CN104976810B - Four-air outlet refrigeration device and its refrigeration module - Google Patents

Abstract

A four-air vent refrigeration device and a refrigeration module thereof, the refrigeration module comprising: a semiconductor refrigeration plate; a heat transfer device, consisting of a substrate and a plurality of fins formed on the substrate that are opposite and spaced apart by a certain gap, the fin surface is wavy, the substrate is in contact with the cold end of the semiconductor refrigeration plate; and a radiator, consisting of an L-shaped heat pipe and a heat absorbing plate and a heat sink group correspondingly sleeved on the two arms of the L-shaped heat pipe, the whole being in an L-shaped folded plate shape, the heat absorbing plate is in contact with the hot end of the semiconductor refrigeration plate, and the heat pipe is filled with superconducting liquid. The four-air vent refrigeration device comprises a shell, an arc plate and the above-mentioned refrigeration module, the shell having a main shell portion, a first and a second air duct, the arc plate is placed in the main shell portion and forms an inverted U-shaped circulation air duct with the first and the second air duct, the semiconductor refrigeration plate is placed in the assembly hole, the heat transfer device is placed in the inverted U-shaped circulation air duct, and the radiator is placed on the upper side of the arc plate. The refrigeration device has high refrigeration efficiency.

Description

Four-air outlet refrigeration device and its refrigeration module

technical field

The invention relates to the technical field of refrigeration equipment, in particular to a four-outlet refrigeration device and a refrigeration module thereof that provide cold sources for cold and/or heat storage equipment (such as refrigerators, freezers, and integrated cooling and heating cabinets, etc.).

Background technique

Traditional refrigeration equipment needs to use refrigerant, which is not environmentally friendly, noisy, and high in energy consumption.

With the development of science and technology, people use semiconductor refrigeration chips or the combination of semiconductor refrigeration chips and traditional compressors to provide cold sources for refrigeration equipment. Refrigeration of above-liter containers.

Contents of the invention

The object of the present invention is to provide a refrigeration module with high refrigeration efficiency.

Another object of the present invention is to provide a four-outlet refrigeration device with high refrigeration efficiency to meet the refrigeration and heating requirements of large and medium-sized cold and/or heat storage equipment.

A refrigeration module provided by the present invention includes:

semiconductor cooling chip;

The heat spreader is composed of a substrate and a plurality of fins formed on the substrate facing each other and separated by a certain gap, the surface of the fins is wavy, and the substrate is bonded to the cold end of the semiconductor refrigeration sheet; and

The radiator is composed of L-shaped heat pipes and heat-absorbing plates and heat-radiating fin groups correspondingly sleeved on the two arms of the L-shaped heat pipes. The whole is in the shape of an L-shaped folded plate. The ends are attached together, and the heat pipe is filled with a superconducting liquid.

In the above refrigeration module, preferably, the material of the heat spreader is 6063 aluminum or 1060 aluminum, the thickness of the heat spreader substrate is 2mm-5mm, and the thickness of the heat spreader fins is 0.4mm-0.6mm , The height is 40mm~65mm, and the gap between adjacent fins is 1.2mm~2mm.

In the above refrigeration module, preferably, the wavy protrusions on the surface of the fins of the heat spreader are perpendicular to the semiconductor refrigeration fins.

In the above refrigeration module, preferably, the heat absorbing plate of the radiator is made of 6063 aluminum or 1060 aluminum; the diameter of the heat pipe is 8 mm to 10 mm, and the distance between the edges of adjacent heat pipes is 1 mm to 3 mm , the sum of the thicknesses of the bottom of the heat pipe and the bottom of the heat-absorbing plate is 1 mm to 2.5 mm; by weight, the superconducting liquid consists of 1 to 1.5 parts of sodium hydroxide, 4 to 5 parts of potassium chromate, 1570 to 1580 parts of ethanol and 8030~8040 parts of pure water.

