铜基复合材料的制备方法,第一步中,泡沫骨架衬底清洗、烘干后,先采用电镀、化学镀、蒸镀、磁控溅射、化学气相沉积、物理气相沉积中的一种方法在衬底表面沉积镍、铜、钨、钼、钛、银、铬中的一种或复合金属层,然后,置于纳米晶和微米晶金刚石混合颗粒的悬浊液中,加热至沸腾后,于超声波中震荡、分散均匀,得到网孔中间镶嵌大量纳米晶和微米晶金刚石颗粒的泡沫骨架衬底;对泡面骨架衬底采用化学气相沉积在泡沫骨架表面或金刚石颗粒表面原位生长石墨烯膜、石墨烯墙、石墨烯包覆金刚石、碳纳米管包覆石墨烯,得到增强体。A method for preparing a foamed graphene skeleton reinforced copper-based composite material. In the first step, after the foamed skeleton substrate is cleaned and dried, electroplating, electroless plating, vapor deposition, magnetron sputtering, chemical vapor deposition, physical A method in vapor deposition deposits one or a composite metal layer of nickel, copper, tungsten, molybdenum, titanium, silver, chromium on the surface of the substrate, and then places a suspension of nanocrystalline and microcrystalline diamond mixed particles After heating to boiling, oscillate and disperse evenly in ultrasonic waves to obtain a foam skeleton substrate with a large number of nanocrystalline and microcrystalline diamond particles inlaid in the middle of the mesh; for the foam skeleton substrate, use chemical vapor deposition on the surface of the foam skeleton or diamond In-situ growth of graphene film, graphene wall, graphene-coated diamond, and carbon nanotube-coated graphene on the particle surface to obtain a reinforcement.
一种泡沫石墨烯骨架增强铜基复合材料的制备方法,在增强体表面制备一层改性层后,采用压力熔渗技术与铜基体复合;所述改性层选自钨、碳化钨、钼、碳化钼、铬、碳化铬、钛、碳化钛、镍、铜、铝、铂、钨合金、钼基合金、铬基合金、钛基合金、镍基合金、铜基合金、铝基合金、铂基合金中的至少一种;采用电镀、化学镀、蒸镀、磁控溅射、化学气相沉积、物理气相沉积中的一种方法在增强体表面制备改性层。A method for preparing a foamed graphene skeleton reinforced copper-based composite material. After preparing a modified layer on the surface of the reinforced body, the pressure infiltration technology is used to compound the copper matrix; the modified layer is selected from tungsten, tungsten carbide, and molybdenum. , molybdenum carbide, chromium, chromium carbide, titanium, titanium carbide, nickel, copper, aluminum, platinum, tungsten alloys, molybdenum-based alloys, chromium-based alloys, titanium-based alloys, nickel-based alloys, copper-based alloys, aluminum-based alloys, platinum At least one of base alloys; using one of electroplating, electroless plating, vapor deposition, magnetron sputtering, chemical vapor deposition, and physical vapor deposition to prepare a modified layer on the surface of the reinforcement.
一种泡沫石墨烯骨架增强铜基复合材料的制备方法,在沉积碳纳米管前,需采用电镀、化学镀、蒸镀、磁控溅射、化学气相沉积、物理气相沉积中的一种方法在衬底表面沉积镍、铜、钴的一种或复合催化层。A method for preparing a foamed graphene skeleton reinforced copper-based composite material. Before depositing carbon nanotubes, one of the methods of electroplating, electroless plating, vapor deposition, magnetron sputtering, chemical vapor deposition, and physical vapor deposition is required. One or a composite catalytic layer of nickel, copper, cobalt is deposited on the surface of the substrate.
CVD是目前最有可能实现工业化制备高质量、大面积石墨烯的方法。本专利选用易于制备且无缝连接的泡沫金属或泡沫陶瓷或泡沫碳骨架作为衬底,利用化学气相沉积技术在其表面制备高导热石墨烯膜层,构建出高导热石墨烯三维网络骨架,再将其与金属基体复合,使高导热石墨烯与金属形成双连通三维网络互穿结构,使增强相与基体相在空间都保持连续分布,构成连续的导热通道,产生并联式导热,从而弱化复合界面对材料热学性能的负面影响,既能使增强相作为一个整体充分发挥导热效率,又不降低金属基体在复合材料中的良好塑韧性。同时还可以添加高导热金刚石粉、石墨烯、碳纳米管或降低热膨胀系数的高导热陶瓷颗粒如SiC、AlN等中的一种或多种,实现热学和力学性能的进一步提升。CVD is currently the most likely method to industrially prepare high-quality, large-area graphene. This patent selects metal foam or ceramic foam or carbon foam skeleton that is easy to prepare and seamlessly connected as the substrate, and uses chemical vapor deposition technology to prepare a high thermal conductivity graphene film layer on its surface to construct a three-dimensional graphene network skeleton with high thermal conductivity. Combining it with the metal matrix makes the high thermal conductivity graphene and the metal form a double-connected three-dimensional network interpenetrating structure, so that the reinforcement phase and the matrix phase maintain a continuous distribution in space, forming a continuous heat conduction channel, resulting in parallel heat conduction, thus weakening the composite The negative impact of the interface on the thermal properties of the material can not only make the reinforced phase fully exert its thermal conductivity as a whole, but also not reduce the good plasticity and toughness of the metal matrix in the composite material. At the same time, one or more of high thermal conductivity diamond powder, graphene, carbon nanotubes or high thermal conductivity ceramic particles such as SiC and AlN with reduced thermal expansion coefficient can be added to achieve further improvement of thermal and mechanical properties.
