CN105004476B - A kind of pressure sensor systems - Google Patents

Abstract

The invention provides a pressure sensor system. The pressure sensor system includes: a first support plate; a pressure sensor module fixed on the first support plate; and a temperature control heating module fixed on the first support plate for detecting the working temperature of the pressure sensing module and It is heated to maintain a constant working temperature. The invention maintains the pressure sensing module at a constant working temperature by increasing the hardware cost, thereby greatly simplifying the calibration and temperature compensation methods of the pressure sensor.

Description

A pressure sensor system

technical field

The invention relates to the technical field of sensors, in particular to a pressure sensor system.

Background technique

Pressure sensors have been widely used in consumer electronics, industrial control, weather monitoring and other fields, and their preparation technology is very mature. However, the current pressure sensors have complex algorithms, time-consuming and labor-intensive problems in terms of calibration and temperature.

Taking the commonly used ST piezoresistive pressure sensor LPS25HB in the field of consumer electronics as an example, its calibration and temperature compensation process needs to be calibrated at three temperature points and two pressure points, which is quite simplified, but still relatively complicated. The calibration and temperature compensation of pressure sensors in industrial control and meteorological fields are more complicated. In order to obtain better air pressure measurement accuracy in a wide temperature range, the piezoresistive air pressure sensor needs to test pressure points such as 1100hPa, 1013hPa, 950hPa, 900hPa, 850hPa at each temperature interval of 10 degrees or less, in order to Obtain a nice 2D fit curve.

Contents of the invention

(1) Technical problems to be solved

In view of the above technical problems, the present invention provides a pressure sensor system to simplify the calibration and temperature compensation methods of the pressure sensor through hardware.

(2) Technical solution

The pressure sensor system of the present invention includes: a first support plate 7; a pressure sensor module 2 fixed on the first support plate 7; and a temperature control heating module 3 fixed on the first support plate 7 for detecting pressure transmission. Sensing the operating temperature of the module 2 and heating it to maintain a constant operating temperature.

(3) Beneficial effects

It can be seen from the above technical solutions that the pressure sensor system of the present invention maintains the pressure sensing module at a constant working temperature by increasing the hardware cost, thereby greatly simplifying the calibration and temperature compensation methods of the pressure sensor.

Description of drawings

FIG. 1 is a schematic structural diagram of a piezoresistive pressure sensor system according to an embodiment of the present invention.

【Main components】

1- Insulation shell;

101 - heat-resistant material;

2- Pressure sensor module;

201-pressure outer packaging shell; 202-pressure sensitive element;

3-Temperature control heating module;

301-heating resistance; 302-temperature control circuit; 303-organic glue;

4-micro-control detection module; 5-power supply module;

6-circuit connection column; 7-first printed circuit board;

8 - Second printed circuit board.

Detailed ways

The pressure sensor system of the present invention makes the pressure sensor work at a constant temperature by increasing the complexity of the system, that is, adding a heating module at an appropriate position in the pressure sensor system, and placing the pressure sensitive part of the core component of the pressure sensor in the heat shield box. temperature, the goal of completing the calibration process of the pressure sensor can be achieved by only calibrating two pressure points.

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

In one exemplary embodiment of the invention, a piezoresistive pressure sensor system is provided. FIG. 1 is a schematic structural diagram of a piezoresistive pressure sensor system according to an embodiment of the present invention. As shown in Figure 1, the piezoresistive pressure sensor system of this embodiment includes: a heat-insulating housing 1, which forms a heat-insulating cavity; a printed circuit board group, including a first printed circuit board 7 and a second printed circuit board 8, The two are connected through the circuit connection column 6, wherein the second printed circuit board 8 is fixed on the lower surface of the heat insulation cavity; the pressure sensor module 2 is fixed on the upper surface of the first printed circuit board 7; the temperature control heating module 3, It is fixed on the lower surface of the first printed circuit board 7 ; the micro-control detection module 4 is fixed on the second printed circuit board 8 ; the power supply module 5 is fixed on the second printed circuit board 8 .

Each component of the piezoresistive pressure sensor system of this embodiment will be described in detail below.

The heat-insulating shell 1 is filled with a heat-resistant material 101 , such as a foam material, so as to provide a stable heat-insulating environment for other components, so that the pressure-sensitive part of the core component of the pressure sensor is placed in the heat-insulating environment.

The pressure sensor module 2 includes: a pressure outer package casing 201 and a pressure sensitive element 202 . Wherein, the pressure sensitive element 202 is located in the space defined by the pressure outer packaging casing 201 . In this embodiment, the pressure sensitive element 202 is a piezoresistive pressure sensor, but the present invention is not limited thereto, and the pressure sensitive element can also be a capacitive pressure sensor or other pressure sensors.

The first printed circuit board 7 and the second printed circuit board 8 are common printed circuit boards, and the two are connected through the circuit connection post 6 . Both the printed circuit board and the circuit connection post are common components in the field, and will not be described in detail here.

