CN105046240B - The manufacturing method of finger print detection device - Google Patents

Abstract

The present invention relates to a kind of manufacturing methods of finger print detection device.The manufacturing method of the finger print detection device includes the following steps：By fingerprint sensor and circuit board electrical connection, fingerprint sensor is used to acquire the fingerprint pattern of the finger of person to be verified；By light source module and OPTICAL SENSORS respectively with circuit board electrical connection, obtain finger print detection device, light source module can send out optical signal, OPTICAL SENSORS can receive the optical signal of the finger reflection of person to be verified, and it can be by the optical signal transmission reflected by finger to processor, fingerprint pattern can be transferred to processor by fingerprint sensor, the optical signal reflected by finger can be converted into pulse signal by processor, processor can determine whether that startup fingerprint sensor, processor can also determine the identity of person to be verified according to fingerprint pattern according to the pulse signal.The finger print detection device of above method manufacture can realize the fingerprint recognition to live finger so that it is more safe and reliable that finger print detection device verifies identity.

Description

Manufacturing method of fingerprint detection device

technical field

The invention relates to the field of touch screens, in particular to a manufacturing method of a fingerprint detection device.

Background technique

The conventional fingerprint recognition device in the prior art only recognizes the fingerprint pattern to be tested, compares it with the fingerprint pattern recorded in the system, and if the judgment is consistent, it is determined that the fingerprint pattern has passed the verification. At present, a special imitation fingerprint film technology has appeared on the market. By copying the subject's fingerprint pattern, the fingerprint can be copied on a similar silica gel material. Because the copied fingerprint is the same as the subject's fingerprint, a conventional fingerprint identification device can also be obtained. The verification passed, which makes the security of identity verification originally intended to use the uniqueness of human fingerprints unguaranteed.

Contents of the invention

Based on this, it is necessary to provide a method for manufacturing a fingerprint detection device, which can manufacture a fingerprint detection device for identifying living fingerprints, so that fingerprint identity verification is more secure and reliable.

A method of manufacturing a fingerprint detection device, comprising the steps of:

Electrically connecting the fingerprint sensor chip to the circuit board, wherein the circuit board is electrically connected to the processor, and the fingerprint sensor chip is used to collect the fingerprint pattern of the finger of the person to be verified; and

Electrically connecting the light source module and the light sensor to the circuit board respectively to obtain a fingerprint detection device, wherein the light source module can emit light signals, and the light sensor can receive the light reflected by the finger of the person to be verified signal, and can transmit the light signal reflected by the finger to the processor, the fingerprint sensor chip can transmit the fingerprint pattern to the processor, and the processor can be used by the The light signal reflected by the finger is converted into a pulse signal, and the processor can determine whether to start the fingerprint sensor chip according to the pulse signal, and the processor can also determine the identity of the person to be verified according to the fingerprint pattern. identity.

In one of the embodiments, the step of electrically connecting the fingerprint sensor chip to the circuit board is specifically:

providing a conductive substrate, mounting the fingerprint sensor chip on the conductive substrate, and electrically connecting the fingerprint sensor chip to the conductive substrate;

The conductive substrate is mounted on the circuit board, and the conductive substrate is electrically connected to the circuit board.

In one of the embodiments, the step of electrically connecting the light source module and the light sensor to the circuit board is specifically:

An outer frame is provided, and the outer frame has a first storage cavity, a second storage cavity, and a third storage cavity arranged at intervals, and an operation hole communicated with the first storage cavity is opened on the outer frame to communicate with the outside world and all The light exit channel of the second storage cavity, and the light input channel connecting the outside world and the third storage cavity;

The light source module and the light sensor are arranged in the second storage cavity and the third storage cavity respectively, and the light signal emitted by the light source module can be emitted from the light output channel, and is received by the light source module. The light signal reflected by the finger can enter the light incident channel;

Installing the outer frame on the circuit board, electrically connecting the light source module and the light sensor to the circuit board respectively, and making the fingerprint sensor chip and the conductive substrate housed In the first storage chamber, the position of the operation hole corresponds to the position of the fingerprint sensor chip.

