CN105088008A - Microalloyed copper alloy frame strip and manufacturing method thereof - Google Patents
Microalloyed copper alloy frame strip and manufacturing method thereof Download PDFInfo
- Publication number
- CN105088008A CN105088008A CN201510441804.XA CN201510441804A CN105088008A CN 105088008 A CN105088008 A CN 105088008A CN 201510441804 A CN201510441804 A CN 201510441804A CN 105088008 A CN105088008 A CN 105088008A
- Authority
- CN
- China
- Prior art keywords
- cold
- copper alloy
- cold rolling
- insulation
- ageing treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 52
- 238000004519 manufacturing process Methods 0.000 title abstract description 7
- 238000005096 rolling process Methods 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 7
- 238000005097 cold rolling Methods 0.000 claims description 37
- 230000032683 aging Effects 0.000 claims description 30
- 238000009413 insulation Methods 0.000 claims description 24
- 238000005098 hot rolling Methods 0.000 claims description 19
- 238000002844 melting Methods 0.000 claims description 18
- 230000008018 melting Effects 0.000 claims description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 238000002791 soaking Methods 0.000 claims description 12
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 10
- 238000002360 preparation method Methods 0.000 claims description 7
- 238000010791 quenching Methods 0.000 claims description 7
- 238000000137 annealing Methods 0.000 claims description 6
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- 238000005266 casting Methods 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 6
- 238000003801 milling Methods 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000003643 water by type Substances 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 229910052741 iridium Inorganic materials 0.000 claims description 4
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- 229910052779 Neodymium Inorganic materials 0.000 claims description 3
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 3
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims description 3
- 229910052691 Erbium Inorganic materials 0.000 claims description 2
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 claims description 2
- 229910052746 lanthanum Inorganic materials 0.000 claims description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 238000005457 optimization Methods 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 description 6
- 230000018109 developmental process Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 3
- 229910017526 Cu-Cr-Zr Inorganic materials 0.000 description 2
- 229910017810 Cu—Cr—Zr Inorganic materials 0.000 description 2
- 229910017824 Cu—Fe—P Inorganic materials 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
The invention discloses a microalloyed copper alloy frame strip which is composed of 4.6%-5.5% of Ni, 2%-3.3% of Si, 0.02%-0.03% of Zr, 1%-1.2% of Sn, 0.65%-0.75% of Mg, 0.005%-0.008% of Fe, 0.15%-0.20% of Ag, less than 0.001% of P, 0.05%-0.15% of Zn, 0.25%-0.35% of Bi, 0.01%-0.03% of Ti, 0.05%-0.08% of Cr, 0.01%-0.03% of In, 0.04%-0.05% of B, 0.05%-0.2% of rate earth elements, and the balance Cu. The invention further discloses a manufacturing method of the copper alloy frame strip. The copper alloy strip obtained through composition optimization, rolling and refinement of a heat treatment system has high intensity, high electrical conductivity, high-temperature softening temperature resistance and excellent corrosion resistance and meets the requirement of the frame strip for large-scale and extremely-large-scale integrated circuits.
Description
Technical field
The present invention relates to copper alloy, particularly microalloying copper alloy framework band and preparation method thereof.
Background technology
Copper alloy frame material has high strength, high connductivity, low-thermal-expansion, platability and excellent processing characteristics etc., has huge market potential at the electronic applications such as unicircuit, semiconductor components and devices.Along with the development of large-scale integrated circuit and super large-scale integration, Electronic Packaging is to short, little, light, thin future development, and lead frame will to multioutlet, Small Distance future development.Therefore, copper alloy band obtains applying more widely.
Frame material not only will have high-performance, also requires the unrelieved stress of polar region.At present, frame material band mainly adopts founding, hot rolling, cold rolling, thermal treatment and the finishing technological process of production.After etching and processing is carried out in downstream, because band inside exists unrelieved stress, usually there is the metamorphism such as distortion, warpage in the strip product of high strength, causes the operations such as follow-up plating, encapsulation not carry out smoothly.
Along with electronics and IT products are to miniaturization, slimming, lightweight and intelligent direction development and unicircuit (IC) to extensive (LSI) and great scale (GSI) future development, the performance requriements of lead frame Cu alloy material is also more and more high, and corresponding to short, light, thin, high strength, the researchdevelopment of high precision direction.
