CN105203549A - Circuit board AOI (automated optical inspection) detection method - Google Patents
Circuit board AOI (automated optical inspection) detection method Download PDFInfo
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- CN105203549A CN105203549A CN201510573733.9A CN201510573733A CN105203549A CN 105203549 A CN105203549 A CN 105203549A CN 201510573733 A CN201510573733 A CN 201510573733A CN 105203549 A CN105203549 A CN 105203549A
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- 238000001514 detection method Methods 0.000 title claims abstract description 19
- 238000007689 inspection Methods 0.000 title abstract description 3
- 230000003287 optical effect Effects 0.000 title abstract description 3
- 230000007547 defect Effects 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000012360 testing method Methods 0.000 claims description 6
- 230000003044 adaptive effect Effects 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 238000011160 research Methods 0.000 abstract description 2
- 238000003384 imaging method Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- 238000010009 beating Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention relates to a circuit board AOI (automated optical inspection) detection method. The method comprises the following steps: I, defining a material number; II, establishing a standard drawing according to the material number by virtue of CAM software, and taking the standard drawing as a standard reference for appearance comparison; III, photographing a detected PCB (printed circuit board) by virtue of a CCD camera, converting an image to a digital signal, and restoring the digital signal to a current image by virtue of an imaging module; IV, limiting a research range and offset range parameters in four directions and angles in the parameter setting of an element body, and setting a defect percent number; V, scanning the current image according to the standard drawing, and acquiring a similarity percent number of the current image and the standard image according to the parameter setting of the element body; VI, if the similarity percent number is smaller than or equal to the defect percent number, determining that the element has a defect. The circuit board AOI detection method not only has a function of detecting a missing solder of the element, but also has a function of detecting the displacement and deviation of the element, and also improves the detection capacity for the element defect.
Description
Technical field
The present invention relates to a kind of printed-wiring board (PWB) AOI detection technique field, particularly relate to and a kind ofly can detect element missing solder on PCB, displacement and crooked AOI detection method.
Background technology
The full name of AOI (AutomaticOpticInspection) is automatic optics inspection, is the equipment detected the common deficiency run in welding production based on optical principle.AOI is new a kind of novel test technology of rising, but development rapidly, and a lot of producer is all proposed AOI testing apparatus.Upon automatic detection, machine, by camera autoscan PCB, gathers image, test solder joint and database in qualified parameter compare, through image procossing, check out defect on PCB, and by display or Automatic Logos Flaw display/mark, repair for maintenance personal.
At present, the scanning sequence of AOI equipment generally all has the function of detecting element missing solder, and some possesses the function of detecting element significantly displacement, but can not the crooked and a small amount of displacement of element welding anyway.
Because above-mentioned defect, the design people, actively in addition research and innovation, to founding a kind of wiring board AOI detection method, make it have more value in industry.
Summary of the invention
For solving the problems of the technologies described above, the object of this invention is to provide a kind of wiring board AOI detection method.
Wiring board AOI detection method of the present invention, carry out according to following step:
One, item number is defined;
Two, CAM software is according to item number Criterion figure, as the standard reference of profile comparison;
Three, CCD camera is made a video recording to being verified PCB, and image is converted into digital signal, by image-forming module, digital signal is reduced into active view;
Four, in the optimum configurations of component body, limit the range parameter that its hunting zone and upper and lower, left and right and angle can offset, percentage of defects numerical value is set;
Five, according to test pattern scanning active view, and according to the optimum configurations of component body, the similarity percentages of active view and normal view is obtained;
If six similarity percentages are less than or equal to percentage of defects numerical value, then decision element existing defects.
Further, described definition item number comprises the definition of following content: wiring board title, boring floor title, item number parameter, scanning area, image resolution, laminate thickness, Bu Jian district and on-line parameters.
Further, when detecting that defect exists, marking the method for display by screen or beating the position that calibration method indicates defect existence in the circuit board.
Further, active view utilizes adaptive wiener filter to carry out denoising to present image after being formed.
Further, described CCD camera is black and white camera or colour imagery shot.
By such scheme, the present invention at least has the following advantages: wiring board AOI detection method of the present invention not only has the function of detecting element missing solder, also has detecting element displacement and crooked function, improves the detectability to component defects.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of instructions, be described in detail below with preferred embodiment of the present invention.
Embodiment
Below in conjunction with embodiment, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
A kind of wiring board AOI detection method, carry out according to following step:
One, define item number, comprise the definition of following content: wiring board title, boring floor title, item number parameter, scanning area, image resolution, laminate thickness, Bu Jian district and on-line parameters;
Two, CAM software is according to item number Criterion figure, as the standard reference of profile comparison;
Three, CCD camera is made a video recording to being verified PCB, and image is converted into digital signal, by image-forming module, digital signal is reduced into active view, utilizes adaptive wiener filter to carry out denoising to present image after active view is formed;
Four, in the optimum configurations of component body, limit the range parameter that its hunting zone and upper and lower, left and right and angle can offset, percentage of defects numerical value is set;
Five, according to test pattern scanning active view, and according to the optimum configurations of component body, the similarity percentages of active view and normal view is obtained;
If six similarity percentages are less than or equal to percentage of defects numerical value, then decision element existing defects.When detecting that defect exists, marking the method for display by screen or beating the position that calibration method indicates defect existence in the circuit board.