通过该方法制得的复合材料可以完整地复制了泡沫金属的结构,高导热材料以无缝连接的方式构成一个全连通的整体,以三维网络的形式均匀地分布于复合材料中,具有优异的连续导热能力、电荷传导能力和极低密度,使得复合材料的热导率、导电率及机械强度相比较传统复合材料有极大提高,将会是一种很有潜力的新型多功能复合材料,可以广泛应用于在热管理、电子、能源、交通等国民经济领域。The composite material prepared by this method can completely replicate the structure of metal foam, and the high thermal conductivity material forms a fully connected whole in a seamless connection, and is evenly distributed in the composite material in the form of a three-dimensional network. Continuous thermal conductivity, charge conductivity and extremely low density make the thermal conductivity, electrical conductivity and mechanical strength of composite materials greatly improved compared with traditional composite materials, and will be a new type of multifunctional composite material with great potential. It can be widely used in thermal management, electronics, energy, transportation and other national economic fields.
附图说明Description of drawings
附图1为本发明中泡沫骨架在基体中以单体增强的结构示意图。Accompanying drawing 1 is the schematic structural view of the foam skeleton reinforced by monomers in the matrix in the present invention.
附图2为本发明中泡沫骨架在基体中以层片状平行分布增强的结构示意图。Accompanying drawing 2 is the schematic structural diagram of the foam skeleton in the matrix distributed in parallel in lamellar form in the present invention.
附图3a、附图3b为本发明中泡沫骨架在基体中以柱状平行分布增强的结构示意图。Accompanying drawing 3a, accompanying drawing 3b are the structural schematic diagrams of the reinforcement of the foam skeleton in the matrix in a columnar parallel distribution in the present invention.
具体实施方式detailed description
下面通过具体的实施例进一步描述本发明的技术方案。The technical solution of the present invention is further described below through specific examples.
本发明实施例按以下工艺或步骤进行:Embodiments of the present invention are carried out according to the following processes or steps:
(1)将泡沫骨架衬底放入在乙醇中进行超声震荡清洗,取出烘干待用;(1) Put the foam skeleton substrate in ethanol for ultrasonic vibration cleaning, take it out and dry it for later use;
(2)采用电镀、化学镀、蒸镀、磁控溅射、化学气相沉积、物理气相沉积中的一种方法在泡沫骨架表面制备中间过渡层,所述的中间过渡层包括镍、铜、钨、钼、钛、银、铬中的一种或复合金属层;(2) Adopt a method in electroplating, electroless plating, vapor deposition, magnetron sputtering, chemical vapor deposition, physical vapor deposition to prepare intermediate transition layer on foam skeleton surface, described intermediate transition layer comprises nickel, copper, tungsten , molybdenum, titanium, silver, chromium or a composite metal layer;
(3)将纳米晶和微米晶金刚石混合颗粒、泡沫骨架衬底、溶剂混合,加热至沸腾,然后,置于大功率超声波中震荡30min、分散均匀后,取出泡沫骨架衬底烘干,得到网孔中间镶嵌大量纳米晶和微米晶金刚石颗粒的泡沫骨架衬底;(3) Mix nanocrystalline and microcrystalline diamond mixed particles, foam skeleton substrate, and solvent, heat to boiling, then place in high-power ultrasonic wave for 30 minutes and disperse evenly, then take out the foam skeleton substrate and dry it to obtain the net A foam skeleton substrate with a large number of nanocrystalline and microcrystalline diamond particles embedded in the middle of the hole;
(4)采用热丝化学气相沉积在金属衬底表面沉积连续致密的石墨烯强化层,所述石墨烯强化层为选自石墨烯膜、石墨烯包覆金刚石、碳纳米管包覆石墨烯中的至少一种;(4) adopting hot wire chemical vapor deposition to deposit a continuous and dense graphene strengthening layer on the surface of the metal substrate, the graphene strengthening layer is selected from graphene film, graphene-coated diamond, and carbon nanotube-coated graphene at least one of
