CN105354816B - Electronic component positioning method and device - Google Patents
Electronic component positioning method and device Download PDFInfo
- Publication number
- CN105354816B CN105354816B CN201510617925.5A CN201510617925A CN105354816B CN 105354816 B CN105354816 B CN 105354816B CN 201510617925 A CN201510617925 A CN 201510617925A CN 105354816 B CN105354816 B CN 105354816B
- Authority
- CN
- China
- Prior art keywords
- plug
- pixel
- image
- model
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
- G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
- G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10004—Still image; Photographic image
Landscapes
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Image Processing (AREA)
Abstract
本发明公开了一种电子元件定位方法,包括如下步骤:对采集的至少两张插件前板图像进行背景建模,获得背景模型的每个像素点的模型;分别计算采集的插件后板图像的每个像素点在所述背景模型上的对应的像素点的k个高斯分布函数下的k个概率值;逐一将所述的k个概率值与一预设的阈值进行比较,并在任一个概率值小于所述阈值时,在所述插件后板图像上将对应的像素点标记为候选元件像素;在所述插件后板图像上连通相邻的候选元件像素,形成至少一个连通区域,以定位所述电子元件。本发明还公开一种电子元件定位装置。本发明实现了快速的电子元件定位,提高了电路板检测过程中的标准版式的制作速度。
The invention discloses a method for locating electronic components, comprising the following steps: performing background modeling on at least two images of the front panel of the plug-in that are collected, and obtaining a model of each pixel of the background model; K probability values of each pixel point under the k Gaussian distribution functions of the corresponding pixel points on the background model; the k probability values are compared with a preset threshold one by one, and at any probability When the value is less than the threshold, the corresponding pixel is marked as a candidate component pixel on the plug-in rear panel image; the adjacent candidate component pixels are connected on the plug-in rear panel image to form at least one connected region to locate the electronic components. The invention also discloses an electronic component positioning device. The invention realizes fast positioning of electronic components, and improves the production speed of the standard layout in the circuit board detection process.
Description
技术领域technical field
本发明涉及自动检测领域,尤其涉及一种电子元件定位方法及装置。The invention relates to the field of automatic detection, in particular to an electronic component positioning method and device.
背景技术Background technique
自动光学检测是指利用光学成像的方式取得成品的表面状态,并通过影像处理来检测成品的表面是否存在异物或表面瑕疵。目前,自动光学检测被广泛应用于电路板的质量检测。检测时,相关的检测装置通过摄像头自动扫描电路板获取图像,提取每个电子元件的局部图像,并通过图像处理技术,判断电路板上的电子元件是否存在错插、漏插或反插等缺陷,最后将疑似缺陷的电子元件显示或标记出来,方便查看与检修。Automatic optical inspection refers to the use of optical imaging to obtain the surface state of the finished product, and to detect whether there are foreign objects or surface defects on the surface of the finished product through image processing. At present, automatic optical inspection is widely used in the quality inspection of circuit boards. During detection, the relevant detection device automatically scans the circuit board through the camera to obtain images, extracts partial images of each electronic component, and uses image processing technology to determine whether the electronic components on the circuit board have defects such as wrong insertion, missing insertion or reverse insertion. , and finally display or mark the suspected defective electronic components for easy viewing and maintenance.
在检测电子元件缺陷之前,需先制作电路板的标准版式,特别地,需要标记电路板上每个电子元件的位置。现有的方案是采用人工操作的方法在电路板上设置每个电子元件的位置,但是采用人工操作的方案在电子元件数目较多时,不仅耗时,而且容易出现漏设电子元件的现象,无法满足使用需求。Before detecting defects in electronic components, it is necessary to make a standard layout of the circuit board. In particular, it is necessary to mark the position of each electronic component on the circuit board. The existing solution is to set the position of each electronic component on the circuit board by manual operation. However, when the number of electronic components is large, the manual operation is not only time-consuming, but also prone to missing electronic components. To meet the needs of use.
发明内容Contents of the invention
针对上述问题,本发明的目的在于提供一种电子元件定位方法及装置,其可快速、准确的在电路板的图像上定位出所有电子元件的位置。In view of the above problems, the object of the present invention is to provide a method and device for locating electronic components, which can quickly and accurately locate the positions of all electronic components on the image of the circuit board.
本发明实施例提供了一种电子元件定位方法,包括如下步骤:An embodiment of the present invention provides a method for locating electronic components, including the following steps:
对采集的至少两张插件前板图像进行背景建模,获得背景模型的每个像素点的模型,其中,所述插件前板图像为未插入电子元件的电路板的图像,每个像素点的模型由k个高斯分布函数组成,k为大于1的整数;Background modeling is performed on at least two images of the front panel of the plug-in to obtain a model of each pixel of the background model, wherein the image of the front panel of the plug-in is an image of a circuit board without electronic components inserted, and the model of each pixel is The model consists of k Gaussian distribution functions, k is an integer greater than 1;
分别计算采集的插件后板图像的每个像素点在所述背景模型上的对应的像素点的k个高斯分布函数下的k个概率值,其中,所述插件后板图像为插入电子元件的电路板的图像;Calculating the k probability values of each pixel of the collected plug-in back panel image under the k Gaussian distribution functions of the corresponding pixels on the background model, wherein the plug-in back panel image is an image of the inserted electronic component image of the circuit board;
逐一将所述的k个概率值与一预设的阈值进行比较,并在任一个概率值小于所述阈值时,在所述插件后板图像上将对应的像素点标记为候选元件像素;Comparing the k probability values with a preset threshold value one by one, and when any probability value is smaller than the threshold value, marking the corresponding pixel on the plug-in rear panel image as a candidate component pixel;
在所述插件后板图像上连通相邻的候选元件像素,形成至少一个连通区域,以定位所述电子元件。Connect adjacent candidate component pixels on the image of the plug-in backboard to form at least one connected region to locate the electronic component.
