CN105400138A - Epoxy resin packaging material for dry-type transformer and preparation method thereof - Google Patents
Epoxy resin packaging material for dry-type transformer and preparation method thereof Download PDFInfo
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 55
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 55
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 239000005022 packaging material Substances 0.000 title abstract 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 40
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000000843 powder Substances 0.000 claims abstract description 15
- 239000011449 brick Substances 0.000 claims abstract description 14
- 239000003063 flame retardant Substances 0.000 claims abstract description 14
- 239000005543 nano-size silicon particle Substances 0.000 claims abstract description 13
- 239000003960 organic solvent Substances 0.000 claims abstract description 13
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 13
- 239000003365 glass fiber Substances 0.000 claims abstract description 11
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 11
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract description 11
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims abstract description 10
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 claims abstract description 10
- 229910000165 zinc phosphate Inorganic materials 0.000 claims abstract description 10
- 229920002125 Sokalan® Polymers 0.000 claims abstract description 9
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000004584 polyacrylic acid Substances 0.000 claims abstract description 9
- -1 dodecyl dimethyl tertiary amine Chemical class 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 44
- 239000002245 particle Substances 0.000 claims description 26
- 238000001816 cooling Methods 0.000 claims description 17
- 239000004593 Epoxy Substances 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 13
- 239000004902 Softening Agent Substances 0.000 claims description 12
- 235000013312 flour Nutrition 0.000 claims description 12
- 229920000120 polyethyl acrylate Polymers 0.000 claims description 12
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- YWFWDNVOPHGWMX-UHFFFAOYSA-N n,n-dimethyldodecan-1-amine Chemical compound CCCCCCCCCCCCN(C)C YWFWDNVOPHGWMX-UHFFFAOYSA-N 0.000 claims description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 8
- 238000000227 grinding Methods 0.000 claims description 8
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 6
- 238000007669 thermal treatment Methods 0.000 claims description 5
- 229930185605 Bisphenol Natural products 0.000 claims description 4
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 claims description 4
- 229920000388 Polyphosphate Polymers 0.000 claims description 4
- 239000001205 polyphosphate Substances 0.000 claims description 4
- 235000011176 polyphosphates Nutrition 0.000 claims description 4
- DMYOHQBLOZMDLP-UHFFFAOYSA-N 1-[2-(2-hydroxy-3-piperidin-1-ylpropoxy)phenyl]-3-phenylpropan-1-one Chemical compound C1CCCCN1CC(O)COC1=CC=CC=C1C(=O)CCC1=CC=CC=C1 DMYOHQBLOZMDLP-UHFFFAOYSA-N 0.000 claims description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 3
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 3
- CAAULPUQFIIOTL-UHFFFAOYSA-L methyl phosphate(2-) Chemical compound COP([O-])([O-])=O CAAULPUQFIIOTL-UHFFFAOYSA-L 0.000 claims description 3
- 229920006122 polyamide resin Polymers 0.000 claims description 3
- 229920001451 polypropylene glycol Polymers 0.000 claims description 3
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 claims description 2
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 claims description 2
- 238000012216 screening Methods 0.000 claims description 2
- 229920006305 unsaturated polyester Polymers 0.000 claims description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 abstract 1
- 239000000440 bentonite Substances 0.000 abstract 1
- 229910000278 bentonite Inorganic materials 0.000 abstract 1
- 125000004494 ethyl ester group Chemical group 0.000 abstract 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 abstract 1
- 239000004014 plasticizer Substances 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003317 industrial substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019633 pungent taste Nutrition 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses an epoxy resin packaging material for a dry-type transformer and a preparation method thereof. The preparation method comprises the steps that 1, epoxy resin, red brick powder, vinyl trimethoxy silane, nanosilicon dioxide, nano aluminum oxide, bentonite, carbonized tantalum, glass fiber, silk and polyacrylic acid ethylester are heated, fused, cooled and solidified to obtain modified epoxy resin; 2, the modified epoxy resin, an organic solvent, pentaerythritol triarylate, dodecyl dimethyl tertiary amine, polyacrylic acid, zinc phosphate, silica powder, a fire retardant and a plasticizer are mixed and thermally treated, and then are cooled and ground to obtain the epoxy resin packaging material. The epoxy resin packaging material obtained through the method has the excellent electrical performance and mechanical performance.