(5)具有石墨烯强化层的泡沫骨架与基体材料复合之前,为改善强化层与基体材料的结合性能,需对强化层进行表面改性处理,采用电镀、化学镀、蒸镀、磁控溅射、化学气相沉积、物理气相沉积中的一种方法在具有石墨烯强化层的泡沫骨架表面制备钨、碳化钨、钼、碳化钼、铬、碳化铬、钛、碳化钛、镍、铜、铝、铂、钨合金、钼合金、铬合金、钛合金、镍合金、铜合金、铝合金、铂合金中的至少一种改性层;(5) Before the foam skeleton with graphene reinforced layer is combined with the matrix material, in order to improve the bonding performance of the reinforced layer and the matrix material, the surface modification treatment of the reinforced layer is required, using electroplating, chemical plating, evaporation, magnetron sputtering Preparation of tungsten, tungsten carbide, molybdenum, molybdenum carbide, chromium, chromium carbide, titanium, titanium carbide, nickel, copper, aluminum on the surface of the foam skeleton with a graphene-enhanced layer by radiation, chemical vapor deposition, and physical vapor deposition , platinum, tungsten alloy, molybdenum alloy, chromium alloy, titanium alloy, nickel alloy, copper alloy, aluminum alloy, platinum alloy at least one modified layer;
(6)经表面改性处理后的泡沫石墨烯骨架增强体在基体中的布设方式可分为如下三种方式:a.泡沫石墨烯骨架作为整体增强体与基体复合,复合材料整体形成金刚石/铜网络互穿结构;b.泡沫石墨烯骨架作为片状增强体与基体复合,增强体在基体中的排布方向为平行排布;c.泡沫石墨烯骨架作为条状增强体与基体复合,增强体在基体中的排布方向为平行排布;(6) The layout of the graphene foam skeleton reinforcement in the matrix after surface modification can be divided into the following three modes: a. the graphene foam skeleton is composited with the matrix as an integral reinforcement, and the composite material integrally forms a diamond/ Copper network interpenetrating structure; b. The graphene foam skeleton is composited with the matrix as a sheet-like reinforcement, and the arrangement direction of the reinforcement in the matrix is parallel; c. The graphene foam skeleton is composited with the matrix as a strip reinforcement, The arrangement direction of reinforcements in the matrix is parallel arrangement;
(7)采用压力熔渗技术将具有石墨烯强化层的泡沫骨架与铜基体复合。(7) The foam skeleton with a graphene-reinforced layer is composited with a copper matrix using pressure infiltration technology.
实施例一:Embodiment one:
泡沫石墨烯骨架增强铜基复合材料,本例中采用孔径为0.2mm泡沫钛作为衬底,泡沫石墨烯增强体占复合材料体积分数8%,首先按照步骤(1)对泡沫钛三维网络衬底进行清洗,之后按步骤(2)采用磁控溅射技术在泡沫钛三维网络骨架表面沉积厚度为50nm的钼膜作为中间过渡层;然后按照步骤(3)得到网孔中间镶嵌大量纳米晶和微米晶金刚石颗粒的泡沫骨架衬底;(4)采用热壁CVD沉积石墨烯膜,具体为:在H2和Ar的气氛中加热至950℃(加热过程中H2和Ar流速分别为200和500mL/min,升温速度为33℃/分钟),待炉温升至950℃后热处理10min;热处理完成后通入CH4、H2和Ar的混合气体(气体流速分别为甲烷5mL/min、氢气200mL/min和氩气500mL/min),开始生长石墨烯,冷却速度100℃/min,生长时间为1h,即得到泡沫钛衬底石墨烯三维网络骨架;之后按照步骤(5)在与基体材料复合之前,采用真空蒸发的方法在泡沫石墨烯骨架表面原位蒸镀一层金属铜膜进行表面改性,铜膜厚度为100nm;(6)将表面铜钨的泡沫石墨烯骨架置于模具中,采用作为片状增强体在基体中平行设置进行复合;(7)采用真空挤压铸造法将具有石墨烯强化层的泡沫骨架与铜基体复合,具体工艺参数如下:泡沫石墨烯骨架预制件加热至1000℃恒温1h,成型模具加热至800℃恒温1h,纯铜熔化加热至1250℃恒温1h后除气去渣;现将铜液浇注再将网络骨架预制件置于静模上,动模下行合模,合模后用压铸真空机对模腔抽真空,当模腔真空度小于1000Pa时,挤压头开始加压,最终铸造压力为120MPa,保压2分钟后脱模得到泡沫石墨烯骨架增强铜基复合材料。性能测试结果:热导率为615W/(m·K)。Foamed graphene skeleton reinforced copper-based composite material, in this example, the pore size is 0.2mm titanium foam as the substrate, the foamed graphene reinforcement accounts for 8% of the volume fraction of the composite material, first according to step (1) on the foamed titanium three-dimensional network substrate Cleaning, followed by step (2) using magnetron sputtering technology to deposit a molybdenum film with a thickness of 50nm on the surface of the foam titanium three-dimensional network skeleton as an intermediate transition layer; A foam skeleton substrate of crystalline diamond particles; (4) adopting hot wall CVD to deposit graphene film, specifically: heating to 950° C. in an atmosphere of H2 and Ar (the flow rates of H2 and Ar during the heating process were 200 and 500 mL/min respectively , the heating rate is 33°C/min), heat treatment for 10min after the furnace temperature rises to 950°C; after the heat treatment is completed, a mixed gas of CH4, H2 and Ar is introduced (the gas flow rates are respectively methane 5mL/min, hydrogen 200mL/min and argon Gas 500mL/min), start to grow graphene, the cooling rate is 100 ℃/min, and the growth time is 1h, that is, the three-dimensional network skeleton of the foamed titanium substrate graphene is obtained; then follow the step (5) before compounding with the matrix material, use vacuum Evaporation method Evaporate a layer of metal copper film in situ on the surface of the