作为上述方案的改进,所述根据高斯混合模型对采集的至少两张插件前板图像进行背景建模,获得根据背景建模得到的背景模型的每个像素点的模型,包括:As an improvement of the above scheme, the Gaussian mixture model is used to carry out background modeling on at least two plug-in front panel images collected, and obtain a model of each pixel of the background model obtained according to the background modeling, including:
对任一张插件前板图像中的每个像素点建立模型p(x),其中,x为所述像素点的灰度值,k为高斯模型的个数,ωj,μj,Cj分别表示第j个高斯模型的权重、均值和协方差;Build a model p(x) for each pixel in any of the front panel images of the plug-in, where, x is the gray value of the pixel, k is the number of Gaussian models, ω j , μ j , and C j represent the weight, mean and covariance of the jth Gaussian model respectively;
利用其他插件前板图像上的对应的像素点对已建立的每个像素点的模型的权重、均值和协方差进行更新,获得更新后的每个像素点的模型p(x)。The weight, mean value and covariance of the established model of each pixel point are updated by using the corresponding pixel points on the front panel image of other plug-ins to obtain the updated model p(x) of each pixel point.
作为上述方案的改进,所述分别计算采集的插件后板图像的每个像素点在所述背景模型上的对应的像素点的k个高斯分布函数下的k个概率值,具体为:As an improvement of the above scheme, the k probability values under the k Gaussian distribution functions of the corresponding pixels of each pixel of the collected plug-in rear plate image on the background model are calculated respectively, specifically:
分别计算所述插件后板图像上的每个像素点y在所述背景模型的对应的像素点的k个高斯分布函数下的概率值pj(y),其中,且1≤j≤k。Calculate the probability value p j (y) of each pixel point y on the image of the plug-in rear panel under the k Gaussian distribution functions of the corresponding pixel points of the background model, wherein, And 1≤j≤k.
作为上述方案的改进,所述连通区域为矩形。As an improvement of the above solution, the connected area is rectangular.
作为上述方案的改进,在所述插件后板图像上连通相邻的候选元件像素,形成至少一个连通区域,以定位所述电子元件所在的区域,包括:As an improvement of the above solution, adjacent candidate component pixels are connected on the image of the plug-in rear board to form at least one connected region to locate the region where the electronic component is located, including:
计算所述至少一个连通区域的面积;calculating the area of the at least one connected region;
判断每个连通区域的面积是否大于预设的面积阈值;Determine whether the area of each connected region is greater than a preset area threshold;
当所述连通区域的面积大于所述面积阈值时,标记所述连通区域为包含有电子元件的有效区域,以定位所述电子元件;否则,标记所述连通区域为干扰区域。When the area of the connected area is greater than the area threshold, mark the connected area as an effective area containing electronic components to locate the electronic components; otherwise, mark the connected area as an interference area.
本发明实施例还提供一种电子元件定位装置,包括:An embodiment of the present invention also provides an electronic component positioning device, including:
建模单元,用于对采集的至少两张插件前板图像进行背景建模,获得背景模型的每个像素点的模型,其中,所述插件前板图像为未插入电子元件的电路板的图像,每个像素点的模型由k个高斯分布函数组成,k为大于1的整数;A modeling unit, configured to perform background modeling on at least two images of the front board of the plug-in, and obtain a model of each pixel of the background model, wherein the image of the front board of the plug-in is an image of a circuit board without electronic components inserted , the model of each pixel is composed of k Gaussian distribution functions, k is an integer greater than 1;
概率值计算单元,用于分别计算采集的插件后板图像的每个像素点在所述背景模型上的对应的像素点的k个高斯分布函数下的k个概率值,其中,所述插件后板图像为插入电子元件的电路板的图像;A probability value calculation unit, configured to separately calculate k probability values under k Gaussian distribution functions of k Gaussian distribution functions corresponding to pixels on the background model for each pixel of the collected plug-in rear panel image, wherein, the plug-in rear The board image is an image of a circuit board into which electronic components are inserted;
比较单元,用于逐一将所述的k个概率值与一预设的阈值进行比较,并在任一个概率值小于所述阈值时,在所述插件后板图像上将对应的像素点标记为候选元件像素;A comparing unit, configured to compare the k probability values with a preset threshold one by one, and when any probability value is smaller than the threshold, mark the corresponding pixel on the plug-in rear panel image as a candidate component pixel;
定位单元,用于在所述插件后板图像上连通相邻的候选元件像素,形成至少一个连通区域,以定位所述电子元件所在的区域。The positioning unit is configured to connect adjacent candidate component pixels on the image of the plug-in backboard to form at least one connected area, so as to locate the area where the electronic component is located.
作为上述方案的改进,所述建模单元包括:As an improvement of the above scheme, the modeling unit includes:
模型建立单元,用于对任一张插件前板图像中的每个像素点建立模型p(x),其中,x为所述像素点的灰度值,k为高斯模型的个数,ωj,μj,Cj分别表示第j个高斯模型的权重、均值和协方差;The model building unit is used to set up a model p(x) for each pixel in any one plug-in front panel image, wherein, x is the gray value of the pixel, k is the number of Gaussian models, ω j , μ j , and C j represent the weight, mean and covariance of the jth Gaussian model respectively;
更新单元,用于利用其他插件前板图像上的对应的像素点对已建立的每个像素点的模型的权重、均值和协方差进行更新,获得更新后的每个像素点的模型。The update unit is configured to update the weight, mean value and covariance of the established model of each pixel by using the corresponding pixels on the front panel image of other plug-ins to obtain the updated model of each pixel.
作为上述方案的改进,所述概率值计算单元具体用于,分别计算所述插件后板图像上的每个像素点y在所述背景模型的对应的像素点的k个高斯分布函数下的概率值pj(y),其中,且1≤j≤k。As an improvement to the above scheme, the probability value calculation unit is specifically configured to calculate the probability of each pixel point y on the plug-in rear panel image under the k Gaussian distribution functions of the corresponding pixel points of the background model value p j (y), where, And 1≤j≤k.
作为上述方案的改进,所述连通区域为矩形。As an improvement of the above solution, the connected area is rectangular.