In one of the embodiments, after the steps of installing the outer frame on the circuit board and electrically connecting the light source module and the light sensor to the circuit board respectively, further comprising: An encapsulation material is filled between the outer frame and the fingerprint sensor chip, and the encapsulation material cooperates with the conductive substrate to form a fourth accommodating cavity for accommodating the fingerprint sensor chip.

In one of the embodiments, the packaging material is epoxy molding compound.

In one of the embodiments, before the step of installing the outer frame on the circuit board, it also includes filling the underfill in the outer frame, and distributing the underfill on the conductive substrate away from the conductive substrate. On one side of the fingerprint sensor chip.

In one embodiment, in the step of mounting the fingerprint sensor chip on the conductive substrate, the fingerprint sensor chip is pasted on the conductive substrate with adhesive.

In one of the embodiments, in the step of mounting the conductive substrate on the circuit board, the conductive substrate is mounted on the circuit board by using contact array packaging technology or ball grid array packaging technology .

In one embodiment, in the step of electrically connecting the fingerprint sensor chip to the conductive substrate, the fingerprint sensor chip is electrically connected to the conductive substrate by punching gold wires.

In one embodiment, the fingerprint sensor chip is a capacitive fingerprint sensor chip.

The manufacturing method of the above-mentioned fingerprint detection device is simple and easy for industrialized production, and when the manufacturing method of the above-mentioned fingerprint detection device is used to verify the identity of the person to be verified, the light signal emitted by the light source module is reflected by the finger of the person to be Received by the sensor, the light sensor can transmit the light signal to the processor, and the processor converts the light signal reflected by the finger into a pulse signal, and the processor converts the pulse signal from the light signal to determine the person to be verified Whether the finger of the person to be verified is a living finger or not, and determine whether to start the fingerprint sensor chip according to whether the finger of the person to be verified is a living finger. When the pulse signal converted from the optical signal is a living pulse signal, the processor starts the fingerprint sensor chip. The sensor chip collects the fingerprint pattern of the finger of the person to be verified, and transmits the collected fingerprint pattern to the processor. The device is more secure and reliable for identity verification.

Description of drawings

1 is a flowchart of a method for manufacturing a fingerprint detection device according to an embodiment;

FIG. 2 is a flow chart of the implementation step S110 of the manufacturing method of the fingerprint detection device shown in FIG. 1;

FIG. 3 is a flow chart of the implementation step S120 of the manufacturing method of the fingerprint detection device shown in FIG. 1;

FIG. 4 is a structural schematic diagram of an outer frame equipped with a light source module and a light sensor in step S120 of the manufacturing method of the fingerprint detection device shown in FIG. 1;

FIG. 5 is a structural schematic diagram of another angle of the outer frame with the light source module and the light sensor shown in FIG. 4;

Fig. 6 is a sectional view along line A-A of Fig. 4;

Fig. 7 is a sectional view along line B-B of Fig. 4;

FIG. 8 is a schematic structural view of a fingerprint detection device manufactured by the method for manufacturing the fingerprint detection device shown in FIG. 1;

FIG. 9 is a block diagram of the circuit connection of the processor, the conductive substrate, the light source module, the light sensor, the fingerprint sensing chip and the circuit board of the fingerprint detection device shown in FIG. 8 .

Detailed ways

In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in Figure 1, the manufacturing method of the fingerprint detection device of an embodiment includes the following steps:

Step S110: Electrically connect the fingerprint sensor chip to the circuit board.

Wherein, the circuit board is electrically connected with the processor.

Wherein, the circuit board may be a rigid circuit board, a flexible circuit board or a combination of rigid and soft boards. In this embodiment, the circuit board is a flexible circuit board (FPC).

Among them, the processor is used for signal processing, conversion and data processing. The fingerprint pattern of the human body and the pulse signal of the human body are pre-stored in the processor. The pulse signal here refers to the pulse frequency range of a normal living person.