Description
Technical field
The present invention relates to transformer material, particularly, relate to a kind of epoxy resin encapsulating material for dry type transformer and preparation method thereof.
Background technology
Dry type transformer, primarily of iron core, high tension coil, low-tension coil, encapsulated layer 4 parts composition, wherein, all needs packaged material to carry out encapsulating to reach insulation and fixing effect between this three of iron core, high tension coil and low-tension coil.At present, the most frequently used encapsulated layer material is with epoxy resin.Epoxy resin is a kind of industrial chemicals of widespread use, there is difficult combustion, fire-retardant, with superior electric property, also higher than the insulation strength of air and transformer oil, it is high that the transformer winding after casting has physical strength, superior protection against the tide, anti-dust performance, be widely used in urban distribution network, especially to the place prevented fires, safety requirements is high.
There is following defect in traditional epoxy resin: smell is large, and pungency is strong, contaminate environment; Building-up process is difficult to control molecular weight, causes a batch inequality, affects lot stability; Technique amplitude is little, and when application coats wire rod, furnace temperature/influence of rotation speed is very large, high to application requiring, is difficult to form smooth finish surface; Cohesive force is less than normal, and unavoidably have gap or bubble to produce during use, be difficult to ensure insulating property, poor heat resistance, easily by the impact of thermal-electrical aging, packaged material overall performance constantly declines, and finally affects the work-ing life of dry type transformer.
Summary of the invention
The object of this invention is to provide a kind of epoxy resin encapsulating material for dry type transformer and preparation method thereof, the epoxy resin encapsulating material obtained by the method has excellent electric property and mechanical property.
To achieve these goals, the invention provides a kind of preparation method of the epoxy resin encapsulating material for dry type transformer, comprising:
1) by epoxy resin, common brick powder, vinyltrimethoxy silane, nano silicon, nano aluminium oxide, wilkinite, charing tantalum, glass fibre, silk and polyethyl acrylate heating and melting, cooling curing with obtained modified epoxy;
2) modified epoxy, organic solvent, pentaerythritol triacrylate, Dodecyl Dimethyl Amine, polyacrylic acid, zinc phosphate, silica flour, fire retardant and softening agent mixed and heat-treat, then cooling, grinding obtained epoxy resin encapsulating material.
Present invention also offers a kind of epoxy resin encapsulating material for dry type transformer, this epoxy resin encapsulating material is obtained by the preparation of above-mentioned method.
Pass through technique scheme, first the present invention carries out modification by common brick powder, vinyltrimethoxy silane, nano silicon, nano aluminium oxide, wilkinite, charing tantalum, glass fibre, silk and polyethyl acrylate to epoxy resin, then the epoxy resin encapsulating material utilizing the synergy of modified epoxy, organic solvent, pentaerythritol triacrylate, Dodecyl Dimethyl Amine, polyacrylic acid, zinc phosphate, silica flour, fire retardant and softening agent to make to obtain not only has excellent mechanical property, also has excellent insulating property simultaneously.
Other features and advantages of the present invention are described in detail in embodiment part subsequently.
Embodiment
Below the specific embodiment of the present invention is described in detail.Should be understood that, embodiment described herein, only for instruction and explanation of the present invention, is not limited to the present invention.
The invention provides a kind of preparation method of the epoxy resin encapsulating material for dry type transformer, comprising:
1) by epoxy resin, common brick powder, vinyltrimethoxy silane, nano silicon, nano aluminium oxide, wilkinite, charing tantalum, glass fibre, silk and polyethyl acrylate heating and melting, cooling curing with obtained modified epoxy;
2) modified epoxy, organic solvent, pentaerythritol triacrylate, Dodecyl Dimethyl Amine, polyacrylic acid, zinc phosphate, silica flour, fire retardant and softening agent mixed and heat-treat, then cooling, grinding obtained epoxy resin encapsulating material.
Of the present invention in step 1) in, the concrete kind of epoxy resin and polyethyl acrylate can be selected in wide scope, but in order to make the epoxy resin encapsulating material obtained, there is more excellent mechanical property and electric property, preferably, epoxy resin is bisphenol A type epoxy resin and/or bisphenol f type epoxy resin, and the weight-average molecular weight of polyethyl acrylate is 3500-7000.