作为上述方案的改进,所述定位单元包括:As an improvement of the above solution, the positioning unit includes:
面积计算单元,用于计算所述至少一个连通区域的面积;an area calculation unit, configured to calculate the area of the at least one connected region;
判断单元,用于每个连通区域的面积是否大于预设的面积阈值;A judging unit, used for whether the area of each connected region is greater than a preset area threshold;
标记单元,用于当所述连通区域的面积大于所述面积阈值时,标记所述连通区域为包含有电子元件的有效区域,以定位所述电子元件;否则,标记所述连接区域为干扰区域。A marking unit, configured to mark the connected area as an effective area containing electronic components when the area of the connected area is greater than the area threshold, so as to locate the electronic components; otherwise, mark the connected area as an interference area .
本发明实施例提供的电子元件定位方法及装置,通过利用高斯混合模型建立背景模型,再根据所述插件后板图像与所述背景模型的每个像素点进行匹配后,根据匹配的情况获得候选元件像素,并通过连通相邻的候选元件像素,在插件后板图像定位出电子元件的位置,从而实现了从所述插件后板图像上快速、准确的定位出电子元件的位置,为后续的电路板检测提供可靠的标准版式。The electronic component positioning method and device provided by the embodiments of the present invention establish a background model by using a Gaussian mixture model, and then match each pixel point of the background model according to the image of the rear panel of the plug-in, and obtain a candidate according to the matching situation. Component pixels, and by connecting the adjacent candidate component pixels, locate the position of the electronic component on the image of the plug-in back board, thereby realizing the fast and accurate positioning of the position of the electronic component from the image of the plug-in back board, for the subsequent Board inspection provides a reliable standard format.
附图说明Description of drawings
为了更清楚地说明本发明的技术方案,下面将对实施方式中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施方式,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to illustrate the technical solution of the present invention more clearly, the accompanying drawings used in the implementation will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some implementations of the present invention. As far as the skilled person is concerned, other drawings can also be obtained based on these drawings on the premise of not paying creative work.
图1是本发明实施例提供的电子元件定位方法的流程图。FIG. 1 is a flowchart of an electronic component positioning method provided by an embodiment of the present invention.
图2是本发明实施例提供的插件前板的示意图。Fig. 2 is a schematic diagram of a plug-in front panel provided by an embodiment of the present invention.
图3是本发明实施例提供的插件后板的示意图。Fig. 3 is a schematic diagram of a plug-in backplane provided by an embodiment of the present invention.
图4是本发明实施例提供的在所述插件后板图像中定位出电子元件的示意图。Fig. 4 is a schematic diagram of locating electronic components in the image of the plug-in backboard provided by an embodiment of the present invention.
图5是本发明实施例提供的电子元件定位装置的流程图。Fig. 5 is a flowchart of an electronic component positioning device provided by an embodiment of the present invention.
图6是图5所示的建模单元的结构示意图。FIG. 6 is a schematic structural diagram of the modeling unit shown in FIG. 5 .
图7是图5所示的定位单元的另一种结构示意图。FIG. 7 is another structural schematic diagram of the positioning unit shown in FIG. 5 .
具体实施方式detailed description
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
本发明实施例提高一种电子元件定位方法及装置,用于通过自动定位的方式定位出电路板上的所有电子元件的位置。以下分别进行详细描述。Embodiments of the present invention provide a method and device for locating electronic components, which are used for locating the positions of all electronic components on a circuit board through automatic positioning. Detailed descriptions are given below respectively.
请参阅图1,图1是本发明实施例提供的电子元件定位方法的流程图。所述电子元件定位方法可由电子元件定位装置来执行,并至少包括步骤S101至S104。其中,Please refer to FIG. 1 . FIG. 1 is a flowchart of an electronic component positioning method provided by an embodiment of the present invention. The electronic component locating method can be executed by an electronic component locating device, and at least includes steps S101 to S104. in,
S101,对采集的至少两张插件前板图像进行背景建模,获得背景模型的每个像素点的模型,其中,所述插件前板图像为未插入电子元件的电路板的图像,每个像素点的模型由k个高斯分布函数组成,k为大于1的整数。S101. Perform background modeling on at least two images of the front board of the plug-in, and obtain a model of each pixel of the background model, wherein the front board image of the plug-in is an image of a circuit board without electronic components inserted, and each pixel The point model consists of k Gaussian distribution functions, where k is an integer greater than 1.
请一并参阅图2,在本发明实施例中,所述插件前板图像为未插入电子元件的电路板的图像。其中,所述电子元件定位装置可采用高斯混合模型对所述插件前板图像进行建模,获得所述插件前板的背景模型。所述高斯混合模型在进行背景建模时,为了刻画背景及其可能的变化,需要多张背景图像,因而,本发明所述的插件前板图像为至少两张。Please refer to FIG. 2 together. In the embodiment of the present invention, the image of the front board of the plug-in is an image of a circuit board without electronic components inserted therein. Wherein, the electronic component positioning device may use a Gaussian mixture model to model the image of the plug-in front board to obtain a background model of the plug-in front board. When the Gaussian mixture model performs background modeling, in order to describe the background and its possible changes, multiple background images are required. Therefore, there are at least two images of the plug-in front panel in the present invention.
具体地,在进行背景建模时:Specifically, when performing background modeling:
首先,对任一张插件前板图像中的每个像素点建立模型p(x),其中,x为所述像素点的灰度值,k为高斯模型的个数,ωj,μj,Cj分别表示第j个高斯模型的权重、均值和协方差。First, establish a model p(x) for each pixel in any image of the front panel of the plug-in, where, x is the gray value of the pixel, k is the number of Gaussian models, ω j , μ j , C j respectively represent the weight, mean and covariance of the jth Gaussian model.
在本发明实施例中,所述电子元件定位装置任取一张插件前板图像,并对所述插件前板图像的每个像素点均建立一个模型p(x),其中,x为所述像素点的像素值,k为高斯模型的个数,ωj,μj,Cj分别表示第j个高斯模型的权重、均值和协方差。这里,可视为将所述插件前板图像的一个像素点的像素值表示为k个高斯分布函数的组合,而高斯模型的权重、均值和协方差可先根据经验值进行设置。In the embodiment of the present invention, the electronic component positioning device randomly takes an image of the front panel of the plug-in, and establishes a model p(x) for each pixel of the image of the front panel of the plug-in, wherein, x is the pixel value of the pixel point, k is the number of Gaussian models, ω j , μ j , C j respectively represent the weight, mean and covariance of the jth Gaussian model. Here, it can be considered that the pixel value of one pixel of the front panel image of the plug-in is expressed as a combination of k Gaussian distribution functions, and the weight, mean value and covariance of the Gaussian model can be set according to empirical values first.
