CN105324009A - Heatsink fixing device and heatsink assembly having the same - Google Patents

Abstract

The present invention provides a radiator fixing device and a radiator assembly including the radiator fixing device. The radiator fixing device includes: a main body, one end of the main body includes one or more dividing slits and is inserted into a heating element and the radiator; the head extends from the other end of the main body along the radial direction of the main body to the outside of the main body; the radiator support part extends from the head in the direction in which the main body is arranged. Even when an external impact is transmitted to the heat sink, the angle at which the heat sink is inclined relative to the heat sink support portion is significantly reduced, thereby preventing electronic devices included in the heat generating element from being damaged.

Description

Radiator fixing device and radiator assembly including the same

This application claims priority and benefit from Korean Patent Application No. 10-2014-0094168 filed with the Korean Intellectual Property Office on Jul. 24, 2014, the disclosure of which is hereby incorporated by reference.

technical field

The present disclosure relates to a radiator fixing device.

Background technique

Integrated circuit packaging has been used in electronic devices requiring miniaturization and high reliability. The heat generated by these integrated circuit packages can lead to degraded performance of electronic devices, therefore, heat dissipation can be performed by incorporating a heat sink to the integrated circuit package.

Meanwhile, a heat sink may be coupled to an integrated circuit while being in contact with an electronic device generally included in an integrated circuit package to improve heat dissipation efficiency.

However, when the heat sink is tilted to one side due to external impact applied to the heat sink or the electronic device, there occurs a problem that electronic devices included in a lower portion of the heat sink or contacting the heat sink may be damaged.

Therefore, research to address this issue is urgently needed.

Contents of the invention

An aspect of the present disclosure may provide a heat sink fixing device for protecting electronic devices when an external impact is transmitted to the heat sink, and a heat sink assembly including the same.

According to an aspect of the present disclosure, a heat sink fixing device may include: a main body part including one or more division slits at one end of the main body part, and the main body part is inserted into the heating element and the heat sink; The other end of the part extends to the outside of the main part along the radial direction of the main part; the radiator supporting part extends from the head along the direction in which the main part is arranged.

Even in a case where an external impact is transmitted to the heat sink, the angle at which the heat sink is inclined relative to the heat sink support portion is significantly reduced, thereby preventing electronic devices included in the heat generating element from being damaged.

An elastic member is provided between the main body and the radiator supporting portion, and one end of the elastic member is in contact with the bottom surface of the head to apply an elastic supporting force, thereby effectively contacting the radiator and the heating element, and improving heat dissipation efficiency.

According to another aspect of the present disclosure, a radiator assembly may include: the radiator fixing device as described above; the radiator, the radiator fixing device is inserted into the radiator, the radiator is fixed to the heating element, and includes a plurality of fins.

Description of drawings

The above and other aspects, features and other advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, wherein:

FIG. 1 is a perspective view of a radiator assembly according to an exemplary embodiment of the present disclosure;

Fig. 2 is a sectional view taken along line AA' in Fig. 1;

3 is a perspective view of a radiator fixing device according to an exemplary embodiment of the present disclosure;

Fig. 4 is a sectional view taken along line BB' in Fig. 3;

5A is a perspective view of a radiator fixing device according to another exemplary embodiment of the present disclosure, and FIG. 5B is a cross-sectional view taken along line BB' in FIG. 5A;

6A is a perspective view of a radiator fixing device according to another exemplary embodiment of the present disclosure, and FIG. 6B is a cross-sectional view taken along line BB' in FIG. 6A;

7 is a perspective view of a modified example of the main body portion of the radiator fixing device according to the exemplary embodiment of the present disclosure.

detailed description

Exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

However, this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.

FIG. 1 is a perspective view of a heat sink assembly 500 according to an exemplary embodiment of the present disclosure. FIG. 2 is a cross-sectional view taken along line AA' in FIG. 1 .

Referring to FIGS. 1 and 2 , a radiator assembly 500 according to an exemplary embodiment of the present disclosure may include a heat generating element 100 , a radiator 200 and a radiator fixing device 300 .

