CN105046239B - Fingerprint identification device and its terminal device - Google Patents
Fingerprint identification device and its terminal device Download PDFInfo
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- CN105046239B CN105046239B CN201510510941.4A CN201510510941A CN105046239B CN 105046239 B CN105046239 B CN 105046239B CN 201510510941 A CN201510510941 A CN 201510510941A CN 105046239 B CN105046239 B CN 105046239B
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/1382—Detecting the live character of the finger, i.e. distinguishing from a fake or cadaver finger
- G06V40/1394—Detecting the live character of the finger, i.e. distinguishing from a fake or cadaver finger using acquisition arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
Description
技术领域technical field
本发明涉及生物特征识别技术领域,尤其涉及一种具有活体检测功能的指纹识别装置及其终端设备。The invention relates to the technical field of biological feature identification, in particular to a fingerprint identification device with a living body detection function and a terminal device thereof.
背景技术Background technique
生物特征识别技术是利用人的生理特征或行为特征,来进行个人身份的鉴定。目前,已被用于生物识别的生理特征有手形、指纹、脸形、虹膜、视网膜、脉搏、耳廓等,其中尤以指纹为最可靠的生理特征,因此指纹识别技术的应用最为广泛。Biometric identification technology is the use of human physiological or behavioral characteristics to identify individuals. At present, the physiological characteristics that have been used for biometric identification include hand shape, fingerprint, face shape, iris, retina, pulse, auricle, etc. Among them, fingerprints are the most reliable physiological characteristics, so fingerprint recognition technology is the most widely used.
但通过提取残留指纹,再利用明胶、硅胶或橡胶等材料制成的指纹套,与被提取的指纹纹路一致,将指纹套戴在手指上或者假手指上,即可伪造被提取的指纹,骗过指纹识别装置。这对指纹识别应用的安全性带来了极大的隐患。However, by extracting residual fingerprints, and then using a fingerprint cover made of gelatin, silica gel or rubber, which is consistent with the pattern of the extracted fingerprint, and wearing the fingerprint cover on the finger or a fake finger, the extracted fingerprint can be forged and deceived. through the fingerprint recognition device. This poses a great hidden danger to the security of fingerprint identification applications.
发明内容Contents of the invention
有鉴于此,本发明提供一种具有活体检测功能的指纹识别装置的封装结构及包含其的终端设备。一方面该指纹识别装置及包含其的终端设备可通过活体检测功能判断待检测对象是否为活体;另一方面该指纹识别装置的封装结构封装尺寸较小,有利于应用在各种手持式终端设备中。In view of this, the present invention provides a packaging structure of a fingerprint recognition device with a living body detection function and a terminal device including the same. On the one hand, the fingerprint identification device and the terminal equipment containing it can judge whether the object to be detected is a living body through the living body detection function; middle.
本发明的额外方面和优点将部分地在下面的描述中阐述,并且部分地将从描述中变得显然,或者可以通过本发明的实践而习得。Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
本发明一方面提供了一种指纹识别装置,包括:电路板;基板,形成于所述电路板的上表面,并与所述电路板电连接;指纹识别传感器,形成于所述基板的远离所述电路板的上表面,与所述基板电连接;光源模块,形成于所述基板的远离所述电路板的上表面,与所述基板电连接,用于发射光信号;光源感测模块,形成于所述基板的远离所述电路板的上表面,与所述基板电连接,用于感测并接收所述光源模块发射的光信号被待检测对象反射后的反射光信号,并将所述反射光信号转换为电信号,以根据所述电信号,判断所述待检测对象是否为活体;控制模块,形成于所述基板的远离所述电路板的上表面,与所述基板电连接,用于控制所述光源模块发射所述光信号;盖环,具有顶开口,形成于所述电路板的上表面,与所述电路板构成一封装空间,所述封装空间将所述基板、所述指纹识别传感器、所述光源模块、所述光源感测模块及所述控制模块容置于其中;以及模塑层,填充于所述封装空间中。One aspect of the present invention provides a fingerprint recognition device, including: a circuit board; a substrate formed on the upper surface of the circuit board and electrically connected to the circuit board; a fingerprint recognition sensor formed on the substrate away from the The upper surface of the circuit board is electrically connected to the substrate; the light source module is formed on the upper surface of the substrate away from the circuit board, is electrically connected to the substrate, and is used to emit light signals; the light source sensing module, Formed on the upper surface of the substrate far away from the circuit board, electrically connected to the substrate, used to sense and receive the reflected light signal after the light signal emitted by the light source module is reflected by the object to be detected, and transmit the The reflected light signal is converted into an electrical signal, so as to determine whether the object to be detected is a living body according to the electrical signal; the control module is formed on the upper surface of the substrate far away from the circuit board, and is electrically connected to the substrate , used to control the light source module to emit the optical signal; the cover ring has a top opening, formed on the upper surface of the circuit board, and forms a package space with the circuit board, and the package space includes the substrate, The fingerprint recognition sensor, the light source module, the light source sensing module and the control module are accommodated therein; and a molding layer is filled in the packaging space.