然后,利用其他插件前板图像上的对应的像素点对已建立的每个像素点的模型的权重、均值和协方差进行更新,获得更新后的每个像素点的模型p(x)。Then, the weight, mean and covariance of the established model of each pixel point are updated by using the corresponding pixels on the front panel image of other plug-ins to obtain the updated model p(x) of each pixel point.
在本发明实施例中,当有新的像素点加入时(即加入新的插件前板图像),所述电子元件定位装置则将这个新的像素点的像素值分别与对应的背景模型的像素点的k个高斯分布的均值μj相比,同时计算新的像素值落入相应高斯分布的概率,并按判断法则选择匹配的高斯分布。当存在匹配的高斯分布时,则需要根据新的像素点的像素值,对这些高斯分布的权重、均值和协方差等参数进行更新。具体的计算过程可参考一般高斯混合模型的参数更新原理,本发明在此不做赘述。In the embodiment of the present invention, when a new pixel is added (that is, a new plug-in front panel image is added), the electronic component positioning device compares the pixel value of the new pixel with the pixel value of the corresponding background model Compared with the mean μ j of the k Gaussian distributions of the point, the probability of the new pixel value falling into the corresponding Gaussian distribution is calculated at the same time, and the matching Gaussian distribution is selected according to the judgment rule. When there is a matching Gaussian distribution, it is necessary to update the parameters of these Gaussian distributions such as weight, mean and covariance according to the pixel value of the new pixel. For the specific calculation process, reference may be made to the principle of updating parameters of a general Gaussian mixture model, which will not be described in detail here.
在本发明实施例中,所述电子元件定位装置通过上述的操作即获得了背景模型的每个像素点的模型,其中,每个像素点的模型由k个高斯分布函数组成,k为大于1的整数,且较佳地,k的取值范围为3至5个。In the embodiment of the present invention, the electronic component positioning device obtains the model of each pixel of the background model through the above operations, wherein the model of each pixel is composed of k Gaussian distribution functions, and k is greater than 1 is an integer, and preferably, the value range of k is 3 to 5.
S102,分别计算采集的插件后板图像的每个像素点在所述背景模型上的对应的像素点的k个高斯分布函数下的k个概率值,其中,所述插件后板图像为插入电子元件的电路板的图像。S102, respectively calculate k probability values of each pixel of the collected plug-in rear panel image under the k Gaussian distribution functions of the corresponding pixels on the background model, wherein the plug-in rear panel image is the plug-in electronic An image of a circuit board with components.
请一并参阅图3,在本发明实施例中,所述电子元件定位装置先获取插件后板图像,其中,所述插件后板图像为插入电子元件的电路板的图像。然后,所述电子元件定位装置分别计算所述插件后板图像的每个像素点在所述背景模型上的对应的像素点的k个高斯分布函数下的k个概率值。Please also refer to FIG. 3 , in the embodiment of the present invention, the electronic component positioning device first obtains an image of the back board of the plug-in, wherein the image of the back board of the plug-in is an image of a circuit board where electronic components are inserted. Then, the electronic component positioning device respectively calculates k probability values of each pixel of the plug-in rear board image under k Gaussian distribution functions of corresponding pixels on the background model.
例如,假设所述背景模板与所述插件后板图像的尺寸大小均为M×N个像素。其中,对于所述背景模板的每个像素,均可用k个高斯分布函数来表示。在进行计算时,所述电子元件定位装置先读取所述插件后板图像的第一个像素点(如坐标为(1,1))的像素值y,接着所述电子元件定位装置读取对应的背景模型上的像素点(如坐标也为(1,1))的k个高斯分布函数然后,所述电子元件定位装置将所述插件后板图像的像素值y分别代入所述的k个高斯分布函数,获得k个概率值,其中,第j个概率值可表示为 For example, it is assumed that the size of the background template and the plug-in back panel image are both M×N pixels. Wherein, each pixel of the background template can be represented by k Gaussian distribution functions. When performing calculations, the electronic component positioning device first reads the pixel value y of the first pixel point (such as coordinates (1,1)) of the image of the back plate of the plug-in, and then the electronic component positioning device reads k Gaussian distribution functions of pixels on the corresponding background model (for example, the coordinates are also (1,1)) Then, the electronic component positioning device respectively substitutes the pixel value y of the image of the plug-in back plate into the k Gaussian distribution functions to obtain k probability values, wherein the jth probability value can be expressed as
如此,当所述电子元件定位装置遍历所述插件后板图像及所述背景模板上的所有像素点后,即可获得每个像素点对应的k个概率值。In this way, after the electronic component locating device traverses all the pixels on the image of the plug-in rear board and the background template, k probability values corresponding to each pixel can be obtained.
S103,逐一将所述的k个概率值与一预设的阈值进行比较,并在任一个概率值小于所述阈值时,在所述插件后板图像上将对应的像素点标记为候选元件像素。S103, comparing the k probability values with a preset threshold one by one, and when any probability value is smaller than the threshold, mark the corresponding pixel on the plug-in rear panel image as a candidate component pixel.
在本发明实施例中,所述电子元件定位装置逐一将所述的k个概率值与一预设的阈值进行比较,其中,当任一个概率值小于所述阈值时,则将对应的像素点标记为候选元件像素,而当所有的k个概率值均大于所述阈值时,则将所述像素点标记为背景像素。In the embodiment of the present invention, the electronic component locating device compares the k probability values with a preset threshold value one by one, wherein, when any probability value is smaller than the threshold value, the corresponding pixel point mark as a candidate component pixel, and when all the k probability values are greater than the threshold, then mark the pixel as a background pixel.
S104,在所述插件后板图像上连通相邻的候选元件像素,形成至少一个连通区域,以定位所述电子元件。S104. Connect adjacent candidate component pixels on the plug-in backboard image to form at least one connected region, so as to locate the electronic component.
