CN105116701A - Method for preparing single-sided, double-sided single-layer single-function or single-sided, double-sided single-layer multifunctional printed electronic products by light induction - Google Patents

Abstract

A method for preparing single-sided and double-sided single-layer single-function or single-sided and double-sided single-layer multifunctional printed electronic products by adopting light induction relates to the technical field of printed electronics. The invention aims to solve the problem that the existing ink-jet printing electronic technology cannot realize high-efficiency, high-resolution and large-scale electronic circuit production. The method comprises the steps of firstly selecting a substrate, completing the design of circuit information on a computer, controlling light beam irradiation through a light beam controller to enable the circuit information to be stored on a photosensitive material to form an electrostatic latent image of a circuit, covering a functional toner on the photosensitive material, converting the circuit information into a visible toner circuit image, transferring the functional toner onto the substrate through hot-pressing sintering or electrostatic adsorption or combination of the hot-pressing sintering and the electrostatic adsorption, and then baking to form a circuit layer. The invention is also applicable to printed integrated circuits and the like.

Description

Method for preparing single-sided, double-sided single-layer single-function or single-sided, double-sided single-layer multifunctional printed electronic products by light induction

technical field

The invention relates to the technical field of printed electronics; in particular, it relates to a printed electronic technology using light-induced conductive toner to form circuits.

Background technique

In the electronic information manufacturing industry, the traditional copper foil etching technology is widely used because of its mature technology, but it also brings environmental pollution due to its complicated manufacturing process, numerous production processes, large material consumption, and large amount of waste liquid. It was widely criticized because of the great pressure. In order to overcome the cumbersome process and serious pollution of traditional copper foil etching technology, and meet the development requirements of a new generation of flexible circuits and wearable circuits, inkjet printed electronics technology emerged as the times require.

The basic idea of inkjet printed electronic technology is to print electronic circuits directly on insulating substrates by using functional inks or inks. This technology has outstanding advantages such as simple process, low cost, and no pollution to the environment. However, limited by the low accuracy of the line width of the printed circuit and the easy clogging of the nozzle during inkjet printing, this technology is currently developing slowly and only stays at the laboratory level, and it is rarely used in large-scale production.

Contents of the invention

In order to solve the problem that the existing inkjet printed electronic technology cannot realize high-efficiency, high-resolution, and large-scale electronic circuit production, the present invention proposes the use of light-induced preparation of single-sided, double-sided single-layer single-function or single-sided 1. A method for double-sided single-layer multifunctional printed electronic products.

A method for preparing a single-sided, single-layer, single-function printed electronic product by light induction, comprising the following steps:

Step 1, selecting a non-conductive material as the substrate;

Step 2, using computer-aided manufacturing technology to complete the design of the circuit, and sending the circuit information to the beam controller;

Step 3, the light beam controller controls the light beam to selectively irradiate the photosensitive material, and the potential of the light-receiving part of the photosensitive material is different from that of the non-light-receiving part. At this time, the circuit information is stored on the photosensitive material and forms an electrostatic latent image of the circuit;

Step 4, coating the Nth functional toner with charge on the photosensitive material; different positions on the photosensitive material have different potentials, and the Nth functional toner with charge is selectively adsorbed on the photosensitive material. At this time, the electrostatic latent image of the circuit on the photosensitive material is converted into a visible toner circuit image to complete the development process; N is a positive integer;

Step 5: transfer the Nth functional toner that forms a visible toner circuit image on the photosensitive material to the substrate through electrostatic adsorption technology or hot pressing sintering technology or a combination of the two technologies. At this time, the substrate is covered with There is Nth functional toner;

Step 6, put the substrate covered with the Nth functional toner in an oven to bake, the baking temperature is lower than the softening temperature or denaturation temperature of the substrate, and higher than the functional material in the Nth functional toner The sintering temperature is higher, so that one surface of the substrate forms a circuit layer, and a printed electronic product with single-sided, single-layer, and single-function is obtained.

The method for preparing a double-sided single-layer multifunctional printed electronic product by light induction comprises the following steps:

Step A1, selecting a non-conductive material as the substrate;

Step B1, using computer-aided manufacturing technology to complete the design of the circuit, and sending the circuit information to the beam controller;

Step C1, the light beam controller controls the light beam to selectively irradiate the photosensitive material, and the potential of the light-receiving part of the photosensitive material is different from that of the non-light-receiving part. At this time, the circuit information is stored on the photosensitive material and forms an electrostatic latent image of the circuit;

Step D1, coating the Nth functional toner with charge on the photosensitive material; different positions on the photosensitive material have different potentials, and the Nth functional toner is selectively adsorbed on the light-receiving part of the photosensitive material or the non-light-receiving part Part, at this time, the electrostatic latent image of the circuit on the photosensitive material is converted into a visible toner circuit image, and the development process is completed;