Extensive and great scale integrated circuit manufacture has complex manufacturing technology, operating frequency superelevation, service rating super large, the large outstanding feature of Working environment exceedingly odious four, therefore very harsh to the requirement of its mechanical property, conductivity, heat conductivility, high temperature softening resistant performance, corrosion resisting property.At present, global development Copper Alloys for Lead Frame out reaches more than 120 and plants, and major families is Cu-Fe-P system, Cu-Ni-Si system, Cu-Cr-Zr system.The Cu-Fe-P system alloy with medium tenacity is first-generation lead frame copper alloy, there is good specific conductivity (being not less than 70%IACS), be that current circuit lead frame applies a wider Albatra metal-, but the integrated performance index such as its tensile strength (being not more than 550MPa) and high temperature resistance softening temperature (being not more than 400 DEG C) also can not meet the requirement of great scale integrated circuit high loading long-term stable operation far away.Cu-Cr-Zr system alloy has high strength & high electric-conduction and good heat-resistant stability, but Zr element is very easily oxidized, and such alloy quenching sensitive when prepared by band is strong, therefore its complex manufacturing, preparation cost are high, commercially and for being widely used.
Summary of the invention
The object of the invention is to by composition, rolling pattern and optimization of Heat Treatment Process provide a kind of there is high strength & high electric-conduction, high temperature resistance softening temperature and excellent corrosion resistance microalloying copper alloy ribbon of material and preparation method, meet demand that is extensive and great scale integrated circuit lead frame band.
For reaching this object, the present invention by the following technical solutions:
A kind of microalloying copper alloy framework band, consists of the following composition, Ni:4.6-5.5%; Si:2-3.3%; Zr:0.02-0.03%, Sn:1-1.2%, Mg:0.65-0.75%; Fe::0.005-0.008%; Ag:0.15-0.20%, P: be less than 0.001%, Zn:0.05-0.15%, Bi:0.25-0.35%, Ti:0.01-0.03%, Cr:0.05-0.08%, In:0.01-0.03%, B:0.04-0.05%, rare earth element: 0.05-0.2%, all the other are Cu.
Further, consist of the following composition: Ni:4.8%; Si:2.7%; Zr:0.025%, Sn:1.15%, Mg:0.68%; Fe::0.007%; Ag:0.185%, P:0.0005%, Zn:0.09%, Bi:0.28%, Ti:0.015%, Cr:0.06%, In:0.02%, B:0.045%, rare earth element: 0.13%, all the other are Cu.
Further, described rare earth element is one or more in erbium, lanthanum, cerium, iridium, neodymium.
further,the method of the copper alloy framework band described in preparation, is characterized in that, comprise the following steps:
(1) melting: the raw material prepared is carried out melting under nitrogen protection atmosphere in high frequency furnace, and melting waters casting copper alloys ingot after meeting component content requirement;
(2) hot rolling: it is 900-1000 DEG C that hot rolling starts temperature, finishing temperature is 650-750 DEG C, and strip plate after rolling quenches with the speed of cooling of 20-35 DEG C/s;
(3) cold rolling: the cold rolling processing copper alloy after hot rolling being carried out after the scale removal of milling face 40-60% draft; Then the copper alloy cold rolling processing obtained, at 750-780 DEG C, is incubated 25-35min; Then the cold rolling processing of 50-55% draft is carried out, subsequently soaking time 45-60min at 480-550 DEG C of temperature; Carry out the cold rolling processing of 40-60% draft again, subsequently soaking time 2-3h at 450-470 DEG C of temperature; Carry out the cold rolling of 40-45% draft again and be worked into desired thickness, finally at 410-430 DEG C of condition annealing 0.5-1h;
(4) interrupted aging:
First step ageing treatment: 350-380 DEG C, insulation 1-2h, stove is as cold as 280-320 DEG C, carries out second stage ageing treatment, insulation 1-2h, stove is as cold as 220-260 DEG C, carries out third stage ageing treatment, insulation 3-4h, stove is as cold as 160-200 DEG C, carry out fourth stage ageing treatment, insulation 12-24h, cold-water quench obtains copper alloy framework band afterwards.