请一并参阅图4,在本发明的一个实施例中,所述电子元件定位装置在对所述插件后板图像上的所有像素点均进行标记后,连通相邻的候选元件像素。其中,连通后将形成至少一个连通区域,所述连通区域即为电子元件所在的位置。其中,较佳地,作为本发明的优选实施例,所述连通区域的形状为一矩形(如图4中的三个白色方框所示)。当然,可以理解的是,在本发明的其他实施例中,所述连通区域还可为圆形、三角形或其他形状,本发明不做具体限定。Please refer to FIG. 4 together. In one embodiment of the present invention, the electronic component locating device connects adjacent candidate component pixels after marking all the pixels on the image of the plug-in rear board. Wherein, after being connected, at least one connected area will be formed, and the connected area is where the electronic components are located. Wherein, preferably, as a preferred embodiment of the present invention, the shape of the connected region is a rectangle (as shown by three white boxes in FIG. 4 ). Of course, it can be understood that, in other embodiments of the present invention, the communication area may also be circular, triangular or other shapes, which are not specifically limited in the present invention.
在本发明的另一个实施例中,由于算法的精度或参数误差等问题,有时会导致原本是背景像素的像素点被错误计算为候选元件像素。此时,可能会造成原本不存在电子元件的位置形成连通区域。为了防止出现上述情况,所述电子元件定位装置可进行如下设置:In another embodiment of the present invention, due to problems such as the accuracy of the algorithm or parameter errors, sometimes pixels that were originally background pixels are miscalculated as candidate component pixels. At this time, a connection area may be formed at a position where no electronic component originally exists. In order to prevent the above situation, the electronic component positioning device can be set as follows:
首先,计算所述至少一个连通区域的面积。First, the area of the at least one connected region is calculated.
其次,判断每个连通区域的面积是否大于预设的面积阈值。Secondly, it is judged whether the area of each connected region is greater than a preset area threshold.
最后,当所述连通区域的面积大于所述面积阈值时,标记所述连通区域为包含有电子元件的有效区域;否则,标记所述连通区域为不包含有电子元件的干扰区域。Finally, when the area of the connected region is greater than the area threshold, mark the connected region as an effective region containing electronic components; otherwise, mark the connected region as an interference region not containing electronic components.
如此,排除掉那些面积较小的连通区域,即排除那些因计算精度或误差等造成的干扰区域,保证了所述连通区域均为包括电子元件的区域。In this way, those connected areas with smaller areas are excluded, that is, those interference areas caused by calculation accuracy or errors are excluded, so as to ensure that the connected areas are all areas including electronic components.
综上所述,本发明实施例提供的电子元件定位方法,通过利用高斯混合模型建立背景模型,再根据所述插件后板图片与所述背景模型的每个像素点进行匹配,获得候选元件像素,并通过连通相邻的候选元件像素,在插件后板图像定位出电子元件的位置,从而实现了从插件后板图像上快速、准确的定位出电子元件的位置,为后续的电路板检测提供可靠的标准版式。To sum up, the electronic component positioning method provided by the embodiment of the present invention uses a Gaussian mixture model to establish a background model, and then matches each pixel of the background model according to the picture of the plug-in rear board to obtain candidate component pixels , and by connecting the pixels of adjacent candidate components, the position of the electronic component is located on the image of the back board of the plug-in, so as to realize the fast and accurate positioning of the position of the electronic component from the image of the back board of the plug-in, and provide for the subsequent circuit board detection Solid standard layout.
请参阅图5,图5是本发明实施例提供的电子元件定位装置的结构图。所述电子元件定位装置100可用于执行上述的电子元件定位方法,并至少包括建模单元10、概率值计算单元20、比较单元30及定位单元40,其中:Please refer to FIG. 5 . FIG. 5 is a structural diagram of an electronic component positioning device provided by an embodiment of the present invention. The electronic component locating device 100 can be used to implement the above-mentioned electronic component locating method, and at least includes a modeling unit 10, a probability value calculation unit 20, a comparing unit 30 and a locating unit 40, wherein:
所述建模单元10,用于对采集的至少两张插件前板图像进行背景建模,获得背景模型的每个像素点的模型,其中,所述插件前板图像为未插入电子元件的电路板的图像,每个像素点的模型由k个高斯分布函数组成,k为大于1的整数。The modeling unit 10 is configured to perform background modeling on the collected at least two plug-in front board images to obtain a model of each pixel of the background model, wherein the plug-in front board images are circuits without electronic components inserted The image of the plate, the model of each pixel is composed of k Gaussian distribution functions, k is an integer greater than 1.
在本发明实施例中,所述插件前板图像为未插入电子元件的电路板的图像。为了从电路板上定位出电子元件的位置,所述建模单元10可先采集至少两张插件前板图像作为背景图像。其中,所述建模单元10可采用高斯混合模型对所述插件前板图像进行建模,获得所述插件前板的背景模型。所述高斯混合模型在进行背景建模时,为了刻画背景及其可能的变化,需要多张背景图像,因而,本发明所述的插件前板图像为至少两张。In the embodiment of the present invention, the image of the front board of the plug-in is an image of a circuit board without electronic components inserted therein. In order to locate the position of the electronic components from the circuit board, the modeling unit 10 may first collect at least two images of the front board of the plug-in as background images. Wherein, the modeling unit 10 may use a Gaussian mixture model to model the image of the plug-in front board to obtain a background model of the plug-in front board. When the Gaussian mixture model performs background modeling, in order to describe the background and its possible changes, multiple background images are required. Therefore, there are at least two images of the plug-in front panel in the present invention.
请一并参阅图6,具体地,所述建模单元10包括模型建立单元11及更新单元12,其中:Please refer to FIG. 6 together. Specifically, the modeling unit 10 includes a model building unit 11 and an updating unit 12, wherein:
所述模型建立单元11,用于对任一张插件前板图像中的每个像素点建立模型p(x),其中,x为所述像素点的灰度值,a为高斯模型的个数,ωj,μj,Cj分别表示第j个高斯模型的权重、均值和协方差。The model building unit 11 is configured to set up a model p(x) for each pixel in any image of the front panel of the plug-in, wherein, x is the gray value of the pixel, a is the number of Gaussian models, ω j , μ j , C j respectively represent the weight, mean and covariance of the jth Gaussian model.