于一实施例中,所述光源模块包括:红光LED、红外光LED及绿光 LED。In one embodiment, the light source module includes: red LEDs, infrared LEDs and green LEDs.
于另一实施例中,所述控制模块控制所述红光LED、所述红外光LED 及所述绿光LED的全部点亮、部分点亮或全部熄灭。In another embodiment, the control module controls all of the red LEDs, the infrared LEDs and the green LEDs to be turned on, partially turned on or completely turned off.
于再一实施例中,所述控制模块为MCU控制器。In yet another embodiment, the control module is an MCU controller.
于再一实施例中,所述盖环由金属或塑料材料制成。In yet another embodiment, the cover ring is made of metal or plastic material.
于再一实施例中,所述指纹识别传感器包括一焊盘;所述焊盘设置于所述指纹识别传感器的上表面,并通过金属线与所述基板电连接。In yet another embodiment, the fingerprint recognition sensor includes a welding pad; the welding pad is disposed on the upper surface of the fingerprint recognition sensor, and is electrically connected to the substrate through a metal wire.
于再一实施例中,所述金属线包括:金线、铝线、铜线、铝-镁-硅合金线及铝-铜合金线中的至少一种。In yet another embodiment, the metal wires include at least one of gold wires, aluminum wires, copper wires, aluminum-magnesium-silicon alloy wires, and aluminum-copper alloy wires.
于再一实施例中,所述基板与所述电路板通过焊锡层或金属焊球电连接。In yet another embodiment, the substrate is electrically connected to the circuit board through a solder layer or metal solder balls.
于再一实施例中,所述电路板的下表面上还形成有连接器,以通过所述连接器与外部电路连接。In yet another embodiment, a connector is formed on the lower surface of the circuit board for connecting with an external circuit through the connector.
本发明另一方面提供了一种终端设备,包括上述任一种指纹识别装置。Another aspect of the present invention provides a terminal device, including any one of the above-mentioned fingerprint identification devices.
本发明提供的指纹识别装置利用控制模块控制光源模块的发光方式来检测待检测对象的活体信息,进而判断其是否为活体,并在确认为活体后,再进行后续的指纹识别操作,消除了现有指纹识别技术中使用假体手指进行指纹识别的安全隐患;此外,其封装结构利用SIP封装技术将指纹识别传感器、控制模块、 光源模块及光源感测模块集成封装于基板上,缩小了指纹识别装置的尺寸,实现了微型化,可利于应用在尺寸较小的手持终端设备中。The fingerprint identification device provided by the present invention uses the control module to control the light emitting mode of the light source module to detect the living body information of the object to be detected, and then judge whether it is a living body, and after confirming that it is a living body, perform subsequent fingerprint recognition operations, eliminating the inconvenience There are potential safety hazards in fingerprint identification technology using prosthetic fingers for fingerprint identification; in addition, its packaging structure utilizes SIP packaging technology to integrate fingerprint identification sensors, control modules, light source modules and light source sensing modules on the substrate, reducing the size of fingerprint identification. The size of the device realizes miniaturization, which can be used in smaller handheld terminal equipment.