foamed graphene skeleton for surface modification, the thickness of the copper film is 100nm; The reinforcing body is set in parallel in the matrix for compounding; (7) The foam skeleton with the graphene reinforced layer is compounded with the copper matrix by vacuum extrusion casting method, and the specific process parameters are as follows: the foamed graphene skeleton preform is heated to 1000°C for 1 hour , the forming mold is heated to 800°C for 1 hour, the pure copper is melted and heated to 1250°C for 1 hour, and then degassed and slag removed; now the copper liquid is poured and the network skeleton prefabricated part is placed on the static mold, and the movable mold moves downward to close the mold. Use a die-casting vacuum machine to evacuate the mold cavity. When the vacuum degree of the mold cavity is less than 1000Pa, the extrusion head starts to pressurize, and the final casting pressure is 120MPa. After holding the pressure for 2 minutes, the mold is demoulded to obtain a foamed graphene skeleton reinforced copper matrix composite. Performance test results: thermal conductivity is 615W/(m·K).
实施例二:Embodiment two:
泡沫石墨烯骨架增强铜基复合材料,本例中采用孔径为0.3mm泡沫镍作为衬底,泡沫石墨烯增强体占复合材料体积分数20%,首先按照步骤(1)对泡沫镍三维网络衬底进行清洗,之后按步骤(2)采用蒸镀的方法在泡沫镍三维网络骨架表面沉积厚度为300nm的铬膜作为中间过渡层;然后按照步骤(3)得到网孔中间镶嵌大量纳米晶和微米晶金刚石颗粒的泡沫骨架衬底;(4)采用热丝CVD沉积金刚石膜,沉积工艺参数:热丝距离6mm,基体温度850℃,热丝温度2200℃,沉积压强3KPa,CH4/H2体积流量比1:99,控制沉积时间得到金刚石膜厚度200μm,得到泡沫镍衬底金刚石三维网络骨架,再在金刚石表面利用等离子辅助化学气相沉积在金刚石表面原位生长石墨烯,沉积过程中在泡沫骨架衬底上施加等离子辅助生长,并通过在衬底底部添加磁场把等离子体约束在泡沫骨架近表面,强化等离子对泡沫骨架表面的轰击,使石墨烯垂直于金刚石表面生长,获得网孔中含有大量石墨烯包覆金刚石高导热颗粒和骨架表面生长大量石墨烯墙的泡沫骨架,沉积参数为:基体温度为800℃,沉积气压为5.0kPa,CH4/H2体积流量比23:77,等离子电流密度15mA/cm2;同时外加电场下作用下控制石墨烯的生长取向,使它们垂直与金刚石表面形成石墨烯墙,得到石墨烯包覆金刚石膜的强化层,其中沉积区域中磁场强度为600高斯,得到泡沫镍衬底石墨烯包覆金刚石三维网络骨架;之后按照步骤(5)在与基体材料复合之前,采用电镀的方法在泡沫石墨烯骨架表面电镀一层金属铬膜进行表面改性,铬膜厚度为400nm;(6)将表面镀铬的泡沫石墨烯骨架置于模具中,采用作为条状增强体在基体中平行设置进行复合;(7)采用真空压力铸造法将具有石墨烯强化层的泡沫骨架与铜基体复合,具体工艺参数如下:泡沫石墨烯骨架预制件加热至1020℃恒温1h,成型模具加热至840℃恒温1h,铜合金(牌号T1)熔化加热至1260℃恒温0.5h后除气去渣;铜合金液浇注合模且冲头超过浇注口后用压铸真空机对模腔抽真空,当模腔真空度小于1000Pa时,冲头继续加压,最终铸造压力为80MPa,保压2分钟后脱模得到泡沫石墨烯骨架增强铜合金复合材料。性能测试结果:轴向热导率为925W/(m·K)。Foamed graphene skeleton reinforced copper-based composite material, in this example, the pore size of 0.3mm nickel foam is used as the substrate, and the foamed graphene reinforcement accounts for 20% of the volume fraction of the composite material. Carry out cleaning, adopt the method for evaporation to deposit thickness be the chromium film of 300nm as the intermediate transition layer on the surface of nickel foam three-dimensional network framework by step (2) afterwards; Diamond particle foam skeleton substrate; (4) Hot wire CVD is used to deposit diamond film, deposition process parameters: hot wire distance 6mm, substrate temperature 850°C, hot wire temperature 2200°C, deposition pressure 3KPa, CH 4 /H 2 volume flow rate Ratio 1:99, control the deposition time to obtain a diamond film thickness of 200 μm, and obtain a three-dimensional diamond network skeleton on a nickel foam substrate, and then use plasma-assisted chemical vapor deposition on the diamond surface to grow graphene in situ on the diamond surface. During the deposition process, the foam skeleton lining Plasma-assisted growth is applied on the bottom of the substrate, and the plasma is confined near the surface of the foam skeleton by adding a magnetic field at the bottom of the substrate, and the bombardment of the plasma on the surface of the foam skeleton is strengthened, so that graphene grows perpendicular to the diamond surface, and a large amount of graphite is obtained in the mesh. Graphene-coated diamond particles with high thermal conductivity and a foam skeleton with a large number of graphene walls grown on the surface of the skeleton. The deposition parameters