Step E1, the Nth functional toner that forms a visible toner circuit image on the photosensitive material is transferred to the substrate by electrostatic adsorption technology or hot pressing sintering technology or a combination of the two technologies. At this time, the substrate is covered with There is Nth functional toner; N is a positive integer;

Step F1, using computer-aided manufacturing technology to complete the design of the circuit, and sending the circuit information to the beam controller;

Step G1, the light beam controller controls the light beam to selectively irradiate the photosensitive material, and the potential of the light-receiving part of the photosensitive material is different from that of the non-light-receiving part. At this time, the circuit information is stored on the photosensitive material and forms an electrostatic latent image of the circuit;

Step H1, coating the N+1th functional toner with charge on the photosensitive material; different positions on the photosensitive material have different potentials, and the N+1th functional toner is selectively adsorbed on the photosensitive material. Partial or non-light-receiving part, at this time, the electrostatic latent image of the circuit on the photosensitive material is converted into a visible toner circuit image, and the development process is completed;

In step I1, the N+1th functional toner forming a visible toner circuit image on the photosensitive material is transferred to the layer covered with On the substrate of the Nth functional toner, at this time, the substrate is covered with the Nth and N+1 functional toners;

Step J1, when the substrate is covered with the first to N+1 functional toners, proceed to the next step;

Step K1, placing the substrate covered with the first to N+1th functional toners in an oven and baking at a temperature lower than the softening temperature or denaturation temperature of the substrate and higher than the first to Nth +1 sintering temperature of the functional material in the functional toner, so that a circuit layer is formed on one surface of the substrate, and a printed electronic product with single-sided, single-layer and multi-functional is obtained;

Step L1, repeating step B1 to step K1, forming a circuit layer on the other surface of the printed electronic product with single-sided single-layer multi-function, and obtaining a printed electronic product with double-sided single-layer multi-functional.

Beneficial effects: Compared with the traditional copper foil etching technology, the electronic printing method of the present invention has simple production process and low cost; it also has low energy consumption, no waste liquid and less waste material, and can realize green and efficient production. At the same time, it can quickly generate single-layer and multi-layer circuit boards under laboratory or small-batch production conditions. At the same time, the circuit is not easy to produce defects, low cost, fast response, and small equipment investment.

Compared with the existing inkjet printed electronics technology, the printed electronics method of the present invention avoids the problem that the nozzles of the inkjet printed electronics technology are easy to clog in principle, and uses light beams instead of mechanical drawing graphics, greatly improving Increased production efficiency. At the same time, the limit resolution of this technology is also higher than the existing inkjet printed electronics technology, compared with the existing inkjet printed electronics technology, the limit resolution of the printed electronics method described in the present invention is increased by 30% above.

The invention is also applicable to the fields of electronic information manufacturing technology, additive manufacturing technology, printed circuit board technology, electronic label technology, flat panel display technology, flexible wearable electronic technology and the like.

Description of drawings

Fig. 1 is a flow chart of a method for preparing a single-sided single-layer single-function printed electronic product by light induction.

Detailed ways

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS 1. This embodiment will be specifically described with reference to FIG. 1. The method for preparing a printed electronic product using light induction described in this embodiment includes the following steps:

Step 1, selecting a non-conductive material as the substrate;

Step 2, using computer-aided manufacturing technology to complete the design of the circuit, and sending the circuit information to the beam controller;

Step 3, the light beam controller controls the light beam to selectively irradiate the photosensitive material, and the potential of the light-receiving part of the photosensitive material is different from that of the non-light-receiving part. At this time, the circuit information is stored on the photosensitive material and forms an electrostatic latent image of the circuit;

Step 4, coating the Nth functional toner with charge on the photosensitive material; different positions on the photosensitive material have different potentials, and the Nth functional toner with charge is selectively adsorbed on the photosensitive material. At this time, the electrostatic latent image of the circuit on the photosensitive material is converted into a visible toner circuit image to complete the development process; N is a positive integer;

Step 5: transfer the Nth functional toner that forms a visible toner circuit image on the photosensitive material to the substrate through electrostatic adsorption technology or hot pressing sintering technology or a combination of the two technologies. At this time, the substrate is covered with There is Nth functional toner;

Step 6, put the substrate covered with the Nth functional toner in an oven to bake, the baking temperature is lower than the softening temperature or denaturation temperature of the substrate, and higher than the functional material in the Nth functional toner The sintering temperature is higher, so that one surface of the substrate forms a circuit layer, and a printed electronic product with single-sided, single-layer, and single-function is obtained.