Wherein, the fingerprint sensor chip is used to collect the fingerprint pattern of the finger of the person to be verified. Wherein, the fingerprint sensor chip is a capacitive fingerprint sensor chip. Among them, the capacitive fingerprint sensor chip is a fingerprint sensor chip integrated with multiple semiconductor devices on a "flat panel". The principle is: when the human finger sticks on the "plate" and forms the other side of the capacitor, due to the unevenness of the finger plane, the actual distance between the concave point and the convex point touching the "plate" is different, and the resulting capacitance value is also different. According to the difference between the "ridge" and "valley" of the fingerprint and the capacitance value formed by the semiconductor capacitive sensing particles, the position of the "ridge" and "valley" is judged, and the collection of the fingerprint pattern is realized. Its specific working process is to pre-charge the capacitive sensing particles on each pixel to a certain reference voltage. When the finger touches the capacitive fingerprint sensor chip, because the "ridge" is raised and the "valley" is Concave, according to the relationship between the capacitance value and the distance, different capacitance values will be formed at the "ridge" and "valley", and then discharge with the discharge current, because the capacitance values corresponding to the "ridge" and "valley" are different , so the discharge speed is also different, the pixels under the "ridge" (high capacitance) discharge slowly, while the pixels under the "valley" (low capacitance) discharge faster. When the finger is pressed on the surface of the capacitive fingerprint sensor chip, the capacitance formed by the "ridge" of the fingerprint is slightly larger than that of the "valley". The digital image signal of the fingerprint can be obtained by using the charging and discharging process of the capacitor array.

Please also refer to Figure 2. Specifically, the steps for electrically connecting the fingerprint sensor chip to the circuit board are as follows:

Step S112: providing a conductive substrate, mounting the fingerprint sensor chip on the conductive substrate, and electrically connecting the fingerprint sensor chip to the conductive substrate.

Specifically, in the step of installing the fingerprint sensor chip on the conductive substrate, the fingerprint sensor chip is pasted on the conductive substrate with adhesive. Wherein, the bonding glue is double-sided tape, for example, DAF (Die Attached Film) film.

Wherein, in the step of electrically connecting the fingerprint sensor chip to the conductive substrate, the fingerprint sensor chip is electrically connected to the conductive substrate by punching gold wires.

Step S114: installing the conductive substrate on the circuit board, and electrically connecting the conductive substrate to the circuit board.

Specifically, in the step of mounting the conductive substrate on the circuit board, the conductive substrate is mounted on the circuit board by using contact array packaging technology (LandGrid Array, LGA) or ball grid array packaging technology (Ball Grid Array, BGA). superior.

Specifically, the conductive substrate is stacked on the circuit board. And the fingerprint sensor chip is arranged on the side of the conductive substrate away from the circuit board.

Step S120: Electrically connect the light source module and the light sensor to the circuit board to obtain a fingerprint detection device.

Wherein, the light source module can emit a light signal, and the light sensor can receive the light signal reflected by the finger of the person to be verified, and can transmit the light signal reflected by the finger to the processor; the processor can convert the light signal reflected by the finger The processor can determine whether to activate the fingerprint sensor chip according to the pulse signal, and the processor can also determine the identity of the person to be verified according to the fingerprint pattern.

Specifically, the light source module includes a green light source. Because when red light or infrared light is irradiated on the blood, the blood can reflect most of the red light or infrared light, and when the green light is irradiated on the blood, the blood can absorb most of the green light, so that the green light can be absorbed by the blood Or the difference in light quantity of reflected red light is converted into a pulse signal. Therefore, the light source module further includes at least one of a red light source and an infrared light source. That is, the light source module may be a green light source module; or the light source module may be a mixed light source module composed of at least one of a red light source and an infrared light source and a green light source.

Please also refer to Figure 3. Specifically, the steps for electrically connecting the light source module and the light sensor to the circuit board are as follows:

Step S122: Provide an outer frame, the outer frame has a first storage cavity, a second storage cavity, and a third storage cavity arranged at intervals, and an operation hole communicated with the first storage cavity is opened on the outer frame to communicate with the outside world and the second storage cavity The light exit channel, and the light input channel that communicates with the outside world and the third storage cavity.