在本发明实施例中,所述模型建立单元11任取一张插件前板图像,并对所述插件前板图像的每个像素点建立一个模型p(x),其中,x为所述像素点的像素值,k为高斯模型的个数,ωj,μj,Cj分别表示第j个高斯模型的权重、均值和协方差。这里,可视为将所述插件前板图像的一个像素点的像素值表示为k个高斯分布函数的组合,而高斯模型的权重、均值和协方差可先根据经验值进行设置。In the embodiment of the present invention, the model building unit 11 randomly takes an image of the front panel of the plug-in, and establishes a model p(x) for each pixel of the image of the front panel of the plug-in, wherein, x is the pixel value of the pixel point, k is the number of Gaussian models, ω j , μ j , C j respectively represent the weight, mean and covariance of the jth Gaussian model. Here, it can be considered that the pixel value of one pixel of the front panel image of the plug-in is expressed as a combination of k Gaussian distribution functions, and the weight, mean value and covariance of the Gaussian model can be set according to empirical values first.
所述更新单元12,用于利用其他插件前板图像上的对应的像素点对已建立的每个像素点的模型的权重、均值和协方差进行更新,获得更新后的每个像素点的模型p(x)。The update unit 12 is used to update the weight, mean and covariance of the established model of each pixel point by using the corresponding pixels on the front panel image of other plug-ins to obtain the updated model of each pixel point p(x).
在本发明实施例中,当有新的像素点加入时(即加入新的插件前板图像),所述更新单元12则将这个新的像素点的像素值分别与上述的k个高斯分布的均值μj相比,同时计算新的像素值落入相应高斯分布的概率,并按判断法则选择匹配的高斯分布。当存在匹配的高斯分布时,则需要根据新的像素点的像素值,对这些高斯分布的权重、均值和协方差等参数进行更新。具体的计算过程可参考一般高斯混合模型的参数更新原理,本发明在此不做赘述。In the embodiment of the present invention, when a new pixel is added (that is, a new plug-in front panel image is added), the update unit 12 compares the pixel value of the new pixel with the above-mentioned k Gaussian distribution At the same time, the probability that the new pixel value falls into the corresponding Gaussian distribution is calculated, and the matching Gaussian distribution is selected according to the judgment rule. When there is a matching Gaussian distribution, it is necessary to update the parameters of these Gaussian distributions such as weight, mean and covariance according to the pixel value of the new pixel. For the specific calculation process, reference may be made to the principle of updating parameters of a general Gaussian mixture model, which will not be described in detail here.
在本发明实施例中,所述建模单元10通过上述的操作即获得了背景模型的每个像素点的模型,其中,每个像素点的模型由k个高斯分布函数组成,k为大于1的整数,且较佳地,k的取值范围为3至5个。In the embodiment of the present invention, the modeling unit 10 obtains the model of each pixel of the background model through the above operations, wherein the model of each pixel is composed of k Gaussian distribution functions, and k is greater than 1 is an integer, and preferably, the value range of k is 3 to 5.
所述概率值计算单元20,用于分别计算采集的插件后板图像的每个像素点在所述背景模型上的对应的像素点的k个高斯分布函数下的k个概率值,其中,所述插件后板图像为插入电子元件的电路板的图像。The probability value calculation unit 20 is used to separately calculate k probability values under k Gaussian distribution functions of k Gaussian distribution functions of each pixel point of the collected plug-in rear plate image on the corresponding pixel point on the background model, wherein, The aforementioned image of the backboard of the plug-in is an image of the circuit board on which the electronic components are inserted.
在本发明实施例中,所述概率值计算单元20先获取插件后板图像,其中,所述插件后板图像为插入电子元件的电路板的图像。然后,所述概率值计算单元20分别计算所述插件后板图像的每个像素点在所述背景模型上的对应的像素点的k个高斯分布函数下的k个概率值。In the embodiment of the present invention, the probability value calculation unit 20 first acquires an image of a plug-in back board, wherein the image of the plug-in back board is an image of a circuit board where electronic components are inserted. Then, the probability value calculation unit 20 respectively calculates k probability values of each pixel of the plug-in rear panel image under the k Gaussian distribution functions of the corresponding pixel on the background model.
例如,假设所述背景模板与所述插件后板图像的尺寸大小均为M×N个像素。其中,对于所述背景模板的每个像素,均可用k个高斯分布函数来表示。在进行计算时,所述概率值计算单元20先读取所述插件后板图像的第一个像素点(如坐标为(1,1))的像素值y,接着所述概率值计算单元20读取对应的背景模型上的像素点(如坐标也为(1,1))的k个高斯分布函数然后,所述概率值计算单元20将所述插件后板图像的像素值y分布代入所述的k个高斯分布函数,获得k个概率值,其中,第j个概率值可表示为 For example, it is assumed that the size of the background template and the plug-in back panel image are both M×N pixels. Wherein, each pixel of the background template can be represented by k Gaussian distribution functions. When calculating, the probability value calculation unit 20 first reads the pixel value y of the first pixel point (such as coordinates (1,1)) of the plug-in back plate image, and then the probability value calculation unit 20 Read the k Gaussian distribution functions of the pixels on the corresponding background model (for example, the coordinates are also (1,1)) Then, the probability value calculation unit 20 substitutes the pixel value y distribution of the plug-in rear panel image into the k Gaussian distribution functions to obtain k probability values, wherein the jth probability value can be expressed as
如此,当所述概率值计算单元20遍历所述插件后板图像及所述背景模板上的所有像素点后,即可获得每个像素点对应的k个概率值。In this way, after the probability value calculation unit 20 traverses all the pixels on the plug-in back panel image and the background template, k probability values corresponding to each pixel can be obtained.