Of the present invention in step 1) in, common brick powder, nano aluminium oxide and bentonitic particle diameter can be selected in wide scope, but in order to make the epoxy resin encapsulating material obtained, there is more excellent mechanical property and electric property, preferably, the particle diameter of common brick powder is 1-3 μm, the particle diameter of nano silicon is 15-25nm, and the particle diameter of nano aluminium oxide is 2-8nm, and bentonitic particle diameter is 2-4 μm.
Of the present invention in step 1) in, the condition of heating and melting and cooling curing can be selected in wide scope, but in order to make the epoxy resin encapsulating material obtained, there is more excellent mechanical property and electric property, preferably, heating and melting at least meets the following conditions: Heating temperature is 135-145 DEG C, and heat-up time is 1-2h; Cooling curing at least meets the following conditions: cooling temperature is 30-35 DEG C.
Of the present invention in step 1) in, the consumption of each material can be selected in wide scope, but in order to make the epoxy resin encapsulating material obtained, there is more excellent mechanical property and electric property, preferably, relative to the epoxy resin of 100 weight parts, the consumption of common brick powder is 7-13 weight part, the consumption of vinyltrimethoxy silane is 40-65 weight part, the consumption of nano silicon is 0.1-0.4 weight part, the consumption of nano aluminium oxide is 0.3-0.8 weight part, bentonitic consumption is 3-5 weight part, the consumption of charing tantalum is 2-2.3 weight part, the consumption of glass fibre is 4-8 weight part, the consumption of silk is 6-12 weight part, the consumption of polyethyl acrylate is 55-70 weight part.
Of the present invention in step 2) in, the consumption of each material can be selected in wide scope, but in order to make the epoxy resin encapsulating material obtained, there is more excellent mechanical property and electric property, preferably, relative to the modified epoxy of 100 weight parts, the consumption of organic solvent is 150-170 weight part, the consumption of pentaerythritol triacrylate is 25-40 weight part, the consumption of Dodecyl Dimethyl Amine is 17-30 weight part, polyacrylic consumption is 15-20 weight part, the consumption of zinc phosphate is 15-23 weight part, the consumption of silica flour is 7-13 weight part, the consumption of fire retardant is 0.6-1.2 weight part, the consumption of softening agent is 0.3-1.8 weight part.
Similarly, of the present invention in step 2) in, the kind of organic solvent, fire retardant, softening agent and silica flour can be selected in wide scope, but in order to make the epoxy resin encapsulating material obtained, there is more excellent mechanical property and electric property, preferably, organic solvent is one or more in propyl carbinol, Pentyl alcohol, hexalin, pimelinketone and dimethylbenzene; Fire retardant is trimeric cyanamide polyphosphate and/or methyl-phosphoric acid dimethyl ester, and softening agent is one or more in polyamide resin, thiorubber, poly(propylene oxide) rubber and unsaturated polyester; Polyacrylic weight-average molecular weight is 5000-8000; The particle diameter of silica flour is 1-3mm.
In addition, of the present invention in step 2) in, the actual conditions of thermal treatment and cooling can be selected in wide scope, but in order to make the epoxy resin encapsulating material obtained, there is more excellent mechanical property and electric property, preferably, thermal treatment at least meets the following conditions: thermal treatment temp is 140-150 DEG C, and heat treatment time is 40-60min; The temperature of cooling is 20-30 DEG C.
On the basis of the above, can be convenient to make the epoxy resin encapsulating material obtained subsequently in transformer box, carry out embedding, preferably, after the operation of grinding, this preparation method also comprises and screening, and wherein, the mesh of filter sieve is not less than 200 orders.
Present invention also offers a kind of epoxy resin encapsulating material for dry type transformer, this epoxy resin encapsulating material is obtained by the preparation of above-mentioned method.
Below will be described the present invention by embodiment.