In this embodiment, the present invention stores circuit information on the photosensitive material by selectively irradiating the light beam on the photosensitive material. The circuit design is completed on the computer, and the circuit information is sent to the beam controller. The light beam controller controls the light beam to selectively irradiate the photosensitive material, and the charge of the light-receiving part of the photosensitive material changes, and the circuit information is stored on the photosensitive material to form an electrostatic latent image of the circuit. The charged functional toner is selectively adsorbed on the light-receiving part or the non-light-receiving part of the photosensitive material, and converts the electrostatic latent image of the circuit on the photosensitive material into a visible toner circuit image. The functional toner is transferred to the substrate by hot-press sintering or electrostatic adsorption or a combination of both. After baking or lighting, the circuit layer is formed. This technology can realize green, high-efficiency, high-resolution, and large-scale production of electronic circuits, which can be used in printed circuit boards, electronic labels, flat panel displays, and flexible wearable electronics.

The method of the invention solves the problem that the existing ink-jet printed electronic technology cannot realize high-efficiency, high-resolution and large-scale electronic circuit production.

Specific Embodiment 2. This embodiment is a further description of the method for preparing single-sided, single-layer, single-function printed electronic products using light induction in Embodiment 1. In this embodiment, step 6 is replaced by the following method:

The substrate covered with the Nth functional toner is baked in an oven at a temperature lower than the softening temperature or denaturation temperature of the substrate and higher than the softening temperature of the organic polymer in the Nth functional toner Or denaturation temperature, remove the organic substance organic polymer in the Nth functional toner, form a circuit layer on one surface of the substrate, and obtain a printed electronic product with single-sided, single-layer, and single-function.

Specific Embodiment 3. This embodiment is a further description of the method for preparing single-sided, single-layer, single-function printed electronic products using light induction in Embodiment 1. In this embodiment, step 6 is replaced by the following method:

Put the substrate covered with the Nth functional toner under the light to decompose the organic substances in the Nth functional toner, remove the organic substances in the Nth functional toner, and make one surface of the substrate Form circuit layers to obtain printed electronic products with single-sided, single-layer, and single-function.

Specific Embodiment Four. The method for preparing a double-sided single-layer single-function printed electronic product by light induction described in this embodiment includes the following steps:

Step 11, selecting a non-conductive material as the substrate;

Step 21, using computer aided manufacturing technology to complete the design of the circuit, and sending the circuit information to the beam controller;

In step 31, the light beam controller controls the light beam to selectively irradiate the photosensitive material, and the potential of the light-receiving part of the photosensitive material is different from that of the non-light-receiving part. At this time, the circuit information is stored on the photosensitive material and forms an electrostatic latent image of the circuit;

Step 41, coating the Nth functional toner with charge on the photosensitive material; different positions on the photosensitive material have different potentials, and the Nth functional toner with charge is selectively adsorbed on the photosensitive material The light-receiving part or the non-light-receiving part, at this time, the electrostatic latent image of the circuit on the photosensitive material is converted into a visible toner circuit image, and the development process is completed; N is a positive integer;

In step 51, the Nth functional toner forming a visible toner circuit image on the photosensitive material is transferred to the substrate by electrostatic adsorption technology or hot pressing sintering technology or a combination of the two. Covered with Nth functional toner;

In step 61, the substrate covered with the Nth functional toner is baked in an oven at a temperature lower than the softening temperature or denaturation temperature of the substrate and higher than the functional toner in the Nth functional toner. The sintering temperature of the material enables the formation of a circuit layer on one surface of the substrate to obtain printed electronic products with single-sided, single-layer, and single-function;

Step 71: Repeat steps 21 to 61 to form a circuit layer on the other surface of the single-sided single-layer single-function printed electronic product to obtain a double-sided single-layer single-function printed electronic product.

In this embodiment, on the basis of steps 21 to 61, a circuit layer is formed on the other side of the substrate, so that circuit layers are formed on both sides of the substrate, and a printed electronic product with double-sided single-layer and single-function is obtained.

