CN105182700A - Maskless direct-writing photolithography machine suction cup structure with back surface alignment function - Google Patents
Maskless direct-writing photolithography machine suction cup structure with back surface alignment function Download PDFInfo
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- CN105182700A CN105182700A CN201510634630.9A CN201510634630A CN105182700A CN 105182700 A CN105182700 A CN 105182700A CN 201510634630 A CN201510634630 A CN 201510634630A CN 105182700 A CN105182700 A CN 105182700A
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- sucker
- light hole
- light
- mounting groove
- passing hole
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- 238000000206 photolithography Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 claims abstract description 25
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 13
- 238000001259 photo etching Methods 0.000 claims description 13
- 238000012634 optical imaging Methods 0.000 claims description 11
- 238000009434 installation Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 2
- 239000003550 marker Substances 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 238000003384 imaging method Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 230000007306 turnover Effects 0.000 description 3
- 238000001459 lithography Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 206010022000 influenza Diseases 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention relates to a maskless direct-writing photolithography machine suction cup structure with a back surface alignment function. Compared with the prior art, the defects of complicated structure and high operation complexity are overcome. A left mounting groove and a right mounting groove are formed in the back surface of an upper suction cup, a right image acquisition assembly is mounted in the right mounting groove, and a left image acquisition assembly and the right image acquisition assembly are same in structure; and a light-passing hole A, a light-passing hole B, a light-passing hole C and a light-passing hole D are formed in the upper suction cup, the light-passing hole A and the light-passing hole B are formed in the upper parts of two reflecting prisms of the left image acquisition assembly respectively, the light-passing hole C and the light-passing hole D are formed in the upper parts of two reflecting prisms of the right image acquisition assembly respectively, the light-passing hole B and the light-passing hole C correspond to two reference marks of a substrate respectively, and the light-passing hole A and the light-passing hole D are both formed in the periphery of the substrate. The maskless direct-writing photolithography machine suction cup structure can be suitable for image acquisition in a back surface alignment mode, and a suction cup body can be directly arranged on a working platform to work.
Description
Technical field
The present invention relates to non-mask write through photo-etching machine technical field, specifically a kind of non-mask write through photo-etching machine sucker structure with back side alignment function.
Background technology
Sucker is the important component part without mask direct-write photoetching equipment, in the course of the work, sucker is tightly fitted in work top by vacuum suction by needing the substrate of etching, ensure the flatness of substrate in etching process, realize the image acquisition that the back side is aimed at, the reference marker of clear collection backside of substrate, and the image collected is sent in image receiving system.The back side is aimed at and is mainly observed the reference marker in substrate (substrate) by image rotating device, and the workbench coordinate of true substrate is calculated by the object-image relation of image rotating device, then by substrate-workbench coordinate transformation relation, come in suprabasil coordinate points mapping to workbench coordinate.
Although in semiconductor lithography equipment, also have multiple back side alignment so, wherein adopted mechanical-optical setup is also not quite similar, and it all needs additional light source and image receiving system, exists and takies too much space, complex structure, shortcoming that operation complexity is high.The alignment so how simplifying substrate has become the technical matters being badly in need of solving.
Summary of the invention
The object of the invention is, in order to solve complex structure in prior art, defect that operation complexity is high, to provide a kind of non-mask write through photo-etching machine sucker structure with back side alignment function to solve the problems referred to above.
To achieve these goals, technical scheme of the present invention is as follows:
Have a non-mask write through photo-etching machine sucker structure for back side alignment function, comprise sucker and lower sucker, upper sucker and lower sucker fixedly mount, substrate adsorption on the front of upper sucker,
The back side of described upper sucker offers left mounting groove and right mounting groove, the same that left mounting groove and right mounting groove are positioned at sucker diametrically and both to be mirror image corresponding, left image collection assembly is arranged in left mounting groove, right image collection assembly is arranged in right mounting groove, and left image collection assembly is identical with right image collection assembly structure;
Upper sucker is respectively equipped with light hole A, light hole B, light hole C and light hole D, light hole A and light hole B lays respectively at the top of two reflecting prisms of left image collection assembly, light hole C and light hole D lays respectively at the top of two reflecting prisms of right image collection assembly, light hole B and light hole C are corresponding with two reference markers of substrate respectively, and light hole A and light hole D is all positioned at the periphery of substrate.