附图说明Description of drawings
通过参照附图详细描述其示例实施方式,本发明的上述和其它特征及优点将变得更加明显。The above and other features and advantages of the present invention will become more apparent by describing in detail example embodiments thereof with reference to the accompanying drawings.
图1为根据一示例实施例示出的指纹识别装置的平面图。Fig. 1 is a plan view of a fingerprint recognition device according to an example embodiment.
图2为根据一示例实施例示出的指纹识别装置的封装结构的剖面图。Fig. 2 is a cross-sectional view of a packaging structure of a fingerprint identification device according to an example embodiment.
具体实施方式Detailed ways
现在将参考附图更全面地描述示例实施方式。然而,示例实施方式能够以多种形式实施,且不应被理解为限于在此阐述的实施方式;相反,提供这些实施方式使得本发明将全面和完整,并将示例实施方式的构思全面地传达给本领域的技术人员。在图中相同的附图标记表示相同或类似的结构,因而将省略对它们的重复描述。Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals denote the same or similar structures in the drawings, and thus their repeated descriptions will be omitted.
所描述的特征、结构或特性可以以任何合适的方式结合在一个或更多实施方式中。在下面的描述中,提供许多具体细节从而给出对本发明的实施方式的充分理解。然而,本领域技术人员应意识到,没有所述特定细节中的一个或更多,或者采用其它的方法、组元、材料等,也可以实践本发明的技术方案。在其它情况下,不详细示出或描述公知结构、材料或者操作以避免模糊本发明。The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the invention. However, those skilled in the art will appreciate that the technical solutions of the present invention may be practiced without one or more of the specific details, or with other methods, components, materials, and the like. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring the invention.
为了方便说明,在文中所描述的对于图形中相对组件的上、下关系,本领域技术人员皆应能理解其指对象的相对位置,而非限制本发明。因此对于通过翻转而呈现相同的构件,皆应同属本发明所请求保护的范围。For the convenience of description, those skilled in the art should understand that the upper and lower relationships of relative components in the figures described herein refer to the relative positions of objects, rather than limiting the present invention. Therefore, the components that appear the same through turning over should all belong to the scope of protection claimed by the present invention.
图1为根据一示例实施例示出的指纹识别装置的平面图。如图1所示,本发明的指纹识别装置1包括:基板11、指纹识别传感器12、控制模块 13、光源模块14及光源感测模块15。Fig. 1 is a plan view of a fingerprint recognition device according to an example embodiment. As shown in FIG. 1 , the fingerprint identification device 1 of the present invention includes: a substrate 11 , a fingerprint identification sensor 12 , a control module 13 , a light source module 14 and a light source sensing module 15 .
其中,指纹识别传感器12用于识别待检测对象的指纹信息。指纹识别传感器12例如可以为现有的按压式、划擦式等电容式指纹识别传感器,本发明不以此为限。Wherein, the fingerprint identification sensor 12 is used to identify the fingerprint information of the object to be detected. The fingerprint identification sensor 12 can be, for example, an existing capacitive fingerprint identification sensor such as a pressing type, a scratching type, etc., and the present invention is not limited thereto.
光源模块14用于提供光源,发射光信号。在一些实施例中,光源模块14例如可以包括:红光LED芯片141、红外光LED芯片142及绿光 LED芯片143。但本发明不以此为限,光源模块14也可以为其他现有的发光元器件。The light source module 14 is used to provide a light source and emit light signals. In some embodiments, the light source module 14 may include, for example, a red LED chip 141 , an infrared LED chip 142 and a green LED chip 143 . However, the present invention is not limited thereto, and the light source module 14 may also be other existing light-emitting components.
光源感测模块15用于感测并接收光源模块14发射的光信号遇到待检测对象的手指等部位而被反射回来的光信号,并将该光信号转换成电信号,再根据相应的算法计算出待检测对象的用户活体信息,例如为用户的脉搏信号,进而判断出待检测对象是否为活体。The light source sensing module 15 is used to sense and receive the light signal emitted by the light source module 14 when it encounters the finger of the object to be detected and is reflected back, and converts the light signal into an electrical signal, and then according to the corresponding algorithm Calculate the user's vital information of the object to be detected, such as the pulse signal of the user, and then determine whether the object to be detected is alive.