Specific Embodiments Five. The method for preparing single-sided, single-layer, multi-functional printed electronic products using light induction described in this embodiment includes the following steps:

Step A, selecting a non-conductive material as the substrate;

Step B, using computer-aided manufacturing technology to complete the design of the circuit, and sending the circuit information to the beam controller;

Step C, the light beam controller controls the light beam to selectively irradiate the photosensitive material, and the potential of the light-receiving part of the photosensitive material is different from that of the non-light-receiving part. At this time, the circuit information is stored on the photosensitive material and forms an electrostatic latent image of the circuit;

Step D, coating the Nth functional toner with charge on the photosensitive material; different positions on the photosensitive material have different potentials, and the Nth functional toner is selectively adsorbed on the light-receiving part of the photosensitive material or the non-light-receiving part Part, at this time, the electrostatic latent image of the circuit on the photosensitive material is converted into a visible toner circuit image, and the developing process is completed; N is a positive integer;

Step E, transfer the Nth functional toner that forms a visible toner circuit image on the photosensitive material to the substrate by electrostatic adsorption technology or hot pressing sintering technology or a combination of the two technologies, at this time the substrate is covered There is Nth functional toner; N is a positive integer;

Step F, using computer-aided manufacturing technology to complete the design of the circuit, and sending the circuit information to the beam controller;

Step G, the light beam controller controls the light beam to selectively irradiate the photosensitive material, and the potential of the light-receiving part of the photosensitive material is different from that of the non-light-receiving part. At this time, the circuit information is stored on the photosensitive material and forms an electrostatic latent image of the circuit;

Step H, coating the N+1th functional toner with charge on the photosensitive material; different positions on the photosensitive material have different potentials, and the N+1th functional toner is selectively adsorbed on the photosensitive material. Partial or non-light-receiving part, at this time, the electrostatic latent image of the circuit on the photosensitive material is converted into a visible toner circuit image, and the development process is completed;

In step I, the N+1th functional toner that forms a visible toner circuit image on the photosensitive material is transferred to the layer covered with On the substrate of the Nth functional toner, at this time, the substrate is covered with the Nth and N+1 functional toners;

Step J, when the substrate is covered with the first to N+1 functional toners, go to the next step;

Step K, placing the substrate covered with the first to N+1th functional toners in an oven and baking at a temperature lower than the softening temperature or denaturation temperature of the substrate and higher than the first to Nth +1 The sintering temperature of the functional material in the functional toner, so that one surface of the substrate forms a circuit layer, and a printed electronic product with single-sided single-layer multi-function is obtained.

In this embodiment, the circuit layer is formed on one surface of the substrate by first covering the functional toner and then baking together. This embodiment adopts unified baking, which can simplify the process and improve the production efficiency.

Specific Embodiment Six. The method for preparing a double-sided single-layer multi-functional printed electronic product using light induction described in this embodiment includes the following steps:

Step A1, selecting a non-conductive material as the substrate;

Step B1, using computer-aided manufacturing technology to complete the design of the circuit, and sending the circuit information to the beam controller;

Step C1, the light beam controller controls the light beam to selectively irradiate the photosensitive material, and the potential of the light-receiving part of the photosensitive material is different from that of the non-light-receiving part. At this time, the circuit information is stored on the photosensitive material and forms an electrostatic latent image of the circuit;

Step D1, coating the Nth functional toner with charge on the photosensitive material; different positions on the photosensitive material have different potentials, and the Nth functional toner is selectively adsorbed on the light-receiving part of the photosensitive material or the non-light-receiving part Part, at this time, the electrostatic latent image of the circuit on the photosensitive material is converted into a visible toner circuit image, and the developing process is completed; N is a positive integer;

Step E1, the Nth functional toner that forms a visible toner circuit image on the photosensitive material is transferred to the substrate by electrostatic adsorption technology or hot pressing sintering technology or a combination of the two technologies. At this time, the substrate is covered with There is Nth functional toner; N is a positive integer;

Step F1, using computer-aided manufacturing technology to complete the design of the circuit, and sending the circuit information to the beam controller;

Step G1, the light beam controller controls the light beam to selectively irradiate the photosensitive material, and the potential of the light-receiving part of the photosensitive material is different from that of the non-light-receiving part. At this time, the circuit information is stored on the photosensitive material and forms an electrostatic latent image of the circuit;

Step H1, coating the N+1th functional toner with charge on the photosensitive material; different positions on the photosensitive material have different potentials, and the N+1th functional toner is selectively adsorbed on the photosensitive material. Partial or non-light-receiving part, at this time, the electrostatic latent image of the circuit on the photosensitive material is converted into a visible toner circuit image, and the development process is completed;

In step I1, the N+1th functional toner forming a visible toner circuit image on the photosensitive material is transferred to the layer covered with On the substrate of the Nth functional toner, at this time, the substrate is covered with the Nth and N+1 functional toners;

Step J1, when the substrate is covered with the first to N+1 functional toners, proceed to the next step;

Step K1, placing the substrate covered with the first to N+1th functional toners in an oven and baking at a temperature lower than the softening temperature or denaturation temperature of the substrate and higher than the first to Nth +1 sintering temperature of the functional material in the functional toner, so that a circuit layer is formed on one surface of the substrate, and a printed electronic product with single-sided, single-layer and multi-functional is obtained;

Step L1, repeating step B1 to step K1, forming a circuit layer on the other surface of the printed electronic product with single-sided single-layer multi-function, and obtaining a printed electronic product with double-sided single-layer multi-functional.