所述比较单元30,用于逐一将所述的k个概率值与一预设的阈值进行比较,并在任一个概率值小于所述阈值时,在所述插件后板图像上将对应的像素点标记为候选元件像素。The comparison unit 30 is configured to compare the k probability values with a preset threshold value one by one, and when any probability value is smaller than the threshold value, the corresponding pixel point will be displayed on the image of the plug-in rear panel Mark the pixels as candidate components.
在本发明实施例中,所述比较单元30逐一将所述的k个概率值与一预设的阈值进行比较,其中,当任一个概率值小于所述阈值时,则所述比较单元30将对应的像素点标记为候选元件像素,而当所有的k个概率值均大于所述阈值时,则所述比较单元30将所述像素点标记为背景像素。In the embodiment of the present invention, the comparison unit 30 compares the k probability values with a preset threshold one by one, wherein, when any probability value is smaller than the threshold, the comparison unit 30 will The corresponding pixel is marked as a candidate component pixel, and when all the k probability values are greater than the threshold, the comparison unit 30 marks the pixel as a background pixel.
所述定位单元40,用于在所述插件后板图像上连通相邻的候选元件像素,形成至少一个连通区域,以定位所述电子元件。The positioning unit 40 is configured to connect adjacent candidate component pixels on the image of the plug-in backboard to form at least one connected area for locating the electronic component.
在本发明的一个实施例中,所述定位单元40在对所述插件后板图像上的所有像素点均进行标记后,连通相邻的候选元件像素。其中,连通后将形成至少一个连通区域,所述连通区域即为电子元件所在的位置。其中,较佳地,作为本发明的优选实施例,所述连通区域的形状为一矩形。当然,可以理解的是,在本发明的其他实施例中,所述连通区域还可为圆形、三角形或其他形状,本发明不做具体限定。In an embodiment of the present invention, the positioning unit 40 connects adjacent candidate component pixels after marking all the pixel points on the image of the plug-in rear board. Wherein, after being connected, at least one connected area will be formed, and the connected area is where the electronic components are located. Wherein, preferably, as a preferred embodiment of the present invention, the shape of the communication area is a rectangle. Of course, it can be understood that, in other embodiments of the present invention, the communication area may also be circular, triangular or other shapes, which are not specifically limited in the present invention.
请一并参阅图7,在本发明的另一个实施例中,由于算法的精度或参数误差等问题,有时会导致原本是背景像素的像素点被错误计算为候选元件像素。此时,可能会造成原本不存在电子元件的位置形成连通区域。为了防止出现上述情况,所述定位单元40可包括:Please also refer to FIG. 7 . In another embodiment of the present invention, due to problems such as algorithm accuracy or parameter errors, sometimes pixels that were originally background pixels are miscalculated as candidate component pixels. At this time, a connection area may be formed at a position where no electronic component originally exists. In order to prevent the above situation, the positioning unit 40 may include:
面积计算单元41,用于计算所述至少一个连通区域的面积。An area calculation unit 41, configured to calculate the area of the at least one connected region.
判断单元42,用于判断每个连通区域的面积是否大于预设的面积阈值。A judging unit 42, configured to judge whether the area of each connected region is greater than a preset area threshold.
标记单元43,用于当所述连通区域的面积大于所述面积阈值时,标记所述连通区域为包含有电子元件的有效区域;否则,标记所述连通区域为不包含有电子元件的干扰区域。A marking unit 43, configured to mark the connected region as an effective region containing electronic components when the area of the connected region is greater than the area threshold; otherwise, mark the connected region as an interference region not containing electronic components .
如此,所述定位单元40排除掉那些面积较小的连通区域,即排除那些因计算精度或误差等造成的干扰区域,保证了所述连通区域均为包括电子元件的区域。In this way, the positioning unit 40 excludes those connected areas with small areas, that is, excludes those interference areas caused by calculation accuracy or errors, so as to ensure that the connected areas are all areas including electronic components.
综上所述,本发明实施例提供的电子元件定位装置100,通过利用高斯混合模型建立背景模型,再根据所述插件后板图片与所述背景模型的每个像素点进行匹配,获得候选元件像素,并通过连通相邻的候选元件像素,在插件后板图像定位出电子元件的位置,从而实现了从插件后板图像上快速、准确的定位出电子元件的位置,为后续的电路板检测提供可靠的标准版式。To sum up, the electronic component locating device 100 provided by the embodiment of the present invention establishes a background model by using a Gaussian mixture model, and then matches each pixel of the background model according to the picture of the plug-in rear board to obtain a candidate component pixels, and by connecting adjacent candidate component pixels, locate the position of the electronic component on the image of the back board of the plug-in, so as to realize the fast and accurate positioning of the position of the electronic component from the image of the back board of the plug-in, for the subsequent circuit board inspection Provide reliable standard layout.
以上所揭露的仅为本发明一种较佳实施例而已,当然不能以此来限定本发明之权利范围,本领域普通技术人员可以理解实现上述实施例的全部或部分流程,并依本发明权利要求所作的等同变化,仍属于发明所涵盖的范围。What is disclosed above is only a preferred embodiment of the present invention, and of course it cannot limit the scope of rights of the present invention. Those of ordinary skill in the art can understand all or part of the process for realizing the above embodiments, and according to the rights of the present invention The equivalent changes required still belong to the scope covered by the invention.
本领域普通技术人员可以理解实现上述实施例方法中的全部或部分流程,是可以通过计算机程序来指令相关的硬件来完成,所述的程序可存储于一计算机可读取存储介质中,该程序在执行时,可包括如上述各方法的实施例的流程。其中,所述的存储介质可为磁碟、光盘、只读存储记忆体(Read-Only Memory,ROM)或随机存储记忆体(Random AccessMemory,RAM)等。Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be implemented through computer programs to instruct related hardware, and the programs can be stored in a computer-readable storage medium. During execution, it may include the processes of the embodiments of the above-mentioned methods. Wherein, the storage medium may be a magnetic disk, an optical disk, a read-only memory (Read-Only Memory, ROM) or a random access memory (Random Access Memory, RAM) and the like.