The temperature control heating module 3 includes: a heating resistor 301 , a temperature control circuit 302 and an organic glue 303 . The heating resistor 301 is a general-purpose high-power low-resistance resistor, which is attached to the lower surface of the first printed circuit board 7 . The temperature control circuit 302 is a general-purpose circuit or an application-specific integrated circuit chip capable of measuring temperature and outputting a control signal, and the organic glue 303 can be medium-hard glue such as silicone rubber. In the temperature control circuit, chips and circuit components are fixed on the first printed circuit board 7, and the circuit connection part is formed on the second printed circuit board. Likewise, the heating resistor 301 is also fixed on the first printed circuit board 7 . The organic glue 303 encapsulates the heating resistor 301 and the temperature control circuit 302 to isolate them from other components.

In this embodiment, the pressure sensor module 2 , the temperature control heating module 3 and the first printed circuit board layer 7 are placed in a stacked manner. However, it should be noted that, in addition to the stacking sequence of this embodiment, the stacking sequence of the three can also be pressure sensor module 2 - temperature control heating module 3 - first printed circuit board layer 7 .

The micro-control detection module 4 and the power supply module 5 are welded on the second printed circuit board 8 . The micro-control detection module 4 is a general-purpose micro-operation unit. The power module 5 is a general power generation circuit or a dedicated chip. The power supply module 5 supplies power to the micro-control detection module 4 and the temperature control heating module 3 .

In the actual application of the piezoresistive pressure sensor system of this embodiment, the power supply module supplies power to the micro-control detection module and the temperature control heating module at the same time. The temperature control heating module controls the heating amount of the heating module while detecting the actual working temperature of the pressure sensor, so that the pressure The sensor is maintained at a constant working temperature. The micro-control detection module realizes the signal detection and demodulation of the pressure sensor and provides temperature control parameters to the temperature control heating module through the PID algorithm, which simplifies the process of calibration and compensation of the pressure sensor, and finally realizes only two calibrations. The goal of the pressure sensor calibration process can be completed by only one pressure point.

So far, the embodiments of the present invention have been described in detail with reference to the accompanying drawings. Based on the above description, those skilled in the art should have a clear understanding of the piezoresistive pressure sensor system of the present invention.

It should be noted that, in the accompanying drawings or in the text of the specification, implementations that are not shown or described are forms known to those of ordinary skill in the art, and are not described in detail. In addition, the above definitions of each element and method are not limited to the various specific structures, shapes or methods mentioned in the embodiments, and those skilled in the art can easily modify or replace them.

To sum up, the present invention can greatly simplify the calibration and temperature compensation methods of the pressure sensor by increasing some hardware costs, and is applicable to the fields requiring a barometric pressure sensor with better measurement accuracy in a wider temperature range, such as industrial Control, meteorological monitoring and other fields, has a good prospect of popularization and application.

The specific embodiments described above have further described the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above descriptions are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (9)

1. A kind of 1. pressure sensor systems, it is characterised in that including：

   First supporting plate (7)；

   Pressure sensor module (2), it is fixed on first supporting plate (7)；And

   Temperature control heating module (3), it is fixed in the first supporting plate (7), for detecting the operating temperature of pressure sensor module (2) And it is heated, it is maintained a constant operating temperature；

   Thermally insulating housing (1), form a heat-insulated cavity；

   First supporting plate (7), pressure sensor module (2) and temperature control heating module (3) are both secured in the heat-insulation chamber body.
2. 2. pressure sensor systems according to claim 1, it is characterised in that：

   The pressure sensor module (2) and temperature control heating module (3) are both secured to the upper surface of the first supporting plate (7)；Or

   The pressure sensor module (2) and temperature control heating module (3) are individually fixed in the upper surface of first supporting plate (7) And lower surface.
3. 3. pressure sensor systems according to claim 1, it is characterised in that the temperature control heating module (3) includes：Add Thermal resistance (301), temperature-adjusting circuit (302) and organic gel (303)；

   Wherein, the adding thermal resistance (301) fits in the lower surface of the first supporting plate (7)；The temperature-adjusting circuit (302) is to survey The circuit or dedicated IC chip of temperature and output control signal；The organic gel (303) by the adding thermal resistance (301) and Temperature-adjusting circuit (302) is encapsulated in the lower surface of first supporting plate (7).
4. 4. pressure sensor systems according to claim 1, it is characterised in that filled with resistance in the thermally insulating housing (1) Hot material (101).
5. 5. pressure sensor systems according to claim 1, it is characterised in that also include：

   Second supporting plate (8), the lower section of the first supporting plate (7) is fixed on by circuit connecting pole (6)；

   Micro-control module (4), it is fixed on second supporting plate (8), it gives the temperature control heating module by pid algorithm (3) temperature control parameter is provided.
6. 6. pressure sensor systems according to claim 5, it is characterised in that：

   First supporting plate (7) and second supporting plate (8) are printed circuit board (PCB)；

   The micro-control module (4), it is additionally operable to realize detection and the solution of the pressure sensor signal of pressure sensor module (2) output Adjust.
7. 7. pressure sensor systems according to claim 5, it is characterised in that also include：

   Power module, it is fixed on second supporting plate (8), for for the temperature control heating module (3) and micro-control module (4) power.
8. 8. pressure sensor systems according to any one of claim 1 to 7, it is characterised in that the pressure sensor Module (2) includes：Pressure outer package housing (201) and pressure-sensing device (202)；

   Wherein, the pressure-sensing device (202) is located in the space that the pressure outer package housing (201) is limited.
9. 9. pressure sensor systems according to claim 8, it is characterised in that the pressure-sensing device (202) is pressure Resistance pressure transducer or capacitance pressure transducer,.