In this embodiment, on the basis of preparing a single-sided single-layer multi-functional printed electronic product, a circuit layer is formed on the other side of the single-sided single-layer multi-functional printed electronic product to form a double-sided single-layer multi-functional printed electronic products.

Specific Embodiment Seven. The method for preparing a single-sided single-layer multi-functional printed electronic product using light induction described in this embodiment includes the following steps:

Step 11, selecting a non-conductive material as the substrate;

Step 21, using computer-aided manufacturing technology to complete the design of the circuit, and sending the circuit information to the beam controller;

Step 31, the light beam controller controls the light beam to selectively irradiate the photosensitive material, and the potential of the light-receiving part of the photosensitive material is different from that of the non-light-receiving part. At this time, the circuit information is stored on the photosensitive material and forms an electrostatic latent image of the circuit;

Step 41, coating the Nth functional toner with charge on the photosensitive material; different positions on the photosensitive material have different potentials, and the Nth functional toner is selectively adsorbed on the light-receiving part of the photosensitive material or the non-light-receiving part Part, at this time, the electrostatic latent image of the circuit on the photosensitive material is converted into a visible toner circuit image, and the developing process is completed; N is a positive integer;

Step 51, transfer the Nth functional toner that forms a visible toner circuit image on the photosensitive material to the substrate through electrostatic adsorption technology or hot pressing sintering technology or a combination of the two technologies. At this time, the substrate is covered with There is Nth functional toner;

Step 61, placing the substrate covered with the Nth functional toner in an oven and baking at a temperature lower than the softening temperature or denaturation temperature of the substrate and higher than the functional material in the Nth functional toner A higher sintering temperature, so that one surface of the substrate forms a circuit layer;

Step 71, using computer-aided manufacturing technology to complete the design of the circuit, and sending the circuit information to the beam controller;

Step 81, the light beam controller controls the light beam to selectively irradiate the photosensitive material, and the potential of the light-receiving part of the photosensitive material is different from that of the non-light-receiving part. At this time, the circuit information is stored on the photosensitive material to form an electrostatic latent image of the circuit;

Step 91, coating the N+1th functional toner with charge on the photosensitive material; different positions on the photosensitive material have different potentials, and the N+1th functional toner is selectively adsorbed on the photosensitive material. Partial or non-light-receiving part, at this time, the electrostatic latent image of the circuit on the photosensitive material is converted into a visible toner circuit image, and the development process is completed;

Step 101, transfer the N+1th functional toner that forms a visible toner circuit image on the photosensitive material to a surface in step 61 by electrostatic adsorption technology or hot pressing sintering technology or a combination of both On the substrate where the circuit layer is formed; at this time, a substrate with the circuit layer formed on the surface is covered with N+1 functional toner;

Step 111, putting the substrate covered with the N+1th functional toner and forming the circuit layer on one surface to be baked in an oven, the baking temperature is lower than the softening temperature or denaturation temperature of the substrate, and higher than the N+1th functional toner The sintering temperature of the functional material in a functional toner, so that a circuit layer is formed again on a substrate with a circuit layer formed on the surface;

Step 121, repeating steps 21 to 111 to obtain a printed electronic product with single-sided, single-layer and multi-functional.

In this embodiment, the circuit layer is formed on one surface of the substrate by covering the toner once, baking once, covering the toner again, and baking again. This embodiment adopts multiple times of baking, and different baking temperatures can be set for different functional toners, so that each functional toner is baked at an appropriate temperature, and the reliability of the product can be improved at the same time.

Embodiment 8. The method for preparing a double-sided single-layer multi-functional printed electronic product using light induction described in this embodiment includes the following steps:

Step 11-1, selecting a non-conductive material as the substrate;

Step 21-1, using computer-aided manufacturing technology to complete the design of the circuit, and sending the circuit information to the beam controller;

Step 31-1, the light beam controller controls the light beam to selectively irradiate the photosensitive material, and the potential of the light-receiving part of the photosensitive material is different from that of the non-light-receiving part. At this time, the circuit information is stored on the photosensitive material and forms an electrostatic latent image of the circuit;

Step 41-1, coating the charged Nth functional toner on the photosensitive material; different positions on the photosensitive material have different potentials, and the Nth functional toner is selectively adsorbed on the photosensitive part or The part that is not exposed to light, at this time, the electrostatic latent image of the circuit on the photosensitive material is converted into a visible toner circuit image, and the development process is completed; N is a positive integer;