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510617925.5A CN105354816B (en) | 2015-09-24 | 2015-09-24 | Electronic component positioning method and device |
| PCT/CN2016/096745 WO2017050088A1 (en) | 2015-09-24 | 2016-08-25 | Method and device for locating electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510617925.5A CN105354816B (en) | 2015-09-24 | 2015-09-24 | Electronic component positioning method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105354816A CN105354816A (en) | 2016-02-24 |
| CN105354816B true CN105354816B (en) | 2017-12-19 |
Family
ID=55330783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510617925.5A Active CN105354816B (en) | 2015-09-24 | 2015-09-24 | Electronic component positioning method and device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105354816B (en) |
| WO (1) | WO2017050088A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105354816B (en) * | 2015-09-24 | 2017-12-19 | 广州视源电子科技股份有限公司 | Electronic component positioning method and device |
| CN106503737B (en) * | 2016-10-20 | 2019-03-05 | 广州视源电子科技股份有限公司 | Electronic component positioning method and device |
| CN107862690B (en) * | 2017-11-22 | 2023-11-14 | 佛山科学技术学院 | A circuit board component positioning method and positioning device based on feature point matching |
| CN112396062A (en) * | 2020-12-03 | 2021-02-23 | 广州海洋地质调查局 | Identification and segmentation method and processing terminal for benthos |
| CN112734691B (en) * | 2020-12-17 | 2023-06-16 | 郑州金惠计算机系统工程有限公司 | Industrial product defect detection method and device, terminal equipment and storage medium |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6078700A (en) * | 1997-03-13 | 2000-06-20 | Sarachik; Karen B. | Method and apparatus for location and inspecting a two-dimensional image including co-linear features |
| CN102982519A (en) * | 2012-11-23 | 2013-03-20 | 南京邮电大学 | Foreground identifying, extracting and splicing method of video images |
| CN103577646A (en) * | 2013-11-09 | 2014-02-12 | 深港产学研基地 | Calculation method for fast estimating yield of integrated circuit |
| CN104463178A (en) * | 2014-12-29 | 2015-03-25 | 广州视源电子科技股份有限公司 | Electronic component identification method and system |
| CN104777176A (en) * | 2015-03-25 | 2015-07-15 | 广州视源电子科技股份有限公司 | PCB detection method and device |
| CN104867145A (en) * | 2015-05-15 | 2015-08-26 | 广东工业大学 | IC component solder joint defect detection method based on VIBE model |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105354816B (en) * | 2015-09-24 | 2017-12-19 | 广州视源电子科技股份有限公司 | Electronic component positioning method and device |
-
2015
- 2015-09-24 CN CN201510617925.5A patent/CN105354816B/en active Active
-
2016
- 2016-08-25 WO PCT/CN2016/096745 patent/WO2017050088A1/en not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6078700A (en) * | 1997-03-13 | 2000-06-20 | Sarachik; Karen B. | Method and apparatus for location and inspecting a two-dimensional image including co-linear features |
| CN102982519A (en) * | 2012-11-23 | 2013-03-20 | 南京邮电大学 | Foreground identifying, extracting and splicing method of video images |
| CN103577646A (en) * | 2013-11-09 | 2014-02-12 | 深港产学研基地 | Calculation method for fast estimating yield of integrated circuit |
| CN104463178A (en) * | 2014-12-29 | 2015-03-25 | 广州视源电子科技股份有限公司 | Electronic component identification method and system |
| CN104777176A (en) * | 2015-03-25 | 2015-07-15 | 广州视源电子科技股份有限公司 | PCB detection method and device |
| CN104867145A (en) * | 2015-05-15 | 2015-08-26 | 广东工业大学 | IC component solder joint defect detection method based on VIBE model |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017050088A1 (en) | 2017-03-30 |
| CN105354816A (en) | 2016-02-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113688807B (en) | Self-adaptive defect detection method, device, recognition system and storage medium | |
| CN105354816B (en) | Electronic component positioning method and device | |
| CN106097361B (en) | Defect area detection method and device | |
| CN108961236A (en) | Training method and device, the detection method and device of circuit board defect detection model | |
| CN102938077A (en) | Online AOI (Automatic Optical Inspection) image retrieval method based on double-threshold binaryzation | |
| WO2017092427A1 (en) | Electronic element positioning method and apparatus | |
| CN111681186A (en) | Image processing method and device, electronic equipment and readable storage medium | |
| CN112581447A (en) | FPC (flexible printed circuit) flexible board line detection method based on global defects and local defects | |
| CN104867145B (en) | IC component solder joint defect detection method based on VIBE model | |
| CN113034613B (en) | Camera external parameter calibration method and related devices | |
| CN102576462A (en) | Pattern matching method, pattern matching program, electronic computer, electronic equipment inspection device | |
| CN115615992B (en) | Fireproof brick size measurement and defect detection method | |
| CN105303573B (en) | Pin detection method and system for gold needle type element | |
| CN112435252B (en) | Warhead fragment perforation and pit detection method | |
| CN115861443B (en) | Multi-camera internal parameter calibration method and device, electronic equipment and storage medium | |
| CN105092604B (en) | Line information and non-line area information acquisition method and line defect detection method | |
| CN110874837A (en) | Automatic defect detection method based on local feature distribution | |
| CN106845535A (en) | Typical Components recognition methods based on a cloud | |
| CN110967851A (en) | Circuit extraction method and system for array image of liquid crystal panel | |
| KR20160105082A (en) | Apparatus for testing board and testing method thereof | |
| US11357149B2 (en) | Component orientation determination data creation device and component orientation determination data creation method | |
| KR101184005B1 (en) | Drawing update method through examining symbol | |
| TWI803756B (en) | Method for labeling image | |
| CN111935480A (en) | A detection method and related device for an image acquisition device | |
| CN119359822B (en) | Relative position calibration method and related device for alignment camera and measurement camera |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181031 Address after: 510663 3, 310, No. 192, Ke Zhu Road, Guangzhou high tech Industrial Development Zone, Guangdong Patentee after: GUANGZHOU SHIKUN ELECTRONICS Co.,Ltd. Address before: 510663, 4, No. 192, Ke Zhu Road, science and Technology City, Guangzhou high tech Industrial Development Zone, Guangdong Patentee before: Guangzhou Shiyuan Electronic Technology Company Limited |