Wherein, the outer frame may be a square frame, a circular frame or an elliptical frame or the like.

Further, the material of the outer frame may be a material commonly used in the field. For example, the outer frame can be a ceramic outer frame or a metal outer frame.

In this embodiment, the outer frame has an operation surface, the operation hole extends from the side wall of the first storage cavity to the operation surface, the light exit channel extends from the side wall of the second storage cavity to the operation surface, and the light entrance channel extends from the side wall of the third storage cavity The side walls extend to the operating surface. That is, the operation hole, the light exit port of the light exit channel and the light entrance port of the light entry channel are located on the same side of the outer frame.

Step S124: Install the light source module and the light sensor in the second and third storage chambers respectively, and enable the light signal emitted by the light source module to exit the light exit channel, and the light signal reflected by the finger to enter the light entrance channel.

Wherein, in order to facilitate the light signal sent by the light source module to be received by the light sensor, the light exit channel extends along a straight line, and the light entrance channel extends along a straight line, and the distance between the light exit channel and the opening of the operation surface is less than that of the light exit channel The distance between the opening on the side wall of the second storage cavity and the opening of the light incident channel on the side wall of the third storage cavity. Specifically, the light-receiving surface of the light sensor is facing the light-incoming channel, so as to receive light signals.

It can be understood that, in other embodiments, the extending direction of the light exiting channel and the extending direction of the light entering channel may also be parallel. In this case, the distance between the light source module and the photosensor needs to be shortened. The storage cavity is set close to the third storage cavity.

Wherein, the light sensor is a photodiode (Photo-Diode, PD).

Wherein, there are multiple light sensors, corresponding to multiple light source modules, and each light sensor corresponds to a light source module. At this time, the second storage cavity, the third storage cavity, the light output channel and the light input channel correspond to a plurality respectively, one light source module corresponds to one second storage cavity and one light output channel, and one light sensor corresponds to one third storage cavity and a light incident channel, and a plurality of third storage cavities are arranged around the first storage cavity. It can be understood that there may be one light sensor, and in this case, there is also one light source module.

As shown in FIGS. 4 , 5 , 6 and 7 , in the illustrated embodiment, the outer frame 210 is a square frame. The outer frame 210 has a first receiving cavity 212 , a second receiving cavity 213 , a third receiving cavity 214 , an operation hole 215 , a light exit channel 216 , a light input channel 217 and an operation surface 218 . Wherein, the operation hole 215 communicates with the first storage cavity 212, and the operation hole 215 extends from the side wall of the first storage cavity 212 to the operation surface 218; The sidewall of the second storage cavity 213 extends to the operation surface 218 ; the light incident channel 217 communicates with the outside world and the third storage cavity 214 , and the light incident channel 217 extends from the side wall of the third storage cavity 214 to the operation surface 218 . Wherein, the light output channel 216 extends along a straight line, and the light input channel 217 extends along a straight line. And the distance between the opening of the light exit channel 216 and the light entry channel 217 located on the operating surface 218 is smaller than the opening of the light exit channel 216 located on the side wall of the second storage cavity 213 and the distance between the light input channel 217 located on the side wall of the third storage cavity 214 the distance between the openings. Wherein, the light source module 220 is accommodated in the second accommodation cavity 213 , and the light sensor 230 is accommodated in the third accommodation cavity 214 . The light source module 220 is electrically connected to the circuit board through the first wire 225 ; the light sensor 230 is electrically connected to the circuit board through the second wire 235 .

In the illustrated embodiment, there are two second storage cavities 213 and third storage cavities 214, the two second storage cavities 213 are arranged on both sides of the first storage cavity 212, the light exit channel 216 and the light input channel 217 There are also two, one light exit channel 216 corresponds to one second receiving cavity 213 , and one light input channel 217 corresponds to one third receiving cavity 214 . There are two light sensors 230 and light source modules 220, one light source module 220 corresponds to one light sensor 230, one light sensor 230 corresponds to one third storage cavity 214, and one light source module 220 corresponds to one second storage cavity 213. It can be understood that there may be one, three or more photosensors 230 and light source modules 220 .