控制模块13用于控制光源模块14。在一些实施例中,控制模块13 例如为MCU(Microcontroller Unit,微控制单元)控制芯片,除了MCU 控制芯片的一般功能外,控制模块13还具有控制光源模块14中的红光 LED芯片141、红外光LED芯片142及绿光LED芯片143的功能,例如只点亮一个LED芯片,或者点亮其中两个LED芯片,再或者点亮或熄灭全部LED芯片等。通过控制不同LED芯片的点亮方式,可以达到较高的信噪比(SNR)。The control module 13 is used to control the light source module 14 . In some embodiments, the control module 13 is, for example, an MCU (Microcontroller Unit, micro control unit) control chip. In addition to the general functions of the MCU control chip, the control module 13 also has the functions of controlling the red light LED chip 141, the infrared LED chip 141 and the infrared light in the light source module 14. The functions of the light LED chip 142 and the green LED chip 143 are, for example, turning on only one LED chip, or turning on two of the LED chips, or turning on or off all the LED chips. By controlling the lighting methods of different LED chips, a higher signal-to-noise ratio (SNR) can be achieved.
下面简单介绍本发明的指纹识别装置在进行指纹识别之前,如何判断待检测对象为活体。人体的血液具有反射红光并吸收绿光的特性,心脏跳动时,流经人体手腕的血液会增加,反射的红光、红外光会增加,吸收的绿光也会增加;心脏跳动间隔期,流经手腕的血液会减少,反射的红光、红外光会减少、吸收的绿光也会随之减少。因此,可通过检测反射的红光、红外光或被吸收后的绿光,来检测人体的脉搏,从而进行是否为活体的判断。The following briefly introduces how the fingerprint recognition device of the present invention judges that the object to be detected is a living body before performing fingerprint recognition. The blood of the human body has the characteristics of reflecting red light and absorbing green light. When the heart beats, the blood flowing through the wrist of the human body will increase, the reflected red light and infrared light will increase, and the absorbed green light will also increase; during the interval between heart beats, The blood flowing through the wrist will be reduced, the reflected red light and infrared light will be reduced, and the absorbed green light will be reduced accordingly. Therefore, the pulse of the human body can be detected by detecting the reflected red light, infrared light or absorbed green light, so as to judge whether it is a living body.
而当仅通过绿光作为发射光源时,发出的光总量比较小,经血液吸收后可能仅有少量的光反射至光源感测模块15,在加上传输过程中的光量损耗,光源感测模块15获得的反射信号较少。利用控制模块13同时控制点亮绿光LED芯片143和红光LED芯片141,或者同时控制点亮绿光LED 芯片143和红外光LED芯片142,再或者同时控制点亮三个LED芯片作为发射光源,可以增加发射的光总量,因此反射到光源感测模块15的光总量仍然较大,从而使判断结果具有较高的信噪比。And when only green light is used as the emission light source, the total amount of light emitted is relatively small, and only a small amount of light may be reflected to the light source sensing module 15 after being absorbed by the blood. Module 15 obtains fewer reflected signals. Use the control module 13 to simultaneously control the lighting of the green LED chip 143 and the red LED chip 141, or simultaneously control the lighting of the green LED chip 143 and the infrared LED chip 142, or simultaneously control the lighting of three LED chips as the emission light source , the total amount of emitted light can be increased, so the total amount of light reflected to the light source sensing module 15 is still relatively large, so that the judgment result has a higher signal-to-noise ratio.
此外,本发明提供的指纹识别装置,首先判断待检测对象是否为活体,而仅当待检测对象被判断为活体时,指纹识别传感器12被激活,从而继续进行后续的指纹识别操作。需要说明的是,上述各器件/芯片之间的摆放方式仅为一示例,而非限制本发明。在实际应用时,各器件/芯片的摆放可依需要任意放置。In addition, the fingerprint recognition device provided by the present invention first judges whether the object to be detected is a living body, and only when the object to be detected is judged to be a living body, the fingerprint recognition sensor 12 is activated to continue subsequent fingerprint recognition operations. It should be noted that the arrangement of the above devices/chips is only an example, rather than limiting the present invention. In practical application, the arrangement of each device/chip can be placed arbitrarily as required.