The heat generating element 100 may be various types of electronic elements that dissipate heat to the outside when driven, and may be, for example, a substrate 110 on which a plurality of electronic devices 120 are mounted.

One or more electronic devices 120 may be mounted in the substrate 110 . Accordingly, a mounting element (not shown), a wiring pattern electrically connecting the mounting electrodes to each other, a ground electrode, and the like may be formed in the substrate 110 .

The substrate 110 may be a printed circuit board (PCB) substrate or a flexible printed circuit board (FPCB) substrate formed of polyethylene terephthalate (PET), glass, polycarbonate (PC), silicon (Si), or the like. , and the substrate 110 may be formed in the form of a film.

However, the type of the substrate 110 is not limited to the proposed embodiment, but various types of members to which the electronic device 120 can be bonded may be used.

The substrate 110 may include: mounting electrodes formed on the top surface; circuit patterns formed inside the substrate 110; conductive vias (not shown) electrically connecting the mounting electrodes and the circuit patterns. A cavity in which electronic components may be mounted may be formed inside the substrate 110 .

In this regard, the substrate 110 may be coupled to the heat sink 200 through a heat sink fixing device 300 (to be described below). For this, at least one through hole for installing the heat sink fixing device 300 may be provided in the base plate 110 .

Meanwhile, one or more electronic devices 120 may be mounted in the substrate 110, and the one or more electronic devices 120 may be, for example, an integrated circuit (IC) chip or a multilayer ceramic capacitor (MLCC).

The electronic device 120 generates a large amount of heat when electronic products are driven. The heat generated by the electronic device 120 degrades the performance of other surrounding electronic components or degrades the performance of the electronic product.

Therefore, in order to dissipate the heat of the electronic device 120 , the heat sink 200 may be provided around the electronic device 120 . More specifically, a heat sink 200 may be disposed on top of the electronic device 120 .

When a plurality of electronic devices 120 are provided, at least one of the plurality of electronic devices 120 may be in contact with the heat sink 200 .

The heat sink 200 is a passive type heat dissipation device configured to dissipate heat generated by the electronic device 120 to the outside, and may be configured to include a heat dissipation plate 210 and heat dissipation fins 220 .

In this regard, the heat dissipation plate 210 may be provided in, for example, a flat plate shape. However, the heat dissipation plate 210 is not limited thereto, but the heat dissipation plate 210 may be provided in various shapes according to the structure and needs of electronic products.

Meanwhile, the heat dissipation plate 210 may be disposed on top of the electronic device 120 , and one side of the heat dissipation plate 210 may be in contact with the electronic device 120 .

Accordingly, the heat dissipation plate 210 may receive heat from the one or more electronic devices 120 through conduction, radiation, or convection to cool the electronic devices 120 .

Meanwhile, a plurality of heat dissipation fins 220 may be disposed on one surface of the heat dissipation plate 210 not facing the electronic device 120 .

The heat dissipation fins 220 may be provided to protrude from one surface of the heat dissipation plate 210 to the outside, and may be formed in plurality corresponding to the size of the heat dissipation plate 210 .

The heat dissipation fins 220 are provided to increase a contact area with external air and improve cooling efficiency of the heat sink 200 . In order to contact the outside with a maximum large area, a plurality of heat dissipation fins 220 may be provided to protrude long from one surface of the heat dissipation plate 210 .

In the drawings, rectangular heat dissipation fins 220 are provided in the heat dissipation plate 210, but it is not necessarily limited thereto. The heat dissipation fins 220 may be modified in various shapes such as a curved wave shape.

Meanwhile, the heat sink 200 may be coupled to the heat generating element 100 through a heat sink fixing device 300 (to be described below). For this, at least one through hole for installing the radiator fixing device 300 may be provided in the radiator 200 .

FIG. 3 is a perspective view of a radiator fixing device 300 according to an exemplary embodiment of the present disclosure. FIG. 4 is a cross-sectional view taken along line BB' in FIG. 3 .