Described CCD camera is black and white camera or colour imagery shot.
The above is only the preferred embodiment of the present invention; be not limited to the present invention; should be understood that; for those skilled in the art; under the prerequisite not departing from the technology of the present invention principle; can also make some improvement and modification, these improve and modification also should be considered as protection scope of the present invention.
Claims (6)
1. a wiring board AOI detection method, is characterized in that: carry out according to following step:
One, item number is defined;
Two, CAM software is according to item number Criterion figure, as the standard reference of profile comparison;
Three, CCD camera is made a video recording to being verified PCB, and image is converted into digital signal, by image-forming module, digital signal is reduced into active view;
Four, in the optimum configurations of component body, limit the range parameter that its hunting zone and upper and lower, left and right and angle can offset, percentage of defects numerical value is set;
Five, according to test pattern scanning active view, and according to the optimum configurations of component body, the similarity percentages of active view and normal view is obtained;
If six similarity percentages are less than or equal to percentage of defects numerical value, then decision element existing defects.
2. wiring board AOI detection method according to claim 1, is characterized in that: described definition item number comprises the definition of following content: wiring board title, boring floor title, item number parameter, scanning area, image resolution, laminate thickness, Bu Jian district and on-line parameters.
3. wiring board AOI detection method according to claim 1, is characterized in that: when detecting that defect exists, and marks the method for display or beat the position that calibration method indicates defect existence in the circuit board by screen.
4. wiring board AOI detection method according to claim 1, is characterized in that: utilize adaptive wiener filter to carry out denoising to present image after active view is formed.
5. wiring board AOI detection method according to claim 1, is characterized in that: described CCD camera is black and white camera.
6. wiring board AOI detection method according to claim 1, is characterized in that: described CCD camera is colour imagery shot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510573733.9A CN105203549A (en) | 2015-09-10 | 2015-09-10 | Circuit board AOI (automated optical inspection) detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510573733.9A CN105203549A (en) | 2015-09-10 | 2015-09-10 | Circuit board AOI (automated optical inspection) detection method |
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| Publication Number | Publication Date |
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| CN105203549A true CN105203549A (en) | 2015-12-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510573733.9A Pending CN105203549A (en) | 2015-09-10 | 2015-09-10 | Circuit board AOI (automated optical inspection) detection method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106404782A (en) * | 2016-09-06 | 2017-02-15 | 凌云光技术集团有限责任公司 | PCB online detecting method |
| CN106596580A (en) * | 2016-06-14 | 2017-04-26 | 艾悌亚信息技术（上海）有限公司 | AOI (automatic optical inspection) algorithm/technique capable of increasing AOI yield of glass screen of touch screen |
| CN108717697A (en) * | 2018-05-18 | 2018-10-30 | 广州视源电子科技股份有限公司 | Circuit board detection method and device, computer equipment and storage medium |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101666761A (en) * | 2009-10-26 | 2010-03-10 | 北京星河泰视特科技有限公司 | AOI non-programming detection method |
| JP2011047724A (en) * | 2009-08-26 | 2011-03-10 | Hitachi High-Technologies Corp | Apparatus and method for inspecting defect |
| CN102062573A (en) * | 2009-11-16 | 2011-05-18 | 吴家旺 | Appearance error detection method of printed circuit board |
| CN102901737A (en) * | 2011-07-27 | 2013-01-30 | 何忠亮 | Automatic optical detection method |
-
2015
- 2015-09-10 CN CN201510573733.9A patent/CN105203549A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011047724A (en) * | 2009-08-26 | 2011-03-10 | Hitachi High-Technologies Corp | Apparatus and method for inspecting defect |
| CN101666761A (en) * | 2009-10-26 | 2010-03-10 | 北京星河泰视特科技有限公司 | AOI non-programming detection method |
| CN102062573A (en) * | 2009-11-16 | 2011-05-18 | 吴家旺 | Appearance error detection method of printed circuit board |
| CN102901737A (en) * | 2011-07-27 | 2013-01-30 | 何忠亮 | Automatic optical detection method |
Non-Patent Citations (2)
| Title |
|---|
| 孙明睿: "AOI 设备在PCB 和SMT 主要生产环节中的应用", 《电子工业专用设备》 * |
| 百度文库: "TR7100入门手册", 《百度文库》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106596580A (en) * | 2016-06-14 | 2017-04-26 | 艾悌亚信息技术（上海）有限公司 | AOI (automatic optical inspection) algorithm/technique capable of increasing AOI yield of glass screen of touch screen |
| CN106404782A (en) * | 2016-09-06 | 2017-02-15 | 凌云光技术集团有限责任公司 | PCB online detecting method |
| CN106404782B (en) * | 2016-09-06 | 2019-02-22 | 凌云光技术集团有限责任公司 | A kind of PCB online test method |
| CN108717697A (en) * | 2018-05-18 | 2018-10-30 | 广州视源电子科技股份有限公司 | Circuit board detection method and device, computer equipment and storage medium |
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Application publication date: 20151230 |