Described left image collection assembly comprises pedestal, pedestal is arranged in left mounting groove, pedestal is provided with successively reflecting prism A, optical imaging channel and reflecting prism B, reflecting prism A, optical imaging channel and reflecting prism B three are on same straight line, and reflecting prism A and reflecting prism B is that mirror image is corresponding.
Described upper sucker is provided with open slot.
Described upper sucker and lower sucker are all covered with black oxide film.
beneficial effect
A kind of non-mask write through photo-etching machine sucker structure with back side alignment function of the present invention, compared with prior art can be applicable to the image acquisition that the back side is aimed at, and sucker directly can be placed on workbench and works.The design in sucker is built in by image collecting device, imaging system design wave band contains without mask direct-write photoetching equipment own illumination systems radiate source wave band, like this without the need to additional light source, without the need to additional image receiving system, directly utilize the light source of direct-write lithography machine own, image receiving system to receive the back side and aim at the image gathered, reduce the Operating Complexity and cost aimed at the back side.And can rationally change sucker and ray machine part size according to different demand, for realizing the clear accurate acquisition of back side alignment image, have that structure is simple, reasonable in design, layout feature cleverly.
Accompanying drawing explanation
Fig. 1 is structural perspective of the present invention;
Fig. 2 is structure front elevation of the present invention;
Fig. 3 is the structural representation of upper sucking disc back side in the present invention;
Fig. 4 is the structural representation of lower sucker in the present invention;
Fig. 5 is the structural representation of left image collection assembly in the present invention;
Fig. 6 is principle of work schematic diagram of the present invention;
Wherein, the upper sucker of 1-, sucker under 2-, 4-reference marker, 5-sucker, 6-air flue, 7-aspirating hole, 8-linked hole, 9-pilot hole, 10-suction hole, 11-open slot, 14-reflecting prism B, 15-light hole E, 16-optical imaging channel, 17-light hole F, 18-reflecting prism A, 19-silicon plate positional mirror, the catoptric imaging of 20-reference marker, 21-optical projection system, 22-substrate, the left mounting groove of 24-, the right mounting groove of 25-, the left image collection assembly of 26-, the right image collection assembly of 27-, 28-pedestal, 31-light hole A, 32-light hole B, 33-light hole C, 34-light hole D.
Embodiment
For making to have a better understanding and awareness architectural feature of the present invention and effect of reaching, coordinating detailed description in order to preferred embodiment and accompanying drawing, being described as follows:
As shown in Figure 1, a kind of non-mask write through photo-etching machine sucker structure with back side alignment function of the present invention, comprise sucker 1 and lower sucker 2, the structure of upper sucker 1 as shown in Figure 3, the structure of lower sucker 2 as shown in Figure 4, upper sucker 1 and the fixed installation of lower both suckers 2, composition forms sucker 5 together.As shown in Figures 2 and 3, be provided with by prior art mode in sucker 5 and normally vacuumize air flue 6 needed for work, aspirating hole 7, linked hole 8, substrate 22 locate required pilot hole 9, suction hole 10, substrate 22 is adsorbed on sucker 5, namely goes up on the front of sucker 1.Conveniently substrate 22 taking on sucker 5, upper sucker 1 is also provided with open slot 11.In order to ensure picture contrast, upper sucker 1 and lower sucker 2 can also be carried out blackening process, being namely all covered with black oxide film.