In step 51-1, the Nth functional toner forming a visible toner circuit image on the photosensitive material is transferred to the substrate by electrostatic adsorption technology or hot pressing sintering technology or a combination of the two technologies. At this time, the substrate Covered with the Nth functional toner;

Step 61-1, placing the substrate covered with the Nth functional toner in an oven for baking, the baking temperature is lower than the softening temperature or denaturation temperature of the substrate, and higher than the functional toner in the Nth functional toner The sintering temperature of the non-volatile material makes one surface of the substrate form a circuit layer;

Step 71-1, using computer-aided manufacturing technology to complete the design of the circuit, and sending the circuit information to the beam controller;

Step 81-1, the light beam controller controls the light beam to selectively irradiate the photosensitive material, and the potential of the light-receiving part of the photosensitive material is different from that of the non-light-receiving part. At this time, the circuit information is stored on the photosensitive material and forms an electrostatic latent image of the circuit;

Step 91-1, coating the N+1th functional toner with charge on the photosensitive material; different positions on the photosensitive material have different potentials, and the N+1th functional toner is selectively adsorbed on the photosensitive material At this time, the electrostatic latent image of the circuit on the photosensitive material is converted into a visible toner circuit image, and the development process is completed;

Step 10-1, transfer the N+1th functional toner that forms a visible toner circuit image on the photosensitive material to step 61-1 through electrostatic adsorption technology or hot pressing sintering technology or a combination of the two One of the substrates whose surface forms a circuit layer; at this time, a substrate whose surface forms a circuit layer is covered with the N+1th functional toner;

Step 11-1, placing the substrate covered with the N+1th functional toner and forming a circuit layer on one surface and baking in an oven, the baking temperature is lower than the softening temperature or denaturation temperature of the substrate, and higher than the Nth +1 The sintering temperature of the functional material in the functional toner, so that a circuit layer is formed again on a substrate with a circuit layer formed on the surface;

Step 12-1, repeating Step 21-1 to Step 11-1 to obtain a printed electronic product with single-sided, single-layer and multi-function;

Step 13-1, repeating steps 21-1 to 12-1, forming a circuit layer on the other surface of the single-sided single-layer multi-functional printed electronic product to obtain a double-sided single-layer multi-functional printed electronic product .

In this embodiment, a circuit layer is formed on the other surface of the single-sided single-layer multi-functional printed electronic product to obtain a double-sided single-layer multi-functional printed electronic product.

Specific Embodiment Nine. This Embodiment Nine is a further description of Embodiments 1 to 8. In this embodiment, the light beam is one or two of X-rays and γ-rays, laser light, LED light, visible light, ultraviolet rays, or infrared rays. or a combination of two or more.

Using charged functional toner, the circuit information stored on the photosensitive material is transferred to the substrate by transfer printing. The charged functional toners are the first to N+1th functional toners.

Functional toner refers to organic matter containing functional materials, including conductive materials, capacitive materials, resistive materials, inductive materials, insulating materials, superconducting materials, semiconductor materials, dielectric materials, magnetic materials, photoelectric materials, thermoelectric materials, heat sensitive materials, absorbing materials or electronic packaging materials. The first to N+1th functional toners all belong to this category.

The substrate is a substrate made of one, two or a mixture of two or more of polymers, glass, ceramics or biological materials, and the substrate is rigid or flexible.

The photosensitive material refers to a material whose chargeability or conductivity changes after being irradiated by light.

Printed electronics includes printed circuit boards, electronic tags (RFID), chips, printed transistors, organic light-emitting diodes (OLEDs), flat panel displays, flexible electronics, wearable electronics, and solar photovoltaic cells.

The circuit layer and insulation layer can be the same or different for each design.

Specific Embodiments Ten. This embodiment is an embodiment. According to the contents of Embodiments 1 to 9 of the present invention, an embodiment is now proposed, and the steps are as follows:

The first step is to choose polyethylene terephthalate flexible material as the substrate;

The second step is to use computer-aided manufacturing (CAM) technology to complete the circuit design on the computer and transmit the circuit information to the beam controller;

In the third step, the beam controller controls the light beam and selectively irradiates the organic photoconductive material. The potential of the light-receiving part of the organic photoconductive material is different from that of the non-light-receiving part, and the circuit information is stored on the photosensitive material to form an electrostatic latent image of the circuit;

The fourth step is to coat the charged conductive toner (polystyrene containing nano-silver particles) on the organic photoconductive material; different positions on the organic photoconductive material have different potentials, and the charged conductive toner will select It is permanently adsorbed on the light-receiving part of the organic photoconductive material, so that the electrostatic latent image of the circuit on the photosensitive material is converted into a visible toner circuit image, and the development process is completed;

The fifth step is to hot press and sinter the charged conductive toner on the organic photoconductive material to form the circuit image at 1-5MPa, 200-250°C for 10-30s, so that the charged conductive toner is transferred onto a polyethylene terephthalate substrate;

The sixth step is to bake the substrate covered with conductive toner in an oven at a temperature of 150-200°C for 0.5-1 hour to form a conductive circuit layer;

In the seventh step, the beam controller controls the beam and irradiates all the organic photoconductive materials;

The eighth step is to coat the charged insulating toner (polystyrene) on the organic photoconductive material; the organic photoconductive material is completely exposed to light, and the charged insulating toner is adsorbed on the surface of the entire organic photoconductive material;

In the ninth step, the insulating toner on the organic photoconductive material is hot-pressed and sintered at 1-5MPa, 200-250°C for 10-30s, so that the toner is transferred to the polyethylene terephthalate substrate ;

The tenth step is to bake the substrate covered with insulating toner in an oven at a temperature of 150-200°C for 0.5-1 hour to form an insulating layer;

In the eleventh step, repeat the second to tenth steps to obtain a multilayer flexible electronic circuit.

The foregoing embodiments are only preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention, so: all equivalent changes made according to the principle of the present invention, etc., should be covered by the protection scope of the present invention within.

Claims (9)

1. adopt photoinduction to prepare the method for single-surface single-layer list function printed electronics product, it is characterized in that, it comprises the steps:

Step one, selects non-conducting material as substrate;

Step 2, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step 3, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step 4, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, the functional ink powder of N kind with electric charge is optionally adsorbed on the light part of photosensitive material or non-light part, now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process; N is positive integer;

Step 5, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines;

Step 6, the substrate of the functional ink powder of covering N kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N kind, make a circuit forming surface layer of substrate, obtain and there is the unifunctional printed electronics product of single-surface single-layer.

2. the method for single-surface single-layer list function printed electronics product is prepared in employing photoinduction according to claim 1, and it is characterized in that, step 6 is replaced by following method:

The substrate being coated with the functional ink powder of N kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the softening temperature of organic polymer in the functional ink powder of N kind or denaturation temperature, remove the organic substance organic polymer in the functional ink powder of N kind, make a circuit forming surface layer of substrate, obtain and there is the unifunctional printed electronics product of single-surface single-layer.

3. the method for single-surface single-layer list function printed electronics product is prepared in employing photoinduction according to claim 1, and it is characterized in that, step 6 is replaced by following method:

Irradiate under the substrate being coated with the functional ink powder of N kind is placed in light, make the organic material decomposition in the functional ink powder of N kind, remove the organic substance in the functional ink powder of N kind, make a circuit forming surface layer of substrate, obtain and there is the unifunctional printed electronics product of single-surface single-layer.

4. adopt photoinduction to prepare the method for two-sided individual layer list function printed electronics product, it is characterized in that, it comprises the steps:

Step one by one, selects non-conducting material as substrate;

Step 2 one, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step 3 one, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step 4 one, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, the functional ink powder of N kind with electric charge is optionally adsorbed on the light part of photosensitive material or non-light part, now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process; N is positive integer;

Step May Day, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, be transferred on substrate by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines, now substrate be coated with the functional ink powder of N kind;

Step 6 one, the substrate of the functional ink powder of covering N kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N kind, make a circuit forming surface layer of substrate, obtain and there is the unifunctional printed electronics product of single-surface single-layer;

Step July 1st, repeat step 2 one to step 6 one, form circuit layer on the surface at another with the unifunctional printed electronics product of single-surface single-layer, obtain and there is the unifunctional printed electronics product of two-sided individual layer.

5. adopt photoinduction to prepare the method for the multi-functional printed electronics product of single-surface single-layer, it is characterized in that, it comprises the steps:

Steps A, selects non-conducting material as substrate;

Step B, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step C, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step D, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;

Step e, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines; N is positive integer;

Step F, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step G, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step H, is coated on photosensitive material by the functional ink powder of N+1 kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N+1 kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;

Step I, photosensitive material will be formed the functional ink powder of N+1 kind of visual ink powder circuit image, be transferred on the substrate being coated with the functional ink powder of N kind in step e by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines, now substrate be coated with N kind and the functional ink powder of N+1 kind;

Step J, when substrate being coated with the first ink powder functional to N+1 kind, carries out next step;

Step K, the first substrate to the functional ink powder of N+1 kind of covering is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the first sintering temperature to the functional material in the functional ink powder of N+1 kind, make a circuit forming surface layer of substrate, obtain and there is the multi-functional printed electronics product of single-surface single-layer.