A four-tuyere refrigeration device provided by the present invention includes:

The casing has a main casing part, and a first air passage and a second air passage protruding downward from the bottom of the main casing part, the first air passage and the second air passage are separated by a certain distance, and a first The tuyere and the second tuyere, the top and the rear side of the main shell part are provided with the third tuyere and the fourth tuyere correspondingly, and the second, third and fourth tuyere are all equipped with axial flow fans;

An arc-shaped plate is arranged in the main shell part, and forms an inverted U-shaped circulating air duct with the first air duct and the second air duct, and the arc-shaped plate is provided with an assembly hole; and

For any one of the above-mentioned refrigeration modules, the semiconductor refrigeration sheet of the refrigeration module is placed in the assembly hole, the heat spreader is placed in the inverted U-shaped circulating air duct, the radiator is placed on the upper side of the arc-shaped plate in the housing, and its The two large surfaces of the heat sink group correspond to the third air outlet and the fourth air outlet.

In the above-mentioned refrigeration device with four air outlets, preferably, the first air outlet and the second air outlet deviate in directions away from each other, and the centerlines of the two air outlets are in a figure-eight shape.

In the above-mentioned refrigeration device with four air outlets, preferably, a heat insulation layer is provided on the arc-shaped plate.

In the above-mentioned four-outlet refrigeration device, preferably, the heat exchanger divides the inverted U-shaped circulating air duct into two sections, and the gap between the fins of the heat exchanger constitutes the connecting air between the two sections. The connecting air duct is wavy and is the key air duct for releasing low temperature to absorb high temperature or releasing high temperature to absorb low temperature. The connecting air duct is designed in a wavy shape, which can disrupt the flow and slow down the gas flow rate, so as to achieve better exchange of hot and cold gases.

This four-outlet refrigeration device has high refrigeration efficiency and can meet the refrigeration needs of large and medium-sized (volume more than 70 liters) refrigeration equipment and integrated cooling and heating cabinets.

Description of drawings

Fig. 1 is a structural schematic diagram of a refrigeration module of an embodiment;

Fig. 2 is a structural schematic diagram of a four-tuyere refrigeration device of an embodiment;

Fig. 3 is a front view of the four-air outlet refrigeration device shown in Fig. 2;

FIG. 4 is a cross-sectional view along line A-A of FIG. 3 .

detailed description

The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

As shown in FIG. 1 , the cooling module includes a semiconductor cooling chip 1 , a heat spreader 2 and a radiator 3 . The heat spreader 2 is composed of a base plate 21 and a plurality of fins 22 formed on the base plate 21 facing each other and separated by a certain gap. The radiator 3 is composed of an L-shaped heat pipe 31, a heat-absorbing plate 32 sleeved on the lower arm of the L-shaped heat pipe 31, and a heat sink group 33 sleeved on the upper arm of the L-shaped heat pipe 31. The radiator 3 is in the shape of an L-shaped folded plate as a whole. The heat-absorbing plate 32 is bonded to the hot end of the semiconductor refrigeration chip 1, and the heat pipe 31 is filled with superconducting liquid.

It can be seen from Fig. 1 that in this refrigeration module, the radiator 3 formed by the L-shaped heat pipe 31, the heat absorbing plate 32 and the heat sink group 33 is in the shape of an L-shaped folded plate as a whole, so that when the heat absorbing plate 32 and the heat spreader 2 Correspondingly attached to the hot end and cold end of the peltier refrigerating sheet 1, the two large surfaces of the heat sink group 33 will not face the heat absorbing plate 32, and can respectively face the two adjacent end faces of the housing 4 (refer to Fig. 4. The two large surfaces of the cooling fin group 33 face the top surface and the left side of the casing 4 respectively), so as to dissipate heat energy from two directions of the casing 4 and improve heat dissipation efficiency.