Referring to FIGS. 3 and 4 , the radiator fixing device 300 may include a body part 310 , a head part 320 and a radiator support part 330 .

The body part 310 may be inserted into the heat generating element 100 and the heat sink 200 . That is, the body part 310 may pass through the heat generating element 100 and the heat sink 200, and may include the division slit 310a at one end thereof.

In this regard, the dividing slit 310 a reduces the diameter of the main body part 310 so that when the main body part 310 passes through and is inserted into the heating element 100 and the heat sink 200 , the main body part 310 is easily inserted.

In this regard, one or more dividing slits 310 a may be provided at one end of the main body part 310 . That is, one slit or a plurality of slits may be provided at one end of the main body portion 310 in the axial direction (see FIG. 7 ). That is, various changes may be made to the division slit 310 a as long as the division slit 310 a can reduce the diameter of the main body part 310 when the main body part 310 passes through and is inserted into the heating element 100 and the heat sink 200 .

In this regard, the terms about the direction are defined, the axial direction refers to the direction from the upper part of the main body part 310 to the lower part thereof or the opposite direction from the lower part to the upper part with respect to FIG. The direction from the central portion of the part 310 to the outer peripheral surface of the main body part 310.

On an outer peripheral surface of one end of the main body portion 310 provided with the division slit 310a, a hook-shaped protrusion 311 formed radially outward may be provided.

In this regard, a hook-shaped protrusion 311 may be formed on the outer peripheral surface of the main body portion 310, may have a diameter gradually decreasing in the axial direction toward the lower side, and may serve to prevent the heat sink fixing device 300 from moving toward the heat generating element 100. and the exterior of the radiator 200.

The head portion 320 may be formed by extending from the other end of the main body portion 310 outward along the radial direction of the main body portion 310 .

The head portion 320 may be formed extending radially outward, and may be supported by being in contact with the elastic member 10 (to be described later).

Meanwhile, the radiator support part 330 may be formed at the boundary of the head part 320 and extend to a lower side in an axial direction (ie, a direction in which the main body 310 is disposed).

Accordingly, the radiator support part 330 may extend apart from the main body part 310 . In this case, a space S may be provided between the radiator support part 330 and the main body part 310 .

The radiator support part 330 may be configured to have an open lower portion. The radiator support part 330 may be configured to have a cylindrical shape as a whole and have an open lower portion.

The heat sink support part 330 may extend to be in contact with one surface of the heat generating element 100 or the heat sink 200 . Which one of the heat generating element 100 and the heat sink 200 is in contact with the heat sink support part 330 may be determined according to the combining direction of the heat sink fixing device 300 .

An O-ring having elasticity may be provided at an open end of the radiator support part 330 and may be provided between the radiator support part 330 and the radiator 200 to maintain a seal between the two members.

Hereinafter, the principle of preventing damage of the electronic device 120 when an external impact is transmitted to one side of the heat sink 200 according to an exemplary embodiment of the present disclosure will be described with reference to FIG. 2 .

When an external impact F1 is applied to one side of the heat sink 200, since the heat sink 200 is in contact with the electronic device 120 provided at the lower portion of the heat sink 200, an upward force F2 is applied to the heat sink 200 in the opposite direction to the external impact F1. The other side of F1 where no external shock is applied.

In this case, if the movement of the heat sink 200 is not restricted, the heat sink 200 is tilted so that the electronic device 120 disposed at the lower portion of the heat sink 200 is damaged.

However, in the radiator fixing device 300 according to an exemplary embodiment of the present disclosure, the radiator supporting portion 330 extending from the head portion 320 applies a force F3 to drop the radiator 200 as a reaction force to the upward force F2. The radiator 200, therefore, the radiator 200 does not tilt.

Accordingly, the heat sink 200 is prevented from being inclined in one direction, thereby preventing the electronic device 120 disposed at a lower portion of the heat sink 200 from being damaged.

In addition, the heat sink support part 330 is provided in the heat sink fixing device 300 and does not occupy a separate space in the substrate 110 , thus having an effect of maintaining a substrate area in which the electronic device 120 is mounted.