As shown in Figure 3, the back side of upper sucker 1 offers left mounting groove 24 and right mounting groove 25, left mounting groove 24 and right mounting groove 25 are for installing with the pedestal of left image collection assembly 26 and right image collection assembly 27, left mounting groove 24 and right mounting groove 25 can be designed to concave structure, pedestal is directly inserted in the concave structure of left mounting groove 24 or right mounting groove 25.The same that both left mounting groove 24 and right mounting groove 25 are positioned at sucker 1 diametrically and both to be mirror image corresponding, because the air flue 6 at the back side of upper sucker 1 designs, both left mounting groove 24 and right mounting groove 25 are arranged between two air flues 6.Left image collection assembly 26 is arranged in left mounting groove 24, and right image collection assembly 27 is arranged in right mounting groove 25, and left image collection assembly 26 is identical with right both image collection assemblies 27 structure.As shown in Figure 5, left image collection assembly 26 comprises pedestal 28, and pedestal 28 is arranged in left mounting groove 24, and in like manner, right image collection assembly 27 is also arranged in right mounting groove 25 by the pedestal of himself.Pedestal 28 is provided with successively reflecting prism A18, optical imaging channel 16 and reflecting prism B14, reflecting prism A18, optical imaging channel 16 and reflecting prism B14 three are on same straight line, reflecting prism A18 and reflecting prism B14 is that mirror image is corresponding, optical imaging channel 16 i.e. optical imaging system, which is provided with light hole E15 and light hole F17.
Upper sucker 1 is respectively equipped with light hole A31, light hole B32, light hole C33 and light hole D34, four reflecting prisms for left image collection assembly 26 and right image collection assembly 27 use.Light hole A31 and light hole B32 lays respectively at the top of two reflecting prisms of left image collection assembly 26, namely light hole A31 is positioned at above reflecting prism B14, light hole B32 is positioned at above reflecting prism A18, in like manner, light hole C33 and light hole D34 lays respectively at the top of two reflecting prisms of right image collection assembly 27.Light hole B32 and light hole C33 is corresponding with two reference markers 4 of substrate 22 respectively, namely corresponding with the silicon plate positional mirror 19 of two on substrate 22.Light hole A31 and light hole D34 is all positioned at the periphery of substrate 22, for corresponding with optical projection system 21.
During actual use, as shown in Figure 6, substrate 22 is adsorbed on sucker 1, optical projection system 21 emits beam, through light hole A31, enter on the reflecting prism B14 of left image collection assembly 26,90 ° of turnovers are carried out by reflecting prism B14, light after turnover enters into inner optical imaging channel 16 through light hole E15 and shines on reflecting prism A18 through light hole F17 again, and light, through reflecting prism A18,90 ° of turnovers finally to arrive substrate 22 silicon plate positional mirror 19 place through light hole B32 occurs again.Silicon plate positional mirror 19 is provided with reference marker 4, and silicon plate positional mirror 19 itself has light reflection function.Light reflects through silicon plate positional mirror 19, is the object plane of optical system at this reference marker 4 with reference to silicon plate positional mirror 19.Through the reflected light of the silicon plate positional mirror 19 of substrate 22 again by producing the catoptric imaging 20 of reference marker after reflecting prism A18, light hole F17, optical imaging channel 16, light hole E15 and reflecting prism B14, the catoptric imaging 20 of reference marker is the image planes of the reference marker 4 of silicon plate positional mirror 19.The catoptric imaging 20 of reference marker turns back in optical projection system 21 by light hole A31 again, and light path is finally received by the image receiving system of etching system self through turning back again, realizes the accurate acquisition of back side alignment image.
More than show and describe ultimate principle of the present invention, principal character and advantage of the present invention.The technician of the industry should understand; the present invention is not restricted to the described embodiments; the just principle of the present invention described in above-described embodiment and instructions; the present invention also has various changes and modifications without departing from the spirit and scope of the present invention, and these changes and improvements all fall in claimed scope of the present invention.The protection domain of application claims is defined by appending claims and equivalent thereof.