are: substrate temperature 800°C, deposition pressure 5.0kPa, CH4/H2 volume flow ratio 23:77, plasma current density 15mA/ cm 2 ; at the same time, the growth orientation of graphene is controlled under the action of an external electric field, so that they form a graphene wall perpendicular to the diamond surface, and a strengthening layer of graphene-coated diamond film is obtained. The magnetic field strength in the deposition area is 600 gauss, and the foam is obtained. Nickel-substrate graphene coats the diamond three-dimensional network framework; then, according to step (5), before compounding with the matrix material, the method of electroplating is used to electroplate a layer of metal chromium film on the surface of the foamed graphene framework surface for surface modification, and the thickness of the chromium film is 400nm; (6) place the foamed graphene framework with chrome-plated surface in the mould, and use it as a strip-shaped reinforcing body to arrange in parallel in the matrix for compounding; (7) adopt the vacuum pressure casting method to combine the foamed framework with the graphene reinforced layer with the Copper matrix compounding, the specific process parameters are as follows: the foamed graphene skeleton preform is heated to 1020°C for 1 hour, the forming mold is heated to 840°C for 1 hour, and the copper alloy (grade T1) is melted and heated to 1260°C for 0.5 hour to degas and remove slag ; After the copper alloy liquid is poured and the punch exceeds the pouring port, the die cavity is evacuated with a die-casting vacuum machine. When the vacuum degree of the cavity is less than 1000Pa, the punch continues to pressurize, and the final casting pressure is 80MPa. After holding the pressure for 2 minutes Demoulding obtains the foamed graphene skeleton reinforced copper alloy composite material. Performance test results: the axial thermal conductivity is 925W/(m·K).
实施例三:Embodiment three:
泡沫石墨烯骨架增强铜基复合材料,本例中采用孔径为1mm泡沫钨作为衬底,泡沫石墨烯增强体占复合材料体积分数10%,首先按照步骤(1)对泡沫钨三维网络衬底进行清洗,之后不加中间过渡层,直接利用化学气相沉积原位生长石墨烯膜;然后按照步骤(3)得到网孔中间镶嵌大量纳米晶和微米晶金刚石颗粒的泡沫骨架衬底;(4)采用热壁CVD沉积石墨烯膜,具体为:在H2和Ar的气氛中加热至950℃(加热过程中H2和Ar流速分别为200和500mL/min,升温速度为33℃/分钟),待炉温升至950℃后热处理10min;热处理完成后通入CH4、H2和Ar的混合气体(气体流速分别为甲烷5mL/min、氢气200mL/min和氩气500mL/min),开始生长石墨烯,生长时间为1h,冷却速度100℃/min,即得到泡沫钨衬底石墨烯三维网络骨架;再磁控溅射在石墨烯表面沉积一层镍,然后利用等离子辅助化学气相沉积在石墨烯表面催化生长碳纳米管,同时外加电场下作用下控制碳纳米管的生长取向,使它们垂直与石墨烯表面形成碳纳米管林,得到碳纳米管包覆石墨烯膜的强化层,沉积参数为:甲烷、氢气质量流量百分比为5:95;生长温度为600℃,生长气压3000Pa;等离子电流密度5mA/cm2;沉积区域中磁场强度为500高斯,沉积2h,得到泡沫钨衬底碳纳米管包覆石墨烯三维网络骨架;之后按照步骤(5)在与基体材料复合之前,采用真空蒸发的方法在泡沫石墨烯骨架表面蒸镀一层金属钛膜进行表面改性,钛膜厚度为350nm;(6)将表面镀钛的泡沫金刚石骨架置于模具中,采用作为整体增强体的布设方式与基体进行复合;(7)采用真空气压铸造法将具有石墨烯强化层的泡沫骨架与铜基体复合,具体工艺参数如下:真空室压力5Pa,网络骨架和成型模具加热温度840℃恒温2h,铜合金(牌号H96)熔化加热温度1300℃恒温1小时,浸渗入压力为8MPa,保压冷却至400℃卸压,脱模得到复合材料。泡沫石墨烯骨架增强铜合金复合材料。性能测试结果:复合材料整体热导率为815W/(m·K)。Foamed graphene skeleton reinforced copper-based composite material, in this example, tungsten foam with a pore size of 1mm is used as the substrate, and the foamed graphene reinforcement accounts for 10% of the volume fraction of the composite material. After cleaning, no intermediate transition layer is added, and the in-situ growth graphene film is directly utilized by chemical vapor deposition; then according to step (3), a foam skeleton substrate inlaid with a large number of nanocrystalline and microcrystalline diamond particles in the middle of the mesh is obtained; (4) using The graphene film was deposited by hot-wall CVD, specifically: heating to 950°C in an atmosphere of H2 and Ar (the flow rates of H2 and Ar during the heating process were 200 and 500mL/min, and the heating rate was 33°C/min), and the furnace temperature After heating to 950°C, heat treatment for 10 minutes; after the heat treatment is completed, a