Meanwhile, the elastic member 10 may be disposed between the main body part 310 and the radiator support part 330 . At this time, the elastic member 10 may be provided as, for example, a coil spring.

The elastic member 10 may be provided to increase the contact force of the heat sink 200 and the heat generating element 100 . One end of the elastic member 10 contacts the bottom surface of the head portion 320 to apply elastic supporting force to the heat sink 200 or the heat generating element 100 .

FIG. 5A is a perspective view of a radiator fixing device 300 according to another exemplary embodiment of the present disclosure, and FIG. 5B is a cross-sectional view taken along line BB' in FIG. 5A . FIG. 6A is a perspective view of a radiator fixing device 300 according to another exemplary embodiment of the present disclosure, and FIG. 6B is a cross-sectional view taken along line BB' in FIG. 6A .

At this time, the modified example of the radiator fixing device 300 of FIGS. 5A to 6B is substantially the same as the radiator fixing device 300 of FIGS. 1 to 4 except for the radiator supporting part 330 .

Therefore, a detailed description of the same structure will be omitted and is the same as the above description.

Referring to FIGS. 5A and 5B , in a radiator fixing device 300 according to another exemplary embodiment of the present disclosure, an auxiliary support portion formed to extend radially outward may be provided at an open end of the radiator support portion 300 . 331 to increase the contact area with the radiator 200.

The auxiliary support part 331 may be provided to increase in circumference from one end of the radiator support part 330 in an axial direction toward a lower part.

That is, the auxiliary support part 331 may increase the contact area of the heat sink 200 , and thus, the effect that the heat sink fixing device 300 distributes the force applied to the heat sink 200 may be obtained.

6A and 6B, the auxiliary support part 331 can be arranged like this: at least one auxiliary support part 331 can be separated on one end boundary of the radiator support part 330, so, as mentioned above, can be used to make the 200 force distribution.

As explained above, according to the exemplary embodiments of the present disclosure, the radiator fixing device and the radiator assembly including the same can minimize the angle at which the radiator is inclined with respect to the radiator support portion, thereby preventing Electronics are damaged when the shock is transmitted to the radiator.

While exemplary embodiments have been shown and described above, it will be obvious to those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure as defined in the claims.

Claims (11)

1. a fixer for heat radiator, comprising:

Main part, comprises one or more partition seam in one end of main part, and main part is inserted in heater element and radiator;

Head, extends from the other end of main part along the radial direction of main part to the outside of main part;

Radiator support portion, extends from head along the direction arranging main part.

2. fixer for heat radiator according to claim 1, wherein, radiator support portion extends from head, and separates with described main part.

3. fixer for heat radiator according to claim 1, wherein, radiator support portion extends from head, and is the cylindrical shape of lower openings.

4. fixer for heat radiator according to claim 1, wherein, is formed with the supplemental support portion of radially side extension, to increase the contact area with radiator at the openend of radiator support portion.

5. fixer for heat radiator according to claim 4, wherein, supplemental support portion is set to have vertically from one end of radiator support portion towards the girth that the bottom of radiator support portion increases.

6. fixer for heat radiator according to claim 4, wherein, the end margin along radiator support portion is provided with at least one supplemental support portion separated from one another.

7. fixer for heat radiator according to claim 1, wherein, between main part and radiator support portion, arrange elastic component, and one end of elastic component contacts with the basal surface of head, to apply elastic anchorage force.

8. fixer for heat radiator according to claim 7, wherein, elastic component is set to helical spring.

9. fixer for heat radiator according to claim 1, wherein, arrange partition seam main part one end external peripheral surface on be provided with radially from main part hamulus outwardly.

10. a heat sink assembly, comprising:

Fixer for heat radiator as claimed in any one of claims 1-9 wherein;

Radiator, fixer for heat radiator is inserted in radiator, and radiator is fixed to heater element, and comprises multiple radiating fin.

11. heat sink assemblies according to claim 10, wherein, radiator support portion is set to the exterior surface with heater element or radiator.