The thermal conductivity of copper is about 400W/m.k, and the thermal conductivity of aluminum 6063 or 1060 is about 200W/m.k. In order to improve heat dissipation efficiency, people often think of using materials with high thermal conductivity, such as copper, to make heat absorbing plates and heat transfer devices, but compared with aluminum, copper is more expensive and difficult to process. Through research, the inventor proposes that through structural optimization, the effect of the heat transfer device 2 and the heat absorption plate 32 made of low-cost, easy-to-process 6063 or 1060 aluminum is better than that of the copper heat transfer device and the copper heat absorption plate. Specifically, the structure of some preferred 6063 aluminum or 1060 aluminum heat spreaders 2 is designed as follows: the thickness of the heat spreader substrate 21 is 2 mm to 5 mm, and the thickness of the heat spreader fins 22 is 0.4 mm to 5 mm. 0.6mm, the height is 40mm-65mm, and the gap between adjacent fins 22 is 1.2mm-2mm. When the heat-absorbing plate 32 is made of 6063 aluminum or 1060 aluminum, the heat pipe 31 must be filled with a superconducting heat pipe filled with a superconducting mixed liquid composed of a variety of different superconducting liquid materials. The following superconducting liquid: by weight, the superconducting liquid consists of 1-1.5 parts of sodium hydroxide, 4-5 parts of potassium chromate, 1570-1580 parts of ethanol and 8030-8040 parts of water. In addition, the diameter of the heat pipe 31 needs to be 8 mm to 10 mm, the distance between the edges of adjacent heat pipes 31 needs to be 1 mm to 3 mm, and the sum of the thicknesses of the bottom of the heat pipe 31 and the bottom of the heat absorbing plate 32 needs to be 1 mm to 2.5 mm. The performance of the heat absorbing plate 32 exceeds that of the copper heat absorbing plate. Heat-absorbing plate 32 size is as big as semiconductor refrigeration sheet 1 or gets final product a little bigger.

Preferably, the wavy protrusions 23 formed on the surface of the fins 22 (see Figure 4) are perpendicular to the peltier refrigerating sheet 1, so that a curved and narrow air duct can be formed between adjacent fins 22, which can further improve the suction capacity. Thermal efficiency.

Referring to Figures 2-4, the four-outlet refrigeration device includes a housing 4, an arc-shaped plate 5, and the above-mentioned refrigeration module.

The casing 4 has a main shell portion 41, and a first air duct 42 and a second air duct 43 protruding downward from the bottom of the main housing portion 41. The first air duct 42 and the second air duct 43 are separated by a certain distance and their lower ends correspond to A first tuyere 44 and a second tuyere 45 are provided, a third tuyere 46 and a fourth tuyere 47 are arranged on the top and rear side of the main shell 41 correspondingly, the second tuyere 45 is provided with an axial flow fan 45 ′, and the third tuyere 46 is provided with an axial flow fan 45 ′. The flow fan 46', the fourth air outlet 47 is provided with an axial flow fan 47'.

The arc-shaped plate 5 is arranged in the main shell portion 41 and forms an inverted U-shaped circulating air duct 51 with the first air duct 42 and the second air duct 43 . The arc-shaped plate 5 is provided with an assembly hole 52 .

The semiconductor cooling chip 1 of the refrigeration module is placed in the assembly hole 52, the heat spreader 2 is placed in the inverted U-shaped circulating air duct 51, the radiator 3 is placed on the upper side of the arc-shaped plate 5 in the housing 4, and the radiator 3 One large surface of the fin set 33 faces the third air outlet 46 , and the other large surface faces the fourth air outlet 47 .

Its working process is as follows: air enters the inverted U-shaped circulating air duct 51 from the first air outlet 44 , passes through the gap between the fins 22 of the heat spreader 2 (curved narrow air duct), and then flows out from the second air outlet 45 . During this process, the cold end of the semiconductor refrigerating sheet 1 generates a cooling effect, so that when the air flows through the gap between the fins 22, the heat energy in the air is absorbed, and at the same time, the heat energy at the hot end of the semiconductor refrigerating sheet 1 passes through the heat absorbing plate 32 in turn. , the heat pipe 31 and the heat sink group 33 , and emit from the third air outlet 46 on the top of the housing 4 and the fourth air outlet 47 on the side of the housing.

Referring to FIG. 4 , the first tuyere 44 deviates to the left and the second tuyere 45 deviates to the right, that is, the first tuyere 44 and the second tuyere 45 deviate in opposite directions respectively, and the centerlines of the two are in a figure-eight shape. This can make the air circulate better and pass through the inverted U-shaped circulating air duct 51 .

It is also possible to further arrange a heat insulating layer 6 on the curved plate 5 .