Claims (4)
1. one kind has the non-mask write through photo-etching machine sucker structure of back side alignment function, comprise sucker (1) and lower sucker (2), upper sucker (1) and both fixed installations of lower sucker (2), substrate (22) is adsorbed on the front of sucker (1), it is characterized in that:
The back side of described upper sucker (1) offers left mounting groove (24) and right mounting groove (25), left mounting groove (24) and right mounting groove (25) both be positioned at sucker (1) same diametrically and both be mirror image correspondence, left image collection assembly (26) is arranged in left mounting groove (24), right image collection assembly (27) is arranged in right mounting groove (25), and both structures of left image collection assembly (26) and right image collection assembly (27) are identical;
(1) is respectively equipped with light hole A(31 with upper sucker), light hole B(32), light hole C(33) and light hole D(34), light hole A(31) and light hole B(32) lay respectively at the top of two reflecting prisms of left image collection assembly (26), light hole C(33) and light hole D(34) lay respectively at the top of two reflecting prisms of right image collection assembly (27), light hole B(32) and light hole C(33) corresponding with two reference markers (4) of substrate (22) respectively, light hole A(31) and light hole D(34) be all positioned at the periphery of substrate (22).
2. a kind of non-mask write through photo-etching machine sucker structure with back side alignment function according to claim 1, it is characterized in that: described left image collection assembly (26) comprises pedestal (28), pedestal (28) is arranged in left mounting groove (24), (28) are provided with reflecting prism A(18 to pedestal successively), optical imaging channel (16) and reflecting prism B(14), reflecting prism A(18), optical imaging channel (16) and reflecting prism B(14) three is on same straight line, reflecting prism A(18) and reflecting prism B(14) both are corresponding in mirror image.
3. a kind of non-mask write through photo-etching machine sucker structure with back side alignment function according to claim 1, is characterized in that: described upper sucker (1) is provided with open slot (11).
4. a kind of non-mask write through photo-etching machine sucker structure with back side alignment function according to claim 1, is characterized in that: described upper sucker (1) and lower sucker (2) are all covered with black oxide film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510634630.9A CN105182700A (en) | 2015-09-30 | 2015-09-30 | Maskless direct-writing photolithography machine suction cup structure with back surface alignment function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510634630.9A CN105182700A (en) | 2015-09-30 | 2015-09-30 | Maskless direct-writing photolithography machine suction cup structure with back surface alignment function |
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| Publication Number | Publication Date |
|---|---|
| CN105182700A true CN105182700A (en) | 2015-12-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510634630.9A Pending CN105182700A (en) | 2015-09-30 | 2015-09-30 | Maskless direct-writing photolithography machine suction cup structure with back surface alignment function |
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| Country | Link |
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| CN (1) | CN105182700A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0867773A2 (en) * | 1997-03-25 | 1998-09-30 | Nikon Corporation | Stage apparatus and method for producing circuit device utilizing the same |
| CN201153119Y (en) * | 2008-01-04 | 2008-11-19 | 科毅科技股份有限公司 | Light-emitting auxiliary calibration positioning device |
| CN103488064A (en) * | 2012-06-14 | 2014-01-01 | 上海微电子装备有限公司 | Back side alignment apparatus and back side alignment substrate pasting method |
| CN103576467A (en) * | 2012-08-10 | 2014-02-12 | 上海微电子装备有限公司 | Alignment device and alignment method |
| CN204989749U (en) * | 2015-09-30 | 2016-01-20 | 合肥芯碁微电子装备有限公司 | Litho machine sucker structure is directly write to no mask with back alignment function |
-
2015
- 2015-09-30 CN CN201510634630.9A patent/CN105182700A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0867773A2 (en) * | 1997-03-25 | 1998-09-30 | Nikon Corporation | Stage apparatus and method for producing circuit device utilizing the same |
| CN201153119Y (en) * | 2008-01-04 | 2008-11-19 | 科毅科技股份有限公司 | Light-emitting auxiliary calibration positioning device |
| CN103488064A (en) * | 2012-06-14 | 2014-01-01 | 上海微电子装备有限公司 | Back side alignment apparatus and back side alignment substrate pasting method |
| CN103576467A (en) * | 2012-08-10 | 2014-02-12 | 上海微电子装备有限公司 | Alignment device and alignment method |
| CN204989749U (en) * | 2015-09-30 | 2016-01-20 | 合肥芯碁微电子装备有限公司 | Litho machine sucker structure is directly write to no mask with back alignment function |
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Application publication date: 20151223 |