Further: comprise the following steps:
(1) melting: the raw material prepared is carried out melting under nitrogen protection atmosphere in high frequency furnace, and melting waters casting copper alloys ingot after meeting component content requirement;
(2) hot rolling: it is 980 DEG C that hot rolling starts temperature, finishing temperature is 660 DEG C, and strip plate after rolling quenches with the speed of cooling of 28 DEG C/s;
(3) cold rolling: the cold rolling processing copper alloy after hot rolling being carried out after the scale removal of milling face 55% draft; Then the copper alloy cold rolling processing obtained, at 770 DEG C, is incubated 30min; Then the cold rolling processing of 54% draft is carried out, subsequently soaking time 50min at 510 DEG C of temperature; Carry out the cold rolling processing of 55% draft again, subsequently soaking time 2.5h at 460 DEG C of temperature; Carry out the cold rolling of 43% draft again and be worked into desired thickness, finally at 420 DEG C of condition annealing 0.6h;
(4) interrupted aging:
First step ageing treatment: 375 DEG C, insulation 1.2h, stove is as cold as 285 DEG C, carries out second stage ageing treatment, insulation 1.8h, stove is as cold as 230 DEG C, carries out third stage ageing treatment, insulation 3.5h, stove is as cold as 180 DEG C, carry out fourth stage ageing treatment, insulation 16h, cold-water quench obtains copper alloy framework band afterwards.
Effect of the present invention is:
What the present invention proposed is a kind of copper alloy framework band of many alloying elements microalloying, by the cooperation of the optimization to composition, rolling technology and heat treating regime, copper alloy framework band of the present invention gained finished product under above-mentioned technique tensile strength reaches 870-1075Mpa, specific conductivity reaches 75-85%IACS, unit elongation is not less than 8.2%, softening temperature is not less than 585 DEG C, the performance requirement of large-scale integrated circuit lead frame Cu alloy material can be met preferably.The frame material band produced, in the etching, encapsulation process of downstream client, does not have the distortion such as warpage, distortion, meets the etch process requirement of high performance frame frame material, has that technique is simple, low cost, can realize the feature of suitability for industrialized production.
Embodiment
Embodiment 1
Microalloying copper alloy framework band, consists of the following composition (mass percent), Ni:5.45%; Si:3.12%; Zr:0.026%, Sn:1.15%, Mg:0.71%; Fe::0.006%; Ag:0.165%, P:0.0008%, Zn:0.075%, Bi:0.29%, Ti:0.026%, Cr:0.065%, In:0.012%, B:0.043%, rare earth element: 0.07%, all the other are Cu, and described rare earth element is iridium and cerium.
Prepare the method for above-mentioned copper alloy framework band, comprise the following steps:
(1) melting: the raw material prepared is carried out melting under nitrogen protection atmosphere in high frequency furnace, and melting waters casting copper alloys ingot after meeting component content requirement;
(2) hot rolling: it is 970 DEG C that hot rolling starts temperature, finishing temperature is 680 DEG C, and strip plate after rolling quenches with the speed of cooling of 28 DEG C/s;
(3) cold rolling: the cold rolling processing copper alloy after hot rolling being carried out after the scale removal of milling face 55% draft; Then the copper alloy cold rolling processing obtained, at 760 DEG C, is incubated 30min; Then the cold rolling processing of 52% draft is carried out, subsequently soaking time 55min at 490 DEG C of temperature; Carry out the cold rolling processing of 50% draft again, subsequently soaking time 2.5h at 460 DEG C of temperature; Carry out the cold rolling of 42% draft again and be worked into desired thickness, finally at 420 DEG C of condition annealing 0.7h;
(4) interrupted aging:
First step ageing treatment: 375 DEG C, insulation 1h, stove is as cold as 290 DEG C, carries out second stage ageing treatment, insulation 1.5h, stove is as cold as 235 DEG C, carries out third stage ageing treatment, insulation 3.6h, stove is as cold as 180 DEG C, carry out fourth stage ageing treatment, insulation 18h, cold-water quench obtains copper alloy framework band afterwards.
Embodiment 2
Microalloying copper alloy framework band, consists of the following composition (mass percent): Ni:4.8%; Si:2.7%; Zr:0.025%, Sn:1.15%, Mg:0.68%; Fe::0.007%; Ag:0.185%, P:0.0005%, Zn:0.09%, Bi:0.28%, Ti:0.015%, Cr:0.06%, In:0.02%, B:0.045%, rare earth element: 0.13%, all the other are Cu, and described rare earth element is iridium and neodymium.