Embodiment 1
1) epoxy resin (bisphenol A-type), common brick powder (particle diameter is 2 μm), vinyltrimethoxy silane, nano silicon (particle diameter is 20nm), nano aluminium oxide (particle diameter is 5nm), wilkinite (particle diameter is 3nm), charing tantalum, glass fibre, silk and polyethyl acrylate (weight-average molecular weight is 4500) are mixed according to the weight ratio of 100:10:50:0.3:0.4:4:2.1:5:8:60, then heating and melting 1.5h at 140 DEG C, then at 32 DEG C cooling curing with obtained modified epoxy;
2) by above-mentioned modified epoxy, organic solvent (propyl carbinol), pentaerythritol triacrylate, Dodecyl Dimethyl Amine, polyacrylic acid (weight-average molecular weight is 6000), zinc phosphate, silica flour (particle diameter is 2mm), 50min is heat-treated at fire retardant (trimeric cyanamide polyphosphate) and softening agent (weight-average molecular weight is the polyamide resin of 1500) are incorporated in 145 DEG C according to the weight ratio of 100:160:35:25:18:20:10:0.8:1 is mixed, then cool at 25 DEG C, the obtained described epoxy resin encapsulating material A1 of grinding (mesh of filter sieve is 200 orders).
Embodiment 2
1) epoxy resin (bisphenol-f type), common brick powder (particle diameter is 1 μm), vinyltrimethoxy silane, nano silicon (particle diameter is 15nm), nano aluminium oxide (particle diameter is 2nm), wilkinite (particle diameter is 2nm), charing tantalum, glass fibre, silk and polyethyl acrylate (weight-average molecular weight is 3500) are mixed according to the weight ratio of 100:7:40:0.1:0.3:3:2:4:6:55, then heating and melting 1h at 135 DEG C, then at 30 DEG C cooling curing with obtained modified epoxy;
2) by above-mentioned modified epoxy, organic solvent (pimelinketone), pentaerythritol triacrylate, Dodecyl Dimethyl Amine, polyacrylic acid (weight-average molecular weight is 5000), zinc phosphate, silica flour (particle diameter is 1mm), 40min is heat-treated at fire retardant (trimeric cyanamide polyphosphate) and softening agent (average molecular weight is the thiorubber of 3500) are incorporated in 140 DEG C according to the weight ratio of 100:150:25:17:15:15:7:0.6:0.3 is mixed, then cool at 20 DEG C, the obtained described epoxy resin encapsulating material A2 of grinding (mesh of filter sieve is 300 orders).
Embodiment 3
1) epoxy resin (bisphenol A-type), common brick powder (particle diameter is 3 μm), vinyltrimethoxy silane, nano silicon (particle diameter is 25nm), nano aluminium oxide (particle diameter is 8nm), wilkinite (particle diameter is 4nm), charing tantalum, glass fibre, silk and polyethyl acrylate (weight-average molecular weight is 7000) are mixed according to the weight ratio of 100:13:65:0.4:0.8:5:2.3:8:12:70, then heating and melting 2h at 145 DEG C, then at 35 DEG C cooling curing with obtained modified epoxy;
2) by above-mentioned modified epoxy, organic solvent (dimethylbenzene), pentaerythritol triacrylate, Dodecyl Dimethyl Amine, polyacrylic acid (weight-average molecular weight is 8000), zinc phosphate, silica flour (particle diameter is 3mm), 60min is heat-treated at fire retardant (methyl-phosphoric acid dimethyl ester) and softening agent (weight-average molecular weight is the poly(propylene oxide) rubber of 5000) are incorporated in 150 DEG C according to the weight ratio of 100:170:40:30:20:23:13:1.2:1.8 is mixed, then cool at 30 DEG C, the obtained described epoxy resin encapsulating material A3 of grinding (mesh of filter sieve is 400 orders).
Comparative example 1
Carry out obtained packaged material B1 according to the method for embodiment 1, unlike, step 1) in do not use common brick powder.、
Comparative example 2
Carry out obtained packaged material B2 according to the method for embodiment 1, unlike, step 1) in do not use nano silicon.
Comparative example 3
Carry out obtained packaged material B3 according to the method for embodiment 1, unlike, step 1) in do not use nano aluminium oxide.
Comparative example 4
Carry out obtained packaged material B4 according to the method for embodiment 1, unlike, step 1) in do not use wilkinite.