6. adopt photoinduction to prepare the method for the multi-functional printed electronics product of two-sided individual layer, it is characterized in that, it comprises the steps:

Steps A 1, selects non-conducting material as substrate;

Step B1, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step C1, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step D1, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;

Step e 1, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines; N is positive integer;

Step F 1, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step G1, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step H1, is coated on photosensitive material by the functional ink powder of N+1 kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N+1 kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;

Step I1, photosensitive material will be formed the functional ink powder of N+1 kind of visual ink powder circuit image, be transferred on the substrate being coated with the functional ink powder of N kind in step e 1 by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines, now substrate be coated with N kind and the functional ink powder of N+1 kind;

Step J1, when substrate being coated with the first ink powder functional to N+1 kind, carries out next step;

Step K 1, the first substrate to the functional ink powder of N+1 kind of covering is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the first sintering temperature to the functional material in the functional ink powder of N+1 kind, make a circuit forming surface layer of substrate, obtain and there is the multi-functional printed electronics product of single-surface single-layer;

Step L1, repeat step B1 to step K 1, having the multi-functional printed electronics product of single-surface single-layer, another forms circuit layer on the surface, obtains and has the multi-functional printed electronics product of two-sided individual layer.

7. adopt photoinduction to prepare the method for the multi-functional printed electronics product of single-surface single-layer, it is characterized in that, it comprises the steps:

Step 11, selects non-conducting material as substrate;

Step 21, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step 31, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step 41, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;

Step 51, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines;

Step 61, the substrate of the functional ink powder of covering N kind is placed in baking oven toast, baking temperature lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N kind, makes a circuit forming surface layer of substrate;

Step 71, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step 81, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step 91, is coated on photosensitive material by the functional ink powder of N+1 kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N+1 kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;

Step 101, photosensitive material will be formed the functional ink powder of N+1 kind of visual ink powder circuit image, is transferred on the substrate of a circuit forming surface layer in step 61 by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines; The substrate of a now circuit forming surface layer is coated with the functional ink powder of N+1 kind;

Step 111, the substrate of a circuit forming surface layer of the functional ink powder of covering N+1 kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N+1 kind, make the substrate of a circuit forming surface layer forms circuit layer again;

Step 121, repeats step 21 to step 111, obtains and have the multi-functional printed electronics product of single-surface single-layer.

8. adopt photoinduction to prepare the method for the multi-functional printed electronics product of two-sided individual layer, it is characterized in that, it comprises the steps:

Step 11-1, selects non-conducting material as substrate;

Step 21-1, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step 31-1, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step 41-1, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;

Step 51-1, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines;

Step 61-1, the substrate of the functional ink powder of covering N kind is placed in baking oven toast, baking temperature lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N kind, makes a circuit forming surface layer of substrate;

Step 71-1, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step 81-1, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step 91-1, is coated on photosensitive material by the functional ink powder of N+1 kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N+1 kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;

Step 10-1, photosensitive material will be formed the functional ink powder of N+1 kind of visual ink powder circuit image, is transferred on the substrate of a circuit forming surface layer in step 61-1 by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines; The substrate of a now circuit forming surface layer is coated with the functional ink powder of N+1 kind;

Step 11-1, the substrate of a circuit forming surface layer of the functional ink powder of covering N+1 kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N+1 kind, make the substrate of a circuit forming surface layer forms circuit layer again;

Step 12-1, repeats step 21-1 to step 11-1, obtains and have the multi-functional printed electronics product of single-surface single-layer;

Step 13-1, repeats step 21-1 to step 12-1, forms circuit layer on the surface, obtain the multi-functional printed electronics product of two-sided individual layer at another with the multi-functional printed electronics product of single-surface single-layer.

9. the method for the multi-functional printed electronics product of two-sided individual layer is prepared in employing photoinduction according to claim 8, it is characterized in that,

Described light beam is a kind of, two or more combination in X ray, gamma-rays, laser, LED light, visible ray, ultraviolet or infrared ray;

The described functional ink powder of N+1 kind with electric charge is coated with functional ink powder, wherein include the organism of functional material, functional material wherein comprises conductive material, capacitance material, resistance material, inductive material, insulating material, superconductor, semiconductor material, dielectric substance, magnetic material, photoelectric material, thermoelectric material, thermo-sensitive material, absorbing material or electronic package material;

Described substrate is the substrate that a kind of, two or more potpourri in macromolecule, glass, pottery or biomaterial are made, and this substrate is rigidity or flexibility;

After described photosensitive material refers to that light is irradiated, the material that chargeding performance or electric conductivity change.