Prepare the method for above-mentioned copper alloy framework band, comprise the following steps:
(1) melting: the raw material prepared is carried out melting under nitrogen protection atmosphere in high frequency furnace, and melting waters casting copper alloys ingot after meeting component content requirement;
(2) hot rolling: it is 980 DEG C that hot rolling starts temperature, finishing temperature is 660 DEG C, and strip plate after rolling quenches with the speed of cooling of 28 DEG C/s;
(3) cold rolling: the cold rolling processing copper alloy after hot rolling being carried out after the scale removal of milling face 55% draft; Then the copper alloy cold rolling processing obtained, at 770 DEG C, is incubated 30min; Then the cold rolling processing of 54% draft is carried out, subsequently soaking time 50min at 510 DEG C of temperature; Carry out the cold rolling processing of 55% draft again, subsequently soaking time 2.5h at 460 DEG C of temperature; Carry out the cold rolling of 43% draft again and be worked into desired thickness, finally at 420 DEG C of condition annealing 0.6h;
(4) interrupted aging:
First step ageing treatment: 375 DEG C, insulation 1.2h, stove is as cold as 285 DEG C, carries out second stage ageing treatment, insulation 1.8h, stove is as cold as 230 DEG C, carries out third stage ageing treatment, insulation 3.5h, stove is as cold as 180 DEG C, carry out fourth stage ageing treatment, insulation 16h, cold-water quench obtains copper alloy framework band afterwards.
Copper alloy framework band of the present invention gained finished product under above-mentioned technique tensile strength reaches 870-1075Mpa, specific conductivity reaches 75-85%IACS, unit elongation is not less than 8.2%, softening temperature is not less than 585 DEG C, the performance requirement of large-scale integrated circuit lead frame Cu alloy material can be met preferably.
Claims (5)
1. microalloying copper alloy framework band and preparation method thereof, is characterized in that: consist of the following composition, Ni:4.6-5.5%; Si:2-3.3%; Zr:0.02-0.03%, Sn:1-1.2%, Mg:0.65-0.75%; Fe:0.005-0.008%; Ag:0.15-0.20%, P: be less than 0.001%, Zn:0.05-0.15%, Bi:0.25-0.35%, Ti:0.01-0.03%, Cr:0.05-0.08%, In:0.01-0.03%, B:0.04-0.05%, rare earth element: 0.05-0.2%, all the other are Cu.
2. copper alloy framework band as claimed in claim 1, is characterized in that: Ni:4.8%; Si:2.7%; Zr:0.025%, Sn:1.15%, Mg:0.68%; Fe::0.007%; Ag:0.185%, P:0.0005%, Zn:0.09%, Bi:0.28%, Ti:0.015%, Cr:0.06%, In:0.02%, B:0.045%, rare earth element: 0.13%, all the other are Cu.
3. copper alloy framework band as claimed in claim 1, is characterized in that: described rare earth element is one or more in erbium, lanthanum, cerium, iridium, neodymium.
4. the method for the copper alloy framework band of preparation as described in claim 1-3, is characterized in that, comprise the following steps:
(1) melting: the raw material prepared is carried out melting under nitrogen protection atmosphere in high frequency furnace, and melting waters casting copper alloys ingot after meeting component content requirement;
(2) hot rolling: it is 900-1000 DEG C that hot rolling starts temperature, finishing temperature is 650-750 DEG C, and strip plate after rolling quenches with the speed of cooling of 20-35 DEG C/s;
(3) cold rolling: the cold rolling processing copper alloy after hot rolling being carried out after the scale removal of milling face 40-60% draft; Then the copper alloy cold rolling processing obtained, at 750-780 DEG C, is incubated 25-35min; Then the cold rolling processing of 50-55% draft is carried out, subsequently soaking time 45-60min at 480-550 DEG C of temperature; Carry out the cold rolling processing of 40-60% draft again, subsequently soaking time 2-3h at 450-470 DEG C of temperature; Carry out the cold rolling of 40-45% draft again and be worked into desired thickness, finally at 410-430 DEG C of condition annealing 0.5-1h;
(4) interrupted aging:
First step ageing treatment: 350-380 DEG C, insulation 1-2h, stove is as cold as 280-320 DEG C, carries out second stage ageing treatment, insulation 1-2h, stove is as cold as 220-260 DEG C, carries out third stage ageing treatment, insulation 3-4h, stove is as cold as 160-200 DEG C, carry out fourth stage ageing treatment, insulation 12-24h, cold-water quench obtains copper alloy framework band afterwards.