Comparative example 5
Carry out obtained packaged material B5 according to the method for embodiment 1, unlike, step 1) in do not use charing tantalum.
Comparative example 6
Carry out obtained packaged material B6 according to the method for embodiment 1, unlike, step 1) in do not use glass fibre.
Comparative example 7
Carry out obtained packaged material B7 according to the method for embodiment 1, unlike, step 1) in do not use silk.
Test example 1
1) shock strength (a is carried out to above-mentioned packaged material
1/ KJm
-2) and volume specific resistance (R
1/ Ω m) detection;
2) then above-mentioned packaged material being placed in wavelength is irradiate 10 days under the ultraviolet lamp of 300nm, then detects shock strength (a
2/ KJm
-2) and volume specific resistance (R
2/ Ω m), concrete outcome is in table 1.
Table 1
| a 1/KJ·m -2 | a 2/KJ·m -2 | R 1/10 14Ω·m | R 2/10 14Ω·m | |
| A1 | 25.4 | 24.4 | 1.86 | 1.74 |
| A2 | 25.5 | 23.5 | 1.85 | 1.75 |
| A3 | 25.0 | 22.8 | 1.85 | 1.76 |
| B1 | 18.3 | 11.2 | 1.35 | 0.92 |
| B2 | 19.2 | 13.1 | 1.38 | 0.84 |
| B3 | 17.8 | 14.3 | 1.25 | 0.77 |
| B4 | 20.3 | 16.8 | 1.34 | 0.80 |
| B5 | 21.0 | 15.4 | 1.40 | 0.90 |
| B6 | 20.4 | 14.9 | 1.35 | 0.75 |
| B7 | 19.7 | 12.9 | 1.28 | 0.67 |
As seen from the above table, the epoxy resin encapsulating material for dry type transformer provided by the invention not only has excellent mechanical property, electric property, also has excellent ageing resistance simultaneously.
More than describe the preferred embodiment of the present invention in detail; but the present invention is not limited to the detail in above-mentioned embodiment, within the scope of technical conceive of the present invention; can carry out multiple simple variant to technical scheme of the present invention, these simple variant all belong to protection scope of the present invention.
It should be noted that in addition, each concrete technical characteristic described in above-mentioned embodiment, in reconcilable situation, can be combined by any suitable mode, in order to avoid unnecessary repetition, the present invention illustrates no longer separately to various possible array mode.
In addition, also can carry out arbitrary combination between various different embodiment of the present invention, as long as it is without prejudice to thought of the present invention, it should be considered as content disclosed in this invention equally.
Claims (10)
1. for a preparation method for the epoxy resin encapsulating material of dry type transformer, it is characterized in that, comprising:
1) by epoxy resin, common brick powder, vinyltrimethoxy silane, nano silicon, nano aluminium oxide, wilkinite, charing tantalum, glass fibre, silk and polyethyl acrylate heating and melting, cooling curing with obtained modified epoxy;
2) described modified epoxy, organic solvent, pentaerythritol triacrylate, Dodecyl Dimethyl Amine, polyacrylic acid, zinc phosphate, silica flour, fire retardant and softening agent mixed and heat-treat, then cooling, grinding obtained described epoxy resin encapsulating material.
2. preparation method according to claim 1, wherein, in step 1) in, described epoxy resin is bisphenol A type epoxy resin and/or bisphenol f type epoxy resin, and the weight-average molecular weight of described polyethyl acrylate is 3500-7000.
3. preparation method according to claim 2, wherein, in step 1) in, the particle diameter of described common brick powder is 1-3 μm, the particle diameter of described nano silicon is 15-25nm, and the particle diameter of described nano aluminium oxide is 2-8nm, and described bentonitic particle diameter is 2-4 μm.
4. preparation method according to claim 3, wherein, in step 1) in, described heating and melting at least meets the following conditions: Heating temperature is 135-145 DEG C, and heat-up time is 1-2h; Described cooling curing at least meets the following conditions: cooling temperature is 30-35 DEG C.