图2为根据一示例实施例示出的指纹识别装置的封装结构的剖面图。如图2所示,图1所示的指纹识别装置1通过SIP(System In a Package,系统级封装)封装方式封装为封装结构2。需要说明的是,由于遮挡的关系,图2中未示出光源感测模块15后的控制模块13及光源模块14。Fig. 2 is a cross-sectional view of a packaging structure of a fingerprint identification device according to an example embodiment. As shown in FIG. 2 , the fingerprint recognition device 1 shown in FIG. 1 is packaged into a package structure 2 through a SIP (System In a Package, System In Package) package. It should be noted that, due to shading, the control module 13 and the light source module 14 behind the light source sensing module 15 are not shown in FIG. 2 .
同时参考图1及图2,指纹识别装置1的封装结构2包括:基板11、指纹识别传感器12、控制模块13、光源模块14、光源感测模块15、盖环 26及模塑层27。Referring to FIG. 1 and FIG. 2 at the same time, the packaging structure 2 of the fingerprint recognition device 1 includes: a substrate 11 , a fingerprint recognition sensor 12 , a control module 13 , a light source module 14 , a light source sensing module 15 , a cover ring 26 and a molding layer 27 .
在基板11的上表面形成有基板上接口(例如基板上的电路图案),指纹识别传感器12、控制模块13、光源模块14及光源感测模块15分别设置于基板11的上表面,并通过例如热固胶(DAF胶)或PSA胶等粘合剂111粘贴于基板11上,实现各器件与基板11的机械连接。此外,指纹识别传感器12、控制模块13、光源模块14及光源感测模块15通过金属线112及各自的焊盘121、131、144及151,实现与基板11的上接口的电连接。焊盘121、131、144及151可设置于各器件的上表面。该金属线 112例如为金线、铝线、铜线、铝-镁-硅合金线及铝-铜合金线中的至少一种。On the upper surface of the substrate 11, an interface on the substrate (such as a circuit pattern on the substrate) is formed, and the fingerprint recognition sensor 12, the control module 13, the light source module 14 and the light source sensing module 15 are respectively arranged on the upper surface of the substrate 11, and are connected by, for example, Adhesives 111 such as thermosetting glue (DAF glue) or PSA glue are pasted on the substrate 11 to realize the mechanical connection between each device and the substrate 11 . In addition, the fingerprint recognition sensor 12 , the control module 13 , the light source module 14 and the light source sensing module 15 are electrically connected to the upper interface of the substrate 11 through the metal wires 112 and respective pads 121 , 131 , 144 and 151 . Pads 121, 131, 144, and 151 may be disposed on the upper surface of each device. The metal wire 112 is, for example, at least one of gold wire, aluminum wire, copper wire, aluminum-magnesium-silicon alloy wire, and aluminum-copper alloy wire.
在基板11的下表面,形成有基板下接口,通过焊锡层或者金属焊球 113等方式实现基板11与一电路板28(例如,柔性电路板等)的电连接。此外,并通过底部填充(UnderFill)技术对基板11与电路板28之间通过底部填充胶114进行填充。在一些实施例中,底部填充胶114是一种化学胶水,主要成分是环氧树脂,用以对例如BGA(Ball Grid Array,球栅阵列)封装模式的芯片进行底部填充。On the lower surface of the substrate 11, a substrate lower interface is formed, and the electrical connection between the substrate 11 and a circuit board 28 (such as a flexible circuit board, etc.) is realized through a solder layer or a metal solder ball 113 or the like. In addition, the space between the substrate 11 and the circuit board 28 is filled with an underfill glue 114 through an underfill technology. In some embodiments, the underfill glue 114 is a chemical glue whose main component is epoxy resin, and is used for underfilling chips in a BGA (Ball Grid Array, Ball Grid Array) packaging mode, for example.