Step S126: Install the outer frame on the circuit board, electrically connect the light source module and the light sensor to the circuit board respectively, and accommodate the fingerprint sensor chip and the conductive substrate in the first accommodation chamber, wherein the operation hole The position corresponds to the position of the fingerprint sensor chip.

In this embodiment, after the step of installing the outer frame on the circuit board and electrically connecting the light source module and the light sensor to the circuit board, it also includes filling the packaging material between the outer frame and the fingerprint sensor chip, and making the The packaging material cooperates with the conductive substrate to form a fourth accommodating cavity for accommodating the fingerprint sensor chip.

Wherein, the packaging material may be epoxy molding compound (Epoxy Molding Compound, EMC). Filling the encapsulation material between the frame body and the fingerprint sensing chip can play a role of vacuum sealing the fingerprint sensing chip to ensure that it is not corroded by the external environment.

It can be understood that the step of filling the encapsulation material between the outer frame and the fingerprint sensor chip can be omitted, and in other embodiments, no encapsulation material is filled between the outer frame and the fingerprint sensor chip. Alternatively, the outer frame can also be omitted. In this case, the light source module and the light sensor are directly installed on the circuit board.

In this embodiment, before the step of installing the outer frame on the circuit board, filling the outer frame with underfill glue (Underfill glue), and distributing the underfill glue on the side of the conductive substrate away from the fingerprint sensor chip.

It can be understood that, in other embodiments, the step of filling the underfill in the outer frame can also be omitted.

In this embodiment, it also includes installing components such as resistors and capacitors on the circuit board and installing connectors for signal transmission with other devices.

Fig. 8 is a fingerprint detection device prepared according to the above manufacturing method. Wherein, the outer frame 210 is installed on the circuit board 240, the conductive substrate 250 and the fingerprint sensor chip 260 are accommodated in the first accommodation chamber 212, and are stacked on the circuit board 240 in sequence, and the position of the fingerprint sensor chip 260 and the operation hole 215 corresponding to the position. The conductive substrate 250 is connected to the circuit board 240 through solder 255 , and an underfill glue 270 is filled between the conductive substrate 250 and the circuit board 240 . The fingerprint sensing chip 260 is bonded to the conductive substrate 250 through an adhesive 280 , and the fingerprint sensing chip 260 is electrically connected to the conductive substrate 250 through a gold wire 265 . The encapsulation material 290 cooperates with the conductive substrate 250 to form a fourth cavity 300 for accommodating the fingerprint sensor chip 260 . Components 310 such as capacitors and resistors and connectors 320 are also installed on the circuit board 240 .

9 is a circuit connection block diagram of a fingerprint detection device prepared according to the above manufacturing method, wherein the processor 330, the conductive substrate 250, the light source module 220 and the light sensor 230 are all electrically connected to the circuit board 240, and the fingerprint sensing chip 260 It is electrically connected with the conductive substrate 250 .

Wherein, the fingerprint sensing device prepared by the manufacturing method of the above-mentioned fingerprint detection device recognizes the work of the living fingerprint in detail as follows:

When the finger of the person to be verified is located at the operation hole 215, the light signal emitted by the light source module 220 is emitted from the light exit channel 216, and is reflected after encountering the finger. 230, the light sensor 230 transmits the light signal reflected by the finger to the processor 330, and the processor 330 converts the light signal reflected by the finger into an electrical signal and then converts it into a pulse signal, and judges whether the pulse signal is consistent with the human body Match the pulse signal of the finger, and then judge whether the finger is a living finger;

When the processor 330 judges that the pulse signal converted from the optical signal matches the pre-stored pulse signal of the human body, and the finger of the person to be verified is pressed on the fingerprint sensor chip 260 through the operation hole 215, the fingerprint sensor chip 260 collects the pulse signal of the finger. fingerprint pattern, and transmit the fingerprint pattern to the processor 330, the processor 330 matches the fingerprint pattern transmitted by the fingerprint sensor chip 260 with the pre-stored fingerprint pattern, and judges the fingerprint pattern transmitted by the fingerprint sensor chip 260 and the pre-stored human body Whether the fingerprint pattern matches;

When the processor 330 judges that the fingerprint pattern transmitted by the fingerprint sensing chip 260 matches the pre-stored human fingerprint pattern, the person to be verified passes the identity verification.