5. method as claimed in claim 4, is characterized in that: comprise the following steps:
(1) melting: the raw material prepared is carried out melting under nitrogen protection atmosphere in high frequency furnace, and melting waters casting copper alloys ingot after meeting component content requirement;
(2) hot rolling: it is 980 DEG C that hot rolling starts temperature, finishing temperature is 660 DEG C, and strip plate after rolling quenches with the speed of cooling of 28 DEG C/s;
(3) cold rolling: the cold rolling processing copper alloy after hot rolling being carried out after the scale removal of milling face 55% draft; Then the copper alloy cold rolling processing obtained, at 770 DEG C, is incubated 30min; Then the cold rolling processing of 54% draft is carried out, subsequently soaking time 50min at 510 DEG C of temperature; Carry out the cold rolling processing of 55% draft again, subsequently soaking time 2.5h at 460 DEG C of temperature; Carry out the cold rolling of 43% draft again and be worked into desired thickness, finally at 420 DEG C of condition annealing 0.6h;
(4) interrupted aging:
First step ageing treatment: 375 DEG C, insulation 1.2h, stove is as cold as 285 DEG C, carries out second stage ageing treatment, insulation 1.8h, stove is as cold as 230 DEG C, carries out third stage ageing treatment, insulation 3.5h, stove is as cold as 180 DEG C, carry out fourth stage ageing treatment, insulation 16h, cold-water quench obtains copper alloy framework band afterwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510441804.XA CN105088008A (en) | 2015-07-26 | 2015-07-26 | Microalloyed copper alloy frame strip and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510441804.XA CN105088008A (en) | 2015-07-26 | 2015-07-26 | Microalloyed copper alloy frame strip and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105088008A true CN105088008A (en) | 2015-11-25 |
Family
ID=54569328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510441804.XA Pending CN105088008A (en) | 2015-07-26 | 2015-07-26 | Microalloyed copper alloy frame strip and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105088008A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110205570A (en) * | 2019-04-15 | 2019-09-06 | 深圳万佳互动科技有限公司 | A kind of heat treatment method of electrical and electronic parts copper alloy |
| CN110551917A (en) * | 2019-09-29 | 2019-12-10 | 广东和润新材料股份有限公司 | High-conductivity corrosion-resistant copper strip and preparation method thereof |
| CN115838879A (en) * | 2022-10-27 | 2023-03-24 | 有研工程技术研究院有限公司 | Copper-based alloy and preparation method and application thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101225488A (en) * | 2008-01-15 | 2008-07-23 | 上海理工大学 | Copper alloy material for lead frame and preparation method thereof |
| CN101250644A (en) * | 2008-02-28 | 2008-08-27 | 上海理工大学 | Copper-based alloy usable as lead frame material and preparation method thereof |
| CN101270423A (en) * | 2007-03-19 | 2008-09-24 | 日矿金属加工株式会社 | Cu-Ni-Si Copper Alloys for Electronic Materials |
| CN101348874A (en) * | 2008-09-08 | 2009-01-21 | 河南科技大学 | A kind of high-performance copper-based alloy material and preparation method thereof |
| CN103328665A (en) * | 2010-12-13 | 2013-09-25 | 日本精线株式会社 | Copper alloy and method for producing copper alloy |
| CN103443309A (en) * | 2011-05-02 | 2013-12-11 | 古河电气工业株式会社 | Copper alloy sheet material and process for producing same |
| CN104046843A (en) * | 2014-06-30 | 2014-09-17 | 中色奥博特铜铝业有限公司 | Copper-nickel-silicon alloy material containing rare-earth cerium, lead frame strip and preparation method thereof |
-
2015
- 2015-07-26 CN CN201510441804.XA patent/CN105088008A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101270423A (en) * | 2007-03-19 | 2008-09-24 | 日矿金属加工株式会社 | Cu-Ni-Si Copper Alloys for Electronic Materials |
| CN101225488A (en) * | 2008-01-15 | 2008-07-23 | 上海理工大学 | Copper alloy material for lead frame and preparation method thereof |
| CN101250644A (en) * | 2008-02-28 | 2008-08-27 | 上海理工大学 | Copper-based alloy usable as lead frame material and preparation method thereof |