盖环26设置在电路板28上,具有顶开口,并与电路板28限定出一封装空间。盖环26可以由金属或塑料形成,其例如可以为圆形、椭圆形、正方形或长方形等,本发明不以此为限。The cover ring 26 is disposed on the circuit board 28 , has a top opening, and defines a packaging space with the circuit board 28 . The cover ring 26 can be formed of metal or plastic, and it can be, for example, circular, oval, square or rectangular, and the present invention is not limited thereto.
基板11、指纹识别传感器12、控制模块13、光源模块14及光源感测模块15被设置于上述由盖环26和电路板28限定的封装空间中。The substrate 11 , the fingerprint recognition sensor 12 , the control module 13 , the light source module 14 and the light source sensing module 15 are arranged in the packaging space defined by the cover ring 26 and the circuit board 28 .
模塑层27形成于基板11之上,并填充于盖环26和电路板28限定出的封装空间中,将指纹识别传感器12、控制模块13、光源模块14及光源感测模块15包裹于其中。模塑层27采用的材料例如为环氧树脂模压胶 (Epoxy Modeling Compound,EMC)。The molding layer 27 is formed on the substrate 11, and fills the packaging space defined by the cover ring 26 and the circuit board 28, enclosing the fingerprint recognition sensor 12, the control module 13, the light source module 14 and the light source sensing module 15. . The material used for the molding layer 27 is, for example, epoxy molding compound (EMC).
在一些实施例中,在模塑层27之上,还形成有保护层(图中未示出),保护层显露于盖环26的顶开口。保护层例如为材质为玻璃、陶瓷、蓝宝石或石英的面板,兼有抗压、防刮及透光的特性。保护层使得指纹识别装置持久耐用。In some embodiments, a protective layer (not shown in the figure) is further formed on the molding layer 27 , and the protective layer is exposed at the top opening of the cover ring 26 . The protective layer is, for example, a panel made of glass, ceramics, sapphire or quartz, which has properties of pressure resistance, scratch resistance and light transmission. The protective layer makes the fingerprint recognition device durable.
此外,在电路板28与指纹识别装置1一侧的表面上还设置有其他一些元器件281,如电感元件、电容元件等。而电路板28的另一侧的表面上,则还设置有连接器282,通过连接器282实现与外部电路的电连接。In addition, some other components 281 are provided on the surface of the circuit board 28 and the fingerprint recognition device 1 , such as inductive elements, capacitive elements, and the like. On the surface of the other side of the circuit board 28, a connector 282 is further provided, through which the electrical connection with an external circuit is realized.
本发明提供的指纹识别装置利用控制模块控制光源模块的发光方式来检测待检测对象的活体信息,进而判断其是否为活体,并在确认为活体后,再进行后续的指纹识别操作,消除了现有指纹识别技术中使用假体进行指纹识别的安全隐患;此外,其封装结构利用SIP封装技术将指纹识别传感器、控制模块。光源模块及光源感测模块集成封装于基板上,缩小了指纹识别装置的尺寸,实现了微型化,可利于应用在尺寸较小的手持终端设备中。The fingerprint identification device provided by the present invention uses the control module to control the light emitting mode of the light source module to detect the living body information of the object to be detected, and then judges whether it is a living body, and after confirming that it is a living body, the subsequent fingerprint recognition operation is performed, eliminating the inconvenience There is a security risk of using a prosthesis in fingerprint recognition technology; in addition, its packaging structure utilizes SIP packaging technology to integrate fingerprint recognition sensors and control modules. The light source module and the light source sensing module are integrated and packaged on the substrate, which reduces the size of the fingerprint recognition device, realizes miniaturization, and can be used in smaller handheld terminal devices.
本发明还提供了一种包含上述指纹识别装置的终端设备。该终端设备例如为智能手机、平板电脑等,通常被配置为包括:显示屏、触摸屏、盖板玻璃、存储、片上系统(systemon chip)、CPU、GPU、内存、Wi-Fi连接、蓝牙连接、USB连接、电池、外接电源、计算机可读媒体及软件等,但本发明不以此为限。The present invention also provides a terminal device including the above-mentioned fingerprint identification device. The terminal device is, for example, a smart phone, a tablet computer, etc., and is generally configured to include: a display screen, a touch screen, a cover glass, storage, a system on chip (system on chip), a CPU, a GPU, a memory, a Wi-Fi connection, a Bluetooth connection, USB connection, battery, external power supply, computer readable media and software, etc., but the present invention is not limited thereto.