Wherein, the principle that the processor 330 converts the light signal reflected by the finger into an electrical signal and then converts it into a pulse signal is as follows:

When the light source module 220 is a green light source module, since the blood flow of the microtubes of the fingers increases when the heart of the human body is beating, the absorbed green light will also increase. will decrease, and the absorbed green light will also decrease accordingly. The processor 330 calculates the difference in the total amount of green light before and after being reflected by the finger, and converts it into a pulse signal.

When the light source module 220 is a mixed light source module composed of a green light source and a red light source, the green light source and the red light source emit light signals to the human finger at the same time. When the heart beats, the blood flowing through the capillaries in the finger will increase. The green light absorbed by the blood will increase, and the reflected red light will also increase; during the interval between heart beats, the blood flowing through the capillaries in the finger will decrease, the green light absorbed by the blood will decrease, and the reflected red light will also decrease. Since the green light source and the red light source are used to emit light signals at the same time, the total amount of emitted light is relatively large, and the total amount of light reflected to the surface of the photosensor 230 after being emitted to the surface of the human finger is still relatively large, and the error of the light amount difference before and after reflection Smaller, the processor 330 calculates the difference in the total amount of light before and after reflection, and converts it into a pulse signal.

When the light source module 220 is a mixed light source module composed of a green light source and an infrared light source, the green light source and the infrared light source emit light signals to the human finger at the same time. When the heart beats, the blood flowing through the capillaries in the finger will increase. The green light absorbed by the blood will increase, and the reflected infrared light will also increase; during the interval between heart beats, the blood flowing through the capillaries in the finger will decrease, the green light absorbed by the blood will decrease, and the reflected infrared light will also decrease. Since the green light source and the infrared light source are used to emit light signals at the same time, the total amount of emitted light is relatively large, and the total amount of light reflected to the surface of the photosensor 230 after being emitted to the surface of the human finger is still relatively large, and the error of the light amount difference before and after reflection Smaller, the processor 330 calculates the difference in the total amount of light before and after reflection, and converts it into a pulse signal.

When the light source module 220 is a mixed light source module composed of a green light source, a red light source and an infrared light source, the green light source, the red light source and the infrared light source emit light signals to the human finger at the same time, and when the heart beats, light signals flow through the finger The blood in the capillaries in the finger will increase, the green light absorbed by the blood will increase, and the reflected red light and infrared light will also increase; during the interval between heart beats, the blood flowing through the capillaries in the finger will decrease, and the green light absorbed by the blood will decrease , the reflected red and infrared light will also be reduced. Since the green light source, the red light source and the infrared light source are used to emit light signals at the same time, the total amount of emitted light is relatively large, and the total amount of light reflected to the surface of the photosensor 230 after being emitted to the surface of the human finger is still relatively large. The error of the light quantity difference is small, and the processor 330 calculates the total light quantity difference before and after reflection, and converts it into a pulse signal.

The manufacturing method of the above-mentioned fingerprint detection device is simple and easy for industrialized production, and when the manufacturing method of the above-mentioned fingerprint detection device is used to verify the identity of the person to be verified, the light signal emitted by the light source module is reflected by the finger of the person to be Received by the sensor, the light sensor can transmit the light signal to the processor, and the processor converts the light signal reflected by the finger into a pulse signal, and the processor converts the pulse signal from the light signal to determine the person to be verified Whether the finger of the person to be verified is a living finger or not, and determine whether to start the fingerprint sensor chip according to whether the finger of the person to be verified is a living finger. When the pulse signal converted from the optical signal is a living pulse signal, the processor starts the fingerprint sensor chip. The sensor chip collects the fingerprint pattern of the finger of the person to be verified, and transmits the collected fingerprint pattern to the processor. The device is more secure and reliable for identity verification.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (8)