| CN101348874A (en) * | 2008-09-08 | 2009-01-21 | 河南科技大学 | A kind of high-performance copper-based alloy material and preparation method thereof |
| CN103328665A (en) * | 2010-12-13 | 2013-09-25 | 日本精线株式会社 | Copper alloy and method for producing copper alloy |
| CN103443309A (en) * | 2011-05-02 | 2013-12-11 | 古河电气工业株式会社 | Copper alloy sheet material and process for producing same |
| CN104046843A (en) * | 2014-06-30 | 2014-09-17 | 中色奥博特铜铝业有限公司 | Copper-nickel-silicon alloy material containing rare-earth cerium, lead frame strip and preparation method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110205570A (en) * | 2019-04-15 | 2019-09-06 | 深圳万佳互动科技有限公司 | A kind of heat treatment method of electrical and electronic parts copper alloy |
| CN110551917A (en) * | 2019-09-29 | 2019-12-10 | 广东和润新材料股份有限公司 | High-conductivity corrosion-resistant copper strip and preparation method thereof |
| CN110551917B (en) * | 2019-09-29 | 2021-07-09 | 广东和润新材料股份有限公司 | A kind of high-conductivity and corrosion-resistant copper strip and preparation method thereof |
| CN115838879A (en) * | 2022-10-27 | 2023-03-24 | 有研工程技术研究院有限公司 | Copper-based alloy and preparation method and application thereof |
| CN115838879B (en) * | 2022-10-27 | 2024-03-26 | 有研工程技术研究院有限公司 | Copper-based alloy and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105568039B (en) | The preparation method of high-intensity high-conductivity copper Cr-Zr alloy and its strip | |
| CN106591623B (en) | A kind of high temperature resistant iron bronze and its preparation method and application | |
| CN108823466B (en) | A kind of multi-component composite precipitation strengthened high-strength and high-conductivity copper alloy and preparation method thereof | |
| CN101709401B (en) | Boron, silver, rare earth element added Cu-Cr in-situ composite material and preparation method thereof | |
| CN113943874A (en) | A kind of copper alloy material for 5G base station power connector and preparation method thereof | |
| CN104046843A (en) | Copper-nickel-silicon alloy material containing rare-earth cerium, lead frame strip and preparation method thereof | |
| JP2012207286A (en) | Copper alloy plate material for electromagnetic shielding material | |
| CN101914701A (en) | A kind of processing method of lead frame material and its strip | |
| JPS58199835A (en) | Copper alloy for electrical or electronic equipment | |
| CN109930026B (en) | High-strength high-conductivity stress relaxation-resistant copper alloy lead frame material and preparation method thereof | |
| CN105525135A (en) | Low-anisotropic-index high-intensity Cu-Ni-Si alloy and preparing process thereof | |
| CN105088008A (en) | Microalloyed copper alloy frame strip and manufacturing method thereof | |
| CN105088009A (en) | Copper alloy frame strip and making method thereof | |
| CN103878551A (en) | Method for producing high-strength copper nickel silica lead frame material | |
| CN113981267B (en) | Copper alloy lead frame material | |
| CN101709402A (en) | Cu-Sn-Te-P alloy strip for automobile water tank radiator | |
| CN102690971B (en) | A kind of high-strength copper alloy strip and its preparation method | |
| CN113106293B (en) | A low-cobalt content high-strength medium-conductivity Cu-Ni-Co-Si alloy and its preparation process | |
| CN111020277B (en) | A Cu-Fe-Co-Ti alloy with high electrical conductivity, softening resistance and stress relaxation resistance | |
| CN105112715A (en) | CuZnNiSi alloy, preparation method thereof and method for preparing strips using the same | |
| CN106906377B (en) | A kind of heavy-duty motor conductive material and its production method | |
| CN103667774A (en) | Preparation method of copper alloy semiconductor lead frame | |
| CN102644003A (en) | High-strength high-conductivity corrosion-resistant rare earth-copper alloy and manufacturing method thereof | |
| CN107190215B (en) | A kind of aluminium alloy base power circuit component and preparation method thereof | |
| CN117778915A (en) | Lead frame copper strip and preparation process thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151125 |