The heat spreader 2 divides the inverted U-shaped circulating air duct 51 into two sections, and the gap between the fins 22 of the heat spreader constitutes a connecting air duct between the two sections. This can ensure that all the air passes through the gaps between the fins 22 of the heat spreader to achieve a better heat transfer effect.

Claims (7)

1. A four-air outlet refrigeration device, characterized in that it comprises: A casing (4), the casing has a main casing (41), and a first air passage (42) and a second air passage (43) protruding downward from the bottom of the main casing, the first air passage and the second air passage The air ducts are separated by a certain distance, and the lower ends of the air ducts are correspondingly provided with a first air port (44) and a second air port (45), and the top and rear side of the main shell are respectively provided with a third air port (46) and a fourth air port (47). 2. Axial flow fans (45', 46', 47') are installed at the third and fourth air outlets; An arc-shaped plate (5), arranged in the main shell (41), forms an inverted U-shaped circulating air duct (51) with the first air duct and the second air duct, and the arc-shaped plate is provided with a mounting holes (52); and A refrigeration module, the refrigeration module includes a semiconductor refrigeration sheet (1), a heat spreader (2) and a radiator (3); the heat spreader (2) is composed of a base plate (21) and a plurality of opposite and spaced Composed of fins (22) with a certain gap, the surface of the fins is wavy, the substrate is bonded to the cold end of the semiconductor refrigeration sheet; the radiator (3) consists of an L-shaped heat pipe (31) and a corresponding sleeve The heat-absorbing plate (32) on the two arms of the L-shaped heat pipe and the cooling fin group (33) are composed of an L-shaped folded plate as a whole, and the heat-absorbing plate is bonded to the hot end of the semiconductor refrigeration sheet, so The heat pipe is equipped with superconducting liquid; the semiconductor cooling chip (1) of the refrigeration module is placed in the assembly hole (52), and the heat spreader (2) is placed in the inverted U-shaped circulating air duct (51) to dissipate heat. The device (3) is placed on the upper side of the arc-shaped plate (5) in the housing, and the two large surfaces of its heat sink group (33) are correspondingly facing the third air port (46) and the fourth air port (47). 2. The four-tuyere refrigeration device according to claim 1, characterized in that: the material of the heat spreader (2) is 6063 aluminum or 1060 aluminum, and the thickness of the heat spreader substrate (21) is 2 mm to 5 mm , the heat spreader fins (22) have a thickness of 0.4 mm to 0.6 mm, a height of 40 mm to 65 mm, and a gap between adjacent fins (22) of 1.2 mm to 2 mm. 3. The refrigeration device with four tuyeres according to claim 1, characterized in that the wavy protrusions (23) formed on the surface of the heat spreader fins (22) are perpendicular to the semiconductor cooling fins (1). 4. The refrigeration device with four tuyeres according to claim 1, characterized in that: the heat absorbing plate (32) of the radiator (3) is made of 6063 aluminum or 1060 aluminum; the heat pipe (31) The diameter is 8mm-10mm, the distance between the edges of adjacent heat pipes is 1mm-3mm, and the sum of the thickness of the bottom of the heat pipe and the bottom of the heat-absorbing plate is 1mm-2.5mm; By weight, the superconducting liquid is composed of 1-1.5 parts of sodium hydroxide, 4-5 parts of potassium chromate, 1570-1580 parts of ethanol and 8030-8040 parts of pure water. 5. The four-tuyere refrigeration device according to any one of claims 1 to 4, characterized in that: the first tuyere (44) and the second tuyere (45) deviate in directions away from each other, and the center line of the two It is in the shape of a figure of eight. 6. The refrigeration device with four tuyeres according to any one of claims 1 to 4, characterized in that: a heat insulation layer (6) is provided on the arc-shaped plate (5). 7. The four-tuyere refrigeration device according to any one of claims 1 to 4, characterized in that: the heat transfer device (2) divides the inverted U-shaped circulating air duct (51) into two sections for heat transfer The gap between the device fins (22) constitutes the connecting air duct between the two sections. The connecting air duct is wavy and is a key air duct for releasing low temperature to absorb high temperature or releasing high temperature to absorb low temperature.