1. a kind of manufacturing method of finger print detection device, which is characterized in that include the following steps：

By fingerprint sensor and circuit board electrical connection, wherein the circuit board is electrically connected with processor, the fingerprint sensing core Piece is used to acquire the fingerprint pattern of the finger of person to be verified；And

By light source module and OPTICAL SENSORS respectively with the circuit board electrical connection, finger print detection device is obtained, wherein the light source Module can send out optical signal, and the OPTICAL SENSORS can receive the optical signal of the finger reflection of the person to be verified, and can will be by institute The optical signal transmission of finger reflection is stated to the processor, the fingerprint pattern can be transferred to by the fingerprint sensor The optical signal reflected by the finger can be converted into pulse signal, the processor by the processor, the processor It can be determined whether to start the fingerprint sensor according to the pulse signal, the processor can also be according to the fingerprint pattern Determine the identity of the person to be verified；

Wherein, it is specially by the fingerprint sensor and the step of circuit board electrical connection：

Electrically-conductive backing plate is provided, the fingerprint sensor is installed on the electrically-conductive backing plate, and by the fingerprint sensor It is electrically connected with the electrically-conductive backing plate；

The electrically-conductive backing plate is installed on the circuit board, and makes the electrically-conductive backing plate and the circuit board electrical connection；

It is specially with the step of circuit board electrical connection respectively by the light source module and the OPTICAL SENSORS：

Outline border is provided, the outline border has spaced first host cavity, the second host cavity and third host cavity, the outline border On offer the handle hole communicated with first host cavity, extraneous and described second host cavity of connection goes out optical channel and even The logical external world enters optical channel with the third host cavity；

The light source module and the OPTICAL SENSORS are respectively arranged in second host cavity and the third host cavity, and Make optical signal that the light source module sends out can from it is described go out optical channel project, the optical signal reflected by the finger can enter institute It states into optical channel；

The outline border is installed on the circuit board, and by the light source module and the OPTICAL SENSORS respectively with the circuit Plate is electrically connected, and the fingerprint sensor and the electrically-conductive backing plate is made to be contained in first host cavity, wherein described The position of handle hole is corresponding with the position of the fingerprint sensor.

2. the manufacturing method of finger print detection device according to claim 1, which is characterized in that the outline border is installed to institute State on circuit board, and by the light source module and the OPTICAL SENSORS respectively with the step of the circuit board electrical connection after, also It is included between the outline border and the fingerprint sensor and fills encapsulating material, and makes the encapsulating material and the conductive base Plate cooperatively forms the 4th host cavity of the receiving fingerprint sensor jointly.

3. the manufacturing method of finger print detection device according to claim 2, which is characterized in that the encapsulating material is epoxy Plastic packaging material.

4. the manufacturing method of finger print detection device according to claim 1, which is characterized in that the outline border is installed to institute Further include underfill being filled in the outline border, and the underfill is made to be distributed before stating the step on circuit board In one side of the electrically-conductive backing plate far from the fingerprint sensor.

5. the manufacturing method of finger print detection device according to claim 1, which is characterized in that by the fingerprint sensing core Piece is installed in the step on the electrically-conductive backing plate, and the fingerprint sensor is pasted on the electrically-conductive backing plate using adhesive glue On.

6. the manufacturing method of finger print detection device according to claim 1, which is characterized in that install the electrically-conductive backing plate In the step on the circuit board, led described using land grid array technology or ball-like pins Background Grid array packages technology Electric substrate is installed on the circuit board.

7. the manufacturing method of finger print detection device according to claim 1, which is characterized in that by the fingerprint sensor In the step of being electrically connected with the electrically-conductive backing plate, the fingerprint sensor and the electrically-conductive backing plate are electrically connected by beating gold thread It connects.

8. the manufacturing method of finger print detection device according to claim 1, which is characterized in that the fingerprint sensor is Capacitance type fingerprint sensing chip.