mixed gas of CH4, H2 and Ar is introduced (gas flow rates are respectively methane 5mL/min, hydrogen 200mL/min and argon 500mL/min) to start growing graphene, and the growth time For 1h, the cooling rate is 100°C/min, and the three-dimensional network framework of graphene on the foamed tungsten substrate is obtained; then a layer of nickel is deposited on the surface of graphene by magnetron sputtering, and then plasma-assisted chemical vapor deposition is used to catalyze the growth of carbon on the surface of graphene At the same time, under the action of an external electric field, the growth orientation of carbon nanotubes is controlled, so that they are perpendicular to the graphene surface to form a carbon nanotube forest, and a strengthening layer of carbon nanotube-coated graphene film is obtained. The deposition parameters are: methane, hydrogen The mass flow rate is 5:95; the growth temperature is 600°C, the growth pressure is 3000Pa; the plasma current density is 5mA/cm 2 ; the magnetic field strength in the deposition area is 500 Gauss, and the deposition time is 2h to obtain carbon nanotube-coated graphene on a foamed tungsten substrate Three-dimensional network skeleton; then according to step (5) before being composited with matrix material, adopt the method for vacuum evaporation to vapor-deposit one deck metal titanium film on the surface of foamed graphene skeleton and carry out surface modification, and the thickness of titanium film is 350nm; (6) will The foamed diamond skeleton coated with titanium on the surface is placed in the mold, and is composited with the substrate as an overall reinforcement; (7) The foam skeleton with a graphene reinforced layer is composited with the copper substrate by vacuum air casting method, and the specific process parameters As follows: the vacuum chamber pressure is 5Pa, the heating temperature of the network skeleton and the forming mold is 840°C for 2 hours, the copper alloy (brand H96) is melted and heated at 1300°C for 1 hour, the infiltration pressure is 8MPa, the pressure is kept and cooled to 400°C, the pressure is released, and the mold to obtain composite material. Foamed graphene framework reinforced copper alloy composites. Performance test results: The overall thermal conductivity of the composite material is 815W/(m·K).
实施例四:Embodiment four:
泡沫石墨烯骨架增强铜基复合材料,本例中采用孔径为2mm多孔陶瓷氧化铝作为衬底,泡沫石墨烯增强体占复合材料体积分数10%,首先按照步骤(1)对泡沫氧化铝三维网络衬底进行清洗,之后按步骤(2)采用磁控溅射的技术在泡沫氧化铝三维网络骨架表面沉积厚度为500nm的钨膜作为中间过渡层;然后按照步骤(3)得到网孔中间镶嵌大量纳米晶和微米晶金刚石颗粒的泡沫骨架衬底;(4)利用等离子辅助化学气相沉积在衬底表面原位生长石墨烯,沉积过程中在泡沫骨架衬底上施加等离子辅助生长,并通过在衬底底部添加磁场把等离子体约束在泡沫骨架近表面,强化等离子对泡沫骨架表面的轰击,使石墨烯垂直于金刚石表面生长,获得网孔中含有大量石墨烯包覆金刚石高导热颗粒和骨架表面生长大量石墨烯墙的泡沫骨架,沉积参数为:基体温度为800℃,沉积气压为5.0kPa,CH4/H2体积流量比35:65,等离子电流密度5mA/cm2,沉积区域中磁场强度为700高斯,沉积5h;同时外加电场下作用下控制石墨烯的生长取向,使它们垂直与衬底表面形成石墨烯墙,得到泡沫氧化铝衬底石墨烯三维网络骨架;之后按照步骤(5)在与基体材料复合之前,采用磁控溅射的方法在泡沫石墨烯骨架表面电镀一层金属钨铜合金膜进行表面改性,钨铜合金膜厚度为250nm;(6)将表面钨铜合金膜的泡沫石墨烯骨架置于模具中,采用作为整体增强体的布设方式与基体进行复合;(7)将高导热泡沫石墨烯骨架体积的2倍铜硅合金放置在骨架上方,其中Si的质量含量为15%,然后放入加热炉中,在高纯氮气保护下1300℃保温30min,即可制得泡沫石墨烯骨架增强铜合金复合材料,复合材料热导率分别为772W/(m·K)。Foamed graphene skeleton reinforced copper-based composite material, in this example, the porous ceramic alumina with a pore size of 2 mm is used as the substrate, and the foamed graphene reinforcement accounts for 10% of the volume fraction of the composite material. The substrate is cleaned, and then a tungsten film with a thickness of 500nm is deposited on the surface of the foamed alumina three-dimensional network skeleton as an intermediate transition layer by using the technology of magnetron sputtering according to step (2); The foam skeleton substrate of nanocrystalline and microcrystalline diamond particles; (4) use plasma-assisted chemical vapor deposition to grow graphene in situ on the substrate surface, apply plasma-assisted growth on the foam skeleton substrate during the deposition process, and Add a magnetic field at the bottom to confine the plasma near the surface of the foam skeleton, strengthen the bombardment of the plasma on the surface of the foam skeleton, make graphene grow perpendicular to the diamond surface, and obtain a large number of graphene-coated diamond high thermal conductivity particles in the mesh and growth on the skeleton surface The foam skeleton of a large number of graphene walls, the deposition parameters are: the substrate temperature is 800°C, the deposition pressure is 5.0kPa, the volume flow ratio of CH 4 /H 2 is 35:65, the plasma current density is 5mA/cm 2 , and the magnetic field strength in the deposition area is 700 gauss, deposition 5h; Control the growth orientation of graphene under the action of external electric field simultaneously, make them vertically form graphene wall with substrate surface, obtain foamed aluminum oxide substrate graphene three-dimensional network skeleton; Follow step (5) in afterward Before compounding with the base material, a metal tungsten-copper alloy film is electroplated on the surface of the foamed graphene skeleton by magnetron sputtering to modify the surface. The thickness of the tungsten-copper alloy film is 250nm; The foamed graphene skeleton is placed in the mold, and is composited with the matrix as an overall reinforcement arrangement; (7) the copper-silicon alloy with twice the volume of the highly thermally conductive foamed graphene skeleton is placed above the skeleton, wherein the mass content of Si is 15%, then put it into a heating furnace, and keep it at 1300°C for 30min under the protection of high-purity nitrogen to prepare a foamed graphene skeleton reinforced copper alloy composite material. The thermal conductivity of the composite material is 772W/(m·K).
实施例五:Embodiment five:
泡沫金刚石/碳纳米管骨架增强铜基复合材料,本例中采用孔径为0.15mm泡沫碳作为衬底,泡沫金刚石增强体占复合材料体积分数30%,首先按照步骤(1)对泡沫碳三维网络衬底进行清洗,之后按步骤(2)采用磁控溅射技术在泡沫铜三维网络骨架表面沉积厚度为50nm的铬膜作为中间过渡层;然后按照步骤(3)得到网孔中间镶嵌大量纳米晶和微米晶金刚石颗粒的泡沫骨架衬底;步骤(4)采用热丝CVD沉积金刚石膜,沉积工艺参数:热丝距离6mm,基体温度800℃,热丝温度2200℃,沉积压强3KPa,CH4/H2体积流量比1:99,通过控制沉积时间得到金刚石膜厚度300μm,即得到泡沫碳衬底金刚石三维网络骨架;再磁控溅射在金刚石表面沉积一层镍,然后利用等离子辅助化学气相沉积在镍表面催化生长碳纳米管,同时外加电场下作用下控制碳纳米管的生长取向,使它们垂直与石墨烯表面形成碳纳米管林,得到泡沫碳衬底金刚石/碳纳米管三维网络骨架,沉积参数为:甲烷氢气质量流量百分比为10%;生长温度为600℃,生长气压3000Pa;等离子电流密度5mA/cm2;沉积区域中磁场强度为500高斯,沉积1h。之后按照步骤(5)在与基体材料复合之前,采用真空蒸发的方法在泡沫金刚石骨架表面原位蒸镀一层金属碳化钨膜进行表面改性,碳化钨膜厚度为150nm;(6)将表面镀碳化钨膜的泡沫金刚石骨架置于模具中,采用作为片状增强体在基体中平行设置进行复合;(7)采用真空气压铸造法将具有泡沫碳衬底金刚石/碳纳米管三维网络骨架与铜基体复合,具体工艺参数如下:真空室压力5Pa,网络骨架和成型模具加热温度840℃恒温2h,铜合金(牌号H96)熔化加热温度1260℃恒温1小时,浸渗入压力为8MPa,保压冷却至400℃卸压,脱模得到复合材料。泡沫金刚石/石墨烯/碳纳米管骨架增强铜基复合材料。性能测试结果:复合材料整体热导率为1262W/(m·K)。Foamed diamond/carbon nanotube skeleton reinforced copper matrix composite material. In this example, foamed carbon with a pore size of 0.15 mm is used as the substrate. The foamed diamond reinforcement accounts for 30% of the volume fraction of the composite material. The substrate is cleaned, followed by step (2) using magnetron sputtering technology to deposit a chromium film with a thickness of 50 nm on the surface of the copper foam three-dimensional network skeleton as an intermediate transition layer; then according to step (3) to obtain a large number of nanocrystals embedded in the middle of the mesh and a foam skeleton substrate of microcrystalline diamond particles; step (4) adopts hot wire CVD to deposit diamond film, deposition process parameters: hot wire distance 6mm, substrate temperature 800°C, hot wire temperature 2200°C, deposition pressure 3KPa, CH 4 / The H2 volume flow ratio is 1:99, and the thickness of the diamond film is 300 μm by controlling the deposition time, that is, the three-dimensional