本发明提供的指纹识别装置被集成于该终端设备中,例如被集成在该终端设备的屏幕或者外壳中,并位于终端设备的屏幕或者外壳的顶表面上;还可以与终端设备的控制按钮或者开关元件组合使用,也可以直接嵌入到终端设备的盖板玻璃或壳体内单独使用。总之,能根据终端设备的情况,进行适应性的调整,以方便用户的使用。当指纹识别装置与终端设备的控制按钮或者开关元件组合使用时,在指纹识别装置的下方还需要设置有压敏元件,以感应用户在操作该控制按钮或者开关元件时的按压操作。The fingerprint identification device provided by the present invention is integrated in the terminal device, for example, integrated in the screen or casing of the terminal device, and located on the top surface of the screen or casing of the terminal device; The switching elements are used in combination, and can also be directly embedded in the cover glass or housing of the terminal equipment and used alone. In short, adaptive adjustments can be made according to the conditions of the terminal equipment, so as to facilitate the use of the user. When the fingerprint identification device is used in combination with the control button or switch element of the terminal device, a pressure sensitive element needs to be provided under the fingerprint identification device to sense the user's pressing operation when operating the control button or switch element.
以上具体地示出和描述了本发明的示例性实施方式。应该理解,本发明不限于所公开的实施方式,相反,本发明意图涵盖包含在所附权利要求范围内的各种修改和等效置换。Exemplary embodiments of the present invention have been specifically shown and described above. It should be understood that the invention is not limited to the disclosed embodiments, but on the contrary, the invention is intended to cover various modifications and equivalents included within the scope of the appended claims.
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CN106709413B (en) | 2015-12-31 | 2020-12-08 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and mobile terminal |
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WO2017188715A2 (en) * | 2016-04-28 | 2017-11-02 | 크루셜텍 (주) | Light-emitting fingerprint recognition panel capable of applying under glass and fingerprint recognition display apparatus comprising same |
CN106571377A (en) * | 2016-09-20 | 2017-04-19 | 苏州科阳光电科技有限公司 | Image sensor module and manufacturing method thereof |
CN106252346A (en) * | 2016-09-20 | 2016-12-21 | 苏州科阳光电科技有限公司 | Fingerprint sensor module and preparation method thereof |
CN106682583B (en) * | 2016-11-30 | 2020-02-14 | 维沃移动通信有限公司 | Fingerprint module and mobile terminal |
CN107273830B (en) * | 2017-06-05 | 2021-01-26 | 深圳天珑无线科技有限公司 | Fingerprint module testing method and system |
CN109460694B (en) * | 2017-09-06 | 2024-11-05 | 蓝思科技(长沙)有限公司 | Fingerprint sensor, intelligent terminal and fingerprint sensor packaging method |
US11030434B2 (en) | 2018-10-08 | 2021-06-08 | Shenzhen GOODIX Technology Co., Ltd. | Lens-pinhole array designs in ultra thin under screen optical sensors for on-screen fingerprint sensing |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203858644U (en) * | 2014-03-26 | 2014-10-01 | 映智科技股份有限公司 | Fingerprint sensing device with anti-counterfeiting function |
CN203982403U (en) * | 2014-07-03 | 2014-12-03 | 力传扬股份有限公司 | Sensor for detecting living body fingerprint |
CN104239869A (en) * | 2014-09-25 | 2014-12-24 | 武汉华和机电技术有限公司 | Intelligent fingerprint identification device and device |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203858644U (en) * | 2014-03-26 | 2014-10-01 | 映智科技股份有限公司 | Fingerprint sensing device with anti-counterfeiting function |
CN203982403U (en) * | 2014-07-03 | 2014-12-03 | 力传扬股份有限公司 | Sensor for detecting living body fingerprint |
CN104239869A (en) * | 2014-09-25 | 2014-12-24 | 武汉华和机电技术有限公司 | Intelligent fingerprint identification device and device |
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