5. according to the preparation method in claim 1-4 described in any one, wherein, in step 1) in, relative to the described epoxy resin of 100 weight parts, the consumption of described common brick powder is 7-13 weight part, the consumption of described vinyltrimethoxy silane is 40-65 weight part, the consumption of described nano silicon is 0.1-0.4 weight part, the consumption of described nano aluminium oxide is 0.3-0.8 weight part, described bentonitic consumption is 3-5 weight part, the consumption of described charing tantalum is 2-2.3 weight part, the consumption of described glass fibre is 4-8 weight part, the consumption of described silk is 6-12 weight part, the consumption of described polyethyl acrylate is 55-70 weight part.
6. preparation method according to claim 5, wherein, in step 2) in, relative to the described modified epoxy of 100 weight parts, the consumption of described organic solvent is 150-170 weight part, the consumption of described pentaerythritol triacrylate is 25-40 weight part, the consumption of described Dodecyl Dimethyl Amine is 17-30 weight part, described polyacrylic consumption is 15-20 weight part, the consumption of described zinc phosphate is 15-23 weight part, the consumption of described silica flour is 7-13 weight part, the consumption of described fire retardant is 0.6-1.2 weight part, the consumption of described softening agent is 0.3-1.8 weight part.
7. preparation method according to claim 6, wherein, in step 2) in, described organic solvent is one or more in propyl carbinol, Pentyl alcohol, hexalin, pimelinketone and dimethylbenzene; Described fire retardant is trimeric cyanamide polyphosphate and/or methyl-phosphoric acid dimethyl ester, and described softening agent is one or more in polyamide resin, thiorubber, poly(propylene oxide) rubber and unsaturated polyester; Described polyacrylic weight-average molecular weight is 5000-8000; The particle diameter of described silica flour is 1-3mm.
8. the preparation method according to claim 6 or 7, wherein, in step 2) in, described thermal treatment at least meets the following conditions: thermal treatment temp is 140-150 DEG C, and heat treatment time is 40-60min; The temperature of described cooling is 20-30 DEG C.
9. preparation method according to claim 8, wherein, after the operation of described grinding, described preparation method also comprises and screening, and wherein, the mesh of filter sieve is not less than 200 orders.
10. for an epoxy resin encapsulating material for dry type transformer, it is characterized in that, described epoxy resin encapsulating material is obtained by the method preparation in claim 1-9 described in any one.
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| CN107502145A (en) * | 2017-09-29 | 2017-12-22 | 江苏瑞腾涂装科技有限公司 | A kind of coating |
| CN107674380A (en) * | 2017-09-14 | 2018-02-09 | 江山海维科技有限公司 | A kind of dry-type transformer epoxy resin manufacture method |
| CN107805370A (en) * | 2017-11-03 | 2018-03-16 | 芜湖市卓亚电气有限公司 | Anti-aging transformer enclosure material and preparation method thereof |
| CN107805369A (en) * | 2017-11-03 | 2018-03-16 | 芜湖市卓亚电气有限公司 | Transformer enclosure material with excellent weather resistance and preparation method thereof |
| CN107903583A (en) * | 2017-11-03 | 2018-04-13 | 芜湖市卓亚电气有限公司 | Dry type high life low energy consumption transformer and preparation method thereof |
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| CN102229737A (en) * | 2011-06-09 | 2011-11-02 | 孙国林 | Packaging material for high-blockage organic electronic device |
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| CN105754297A (en) * | 2016-05-06 | 2016-07-13 | 陈昌 | Heat-conducting electronic packaging composite and preparation method thereof |
| CN107674380A (en) * | 2017-09-14 | 2018-02-09 | 江山海维科技有限公司 | A kind of dry-type transformer epoxy resin manufacture method |
| CN107502145A (en) * | 2017-09-29 | 2017-12-22 | 江苏瑞腾涂装科技有限公司 | A kind of coating |
| CN107805370A (en) * | 2017-11-03 | 2018-03-16 | 芜湖市卓亚电气有限公司 | Anti-aging transformer enclosure material and preparation method thereof |
| CN107805369A (en) * | 2017-11-03 | 2018-03-16 | 芜湖市卓亚电气有限公司 | Transformer enclosure material with excellent weather resistance and preparation method thereof |
| CN107903583A (en) * | 2017-11-03 | 2018-04-13 | 芜湖市卓亚电气有限公司 | Dry type high life low energy consumption transformer and preparation method thereof |
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Application publication date: 20160316 |