network skeleton of the diamond on the foamed carbon substrate is obtained; then a layer of nickel is deposited on the diamond surface by magnetron sputtering, and then plasma-assisted chemical vapor deposition is used Catalyze the growth of carbon nanotubes on the nickel surface, and control the growth orientation of carbon nanotubes under the action of an external electric field, so that they form a carbon nanotube forest perpendicular to the graphene surface, and obtain a three-dimensional network framework of diamond/carbon nanotubes on a foamed carbon substrate. The deposition parameters are: the mass flow rate of methane and hydrogen is 10%; the growth temperature is 600°C, the growth pressure is 3000Pa; the plasma current density is 5mA/cm2; the magnetic field strength in the deposition area is 500 Gauss, and the deposition is 1h. Afterwards, according to step (5) before compounding with the matrix material, a metal tungsten carbide film is deposited on the surface of the foam diamond skeleton by vacuum evaporation in situ for surface modification, and the thickness of the tungsten carbide film is 150nm; (6) the surface The foamed diamond skeleton coated with tungsten carbide film is placed in the mold, and is used as a sheet-like reinforcement in parallel in the matrix for compounding; (7) the diamond/carbon nanotube three-dimensional network skeleton with a foamed carbon substrate and Copper matrix compounding, the specific process parameters are as follows: vacuum chamber pressure 5Pa, heating temperature of network skeleton and forming mold at 840°C for 2 hours, copper alloy (brand H96) melting heating temperature at 1260°C for 1 hour, impregnation pressure of 8MPa, holding pressure and cooling The pressure was released at 400°C, and the composite material was obtained by demoulding. Foamed diamond/graphene/carbon nanotube framework reinforced copper matrix composites. Performance test results: The overall thermal conductivity of the composite material is 1262W/(m·K).
从以上实施例得到的热导率数据可知,本发明制备的泡沫石墨烯骨架增强铜基复合材料的热导率获得了巨大提升,热导率高达1262W/mK,本发明制得的复合材料完整地复制了泡沫骨架的结构,高导热材料以无缝连接的方式构成一个全连通的整体,增强相与基体相在三维空间内保持连续分布,形成网络互穿结构,可有效弱化复合界面对材料热学性能的影响,既不降低铜基体良好塑韧性,又能使增强相成为一个整体,最大限度发挥增强体的导热效率,使复合材料具有优异的连续导热能力、电荷传导能力和极低密度,综合性能明显优于传统的铜基复合材料,是一种很有潜力的多功能复合材料,可以广泛应用于在热管理、电子、机械、能源、交通等国民经济领域。From the thermal conductivity data obtained in the above examples, it can be seen that the thermal conductivity of the foamed graphene skeleton reinforced copper-based composite material prepared by the present invention has been greatly improved, and the thermal conductivity is as high as 1262W/mK. The composite material prepared by the present invention is complete. The structure of the foam skeleton is perfectly replicated. The high thermal conductivity material forms a fully connected whole in a seamless connection. The reinforcement phase and the matrix phase maintain a continuous distribution in the three-dimensional space, forming a network interpenetrating structure, which can effectively weaken the compound interface to the material. The influence of thermal properties can neither reduce the good plasticity and toughness of the copper matrix, but also make the reinforcement phase a whole, maximize the thermal conductivity of the reinforcement, and make the composite material have excellent continuous thermal conductivity, charge conductivity and extremely low density. The overall performance is obviously better than that of traditional copper-based composite materials. It is a potential multifunctional composite material that can be widely used in thermal management, electronics, machinery, energy, transportation and other national economic fields.
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